IL253189B - מערכת ושיטה לשיוך דירוג לפגמים שנמצאו במצע לייצור שבבים - Google Patents

מערכת ושיטה לשיוך דירוג לפגמים שנמצאו במצע לייצור שבבים

Info

Publication number
IL253189B
IL253189B IL253189A IL25318917A IL253189B IL 253189 B IL253189 B IL 253189B IL 253189 A IL253189 A IL 253189A IL 25318917 A IL25318917 A IL 25318917A IL 253189 B IL253189 B IL 253189B
Authority
IL
Israel
Prior art keywords
wafer
defects detected
assigning classifications
classifications
assigning
Prior art date
Application number
IL253189A
Other languages
English (en)
Other versions
IL253189A0 (he
Inventor
Kulkarni Ashok
Duffy Brian
Maayah Kais
Rouse Gordon
Original Assignee
Kla Tencor Tech Corporation
Kulkarni Ashok
Duffy Brian
Maayah Kais
Rouse Gordon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/561,735 external-priority patent/US7676077B2/en
Priority claimed from US11/561,659 external-priority patent/US7570796B2/en
Application filed by Kla Tencor Tech Corporation, Kulkarni Ashok, Duffy Brian, Maayah Kais, Rouse Gordon filed Critical Kla Tencor Tech Corporation
Publication of IL253189A0 publication Critical patent/IL253189A0/he
Publication of IL253189B publication Critical patent/IL253189B/he

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F16/00—Information retrieval; Database structures therefor; File system structures therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31718—Logistic aspects, e.g. binning, selection, sorting of devices under test, tester/handler interaction networks, Test management software, e.g. software for test statistics or test evaluation, yield analysis
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Health & Medical Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Data Mining & Analysis (AREA)
  • Databases & Information Systems (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
IL253189A 2005-11-18 2017-06-27 מערכת ושיטה לשיוך דירוג לפגמים שנמצאו במצע לייצור שבבים IL253189B (he)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US73794705P 2005-11-18 2005-11-18
US73829005P 2005-11-18 2005-11-18
PCT/US2006/061113 WO2007120280A2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data
US11/561,735 US7676077B2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data
US11/561,659 US7570796B2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data

Publications (2)

Publication Number Publication Date
IL253189A0 IL253189A0 (he) 2017-08-31
IL253189B true IL253189B (he) 2018-11-29

Family

ID=38610775

Family Applications (14)

Application Number Title Priority Date Filing Date
IL191527A IL191527A (he) 2005-11-18 2008-05-18 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL230235A IL230235A (he) 2005-11-18 2013-12-29 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL230260A IL230260A (he) 2005-11-18 2013-12-31 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234290A IL234290A (he) 2005-11-18 2014-08-25 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234289A IL234289A (he) 2005-11-18 2014-08-25 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234316A IL234316A (he) 2005-11-18 2014-08-26 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234317A IL234317A (he) 2005-11-18 2014-08-26 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234318A IL234318A (he) 2005-11-18 2014-08-26 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234319A IL234319A (he) 2005-11-18 2014-08-26 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234344A IL234344A (he) 2005-11-18 2014-08-27 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234345A IL234345A (he) 2005-11-18 2014-08-27 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234346A IL234346A (he) 2005-11-18 2014-08-27 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234343A IL234343A (he) 2005-11-18 2014-08-27 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL253189A IL253189B (he) 2005-11-18 2017-06-27 מערכת ושיטה לשיוך דירוג לפגמים שנמצאו במצע לייצור שבבים

Family Applications Before (13)

Application Number Title Priority Date Filing Date
IL191527A IL191527A (he) 2005-11-18 2008-05-18 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL230235A IL230235A (he) 2005-11-18 2013-12-29 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL230260A IL230260A (he) 2005-11-18 2013-12-31 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234290A IL234290A (he) 2005-11-18 2014-08-25 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234289A IL234289A (he) 2005-11-18 2014-08-25 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234316A IL234316A (he) 2005-11-18 2014-08-26 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234317A IL234317A (he) 2005-11-18 2014-08-26 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234318A IL234318A (he) 2005-11-18 2014-08-26 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234319A IL234319A (he) 2005-11-18 2014-08-26 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234344A IL234344A (he) 2005-11-18 2014-08-27 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234345A IL234345A (he) 2005-11-18 2014-08-27 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234346A IL234346A (he) 2005-11-18 2014-08-27 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234343A IL234343A (he) 2005-11-18 2014-08-27 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה

Country Status (5)

Country Link
EP (1) EP1955225A4 (he)
JP (12) JP5465880B2 (he)
KR (11) KR20180088924A (he)
IL (14) IL191527A (he)
WO (2) WO2007120280A2 (he)

Families Citing this family (93)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9002497B2 (en) * 2003-07-03 2015-04-07 Kla-Tencor Technologies Corp. Methods and systems for inspection of wafers and reticles using designer intent data
KR20180088924A (ko) * 2005-11-18 2018-08-07 케이엘에이-텐코 코포레이션 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
WO2009020885A1 (en) * 2007-08-03 2009-02-12 Flir Systems, Inc. Wireless remote detector systems and methods
JP6185693B2 (ja) * 2008-06-11 2017-08-23 ケーエルエー−テンカー・コーポレーションＫｌａ−Ｔｅｎｃｏｒ Ｃｏｒｐｏｒａｔｉｏｎ ウェーハー上の設計欠陥および工程欠陥の検出、ウェーハー上の欠陥の精査、設計内の１つ以上の特徴を工程監視特徴として使用するための選択、またはそのいくつかの組み合わせのためのシステムおよび方法
KR101841897B1 (ko) * 2008-07-28 2018-03-23 케이엘에이-텐코어 코오포레이션 웨이퍼 상의 메모리 디바이스 영역에서 검출된 결함들을 분류하기 위한 컴퓨터-구현 방법들, 컴퓨터-판독 가능 매체, 및 시스템들
WO2011004534A1 (ja) * 2009-07-09 2011-01-13 株式会社 日立ハイテクノロジーズ 半導体欠陥分類方法，半導体欠陥分類装置，半導体欠陥分類プログラム
WO2011008688A2 (en) * 2009-07-17 2011-01-20 Kla-Tencor Corporation Scanner performance comparison and matching using design and defect data
WO2011152303A1 (ja) * 2010-05-31 2011-12-08 株式会社日立ハイテクノロジーズ 自動収差補正法を備えた荷電粒子線装置
EP2447889A1 (en) * 2010-10-29 2012-05-02 Siemens Aktiengesellschaft Method for modeling a defect management in a manufacturing process and for handling the defect during the production process based on said modeled defect management
TWI574136B (zh) * 2012-02-03 2017-03-11 應用材料以色列公司 基於設計之缺陷分類之方法及系統
US8718353B2 (en) * 2012-03-08 2014-05-06 Kla-Tencor Corporation Reticle defect inspection with systematic defect filter
JP5943722B2 (ja) * 2012-06-08 2016-07-05 三菱重工業株式会社 欠陥判定装置、放射線撮像システム、及び欠陥判定方法
JP6092602B2 (ja) * 2012-12-04 2017-03-08 株式会社安永 欠陥検査装置及び欠陥検査方法
US9202763B2 (en) 2013-01-16 2015-12-01 Kabushiki Kaisha Toshiba Defect pattern evaluation method, defect pattern evaluation apparatus, and recording media
JP6152281B2 (ja) * 2013-02-25 2017-06-21 株式会社ニューフレアテクノロジー パターン検査方法及びパターン検査装置
US10114368B2 (en) * 2013-07-22 2018-10-30 Applied Materials Israel Ltd. Closed-loop automatic defect inspection and classification
US9401016B2 (en) * 2014-05-12 2016-07-26 Kla-Tencor Corp. Using high resolution full die image data for inspection
TWI660856B (zh) * 2014-07-08 2019-06-01 以色列奧寶科技有限公司 電腦化直接書寫之改良系統及方法
US10267746B2 (en) * 2014-10-22 2019-04-23 Kla-Tencor Corp. Automated pattern fidelity measurement plan generation
KR102269514B1 (ko) * 2014-11-25 2021-06-25 케이엘에이 코포레이션 랜드스케이프의 분석 및 활용
US9830421B2 (en) * 2014-12-31 2017-11-28 Kla-Tencor Corp. Alignment of inspection to design using built in targets
US10199283B1 (en) 2015-02-03 2019-02-05 Pdf Solutions, Inc. Method for processing a semiconductor wager using non-contact electrical measurements indicative of a resistance through a stitch, where such measurements are obtained by scanning a pad comprised of at least three parallel conductive stripes using a moving stage with beam deflection to account for motion of the stage
US9799575B2 (en) 2015-12-16 2017-10-24 Pdf Solutions, Inc. Integrated circuit containing DOEs of NCEM-enabled fill cells
US9875536B2 (en) * 2015-03-31 2018-01-23 Kla-Tencor Corp. Sub-pixel and sub-resolution localization of defects on patterned wafers
US10539612B2 (en) * 2015-05-20 2020-01-21 Kla-Tencor Corporation Voltage contrast based fault and defect inference in logic chips
US9639645B2 (en) 2015-06-18 2017-05-02 Globalfoundries Inc. Integrated circuit chip reliability using reliability-optimized failure mechanism targeting
US9940704B2 (en) 2015-06-19 2018-04-10 KLA—Tencor Corporation Pre-layer defect site review using design
US9891275B2 (en) 2015-06-24 2018-02-13 International Business Machines Corporation Integrated circuit chip reliability qualification using a sample-specific expected fail rate
TWI684225B (zh) * 2015-08-28 2020-02-01 美商克萊譚克公司 自定向計量和圖樣分類
US9576772B1 (en) * 2015-08-31 2017-02-21 Fei Company CAD-assisted TEM prep recipe creation
KR102387459B1 (ko) 2015-11-20 2022-04-15 삼성전자주식회사 반도체 소자의 패턴 형성 방법
US10387601B2 (en) * 2015-11-26 2019-08-20 Kla-Tencor Corporation Methods to store dynamic layer content inside a design file
US10593604B1 (en) 2015-12-16 2020-03-17 Pdf Solutions, Inc. Process for making semiconductor dies, chips, and wafers using in-line measurements obtained from DOEs of NCEM-enabled fill cells
US10978438B1 (en) 2015-12-16 2021-04-13 Pdf Solutions, Inc. IC with test structures and E-beam pads embedded within a contiguous standard cell area
KR102160217B1 (ko) * 2015-12-22 2020-09-28 에이에스엠엘 네델란즈 비.브이. 프로세스-윈도우 특성화를 위한 장치 및 방법
US11205119B2 (en) * 2015-12-22 2021-12-21 Applied Materials Israel Ltd. Method of deep learning-based examination of a semiconductor specimen and system thereof
KR102451650B1 (ko) * 2016-02-05 2022-10-11 에스케이하이닉스 주식회사 적층형 반도체 장치
KR102483787B1 (ko) * 2016-02-25 2023-01-04 에스케이하이닉스 주식회사 반도체 장치의 결함 모델링 장치 및 방법, 이를 위한 컴퓨터 프로그램과, 이를 이용한 반도체 장치의 결함 검사 시스템
US10339262B2 (en) * 2016-03-29 2019-07-02 Kla-Tencor Corporation System and method for defining care areas in repeating structures of design data
US9646961B1 (en) 2016-04-04 2017-05-09 Pdf Solutions, Inc. Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, AACNT-short-configured, TS-short-configured, and metal-short-configured, NCEM-enabled fill cells
US9929063B1 (en) 2016-04-04 2018-03-27 Pdf Solutions, Inc. Process for making an integrated circuit that includes NCEM-Enabled, tip-to-side gap-configured fill cells, with NCEM pads formed from at least three conductive stripes positioned between adjacent gates
US9905553B1 (en) 2016-04-04 2018-02-27 Pdf Solutions, Inc. Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, AACNT-short-configured, GATECNT-short-configured, and metal-short-configured, NCEM-enabled fill cells
US10740888B2 (en) 2016-04-22 2020-08-11 Kla-Tencor Corporation Computer assisted weak pattern detection and quantification system
KR102376200B1 (ko) * 2016-05-12 2022-03-18 에이에스엠엘 네델란즈 비.브이. 기계 학습에 의한 결함 또는 핫스폿의 식별
US11010886B2 (en) * 2016-05-17 2021-05-18 Kla-Tencor Corporation Systems and methods for automatic correction of drift between inspection and design for massive pattern searching
US10192302B2 (en) * 2016-05-25 2019-01-29 Kla-Tencor Corporation Combined patch and design-based defect detection
US10304177B2 (en) * 2016-06-29 2019-05-28 Kla-Tencor Corporation Systems and methods of using z-layer context in logic and hot spot inspection for sensitivity improvement and nuisance suppression
US10902576B2 (en) * 2016-08-12 2021-01-26 Texas Instruments Incorporated System and method for electronic die inking after automatic visual defect inspection
US10204290B2 (en) * 2016-10-14 2019-02-12 Kla-Tencor Corporation Defect review sampling and normalization based on defect and design attributes
US10395358B2 (en) * 2016-11-10 2019-08-27 Kla-Tencor Corp. High sensitivity repeater defect detection
US11047806B2 (en) * 2016-11-30 2021-06-29 Kla-Tencor Corporation Defect discovery and recipe optimization for inspection of three-dimensional semiconductor structures
US11237119B2 (en) * 2017-01-10 2022-02-01 Kla-Tencor Corporation Diagnostic methods for the classifiers and the defects captured by optical tools
US9748153B1 (en) 2017-03-29 2017-08-29 Pdf Solutions, Inc. Process for making and using a semiconductor wafer containing first and second does of standard cell compatible, NCEM-enabled fill cells, with the first DOE including side-to-side short configured fill cells, and the second DOE including tip-to-side short configure
US9773774B1 (en) 2017-03-30 2017-09-26 Pdf Solutions, Inc. Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including chamfer short configured fill cells, and the second DOE including corner short configured fill cells
US10598617B2 (en) * 2017-05-05 2020-03-24 Kla-Tencor Corporation Metrology guided inspection sample shaping of optical inspection results
JP6819451B2 (ja) * 2017-05-08 2021-01-27 信越化学工業株式会社 大型合成石英ガラス基板並びにその評価方法及び製造方法
JP6864122B2 (ja) * 2017-05-22 2021-04-21 ケーエルエー コーポレイション レシピ最適化及び計測のためのゾーナル分析
KR102440742B1 (ko) * 2017-05-25 2022-09-05 삼성전자주식회사 반도체 소자 검사 시스템 및 그 동작 방법
US10648925B2 (en) * 2017-06-05 2020-05-12 Kla-Tencor Corporation Repeater defect detection
KR102447611B1 (ko) * 2017-06-06 2022-09-26 케이엘에이 코포레이션 레티클 최적화 알고리즘들 및 최적의 타겟 설계
US9786649B1 (en) 2017-06-27 2017-10-10 Pdf Solutions, Inc. Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including via open configured fill cells, and the second DOE including stitch open configured fill cells
US9768083B1 (en) 2017-06-27 2017-09-19 Pdf Solutions, Inc. Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including merged-via open configured fill cells, and the second DOE including snake open configured fill cells
US9865583B1 (en) 2017-06-28 2018-01-09 Pdf Solutions, Inc. Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including snake open configured fill cells, and the second DOE including stitch open configured fill cells
US10096530B1 (en) 2017-06-28 2018-10-09 Pdf Solutions, Inc. Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including merged-via open configured fill cells, and the second DOE including stitch open configured fill cells
US10620135B2 (en) * 2017-07-19 2020-04-14 Kla-Tencor Corp. Identifying a source of nuisance defects on a wafer
KR102614266B1 (ko) * 2017-08-22 2023-12-14 삼성전자주식회사 웨이퍼 검사 방법, 및 이를 이용한 반도체 장치 제조 방법
US11037286B2 (en) * 2017-09-28 2021-06-15 Applied Materials Israel Ltd. Method of classifying defects in a semiconductor specimen and system thereof
KR20190073756A (ko) 2017-12-19 2019-06-27 삼성전자주식회사 반도체 결함 분류 장치, 반도체의 결함을 분류하는 방법, 그리고 반도체 결함 분류 시스템
WO2019162496A1 (en) * 2018-02-26 2019-08-29 F. Hoffmann-La Roche Ag Methods and systems for calibrating and using a camera for detecting an analyte in a sample
US10585049B2 (en) * 2018-03-10 2020-03-10 Kla-Tencor Corporation Process-induced excursion characterization
US10677588B2 (en) * 2018-04-09 2020-06-09 Kla-Tencor Corporation Localized telecentricity and focus optimization for overlay metrology
US11797950B2 (en) * 2018-08-27 2023-10-24 Basf Corporation Method and system to digitally track and monitor an automotive refinish repair process
JP7113086B2 (ja) * 2018-10-18 2022-08-04 株式会社図研 設計支援装置、設計支援方法およびプログラム
US11049745B2 (en) * 2018-10-19 2021-06-29 Kla Corporation Defect-location determination using correction loop for pixel alignment
US11600505B2 (en) * 2018-10-31 2023-03-07 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for systematic physical failure analysis (PFA) fault localization
CN109583721B (zh) * 2018-11-16 2024-06-18 北京奇虎科技有限公司 一种渠道的评估方法、装置及电子设备
JP2020161769A (ja) * 2019-03-28 2020-10-01 Ｔａｓｍｉｔ株式会社 画像生成方法
TWI700644B (zh) * 2019-04-02 2020-08-01 精英電腦股份有限公司 板件構件的即時定位裝置與方法
JP7245733B2 (ja) * 2019-06-26 2023-03-24 株式会社日立ハイテク ウェハ観察装置およびウェハ観察方法
US11410292B2 (en) * 2019-09-27 2022-08-09 Kla Corporation Equi-probability defect detection
US11526152B2 (en) * 2019-12-19 2022-12-13 X Development Llc Techniques for determining fabricability of designs by searching for forbidden patterns
US11360030B2 (en) 2020-02-04 2022-06-14 Applied Materials Isreal Ltd Selecting a coreset of potential defects for estimating expected defects of interest
CN113820922B (zh) * 2020-06-18 2024-08-02 台湾积体电路制造股份有限公司 热点预测方法、装置及记录介质
CN111708255B (zh) * 2020-06-19 2023-03-07 上海华虹宏力半导体制造有限公司 Opc的ssa表的形成方法
JP7526940B2 (ja) * 2020-09-11 2024-08-02 パナソニックＩｐマネジメント株式会社 情報処理方法及び情報処理装置
JP7443268B2 (ja) 2021-01-05 2024-03-05 株式会社ニューフレアテクノロジー 欠陥検査方法
US20240053278A1 (en) * 2021-03-30 2024-02-15 Siemens Industry Software Inc. Method and system for detecting a false error on a component of a board inspected by an aoi machine
KR20230033445A (ko) 2021-09-01 2023-03-08 에스케이하이닉스 주식회사 반도체 웨이퍼의 불량 분석 방법 및 그 시스템
US12111355B2 (en) 2021-11-22 2024-10-08 Onto Innovation Inc. Semiconductor substrate yield prediction based on spectra data from multiple substrate dies
KR102672272B1 (ko) * 2022-02-11 2024-06-04 큐알티 주식회사 복수의 가이드 동심원을 갖는 반도체 소자 테스트용 빔 검사 장치, 및 빔 검사 방법
KR102518783B1 (ko) * 2022-06-23 2023-04-06 큐알티 주식회사 적응적 변형이 가능한 빔 제어기, 이를 이용한 반도체 소자의 테스트 장치, 및 이를 이용한 반도체 소자의 테스트 방법
US20240112326A1 (en) * 2022-09-30 2024-04-04 Kla Corporation Inspection of adaptive patterned workpieces with dynamic design and deep learning-based rendering
KR102594471B1 (ko) * 2022-12-07 2023-10-26 주식회사디아이 반도체 테스트 장비의 다중 테스트 존 제어장치

Family Cites Families (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02110565A (ja) * 1988-10-20 1990-04-23 Matsushita Electron Corp フォトマスク検査装置およびフォトマスク検査法
US5054097A (en) * 1988-11-23 1991-10-01 Schlumberger Technologies, Inc. Methods and apparatus for alignment of images
US5252507A (en) * 1990-03-30 1993-10-12 Tactical Fabs, Inc. Very high density wafer scale device architecture
JP3017839B2 (ja) * 1991-06-10 2000-03-13 東芝機械株式会社 欠陥検査方法及び検査装置
JP3730263B2 (ja) * 1992-05-27 2005-12-21 ケーエルエー・インストルメンツ・コーポレーション 荷電粒子ビームを用いた自動基板検査の装置及び方法
JPH06119452A (ja) * 1992-10-02 1994-04-28 Fujitsu Ltd 画像処理装置及び画像処理方法
JPH06265480A (ja) * 1993-03-12 1994-09-22 Toshiba Corp パターン欠陥検査方法および検査装置
JP3370379B2 (ja) * 1993-03-19 2003-01-27 株式会社日立製作所 半導体装置の製造方法
JP3051279B2 (ja) * 1993-05-13 2000-06-12 シャープ株式会社 バンプ外観検査方法およびバンプ外観検査装置
US5544256A (en) 1993-10-22 1996-08-06 International Business Machines Corporation Automated defect classification system
JP3466286B2 (ja) * 1994-08-09 2003-11-10 富士通株式会社 パターン検査方法及びパターン検査装置
US5991699A (en) 1995-05-04 1999-11-23 Kla Instruments Corporation Detecting groups of defects in semiconductor feature space
JPH0915161A (ja) * 1995-06-27 1997-01-17 Hitachi Ltd 欠陥検査方法および装置
JPH10260011A (ja) * 1997-03-19 1998-09-29 Olympus Optical Co Ltd 位置決め装置
JP3564958B2 (ja) * 1997-08-07 2004-09-15 株式会社日立製作所 電子ビームを用いた検査方法及び検査装置
JPH11251377A (ja) * 1998-03-02 1999-09-17 Hitachi Ltd 欠陥検査方法およびその装置並びに欠陥の観察または分析方法およびそのシステム
JP4073088B2 (ja) * 1998-08-20 2008-04-09 株式会社ルネサステクノロジ 半導体基板の製造方法
JP2000065747A (ja) * 1998-08-26 2000-03-03 Toshiba Corp パターン欠陥検査装置及びパターン欠陥検査方法
JP2000306964A (ja) * 1999-04-22 2000-11-02 Hitachi Ltd 検査データ処理方法および検査データ処理装置
JP2000200356A (ja) * 1999-01-08 2000-07-18 Hitachi Ltd 欠陥分類方法およびその装置
JP3350477B2 (ja) * 1999-04-02 2002-11-25 セイコーインスツルメンツ株式会社 ウエハ検査装置
JP2001230289A (ja) * 2000-02-15 2001-08-24 Hitachi Ltd 欠陥解析方法および欠陥解析システム
US7120285B1 (en) * 2000-02-29 2006-10-10 Advanced Micro Devices, Inc. Method for evaluation of reticle image using aerial image simulator
US6862142B2 (en) * 2000-03-10 2005-03-01 Kla-Tencor Technologies Corporation Multi-detector microscopic inspection system
US6507800B1 (en) * 2000-03-13 2003-01-14 Promos Technologies, Inc. Method for testing semiconductor wafers
JP3920003B2 (ja) * 2000-04-25 2007-05-30 株式会社ルネサステクノロジ 検査データ処理方法およびその装置
FR2813145B1 (fr) * 2000-08-18 2002-11-29 St Microelectronics Sa Procede de fabrication d'un condensateur au sein d'un circuit integre, et circuit integre correspondant
US6634018B2 (en) * 2000-08-24 2003-10-14 Texas Instruments Incorporated Optical proximity correction
JP3678133B2 (ja) * 2000-10-30 2005-08-03 株式会社日立製作所 検査システムおよび半導体デバイスの製造方法
KR100846018B1 (ko) * 2000-11-30 2008-07-11 시그마-씨 소프트웨어 에이지 집적 회로의 특성 측정 장치 및 방법
JP2002244275A (ja) * 2001-02-15 2002-08-30 Toshiba Corp フォトマスクの欠陥検査方法、フォトマスクの欠陥検査装置及び記録媒体
JP4014379B2 (ja) * 2001-02-21 2007-11-28 株式会社日立製作所 欠陥レビュー装置及び方法
JP2003023056A (ja) * 2001-07-10 2003-01-24 Hitachi Ltd 半導体デバイスの欠陥分類方法および半導体デバイスの歩留まり予測方法および半導体デバイスの製造方法および半導体デバイスの欠陥分類システムおよび半導体デバイス分類装置およびそれらに用いるプログラムおよび記録媒体
JP4122735B2 (ja) * 2001-07-24 2008-07-23 株式会社日立製作所 半導体デバイスの検査方法および検査条件設定方法
JP3904419B2 (ja) * 2001-09-13 2007-04-11 株式会社日立製作所 検査装置および検査システム
US6918101B1 (en) * 2001-10-25 2005-07-12 Kla -Tencor Technologies Corporation Apparatus and methods for determining critical area of semiconductor design data
US6751519B1 (en) * 2001-10-25 2004-06-15 Kla-Tencor Technologies Corporation Methods and systems for predicting IC chip yield
US6886153B1 (en) 2001-12-21 2005-04-26 Kla-Tencor Corporation Design driven inspection or measurement for semiconductor using recipe
JP2003215060A (ja) * 2002-01-22 2003-07-30 Tokyo Seimitsu Co Ltd パターン検査方法及び検査装置
JP2004031709A (ja) * 2002-06-27 2004-01-29 Seiko Instruments Inc ウエハレス測長レシピ生成装置
JP4073265B2 (ja) * 2002-07-09 2008-04-09 富士通株式会社 検査装置及び検査方法
US6959251B2 (en) 2002-08-23 2005-10-25 Kla-Tencor Technologies, Corporation Inspection system setup techniques
JP2004117016A (ja) * 2002-09-24 2004-04-15 Nec Kansai Ltd 半導体ウェーハ欠陥検査装置
US7457736B2 (en) * 2002-11-21 2008-11-25 Synopsys, Inc. Automated creation of metrology recipes
US6882745B2 (en) * 2002-12-19 2005-04-19 Freescale Semiconductor, Inc. Method and apparatus for translating detected wafer defect coordinates to reticle coordinates using CAD data
JP2004227886A (ja) * 2003-01-22 2004-08-12 Hitachi High-Technologies Corp 走査電子顕微鏡
JP2004296592A (ja) * 2003-03-26 2004-10-21 Dainippon Screen Mfg Co Ltd 欠陥分類装置、欠陥分類方法およびプログラム
JP2004294358A (ja) * 2003-03-28 2004-10-21 Hitachi High-Technologies Corp 欠陥検査方法および装置
JP4230838B2 (ja) * 2003-06-27 2009-02-25 株式会社日立ハイテクノロジーズ 欠陥検査装置における検査レシピ設定方法および欠陥検査方法
US6952653B2 (en) 2003-04-29 2005-10-04 Kla-Tencor Technologies Corporation Single tool defect classification solution
JP2004333386A (ja) * 2003-05-09 2004-11-25 Nec Corp レチクル検査装置及びレチクル検査方法
JP4229767B2 (ja) * 2003-06-30 2009-02-25 株式会社東京精密 画像欠陥検査方法、画像欠陥検査装置及び外観検査装置
US9002497B2 (en) * 2003-07-03 2015-04-07 Kla-Tencor Technologies Corp. Methods and systems for inspection of wafers and reticles using designer intent data
US7135344B2 (en) * 2003-07-11 2006-11-14 Applied Materials, Israel, Ltd. Design-based monitoring
KR20050072166A (ko) * 2004-01-02 2005-07-11 삼성전자주식회사 반도체 웨이퍼 검사방법
JP4771714B2 (ja) * 2004-02-23 2011-09-14 株式会社Ｎｇｒ パターン検査装置および方法
US7194709B2 (en) 2004-03-05 2007-03-20 Keith John Brankner Automatic alignment of integrated circuit and design layout of integrated circuit to more accurately assess the impact of anomalies
JP4778685B2 (ja) * 2004-03-10 2011-09-21 株式会社日立ハイテクノロジーズ 半導体デバイスのパターン形状評価方法及びその装置
JP2005283326A (ja) 2004-03-30 2005-10-13 Hitachi High-Technologies Corp 欠陥レビュー方法及びその装置
US7137083B2 (en) * 2004-04-01 2006-11-14 Verigy Ipco Verification of integrated circuit tests using test simulation and integrated circuit simulation with simulated failure
JP4154374B2 (ja) * 2004-08-25 2008-09-24 株式会社日立ハイテクノロジーズ パターンマッチング装置及びそれを用いた走査型電子顕微鏡
US7760347B2 (en) * 2005-05-13 2010-07-20 Applied Materials, Inc. Design-based method for grouping systematic defects in lithography pattern writing system
KR20180088924A (ko) * 2005-11-18 2018-08-07 케이엘에이-텐코 코포레이션 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템

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