IL234345A - מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה - Google Patents

מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה

Info

Publication number
IL234345A
IL234345A IL234345A IL23434514A IL234345A IL 234345 A IL234345 A IL 234345A IL 234345 A IL234345 A IL 234345A IL 23434514 A IL23434514 A IL 23434514A IL 234345 A IL234345 A IL 234345A
Authority
IL
Israel
Prior art keywords
data
systems
methods
combination
utilizing design
Prior art date
Application number
IL234345A
Other languages
English (en)
Inventor
Kekare Sagar
chang Ellis
Park Allen
Rose Peter
Zafar Khurram
Original Assignee
Kla-Tencor Tech Corp
Kekare Sagar
chang Ellis
Park Allen
Rose Peter
Zafar Khurram
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/561,735 external-priority patent/US7676077B2/en
Priority claimed from US11/561,659 external-priority patent/US7570796B2/en
Application filed by Kla-Tencor Tech Corp, Kekare Sagar, chang Ellis, Park Allen, Rose Peter, Zafar Khurram filed Critical Kla-Tencor Tech Corp
Publication of IL234345A publication Critical patent/IL234345A/he

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31718—Logistic aspects, e.g. binning, selection, sorting of devices under test, tester/handler interaction networks, Test management software, e.g. software for test statistics or test evaluation, yield analysis
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F16/00—Information retrieval; Database structures therefor; File system structures therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Health & Medical Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Data Mining & Analysis (AREA)
  • Databases & Information Systems (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
IL234345A 2005-11-18 2014-08-27 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה IL234345A (he)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US73794705P 2005-11-18 2005-11-18
US73829005P 2005-11-18 2005-11-18
PCT/US2006/061113 WO2007120280A2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data
US11/561,735 US7676077B2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data
US11/561,659 US7570796B2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data

Publications (1)

Publication Number Publication Date
IL234345A true IL234345A (he) 2016-11-30

Family

ID=38610775

Family Applications (14)

Application Number Title Priority Date Filing Date
IL191527A IL191527A (he) 2005-11-18 2008-05-18 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL230235A IL230235A (he) 2005-11-18 2013-12-29 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL230260A IL230260A (he) 2005-11-18 2013-12-31 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234290A IL234290A (he) 2005-11-18 2014-08-25 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234289A IL234289A (he) 2005-11-18 2014-08-25 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234316A IL234316A (he) 2005-11-18 2014-08-26 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234317A IL234317A (he) 2005-11-18 2014-08-26 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234318A IL234318A (he) 2005-11-18 2014-08-26 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234319A IL234319A (he) 2005-11-18 2014-08-26 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234344A IL234344A (he) 2005-11-18 2014-08-27 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234345A IL234345A (he) 2005-11-18 2014-08-27 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234346A IL234346A (he) 2005-11-18 2014-08-27 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234343A IL234343A (he) 2005-11-18 2014-08-27 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL253189A IL253189B (he) 2005-11-18 2017-06-27 מערכת ושיטה לשיוך דירוג לפגמים שנמצאו במצע לייצור שבבים

Family Applications Before (10)

Application Number Title Priority Date Filing Date
IL191527A IL191527A (he) 2005-11-18 2008-05-18 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL230235A IL230235A (he) 2005-11-18 2013-12-29 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL230260A IL230260A (he) 2005-11-18 2013-12-31 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234290A IL234290A (he) 2005-11-18 2014-08-25 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234289A IL234289A (he) 2005-11-18 2014-08-25 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234316A IL234316A (he) 2005-11-18 2014-08-26 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234317A IL234317A (he) 2005-11-18 2014-08-26 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234318A IL234318A (he) 2005-11-18 2014-08-26 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234319A IL234319A (he) 2005-11-18 2014-08-26 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234344A IL234344A (he) 2005-11-18 2014-08-27 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה

Family Applications After (3)

Application Number Title Priority Date Filing Date
IL234346A IL234346A (he) 2005-11-18 2014-08-27 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL234343A IL234343A (he) 2005-11-18 2014-08-27 מערכות ושיטות לשימוש במידע תכנוני ביחד עם מידע של בדיקה
IL253189A IL253189B (he) 2005-11-18 2017-06-27 מערכת ושיטה לשיוך דירוג לפגמים שנמצאו במצע לייצור שבבים

Country Status (5)

Country Link
EP (1) EP1955225A4 (he)
JP (12) JP5465880B2 (he)
KR (11) KR20180088924A (he)
IL (14) IL191527A (he)
WO (2) WO2007120280A2 (he)

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* Cited by examiner, † Cited by third party
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