IL191527A0 - Methods and systems for utilizing design data in combination with inspection data - Google Patents

Methods and systems for utilizing design data in combination with inspection data

Info

Publication number
IL191527A0
IL191527A0 IL191527A IL19152708A IL191527A0 IL 191527 A0 IL191527 A0 IL 191527A0 IL 191527 A IL191527 A IL 191527A IL 19152708 A IL19152708 A IL 19152708A IL 191527 A0 IL191527 A0 IL 191527A0
Authority
IL
Israel
Prior art keywords
data
systems
methods
combination
utilizing design
Prior art date
Application number
IL191527A
Other versions
IL191527A (en
Original Assignee
Kla Tencor Tech Corp
Kulkarni Ashok
Duffy Brian
Maayah Kais
Rouse Gordon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/561,735 external-priority patent/US7676077B2/en
Priority claimed from US11/561,659 external-priority patent/US7570796B2/en
Application filed by Kla Tencor Tech Corp, Kulkarni Ashok, Duffy Brian, Maayah Kais, Rouse Gordon filed Critical Kla Tencor Tech Corp
Publication of IL191527A0 publication Critical patent/IL191527A0/en
Publication of IL191527A publication Critical patent/IL191527A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F16/00—Information retrieval; Database structures therefor; File system structures therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31718—Logistic aspects, e.g. binning, selection, sorting of devices under test, tester/handler interaction networks, Test management software, e.g. software for test statistics or test evaluation, yield analysis
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • Quality & Reliability (AREA)
  • Pathology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Data Mining & Analysis (AREA)
  • Databases & Information Systems (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Tests Of Electronic Circuits (AREA)
IL191527A 2005-11-18 2008-05-18 Methods and systems for utilizing design data in combination with inspection data IL191527A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US73794705P 2005-11-18 2005-11-18
US73829005P 2005-11-18 2005-11-18
PCT/US2006/061113 WO2007120280A2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data
US11/561,735 US7676077B2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data
US11/561,659 US7570796B2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data

Publications (2)

Publication Number Publication Date
IL191527A0 true IL191527A0 (en) 2008-12-29
IL191527A IL191527A (en) 2014-09-30

Family

ID=38610775

Family Applications (14)

Application Number Title Priority Date Filing Date
IL191527A IL191527A (en) 2005-11-18 2008-05-18 Methods and systems for utilizing design data in combination with inspection data
IL230235A IL230235A (en) 2005-11-18 2013-12-29 Methods and systems for utilizing design data in combination with inspection data
IL230260A IL230260A (en) 2005-11-18 2013-12-31 Methods and systems for utilizing design data in combination with inspection data
IL234289A IL234289A (en) 2005-11-18 2014-08-25 Methods and systems for utilizing design data in combination with inspection data
IL234290A IL234290A (en) 2005-11-18 2014-08-25 Methods and systems for utilizing design data in combination with inspection data
IL234319A IL234319A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234316A IL234316A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234317A IL234317A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234318A IL234318A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234346A IL234346A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL234345A IL234345A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL234343A IL234343A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL234344A IL234344A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL253189A IL253189B (en) 2005-11-18 2017-06-27 System and method for assigning classifications to defects detected on a wafer

Family Applications After (13)

Application Number Title Priority Date Filing Date
IL230235A IL230235A (en) 2005-11-18 2013-12-29 Methods and systems for utilizing design data in combination with inspection data
IL230260A IL230260A (en) 2005-11-18 2013-12-31 Methods and systems for utilizing design data in combination with inspection data
IL234289A IL234289A (en) 2005-11-18 2014-08-25 Methods and systems for utilizing design data in combination with inspection data
IL234290A IL234290A (en) 2005-11-18 2014-08-25 Methods and systems for utilizing design data in combination with inspection data
IL234319A IL234319A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234316A IL234316A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234317A IL234317A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234318A IL234318A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234346A IL234346A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL234345A IL234345A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL234343A IL234343A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL234344A IL234344A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL253189A IL253189B (en) 2005-11-18 2017-06-27 System and method for assigning classifications to defects detected on a wafer

Country Status (5)

Country Link
EP (1) EP1955225A4 (en)
JP (12) JP5465880B2 (en)
KR (11) KR20180088924A (en)
IL (14) IL191527A (en)
WO (2) WO2007120279A2 (en)

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