IL253189A0 - System and method for assigning classifications to defects detected on a wafer - Google Patents
System and method for assigning classifications to defects detected on a waferInfo
- Publication number
- IL253189A0 IL253189A0 IL253189A IL25318917A IL253189A0 IL 253189 A0 IL253189 A0 IL 253189A0 IL 253189 A IL253189 A IL 253189A IL 25318917 A IL25318917 A IL 25318917A IL 253189 A0 IL253189 A0 IL 253189A0
- Authority
- IL
- Israel
- Prior art keywords
- wafer
- defects detected
- assigning classifications
- classifications
- assigning
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F16/00—Information retrieval; Database structures therefor; File system structures therefor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/31718—Logistic aspects, e.g. binning, selection, sorting of devices under test, tester/handler interaction networks, Test management software, e.g. software for test statistics or test evaluation, yield analysis
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Immunology (AREA)
- General Health & Medical Sciences (AREA)
- Pathology (AREA)
- Biochemistry (AREA)
- Quality & Reliability (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Data Mining & Analysis (AREA)
- Databases & Information Systems (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Tests Of Electronic Circuits (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US73794705P | 2005-11-18 | 2005-11-18 | |
US73829005P | 2005-11-18 | 2005-11-18 | |
US11/561,659 US7570796B2 (en) | 2005-11-18 | 2006-11-20 | Methods and systems for utilizing design data in combination with inspection data |
US11/561,735 US7676077B2 (en) | 2005-11-18 | 2006-11-20 | Methods and systems for utilizing design data in combination with inspection data |
PCT/US2006/061113 WO2007120280A2 (en) | 2005-11-18 | 2006-11-20 | Methods and systems for utilizing design data in combination with inspection data |
Publications (2)
Publication Number | Publication Date |
---|---|
IL253189A0 true IL253189A0 (en) | 2017-08-31 |
IL253189B IL253189B (en) | 2018-11-29 |
Family
ID=38610775
Family Applications (14)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL191527A IL191527A (en) | 2005-11-18 | 2008-05-18 | Methods and systems for utilizing design data in combination with inspection data |
IL230235A IL230235A (en) | 2005-11-18 | 2013-12-29 | Methods and systems for utilizing design data in combination with inspection data |
IL230260A IL230260A (en) | 2005-11-18 | 2013-12-31 | Methods and systems for utilizing design data in combination with inspection data |
IL234289A IL234289A (en) | 2005-11-18 | 2014-08-25 | Methods and systems for utilizing design data in combination with inspection data |
IL234290A IL234290A (en) | 2005-11-18 | 2014-08-25 | Methods and systems for utilizing design data in combination with inspection data |
IL234319A IL234319A (en) | 2005-11-18 | 2014-08-26 | Methods and systems for utilizing design data in combination with inspection data |
IL234316A IL234316A (en) | 2005-11-18 | 2014-08-26 | Methods and systems for utilizing design data in combination with inspection data |
IL234317A IL234317A (en) | 2005-11-18 | 2014-08-26 | Methods and systems for utilizing design data in combination with inspection data |
IL234318A IL234318A (en) | 2005-11-18 | 2014-08-26 | Methods and systems for utilizing design data in combination with inspection data |
IL234344A IL234344A (en) | 2005-11-18 | 2014-08-27 | Methods and systems for utilizing design data in combination with inspection data |
IL234345A IL234345A (en) | 2005-11-18 | 2014-08-27 | Methods and systems for utilizing design data in combination with inspection data |
IL234346A IL234346A (en) | 2005-11-18 | 2014-08-27 | Methods and systems for utilizing design data in combination with inspection data |
IL234343A IL234343A (en) | 2005-11-18 | 2014-08-27 | Methods and systems for utilizing design data in combination with inspection data |
IL253189A IL253189B (en) | 2005-11-18 | 2017-06-27 | System and method for assigning classifications to defects detected on a wafer |
Family Applications Before (13)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL191527A IL191527A (en) | 2005-11-18 | 2008-05-18 | Methods and systems for utilizing design data in combination with inspection data |
IL230235A IL230235A (en) | 2005-11-18 | 2013-12-29 | Methods and systems for utilizing design data in combination with inspection data |
IL230260A IL230260A (en) | 2005-11-18 | 2013-12-31 | Methods and systems for utilizing design data in combination with inspection data |
IL234289A IL234289A (en) | 2005-11-18 | 2014-08-25 | Methods and systems for utilizing design data in combination with inspection data |
IL234290A IL234290A (en) | 2005-11-18 | 2014-08-25 | Methods and systems for utilizing design data in combination with inspection data |
IL234319A IL234319A (en) | 2005-11-18 | 2014-08-26 | Methods and systems for utilizing design data in combination with inspection data |
IL234316A IL234316A (en) | 2005-11-18 | 2014-08-26 | Methods and systems for utilizing design data in combination with inspection data |
IL234317A IL234317A (en) | 2005-11-18 | 2014-08-26 | Methods and systems for utilizing design data in combination with inspection data |
IL234318A IL234318A (en) | 2005-11-18 | 2014-08-26 | Methods and systems for utilizing design data in combination with inspection data |
IL234344A IL234344A (en) | 2005-11-18 | 2014-08-27 | Methods and systems for utilizing design data in combination with inspection data |
IL234345A IL234345A (en) | 2005-11-18 | 2014-08-27 | Methods and systems for utilizing design data in combination with inspection data |
IL234346A IL234346A (en) | 2005-11-18 | 2014-08-27 | Methods and systems for utilizing design data in combination with inspection data |
IL234343A IL234343A (en) | 2005-11-18 | 2014-08-27 | Methods and systems for utilizing design data in combination with inspection data |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1955225A4 (en) |
JP (12) | JP5465880B2 (en) |
KR (11) | KR101682838B1 (en) |
IL (14) | IL191527A (en) |
WO (2) | WO2007120279A2 (en) |
Families Citing this family (90)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9002497B2 (en) * | 2003-07-03 | 2015-04-07 | Kla-Tencor Technologies Corp. | Methods and systems for inspection of wafers and reticles using designer intent data |
EP1955225A4 (en) * | 2005-11-18 | 2009-11-04 | Kla Tencor Tech Corp | Methods and systems for utilizing design data in combination with inspection data |
WO2009020885A1 (en) * | 2007-08-03 | 2009-02-12 | Flir Systems, Inc. | Wireless remote detector systems and methods |
JP6185693B2 (en) * | 2008-06-11 | 2017-08-23 | ケーエルエー−テンカー・コーポレーションKla−Tencor Corporation | Systems and methods for detection of design and process defects on wafers, inspection of defects on wafers, selection to use one or more features in the design as process monitoring features, or some combination thereof |
KR101623747B1 (en) | 2008-07-28 | 2016-05-26 | 케이엘에이-텐코어 코오포레이션 | Computer-implemented methods, computer-readable media, and systems for classifying defects detected in a memory device area on a wafer |
JPWO2011004534A1 (en) * | 2009-07-09 | 2012-12-13 | 株式会社日立ハイテクノロジーズ | Semiconductor defect classification method, semiconductor defect classification apparatus, semiconductor defect classification program |
CN102484084B (en) * | 2009-07-17 | 2014-12-10 | 克拉-坦科股份有限公司 | Scanner performance comparison and matching using design and defect data |
JP5603421B2 (en) * | 2010-05-31 | 2014-10-08 | 株式会社日立ハイテクノロジーズ | Charged particle beam equipment with automatic aberration correction method |
EP2447889A1 (en) * | 2010-10-29 | 2012-05-02 | Siemens Aktiengesellschaft | Method for modeling a defect management in a manufacturing process and for handling the defect during the production process based on said modeled defect management |
TWI574136B (en) * | 2012-02-03 | 2017-03-11 | 應用材料以色列公司 | Method of design-based defect classification and system thereof |
US8718353B2 (en) * | 2012-03-08 | 2014-05-06 | Kla-Tencor Corporation | Reticle defect inspection with systematic defect filter |
JP5943722B2 (en) | 2012-06-08 | 2016-07-05 | 三菱重工業株式会社 | Defect determination apparatus, radiation imaging system, and defect determination method |
JP6092602B2 (en) * | 2012-12-04 | 2017-03-08 | 株式会社安永 | Defect inspection apparatus and defect inspection method |
US9202763B2 (en) | 2013-01-16 | 2015-12-01 | Kabushiki Kaisha Toshiba | Defect pattern evaluation method, defect pattern evaluation apparatus, and recording media |
JP6152281B2 (en) * | 2013-02-25 | 2017-06-21 | 株式会社ニューフレアテクノロジー | Pattern inspection method and pattern inspection apparatus |
US10114368B2 (en) * | 2013-07-22 | 2018-10-30 | Applied Materials Israel Ltd. | Closed-loop automatic defect inspection and classification |
US9401016B2 (en) * | 2014-05-12 | 2016-07-26 | Kla-Tencor Corp. | Using high resolution full die image data for inspection |
WO2016005965A1 (en) * | 2014-07-08 | 2016-01-14 | Orbotech Ltd. | Improved systems and methods for computerized direct writing |
US10267746B2 (en) | 2014-10-22 | 2019-04-23 | Kla-Tencor Corp. | Automated pattern fidelity measurement plan generation |
CN107078074B (en) * | 2014-11-25 | 2021-05-25 | 科磊股份有限公司 | Analyzing and utilizing landscape |
US9830421B2 (en) * | 2014-12-31 | 2017-11-28 | Kla-Tencor Corp. | Alignment of inspection to design using built in targets |
US9799575B2 (en) | 2015-12-16 | 2017-10-24 | Pdf Solutions, Inc. | Integrated circuit containing DOEs of NCEM-enabled fill cells |
US10199283B1 (en) | 2015-02-03 | 2019-02-05 | Pdf Solutions, Inc. | Method for processing a semiconductor wager using non-contact electrical measurements indicative of a resistance through a stitch, where such measurements are obtained by scanning a pad comprised of at least three parallel conductive stripes using a moving stage with beam deflection to account for motion of the stage |
US9875536B2 (en) | 2015-03-31 | 2018-01-23 | Kla-Tencor Corp. | Sub-pixel and sub-resolution localization of defects on patterned wafers |
US10539612B2 (en) * | 2015-05-20 | 2020-01-21 | Kla-Tencor Corporation | Voltage contrast based fault and defect inference in logic chips |
US9639645B2 (en) | 2015-06-18 | 2017-05-02 | Globalfoundries Inc. | Integrated circuit chip reliability using reliability-optimized failure mechanism targeting |
US9940704B2 (en) * | 2015-06-19 | 2018-04-10 | KLA—Tencor Corporation | Pre-layer defect site review using design |
US9891275B2 (en) | 2015-06-24 | 2018-02-13 | International Business Machines Corporation | Integrated circuit chip reliability qualification using a sample-specific expected fail rate |
TWI684225B (en) * | 2015-08-28 | 2020-02-01 | 美商克萊譚克公司 | Self directed metrology and pattern classification |
US9576772B1 (en) * | 2015-08-31 | 2017-02-21 | Fei Company | CAD-assisted TEM prep recipe creation |
KR102387459B1 (en) | 2015-11-20 | 2022-04-15 | 삼성전자주식회사 | A method for forming pattern of a semiconductor device |
US10387601B2 (en) * | 2015-11-26 | 2019-08-20 | Kla-Tencor Corporation | Methods to store dynamic layer content inside a design file |
US10978438B1 (en) | 2015-12-16 | 2021-04-13 | Pdf Solutions, Inc. | IC with test structures and E-beam pads embedded within a contiguous standard cell area |
US10593604B1 (en) | 2015-12-16 | 2020-03-17 | Pdf Solutions, Inc. | Process for making semiconductor dies, chips, and wafers using in-line measurements obtained from DOEs of NCEM-enabled fill cells |
TWI797699B (en) * | 2015-12-22 | 2023-04-01 | 以色列商應用材料以色列公司 | Method of deep learning - based examination of a semiconductor specimen and system thereof |
US10656531B2 (en) | 2015-12-22 | 2020-05-19 | Asml Netherlands B.V. | Apparatus and method for process-window characterization |
KR102451650B1 (en) * | 2016-02-05 | 2022-10-11 | 에스케이하이닉스 주식회사 | Stacked type seniconductor apparatus |
KR102483787B1 (en) * | 2016-02-25 | 2023-01-04 | 에스케이하이닉스 주식회사 | Apparatus and Method for Modeling of Defect to Semiconductor Apparatus, and Computer Program Therefor, and System for Inspection of Defect to Semiconductor Apparatus |
US10339262B2 (en) * | 2016-03-29 | 2019-07-02 | Kla-Tencor Corporation | System and method for defining care areas in repeating structures of design data |
US9646961B1 (en) | 2016-04-04 | 2017-05-09 | Pdf Solutions, Inc. | Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, AACNT-short-configured, TS-short-configured, and metal-short-configured, NCEM-enabled fill cells |
US9905553B1 (en) | 2016-04-04 | 2018-02-27 | Pdf Solutions, Inc. | Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, AACNT-short-configured, GATECNT-short-configured, and metal-short-configured, NCEM-enabled fill cells |
US9929063B1 (en) | 2016-04-04 | 2018-03-27 | Pdf Solutions, Inc. | Process for making an integrated circuit that includes NCEM-Enabled, tip-to-side gap-configured fill cells, with NCEM pads formed from at least three conductive stripes positioned between adjacent gates |
US10740888B2 (en) | 2016-04-22 | 2020-08-11 | Kla-Tencor Corporation | Computer assisted weak pattern detection and quantification system |
US11443083B2 (en) * | 2016-05-12 | 2022-09-13 | Asml Netherlands B.V. | Identification of hot spots or defects by machine learning |
US11010886B2 (en) * | 2016-05-17 | 2021-05-18 | Kla-Tencor Corporation | Systems and methods for automatic correction of drift between inspection and design for massive pattern searching |
US10192302B2 (en) * | 2016-05-25 | 2019-01-29 | Kla-Tencor Corporation | Combined patch and design-based defect detection |
US10304177B2 (en) * | 2016-06-29 | 2019-05-28 | Kla-Tencor Corporation | Systems and methods of using z-layer context in logic and hot spot inspection for sensitivity improvement and nuisance suppression |
US10902576B2 (en) * | 2016-08-12 | 2021-01-26 | Texas Instruments Incorporated | System and method for electronic die inking after automatic visual defect inspection |
US10204290B2 (en) * | 2016-10-14 | 2019-02-12 | Kla-Tencor Corporation | Defect review sampling and normalization based on defect and design attributes |
US10395358B2 (en) * | 2016-11-10 | 2019-08-27 | Kla-Tencor Corp. | High sensitivity repeater defect detection |
US11047806B2 (en) * | 2016-11-30 | 2021-06-29 | Kla-Tencor Corporation | Defect discovery and recipe optimization for inspection of three-dimensional semiconductor structures |
US11237119B2 (en) * | 2017-01-10 | 2022-02-01 | Kla-Tencor Corporation | Diagnostic methods for the classifiers and the defects captured by optical tools |
US9748153B1 (en) | 2017-03-29 | 2017-08-29 | Pdf Solutions, Inc. | Process for making and using a semiconductor wafer containing first and second does of standard cell compatible, NCEM-enabled fill cells, with the first DOE including side-to-side short configured fill cells, and the second DOE including tip-to-side short configure |
US9773774B1 (en) | 2017-03-30 | 2017-09-26 | Pdf Solutions, Inc. | Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including chamfer short configured fill cells, and the second DOE including corner short configured fill cells |
US10598617B2 (en) * | 2017-05-05 | 2020-03-24 | Kla-Tencor Corporation | Metrology guided inspection sample shaping of optical inspection results |
JP6819451B2 (en) * | 2017-05-08 | 2021-01-27 | 信越化学工業株式会社 | Large synthetic quartz glass substrate and its evaluation method and manufacturing method |
JP6864122B2 (en) * | 2017-05-22 | 2021-04-21 | ケーエルエー コーポレイション | Zonal analysis for recipe optimization and measurement |
KR102440742B1 (en) * | 2017-05-25 | 2022-09-05 | 삼성전자주식회사 | Inspecting system for semiconductor device and operating method of the same |
US10648925B2 (en) * | 2017-06-05 | 2020-05-12 | Kla-Tencor Corporation | Repeater defect detection |
CN110741374B (en) * | 2017-06-06 | 2024-06-11 | 科磊股份有限公司 | Photomask optimization algorithm and optimal target design |
US9786649B1 (en) | 2017-06-27 | 2017-10-10 | Pdf Solutions, Inc. | Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including via open configured fill cells, and the second DOE including stitch open configured fill cells |
US9768083B1 (en) | 2017-06-27 | 2017-09-19 | Pdf Solutions, Inc. | Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including merged-via open configured fill cells, and the second DOE including snake open configured fill cells |
US10096530B1 (en) | 2017-06-28 | 2018-10-09 | Pdf Solutions, Inc. | Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including merged-via open configured fill cells, and the second DOE including stitch open configured fill cells |
US9865583B1 (en) | 2017-06-28 | 2018-01-09 | Pdf Solutions, Inc. | Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including snake open configured fill cells, and the second DOE including stitch open configured fill cells |
US10620135B2 (en) * | 2017-07-19 | 2020-04-14 | Kla-Tencor Corp. | Identifying a source of nuisance defects on a wafer |
KR102614266B1 (en) * | 2017-08-22 | 2023-12-14 | 삼성전자주식회사 | A method for wafer inspection, and a method for manufacturing a semiconductor device using the same |
US11037286B2 (en) * | 2017-09-28 | 2021-06-15 | Applied Materials Israel Ltd. | Method of classifying defects in a semiconductor specimen and system thereof |
KR20190073756A (en) | 2017-12-19 | 2019-06-27 | 삼성전자주식회사 | Semiconductor defect classification device, method for classifying defect of semiconductor, and semiconductor defect classification system |
CA3091988A1 (en) | 2018-02-26 | 2019-08-29 | F. Hoffmann-La Roche Ag | Methods and systems for calibrating and using a camera for detecting an analyte in a sample |
US10585049B2 (en) * | 2018-03-10 | 2020-03-10 | Kla-Tencor Corporation | Process-induced excursion characterization |
US10677588B2 (en) * | 2018-04-09 | 2020-06-09 | Kla-Tencor Corporation | Localized telecentricity and focus optimization for overlay metrology |
US11797950B2 (en) * | 2018-08-27 | 2023-10-24 | Basf Corporation | Method and system to digitally track and monitor an automotive refinish repair process |
WO2020079809A1 (en) * | 2018-10-18 | 2020-04-23 | 株式会社図研 | Design aid device, design aid method, and program |
US11049745B2 (en) * | 2018-10-19 | 2021-06-29 | Kla Corporation | Defect-location determination using correction loop for pixel alignment |
US11600505B2 (en) | 2018-10-31 | 2023-03-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems and methods for systematic physical failure analysis (PFA) fault localization |
CN109583721B (en) * | 2018-11-16 | 2024-06-18 | 北京奇虎科技有限公司 | Channel assessment method and device and electronic equipment |
JP2020161769A (en) * | 2019-03-28 | 2020-10-01 | Tasmit株式会社 | Image generation method |
TWI700644B (en) * | 2019-04-02 | 2020-08-01 | 精英電腦股份有限公司 | Synchronous positioning device and method for circuit board or plate member |
JP7245733B2 (en) * | 2019-06-26 | 2023-03-24 | 株式会社日立ハイテク | Wafer observation device and wafer observation method |
US11526152B2 (en) * | 2019-12-19 | 2022-12-13 | X Development Llc | Techniques for determining fabricability of designs by searching for forbidden patterns |
CN113820922A (en) * | 2020-06-18 | 2021-12-21 | 台湾积体电路制造股份有限公司 | Hot spot prediction method, device and recording medium |
CN111708255B (en) * | 2020-06-19 | 2023-03-07 | 上海华虹宏力半导体制造有限公司 | Method for forming SSA table of OPC |
JP7526940B2 (en) * | 2020-09-11 | 2024-08-02 | パナソニックIpマネジメント株式会社 | Information processing method and information processing device |
JP7443268B2 (en) | 2021-01-05 | 2024-03-05 | 株式会社ニューフレアテクノロジー | Defect inspection method |
EP4315178A1 (en) * | 2021-03-30 | 2024-02-07 | Siemens Industry Software Inc. | Method and system for detecting a false error on a component of a board inspected by an aoi machine |
KR20230033445A (en) | 2021-09-01 | 2023-03-08 | 에스케이하이닉스 주식회사 | Method for failure analysis on semiconductor wafer and system thereof |
KR102672272B1 (en) * | 2022-02-11 | 2024-06-04 | 큐알티 주식회사 | Beam inspection apparatus comprising plurality of a guide concentric circle for testing of semiconductor, and method of inspection for beam |
KR102547617B1 (en) * | 2022-06-23 | 2023-06-26 | 큐알티 주식회사 | Semiconductor device test apparatus that provides an accelerated environment and method for testing semiconductor devices in an accelerated environment using the same |
US20240112326A1 (en) * | 2022-09-30 | 2024-04-04 | Kla Corporation | Inspection of adaptive patterned workpieces with dynamic design and deep learning-based rendering |
KR102594471B1 (en) * | 2022-12-07 | 2023-10-26 | 주식회사디아이 | Multi-test zone controller for semiconductor test equipment |
Family Cites Families (63)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02110565A (en) * | 1988-10-20 | 1990-04-23 | Matsushita Electron Corp | Method and device for photo-mask inspection |
US5054097A (en) * | 1988-11-23 | 1991-10-01 | Schlumberger Technologies, Inc. | Methods and apparatus for alignment of images |
US5252507A (en) * | 1990-03-30 | 1993-10-12 | Tactical Fabs, Inc. | Very high density wafer scale device architecture |
JP3017839B2 (en) * | 1991-06-10 | 2000-03-13 | 東芝機械株式会社 | Defect inspection method and inspection device |
JP3730263B2 (en) | 1992-05-27 | 2005-12-21 | ケーエルエー・インストルメンツ・コーポレーション | Apparatus and method for automatic substrate inspection using charged particle beam |
JPH06119452A (en) * | 1992-10-02 | 1994-04-28 | Fujitsu Ltd | Device and method for processing image |
JPH06265480A (en) * | 1993-03-12 | 1994-09-22 | Toshiba Corp | Pattern defect inspection method and device |
JP3370379B2 (en) * | 1993-03-19 | 2003-01-27 | 株式会社日立製作所 | Method for manufacturing semiconductor device |
JP3051279B2 (en) * | 1993-05-13 | 2000-06-12 | シャープ株式会社 | Bump appearance inspection method and bump appearance inspection device |
US5544256A (en) | 1993-10-22 | 1996-08-06 | International Business Machines Corporation | Automated defect classification system |
JP3466286B2 (en) * | 1994-08-09 | 2003-11-10 | 富士通株式会社 | Pattern inspection method and pattern inspection device |
US5991699A (en) | 1995-05-04 | 1999-11-23 | Kla Instruments Corporation | Detecting groups of defects in semiconductor feature space |
JPH0915161A (en) * | 1995-06-27 | 1997-01-17 | Hitachi Ltd | Method and equipment for defect inspection |
JPH10260011A (en) * | 1997-03-19 | 1998-09-29 | Olympus Optical Co Ltd | Positioning device |
JP3564958B2 (en) | 1997-08-07 | 2004-09-15 | 株式会社日立製作所 | Inspection method and inspection apparatus using electron beam |
JPH11251377A (en) * | 1998-03-02 | 1999-09-17 | Hitachi Ltd | Defect inspection method/device and observation or analysis method/system for defect |
JP4073088B2 (en) * | 1998-08-20 | 2008-04-09 | 株式会社ルネサステクノロジ | Manufacturing method of semiconductor substrate |
JP2000065747A (en) * | 1998-08-26 | 2000-03-03 | Toshiba Corp | Apparatus and method for inspection of defect of pattern |
JP2000306964A (en) * | 1999-04-22 | 2000-11-02 | Hitachi Ltd | Inspection data processing method, and inspection data processor |
JP2000200356A (en) * | 1999-01-08 | 2000-07-18 | Hitachi Ltd | Method and device for defect classification |
JP3350477B2 (en) * | 1999-04-02 | 2002-11-25 | セイコーインスツルメンツ株式会社 | Wafer inspection equipment |
JP2001230289A (en) * | 2000-02-15 | 2001-08-24 | Hitachi Ltd | Fault analyzing method and system |
US7120285B1 (en) * | 2000-02-29 | 2006-10-10 | Advanced Micro Devices, Inc. | Method for evaluation of reticle image using aerial image simulator |
US6862142B2 (en) * | 2000-03-10 | 2005-03-01 | Kla-Tencor Technologies Corporation | Multi-detector microscopic inspection system |
US6507800B1 (en) * | 2000-03-13 | 2003-01-14 | Promos Technologies, Inc. | Method for testing semiconductor wafers |
JP3920003B2 (en) * | 2000-04-25 | 2007-05-30 | 株式会社ルネサステクノロジ | Inspection data processing method and apparatus |
FR2813145B1 (en) * | 2000-08-18 | 2002-11-29 | St Microelectronics Sa | METHOD FOR MANUFACTURING A CAPACITOR WITHIN AN INTEGRATED CIRCUIT, AND CORRESPONDING INTEGRATED CIRCUIT |
US6634018B2 (en) * | 2000-08-24 | 2003-10-14 | Texas Instruments Incorporated | Optical proximity correction |
JP3678133B2 (en) * | 2000-10-30 | 2005-08-03 | 株式会社日立製作所 | Inspection system and semiconductor device manufacturing method |
US7302090B2 (en) * | 2000-11-30 | 2007-11-27 | Synopsys, Inc. | Method and device for determining the properties of an integrated circuit |
JP2002244275A (en) * | 2001-02-15 | 2002-08-30 | Toshiba Corp | Method and device for defect inspection of photomask and recording medium |
JP4014379B2 (en) * | 2001-02-21 | 2007-11-28 | 株式会社日立製作所 | Defect review apparatus and method |
JP2003023056A (en) * | 2001-07-10 | 2003-01-24 | Hitachi Ltd | Method for sorting defect of semiconductor device, method for predicting yield of the semiconductor device, method for manufacturing the semiconductor device, defect-sorting system of semiconductor device and semiconductor device-sorting apparatus, and program used therefor and recording medium |
JP4122735B2 (en) * | 2001-07-24 | 2008-07-23 | 株式会社日立製作所 | Semiconductor device inspection method and inspection condition setting method |
JP3904419B2 (en) * | 2001-09-13 | 2007-04-11 | 株式会社日立製作所 | Inspection device and inspection system |
US6751519B1 (en) * | 2001-10-25 | 2004-06-15 | Kla-Tencor Technologies Corporation | Methods and systems for predicting IC chip yield |
US6918101B1 (en) | 2001-10-25 | 2005-07-12 | Kla -Tencor Technologies Corporation | Apparatus and methods for determining critical area of semiconductor design data |
US6886153B1 (en) | 2001-12-21 | 2005-04-26 | Kla-Tencor Corporation | Design driven inspection or measurement for semiconductor using recipe |
JP2003215060A (en) * | 2002-01-22 | 2003-07-30 | Tokyo Seimitsu Co Ltd | Pattern inspection method and inspection apparatus |
JP2004031709A (en) * | 2002-06-27 | 2004-01-29 | Seiko Instruments Inc | Waferless measuring recipe generating system |
JP4073265B2 (en) * | 2002-07-09 | 2008-04-09 | 富士通株式会社 | Inspection apparatus and inspection method |
US6959251B2 (en) | 2002-08-23 | 2005-10-25 | Kla-Tencor Technologies, Corporation | Inspection system setup techniques |
JP2004117016A (en) * | 2002-09-24 | 2004-04-15 | Nec Kansai Ltd | Semiconductor wafer defect inspecting apparatus |
US7457736B2 (en) * | 2002-11-21 | 2008-11-25 | Synopsys, Inc. | Automated creation of metrology recipes |
US6882745B2 (en) * | 2002-12-19 | 2005-04-19 | Freescale Semiconductor, Inc. | Method and apparatus for translating detected wafer defect coordinates to reticle coordinates using CAD data |
JP2004227886A (en) * | 2003-01-22 | 2004-08-12 | Hitachi High-Technologies Corp | Scanning electron microscope |
JP2004296592A (en) * | 2003-03-26 | 2004-10-21 | Dainippon Screen Mfg Co Ltd | Defect classification equipment, defect classification method, and program |
JP4230838B2 (en) * | 2003-06-27 | 2009-02-25 | 株式会社日立ハイテクノロジーズ | Inspection recipe setting method and defect inspection method in defect inspection apparatus |
JP2004294358A (en) * | 2003-03-28 | 2004-10-21 | Hitachi High-Technologies Corp | Method and apparatus for inspecting defect |
US6952653B2 (en) * | 2003-04-29 | 2005-10-04 | Kla-Tencor Technologies Corporation | Single tool defect classification solution |
JP2004333386A (en) * | 2003-05-09 | 2004-11-25 | Nec Corp | Reticle inspection apparatus and reticle inspection method |
JP4229767B2 (en) * | 2003-06-30 | 2009-02-25 | 株式会社東京精密 | Image defect inspection method, image defect inspection apparatus, and appearance inspection apparatus |
US9002497B2 (en) * | 2003-07-03 | 2015-04-07 | Kla-Tencor Technologies Corp. | Methods and systems for inspection of wafers and reticles using designer intent data |
US7135344B2 (en) | 2003-07-11 | 2006-11-14 | Applied Materials, Israel, Ltd. | Design-based monitoring |
KR20050072166A (en) * | 2004-01-02 | 2005-07-11 | 삼성전자주식회사 | Method for testing wafer |
JP4771714B2 (en) * | 2004-02-23 | 2011-09-14 | 株式会社Ngr | Pattern inspection apparatus and method |
US7194709B2 (en) * | 2004-03-05 | 2007-03-20 | Keith John Brankner | Automatic alignment of integrated circuit and design layout of integrated circuit to more accurately assess the impact of anomalies |
JP4778685B2 (en) * | 2004-03-10 | 2011-09-21 | 株式会社日立ハイテクノロジーズ | Pattern shape evaluation method and apparatus for semiconductor device |
JP2005283326A (en) * | 2004-03-30 | 2005-10-13 | Hitachi High-Technologies Corp | Defect review method and its device |
US7137083B2 (en) * | 2004-04-01 | 2006-11-14 | Verigy Ipco | Verification of integrated circuit tests using test simulation and integrated circuit simulation with simulated failure |
JP4154374B2 (en) * | 2004-08-25 | 2008-09-24 | 株式会社日立ハイテクノロジーズ | Pattern matching device and scanning electron microscope using the same |
US7760347B2 (en) * | 2005-05-13 | 2010-07-20 | Applied Materials, Inc. | Design-based method for grouping systematic defects in lithography pattern writing system |
EP1955225A4 (en) * | 2005-11-18 | 2009-11-04 | Kla Tencor Tech Corp | Methods and systems for utilizing design data in combination with inspection data |
-
2006
- 2006-11-20 EP EP06850792A patent/EP1955225A4/en not_active Withdrawn
- 2006-11-20 KR KR1020157002473A patent/KR101682838B1/en active Application Filing
- 2006-11-20 KR KR1020147015035A patent/KR101565071B1/en active IP Right Grant
- 2006-11-20 KR KR1020087014775A patent/KR101285967B1/en active IP Right Grant
- 2006-11-20 WO PCT/US2006/061112 patent/WO2007120279A2/en active Application Filing
- 2006-11-20 JP JP2008541507A patent/JP5465880B2/en active Active
- 2006-11-20 KR KR1020137009231A patent/KR101370154B1/en active IP Right Grant
- 2006-11-20 KR KR1020137006368A patent/KR101665168B1/en active IP Right Grant
- 2006-11-20 KR KR1020167033159A patent/KR101789004B1/en active IP Right Grant
- 2006-11-20 KR KR1020157030359A patent/KR101672157B1/en active IP Right Grant
- 2006-11-20 KR KR1020137009234A patent/KR101530456B1/en active IP Right Grant
- 2006-11-20 KR KR1020177029140A patent/KR101885585B1/en active IP Right Grant
- 2006-11-20 KR KR1020187021977A patent/KR20180088924A/en not_active Application Discontinuation
- 2006-11-20 WO PCT/US2006/061113 patent/WO2007120280A2/en active Application Filing
- 2006-11-20 KR KR1020157000055A patent/KR101613048B1/en active IP Right Grant
-
2008
- 2008-05-18 IL IL191527A patent/IL191527A/en active IP Right Grant
-
2012
- 2012-05-15 JP JP2012111262A patent/JP5466264B2/en active Active
-
2013
- 2013-06-27 JP JP2013134802A patent/JP5763712B2/en active Active
- 2013-06-27 JP JP2013134798A patent/JP5932723B2/en active Active
- 2013-12-29 IL IL230235A patent/IL230235A/en active IP Right Grant
- 2013-12-31 IL IL230260A patent/IL230260A/en active IP Right Grant
-
2014
- 2014-04-04 JP JP2014077804A patent/JP6023116B2/en active Active
- 2014-08-25 IL IL234289A patent/IL234289A/en active IP Right Grant
- 2014-08-25 IL IL234290A patent/IL234290A/en active IP Right Grant
- 2014-08-26 IL IL234319A patent/IL234319A/en active IP Right Grant
- 2014-08-26 IL IL234316A patent/IL234316A/en active IP Right Grant
- 2014-08-26 IL IL234317A patent/IL234317A/en active IP Right Grant
- 2014-08-26 IL IL234318A patent/IL234318A/en active IP Right Grant
- 2014-08-27 IL IL234344A patent/IL234344A/en active IP Right Grant
- 2014-08-27 IL IL234345A patent/IL234345A/en active IP Right Grant
- 2014-08-27 IL IL234346A patent/IL234346A/en active IP Right Grant
- 2014-08-27 IL IL234343A patent/IL234343A/en active IP Right Grant
- 2014-12-17 JP JP2014255558A patent/JP5965467B2/en active Active
- 2014-12-17 JP JP2014255556A patent/JP5869657B2/en active Active
-
2015
- 2015-09-17 JP JP2015184050A patent/JP6312641B2/en active Active
- 2015-09-17 JP JP2015184061A patent/JP6312642B2/en active Active
-
2016
- 2016-02-24 JP JP2016033027A patent/JP6127170B2/en active Active
- 2016-02-24 JP JP2016033030A patent/JP6364036B2/en active Active
- 2016-02-24 JP JP2016033028A patent/JP6360845B2/en active Active
-
2017
- 2017-06-27 IL IL253189A patent/IL253189B/en active IP Right Grant
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IL253189A0 (en) | System and method for assigning classifications to defects detected on a wafer | |
TWI371073B (en) | Wafer inspection system and a method for translating wafers | |
GB2444222B (en) | Inspection system for inspecting a structure and associated method | |
HUE036690T2 (en) | Method and system for inspecting indirect bandgap semiconductor structure | |
EP1928583A4 (en) | A method and a system for establishing an inspection recipe | |
EP1820031A4 (en) | System and method for fall detection | |
GB2444457B (en) | Method for dynamic sensor network processing | |
GB2421796B (en) | Nondestructive inspection method | |
EP1938250A4 (en) | System and method for image processing | |
EP1846134A4 (en) | System and method for processing biomass | |
EP1921671A4 (en) | Wafer level burn-in method and wafer level burn-in system | |
EP1958077A4 (en) | System and method for providing a presence service | |
EP2063243A4 (en) | Smart coating for damage detected information, inspecting device and damage inspecting method using said coating | |
EP1877918A4 (en) | System and method for scheduling device management | |
EP1949690A4 (en) | Inspection system and method | |
EP1929061A4 (en) | A pipelined inspection system and a method for inspecting a diced wafer | |
PL1901059T3 (en) | Method for forming master data for inspecting protruding and recessed figure | |
IL189712A0 (en) | Device and method for inspecting an object | |
EP1904833A4 (en) | Method and apparatus for detecting overlapped substrates | |
TWI315554B (en) | System, method and apparatus for in-situ substrate inspection | |
GB0414742D0 (en) | Method and system for test case generation | |
SG126061A1 (en) | System and method for designing semiconductor photomasks | |
EP1883974A4 (en) | System and method for testing a photovoltaic module | |
GB0518461D0 (en) | Method and apparatus for deploying pipeline | |
TWI315897B (en) | Method and system for inspecting the image on a wafer |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FF | Patent granted | ||
KB | Patent renewed | ||
KB | Patent renewed |