IL234346A - Methods and systems for utilizing design data in combination with inspection data - Google Patents

Methods and systems for utilizing design data in combination with inspection data

Info

Publication number
IL234346A
IL234346A IL234346A IL23434614A IL234346A IL 234346 A IL234346 A IL 234346A IL 234346 A IL234346 A IL 234346A IL 23434614 A IL23434614 A IL 23434614A IL 234346 A IL234346 A IL 234346A
Authority
IL
Israel
Prior art keywords
systems
methods
combination
data
utilizing design
Prior art date
Application number
IL234346A
Other languages
Hebrew (he)
Original Assignee
Kla Tencor Tech Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US73829005P priority Critical
Priority to US73794705P priority
Priority to US11/561,659 priority patent/US7570796B2/en
Priority to US11/561,735 priority patent/US7676077B2/en
Priority to PCT/US2006/061113 priority patent/WO2007120280A2/en
Application filed by Kla Tencor Tech Corporation filed Critical Kla Tencor Tech Corporation
Publication of IL234346A publication Critical patent/IL234346A/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • G06T7/001Industrial image inspection using an image reference approach
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854Grading and classifying of flaws
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/31718Logistic aspects, e.g. binning, selection, sorting of devices under test, tester/handler interaction networks, Test management software, e.g. software for test statistics or test evaluation, yield analysis
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30148Semiconductor; IC; Wafer
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
IL234346A 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data IL234346A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US73829005P true 2005-11-18 2005-11-18
US73794705P true 2005-11-18 2005-11-18
US11/561,659 US7570796B2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data
US11/561,735 US7676077B2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data
PCT/US2006/061113 WO2007120280A2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data

Publications (1)

Publication Number Publication Date
IL234346A true IL234346A (en) 2017-07-31

Family

ID=38610775

Family Applications (14)

Application Number Title Priority Date Filing Date
IL191527A IL191527A (en) 2005-11-18 2008-05-18 Methods and systems for utilizing design data in combination with inspection data
IL230235A IL230235A (en) 2005-11-18 2013-12-29 Methods and systems for utilizing design data in combination with inspection data
IL230260A IL230260A (en) 2005-11-18 2013-12-31 Methods and systems for utilizing design data in combination with inspection data
IL234290A IL234290A (en) 2005-11-18 2014-08-25 Methods and systems for utilizing design data in combination with inspection data
IL234289A IL234289A (en) 2005-11-18 2014-08-25 Methods and systems for utilizing design data in combination with inspection data
IL234317A IL234317A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234319A IL234319A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234316A IL234316A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234318A IL234318A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234345A IL234345A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL234343A IL234343A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL234346A IL234346A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL234344A IL234344A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL253189A IL253189A (en) 2005-11-18 2017-06-27 System and method for assigning classifications to defects detected on a wafer

Family Applications Before (11)

Application Number Title Priority Date Filing Date
IL191527A IL191527A (en) 2005-11-18 2008-05-18 Methods and systems for utilizing design data in combination with inspection data
IL230235A IL230235A (en) 2005-11-18 2013-12-29 Methods and systems for utilizing design data in combination with inspection data
IL230260A IL230260A (en) 2005-11-18 2013-12-31 Methods and systems for utilizing design data in combination with inspection data
IL234290A IL234290A (en) 2005-11-18 2014-08-25 Methods and systems for utilizing design data in combination with inspection data
IL234289A IL234289A (en) 2005-11-18 2014-08-25 Methods and systems for utilizing design data in combination with inspection data
IL234317A IL234317A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234319A IL234319A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234316A IL234316A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234318A IL234318A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234345A IL234345A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL234343A IL234343A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data

Family Applications After (2)

Application Number Title Priority Date Filing Date
IL234344A IL234344A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL253189A IL253189A (en) 2005-11-18 2017-06-27 System and method for assigning classifications to defects detected on a wafer

Country Status (5)

Country Link
EP (1) EP1955225A4 (en)
JP (12) JP5465880B2 (en)
KR (11) KR101789004B1 (en)
IL (14) IL191527A (en)
WO (2) WO2007120280A2 (en)

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US10593604B1 (en) 2015-12-16 2020-03-17 Pdf Solutions, Inc. Process for making semiconductor dies, chips, and wafers using in-line measurements obtained from DOEs of NCEM-enabled fill cells
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Also Published As

Publication number Publication date
IL234317A (en) 2017-04-30
JP2016029376A (en) 2016-03-03
IL234343A (en) 2016-11-30
JP5965467B2 (en) 2016-08-03
WO2007120279A2 (en) 2007-10-25
JP2016106228A (en) 2016-06-16
KR101885585B1 (en) 2018-08-07
EP1955225A4 (en) 2009-11-04
IL234289A (en) 2016-10-31
KR20130043223A (en) 2013-04-29
JP2009516832A (en) 2009-04-23
IL230260A (en) 2016-05-31
IL234318A (en) 2017-04-30
JP2013217940A (en) 2013-10-24
IL234316A (en) 2017-04-30
KR101672157B1 (en) 2016-11-02
JP5466264B2 (en) 2014-04-09
IL234345A (en) 2016-11-30
JP2016136151A (en) 2016-07-28
KR20130055014A (en) 2013-05-27
KR101565071B1 (en) 2015-11-03
EP1955225A2 (en) 2008-08-13
JP2016011962A (en) 2016-01-21
JP6127170B2 (en) 2017-05-10
KR20180088924A (en) 2018-08-07
JP2016139811A (en) 2016-08-04
KR101285967B1 (en) 2013-07-12
KR101370154B1 (en) 2014-03-04
IL234290A (en) 2016-10-31
KR20130055013A (en) 2013-05-27
JP6360845B2 (en) 2018-07-18
JP5932723B2 (en) 2016-06-08
KR101613048B1 (en) 2016-04-15
JP6312641B2 (en) 2018-04-18
KR20150033708A (en) 2015-04-01
WO2007120279A3 (en) 2008-11-20
KR20160138593A (en) 2016-12-05
KR101530456B1 (en) 2015-06-22
JP6312642B2 (en) 2018-04-18
IL234344A (en) 2016-11-30
KR20080080130A (en) 2008-09-02
WO2007120280A2 (en) 2007-10-25
JP6023116B2 (en) 2016-11-09
IL191527A (en) 2014-09-30
KR101789004B1 (en) 2017-10-20
KR101682838B1 (en) 2016-12-12
KR20170118240A (en) 2017-10-24
JP5465880B2 (en) 2014-04-09
IL191527D0 (en) 2008-12-29
JP5763712B2 (en) 2015-08-12
IL253189D0 (en) 2017-08-31
IL234319A (en) 2016-10-31
KR20150123962A (en) 2015-11-04
JP2015062034A (en) 2015-04-02
JP2014167476A (en) 2014-09-11
WO2007120280A3 (en) 2008-09-18
IL230235A (en) 2015-05-31
JP2015092173A (en) 2015-05-14
JP2012168195A (en) 2012-09-06
IL253189A (en) 2018-11-29
JP6364036B2 (en) 2018-07-25
JP2013238606A (en) 2013-11-28
KR20140091575A (en) 2014-07-21
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JP5869657B2 (en) 2016-02-24

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