TWI660856B - Improved systems and methods for computerized direct writing - Google Patents
Improved systems and methods for computerized direct writing Download PDFInfo
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- TWI660856B TWI660856B TW104120198A TW104120198A TWI660856B TW I660856 B TWI660856 B TW I660856B TW 104120198 A TW104120198 A TW 104120198A TW 104120198 A TW104120198 A TW 104120198A TW I660856 B TWI660856 B TW I660856B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/47—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0082—Digital printing on bodies of particular shapes
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Abstract
本發明揭示一種在一圖案化基板上電腦化直接光學書寫之方法,其包含下列步驟:提供一印刷指令資料庫,其含有用於在該圖案化基板上印刷之精確指令;使該圖案化基板成像以提供一圖案化基板影像;及採用一電腦以用於至少參考該印刷指令資料庫及該圖案化基板影像以用於指示一光學書寫器根據該等精確指令在該圖案化基板上書寫,而無需在該成像與該指示之間的時間期間執行該印刷指令資料庫與該圖案化基板之間的基準配準。 The invention discloses a method for computerized direct optical writing on a patterned substrate, which comprises the following steps: providing a printing instruction database containing precise instructions for printing on the patterned substrate; and making the patterned substrate Imaging to provide a patterned substrate image; and using a computer to reference at least the print instruction database and the patterned substrate image for instructing an optical writer to write on the patterned substrate according to the precise instructions, There is no need to perform reference registration between the print instruction database and the patterned substrate during the time between the imaging and the indication.
Description
本發明大體係關於電腦化直接書寫。 The large system of the present invention relates to computerized direct writing.
技術中已知電腦化直接書寫之各種方法。本發明尋求提供電腦化直接書寫之改良系統及方法。舉例而言,描述具有最先進技術方法之一狀態之美國專利案7,508,515,該案之全部內容以引用之方式併入本文中。 Various methods of computerized direct writing are known in the art. The present invention seeks to provide an improved system and method for computerized direct writing. By way of example, US Patent No. 7,508,515 describing one of the state of the art technology methods is incorporated herein by reference in its entirety.
本發明尋求提供一種電腦化直接書寫之改良系統及方法。 The present invention seeks to provide an improved system and method for computerized direct writing.
根據本發明之該系統及方法之一優勢在於,其可產生優於基於基準配準之方法之改良印刷準確度,由於其可提供每個元素或元素群組之較佳準確度,且該印刷方法可補償基板之總體及局部變形。 One advantage of the system and method according to the present invention is that it can produce improved printing accuracy that is superior to the method based on reference registration, because it can provide better accuracy for each element or group of elements, and the printing The method can compensate the overall and local deformation of the substrate.
因此,根據本發明之一較佳實施例提供一種用於在一圖案化基板上電腦化直接光學書寫之方法,其包含下列步驟:提供一印刷指令資料庫,其含有用於在該圖案化基板上印刷之精確指令;使該圖案化基板成像以提供一圖案化基板影像;及採用一電腦以用於至少參考該印刷指令資料庫及該圖案化基板影像以用於指示一光學書寫器根據該等精確指令在該圖案化基板上書寫,而無需在該成像與該指示之間的時間期間執行該印刷指令資料庫與該圖案化基板之間的基準配準。 Therefore, according to a preferred embodiment of the present invention, a method for computerized direct optical writing on a patterned substrate is provided. The method includes the following steps: A print instruction database is provided, which contains a database for Precise instructions printed on; imaging the patterned substrate to provide a patterned substrate image; and using a computer for referencing at least the print instruction database and the patterned substrate image for instructing an optical writer to The precise instructions are written on the patterned substrate without performing a reference registration between the print instruction database and the patterned substrate during the time between the imaging and the instruction.
較佳地,至少參考該印刷指令資料庫及該圖案化基板影像以用於指示一光學書寫器根據該等精確指令在該圖案化基板上書寫亦包含:提供對應於該圖案化基板之CAM資料;該圖案化基板之一成像影像與對應於該圖案化基板之該CAM資料之電腦化相互覆疊;及利用來自該覆疊層之資訊來提供該等精確指令。 Preferably, at least referring to the printing instruction database and the patterned substrate image for instructing an optical writer to write on the patterned substrate according to the precise instructions also includes: providing CAM data corresponding to the patterned substrate ; An imaging image of one of the patterned substrates and a computerization of the CAM data corresponding to the patterned substrate overlap; and the information from the overlay is used to provide the precise instructions.
較佳地,利用來自該覆疊層之資訊來提供該等精確指令包含利用該CAM資料來修改該印刷指令資料庫中含有之該等精確指令。另外,該印刷指令資料庫用來修改於該利用步驟中使用之該CAM資料。 Preferably, using the information from the overlay to provide the precise instructions includes using the CAM data to modify the precise instructions contained in the print instruction database. In addition, the print instruction database is used to modify the CAM data used in the utilization step.
較佳地,藉由一自動化光學檢測子系統執行該成像。較佳地,該光學書寫器係一直接成像子系統。 Preferably, the imaging is performed by an automated optical detection subsystem. Preferably, the optical writer is a direct imaging subsystem.
根據本發明之另一較佳實施例亦提供一種用於在一圖案化基板上電腦化直接光學書寫之系統,其包含:一印刷指令資料庫,其含有用於在該圖案化基板上印刷之精確指令;成像功能性,其可操作用於使該圖案化基板成像以提供一圖案化基板影像;及一電腦,其可操作用於至少參考該印刷指令資料庫及該圖案化基板影像且用於指示一光學書寫器根據該等精確指令在該圖案化基板上書寫,而無需該成像與該指示之間的時間期間執行該印刷指令資料庫與該圖案化基板之間的基準配準。 According to another preferred embodiment of the present invention, a system for computerized direct optical writing on a patterned substrate is also provided. The system includes: a print instruction database containing information for printing on the patterned substrate Precise instructions; imaging functionality operable to image the patterned substrate to provide a patterned substrate image; and a computer operable to reference at least the print instruction database and the patterned substrate image and use When instructing an optical writer to write on the patterned substrate according to the precise instructions, a reference registration between the print instruction database and the patterned substrate is performed without a time period between the imaging and the instruction.
較佳地,該電腦亦可操作用於該圖案化基板之一成像圖案與對應於該圖案化基板之CAM資料之相互覆疊,且用於利用來自該覆疊層之資訊來提供該等精確指令。 Preferably, the computer is also operable to overlap one imaging pattern of the patterned substrate and the CAM data corresponding to the patterned substrate, and to use the information from the overlay to provide the accuracy instruction.
較佳地,該電腦亦可操作用於利用該CAM資料來修改該印刷指令資料庫中含有之該等精確指令。另外,該印刷指令資料庫用來修改藉由該電腦使用之該CAM資料。 Preferably, the computer is also operable to use the CAM data to modify the precise instructions contained in the print instruction database. In addition, the print order database is used to modify the CAM data used by the computer.
較佳地,該成像功能性經封裝於一自動化光學檢測子系統中。 較佳地,該光學書寫器係一直接成像子系統。 Preferably, the imaging functionality is packaged in an automated optical detection subsystem. Preferably, the optical writer is a direct imaging subsystem.
101‧‧‧機架 101‧‧‧ Rack
102‧‧‧光學桌 102‧‧‧Optical Table
104‧‧‧基板支撐表面 104‧‧‧ substrate support surface
106‧‧‧圖案化基板 106‧‧‧ patterned substrate
112‧‧‧橋 112‧‧‧bridge
114‧‧‧第一軸 114‧‧‧ first axis
116‧‧‧讀/寫總成 116‧‧‧Read / write assembly
118‧‧‧第二軸 118‧‧‧Second axis
124‧‧‧控制總成 124‧‧‧Control Assembly
126‧‧‧電腦 126‧‧‧Computer
128‧‧‧使用者介面 128‧‧‧user interface
130‧‧‧印刷指令資料庫 130‧‧‧Printing instruction database
132‧‧‧自動化光學檢測子系統(AOI) 132‧‧‧Automated Optical Inspection Subsystem (AOI)
134‧‧‧圖案化基板影像 134‧‧‧patterned substrate image
136‧‧‧直接成像子系統(DI) 136‧‧‧Direct Imaging Subsystem (DI)
138‧‧‧印刷指令 138‧‧‧Printing instructions
201‧‧‧運動機架 201‧‧‧Sports rack
202‧‧‧下部固定式機架 202‧‧‧ Lower fixed rack
203‧‧‧軸 203‧‧‧axis
204‧‧‧基板支撐表面 204‧‧‧ substrate support surface
206‧‧‧圖案化基板 206‧‧‧patterned substrate
212‧‧‧固定式橋 212‧‧‧ fixed bridge
224‧‧‧控制總成 224‧‧‧Control Assembly
226‧‧‧電腦 226‧‧‧Computer
230‧‧‧印刷指令資料庫 230‧‧‧Printing instruction database
232‧‧‧自動化光學檢測子系統(AOI) 232‧‧‧Automated Optical Inspection Subsystem (AOI)
234‧‧‧圖案化基板影像 234‧‧‧patterned substrate image
236‧‧‧直接成像子系統(DI) 236‧‧‧Direct Imaging Subsystem (DI)
238‧‧‧印刷指令 238‧‧‧Printing instructions
250‧‧‧步驟 250‧‧‧ steps
252‧‧‧步驟 252‧‧‧step
254‧‧‧步驟 254‧‧‧step
256‧‧‧步驟 256‧‧‧step
258‧‧‧步驟 258‧‧‧step
260‧‧‧步驟 260‧‧‧step
300‧‧‧步驟 300‧‧‧ steps
302‧‧‧步驟 302‧‧‧step
304‧‧‧步驟 304‧‧‧step
306‧‧‧步驟 306‧‧‧step
308‧‧‧步驟 308‧‧‧step
400‧‧‧CAM資料 400‧‧‧CAM Information
402‧‧‧基底組件層 402‧‧‧ substrate component layer
404‧‧‧覆疊組件層 404‧‧‧ Overlay component layer
410‧‧‧規則 410‧‧‧Rules
420‧‧‧成像子系統 420‧‧‧ Imaging Subsystem
422‧‧‧圖案化基板影像 422‧‧‧patterned substrate image
424‧‧‧輪廓化功能性 424‧‧‧ Contouring Functionality
426‧‧‧輪廓化影像 426‧‧‧Outlined image
430‧‧‧加功能標籤功能性 430‧‧‧ plus function tag functionality
432‧‧‧影像設計 432‧‧‧Image Design
440‧‧‧直接成像子系統 440‧‧‧Direct Imaging Subsystem
將自下列實施方式結合圖式更完整地理解及瞭解本發明,在圖式中:圖1A係根據本發明之一項較佳實施例建構且操作之用於電腦化直接書寫之一系統之一簡化圖解;圖1B係根據本發明之另一項較佳實施例建構且操作之用於電腦化直接書寫之一系統之一簡化圖解;圖2係圖解說明圖1A及圖1B之系統之操作中之步驟之一簡化流程圖;圖3係圖解說明圖1A至圖2之系統之操作中之選用之額外步驟之一簡化流程圖;圖4A係圖1A至圖3之系統之部分之一項實施例之一簡化方塊圖解;及圖4B係圖1A至圖3之系統之部分之另一項實施例之一簡化方塊圖解。 The present invention will be more fully understood and understood from the following embodiments in combination with the drawings, in which: FIG. 1A is one of a system for computerized direct writing constructed and operated according to a preferred embodiment of the present invention Simplified diagram; FIG. 1B is a simplified diagram of a system for computerized direct writing constructed and operated according to another preferred embodiment of the present invention; FIG. 2 is a diagram illustrating the operation of the system of FIGS. 1A and 1B One of the steps is a simplified flowchart; Figure 3 is a simplified flowchart illustrating one of the additional steps used in the operation of the system of Figures 1A to 2; Figure 4A is an implementation of a portion of the system of Figures 1A to 3 One example is a simplified block diagram; and FIG. 4B is a simplified block diagram of another embodiment of a portion of the system of FIGS. 1A to 3.
現參考圖1A,圖1A係根據本發明之一項較佳實施例建構且操作之用於電腦化直接書寫之一系統之一簡化圖解。 Reference is now made to FIG. 1A, which is a simplified diagram of a system for computerized direct writing constructed and operated in accordance with a preferred embodiment of the present invention.
如在圖1A中可見,系統較佳地包括一機架101,機架101較佳地安裝於一習知光學桌102上。機架101界定一基板支撐表面104,一圖案化基板106可經放置於基板支撐表面104上。基板106可(例如)係一電路板,一焊料遮罩待印刷至該電路板上。 As can be seen in FIG. 1A, the system preferably includes a rack 101, which is preferably mounted on a conventional optical table 102. The frame 101 defines a substrate support surface 104, and a patterned substrate 106 may be placed on the substrate support surface 104. The substrate 106 may be, for example, a circuit board to which a solder mask is to be printed.
一橋112經配置以沿一第一軸114(相對於機架101界定)而相對於基板支撐表面104線性運動。一讀/寫總成116經配置以沿一第二軸118(垂直於第一軸114)而相對於橋112線性運動。 A bridge 112 is configured to move linearly relative to the substrate support surface 104 along a first axis 114 (defined relative to the frame 101). A read / write assembly 116 is configured to move linearly relative to the bridge 112 along a second axis 118 (perpendicular to the first axis 114).
系統較佳地亦包含一控制總成124,其較佳地包含具有一使用者介面128之一電腦126。電腦126較佳地包含經操作以操作讀/寫總成116之軟體模組。 The system preferably also includes a control assembly 124 which preferably includes a computer 126 having a user interface 128. The computer 126 preferably includes software modules that are operated to operate the read / write assembly 116.
控制總成124較佳地亦包含一印刷指令資料庫130,印刷指令資料庫130含有用於在圖案化基板106上印刷之精確指令。 The control assembly 124 also preferably includes a print instruction database 130 containing precise instructions for printing on the patterned substrate 106.
根據本發明之一較佳實施例,讀/寫總成116較佳地包含:一自動化光學檢測子系統(AOI)132,其可操作用於使圖案化基板106成像以將圖案化基板106之一圖案化基板影像134提供至電腦126;及一直接成像子系統(DI)136,其包含可操作用於在圖案化基板106上書寫之一光學書寫器。 According to a preferred embodiment of the present invention, the read / write assembly 116 preferably includes: an automated optical inspection subsystem (AOI) 132, which is operable to image the patterned substrate 106 to image the patterned substrate 106. A patterned substrate image 134 is provided to the computer 126; and a direct imaging subsystem (DI) 136, which includes an optical writer operable to write on the patterned substrate 106.
本發明之此實施例之一特定特徵為,電腦126可操作用於參考儲存於印刷指令資料庫130中之精確印刷指令及圖案化基板影像134,且用於將精確印刷指令138提供至DI 136,以用於在圖案化基板106上書寫,而無需在藉由AOI 132成像圖案化基板106與藉由DI 136在圖案化基板106上書寫之間的時間期間執行印刷指令資料庫與圖案化基板106之間的基準配準。 One specific feature of this embodiment of the present invention is that the computer 126 is operable to refer to the precise printing instructions and the patterned substrate image 134 stored in the printing instruction database 130 and to provide the precise printing instructions 138 to the DI 136 For writing on the patterned substrate 106 without executing the print instruction database and the patterned substrate during the time between imaging the patterned substrate 106 by AOI 132 and writing on the patterned substrate 106 by DI 136 Benchmark registration between 106.
現參考圖1B,圖1B係根據本發明之另一項較佳實施例建構且操作之用於電腦化直接書寫之一系統之一簡化圖解。 Reference is now made to FIG. 1B, which is a simplified diagram of a system for computerized direct writing constructed and operated in accordance with another preferred embodiment of the present invention.
如在圖1B中可見,系統較佳地包括一運動機架201,運動機架201較佳地安裝於一下部固定式機架202上且經配置沿相對於下部固定式機架202界定之一軸203線性運動。機架201界定一基板支撐表面204,一圖案化基板206可經放置於基板支撐表面204上。基板206可(例如)係一電路板,一焊料遮罩待印刷至該電路板上。 As can be seen in FIG. 1B, the system preferably includes a motion frame 201, which is preferably mounted on the lower fixed frame 202 and is configured along an axis defined relative to the lower fixed frame 202 203 linear motion. The frame 201 defines a substrate supporting surface 204, and a patterned substrate 206 may be placed on the substrate supporting surface 204. The substrate 206 may be, for example, a circuit board to which a solder mask is to be printed.
一固定式橋212較佳地支撐於運動機架201上方且容許運動機架201在其下方沿軸203線性移動。 A fixed bridge 212 is preferably supported above the moving frame 201 and allows the moving frame 201 to move linearly along the axis 203 below it.
系統較佳地亦包含一控制總成224,控制總成224較佳地包含一 電腦226及含有用於在圖案化基板206上印刷之精確指令之一印刷指令資料庫230。 The system preferably also includes a control assembly 224, and the control assembly 224 preferably includes a The computer 226 and a print instruction database 230 containing one of precise instructions for printing on the patterned substrate 206.
根據本發明之一較佳實施例,橋212較佳地支撐一自動化光學檢測子系統(AOI)232(其可操作用於使圖案化基板206成像以將圖案化基板206之一圖案化基板影像234提供至電腦226)及一直接成像子系統(DI)236(其包含可操作用於在圖案化基板206上書寫之一光學書寫器)。 According to a preferred embodiment of the present invention, the bridge 212 preferably supports an automated optical inspection subsystem (AOI) 232 (which is operable to image the patterned substrate 206 to image one of the patterned substrates 206 234 is provided to the computer 226) and a direct imaging subsystem (DI) 236 (which includes an optical writer operable to write on the patterned substrate 206).
本發明之此實施例之一特定特徵為,電腦226可操作用於參考儲存於印刷指令資料庫230中之精確印刷指令及圖案化基板影像234,且用於將精確印刷指令238提供至DI 236以用於在圖案化基板206上書寫,而無需在藉由AOI 232成像圖案化基板206與藉由DI 236在圖案化基板206上書寫之間的時間期間執行印刷指令資料庫與圖案化基板206之間的基準配準。 A specific feature of this embodiment of the present invention is that the computer 226 is operable to refer to the precise printing instructions and the patterned substrate image 234 stored in the printing instruction database 230, and to provide the precise printing instructions 238 to the DI 236 For writing on the patterned substrate 206 without executing the print instruction database and the patterned substrate 206 during the time between imaging the patterned substrate 206 by AOI 232 and writing on the patterned substrate 206 by DI 236 Baseline registration.
儘管圖1B之系統提供運動機架201相對於固定式機架202之一維移動,但應瞭解,亦可提供提供運動機架201相對於固定式機架202之二維移動之一系統。 Although the system of FIG. 1B provides one-dimensional movement of the moving frame 201 relative to the fixed frame 202, it should be understood that a system that provides two-dimensional movement of the moving frame 201 relative to the fixed frame 202 can also be provided.
現參考圖2,圖2係圖解說明圖1A及圖1B之系統之操作中之步驟之一簡化流程圖。如在圖2中展示,一板(諸如圖1A之圖案化基板106及圖1B之圖案化基板206)首先裝載於系統上(250)。此後,較佳地掃描板(252)且使板成像(254)。接著,較佳地處理所獲取之影像(256),此處理可包含個別元素或元素群組之偵測及特性化。此特性可包含大小、位置、形狀及類型。參考一印刷指令資料庫以提供與所獲取影像之元素關聯之精確印刷指令(258)。此後,採用精確印刷指令來直接書寫至板上(260)。 Reference is now made to Fig. 2, which is a simplified flowchart illustrating one of the steps in the operation of the system of Figs. 1A and 1B. As shown in FIG. 2, a board (such as the patterned substrate 106 of FIG. 1A and the patterned substrate 206 of FIG. 1B) is first loaded on the system (250). Thereafter, the plate (252) is preferably scanned and the plate is imaged (254). Then, the acquired image (256) is preferably processed. This processing may include the detection and characterization of individual elements or element groups. This property can include size, position, shape, and type. Reference is made to a print order database to provide precise print orders (258) associated with elements of the acquired image. Thereafter, precise printing instructions are used to write directly to the board (260).
本發明之一特定特徵為,在圖2中圖解說明之方法包括:提供一印刷指令資料庫,其含有用於在圖案化基板上印刷之精確指令;使圖 案化基板成像以提供一圖案化基板影像;參考印刷指令資料庫及圖案化基板影像以用於指示一光學書寫器根據精確指令在圖案化基板上書寫,而無需在成像與指示之間的時間期間執行印刷指令資料庫與圖案化基板之間的基準配準。 A specific feature of the present invention is that the method illustrated in FIG. 2 includes: providing a print instruction database containing precise instructions for printing on a patterned substrate; Image the patterned substrate to provide a patterned substrate image; refer to the print instruction database and patterned substrate image to instruct an optical writer to write on the patterned substrate according to precise instructions, without the time between imaging and instruction During the benchmark registration between the print instruction database and the patterned substrate.
現參考圖3,圖3係圖解說明圖1A至圖2之系統之操作中之選用之額外步驟之一簡化流程圖。較佳地,如上文參考圖1A至圖2所描述參考印刷指令資料庫以提供精確印刷指令包含提供對應於圖案化基板之CAM資料及圖案化基板影像與對應於圖案化基板之CAM資料之電腦化相互覆疊,且自動採用來自覆疊層之資訊來提供精確指令。應瞭解,CAM資料較佳地儲存於印刷指令資料庫中。 Reference is now made to FIG. 3, which is a simplified flowchart illustrating one of the optional extra steps in the operation of the system of FIGS. 1A to 2. Preferably, referring to the printing instruction database as described above with reference to FIGS. 1A to 2 to provide a precise printing instruction including a computer that provides CAM data corresponding to the patterned substrate and a patterned substrate image and CAM data corresponding to the patterned substrate Overlap each other and automatically use information from the overlay to provide precise instructions. It should be understood that the CAM data is preferably stored in the print instruction database.
如在圖3中展示,提供與獲取影像之元素關聯之精確印刷指令之步驟(300)首先包含擷取對應於圖案化基板之CAM資料(302)及接收基板之經處理之影像資料(304)。此後,對應於圖案化基板之CAM資料經覆疊於圖案化基板影像上(306)且採用自覆疊層所得之資訊來提供精確指令(308)。應瞭解,自覆疊層所得之資訊可包含(例如)包括於CAM資料中之圖案與基板之接收經處理影像資料中出現之圖案之圖案匹配。如上文描述,本發明之一特定特徵為,執行提供精確指令,而無需在成像與提供精確指令之間的時間期間執行系統與圖案化基板之間的基準配準。 As shown in Figure 3, the step (300) of providing precise printing instructions associated with the elements of the acquired image first includes retrieving the CAM data (302) corresponding to the patterned substrate and the processed image data (304) of the receiving substrate . Thereafter, the CAM data corresponding to the patterned substrate is overlaid on the patterned substrate image (306) and the information obtained from the self-stacking is used to provide accurate instructions (308). It should be understood that the information obtained from the self-stacking may include, for example, a pattern matching included in the CAM data and a pattern appearing in the received processed image data of the substrate. As described above, one particular feature of the present invention is that execution provides precise instructions without performing reference registration between the system and the patterned substrate during the time between imaging and providing precise instructions.
現參考圖4A及圖4B,圖4A及圖4B係圖1A至圖3之系統之部分之兩項替代實施例之簡化方塊圖解。圖4A圖解說明一基於規則之實施例,且圖4B圖解說明一CAM資料及基於規則之實施例。在圖4A中或在圖4B中圖解說明之元素有助於執行圖2之步驟258,其中參考一印刷指令資料庫以提供與所獲取影像之元素關聯之精確印刷指令。在圖4B中圖解說明之元素有助於執行圖3之步驟308,其中採用自將對應於圖案化基板之CAM資料覆疊至圖案化基板影像上所得之資訊來提 供精確指令。 4A and 4B, FIG. 4A and FIG. 4B are simplified block diagrams of two alternative embodiments of portions of the system of FIGS. 1A to 3. FIG. 4A illustrates a rule-based embodiment, and FIG. 4B illustrates a CAM data and a rule-based embodiment. The elements illustrated in FIG. 4A or FIG. 4B facilitate the execution of step 258 of FIG. 2 in which a print instruction database is referenced to provide precise print instructions associated with elements of the acquired image. The elements illustrated in FIG. 4B are helpful for performing step 308 of FIG. 3, in which information obtained by superimposing CAM data corresponding to a patterned substrate on a patterned substrate image is used to extract For precise instructions.
如在圖4A中展示,系統較佳地包含複數個規則410,其等控管將任何覆疊組件層404放置於一對應基底組件層402上方。應瞭解,規則410可經儲存於一資料庫中,諸如圖1A之資料庫130及圖1B之資料庫230。 As shown in FIG. 4A, the system preferably includes a plurality of rules 410 that control the placement of any overlapping component layer 404 over a corresponding base component layer 402. It should be understood that rules 410 may be stored in a database, such as database 130 of FIG. 1A and database 230 of FIG. 1B.
舉例而言,規則410可規定覆疊組件層404與對應基底組件層402之間的放置角度之一容許變化。規則410亦可控管一覆疊組件層404中之多個覆疊組件之相互對準,多個覆疊組件之各者對應於基底組件層402中之多個基底組件之一者,基底組件具有一不同之相互對準。舉例而言,一規則可建立,圍繞任何方形形狀之大小X x Y印刷具有一預定義寬度之一圖框。此一形狀可對應於一印刷電路板中之一墊。此外,一規則可建立,圍繞具有方形形狀之大小X x Y之一預定義成形陣列之各一者印刷具有一預定義寬度之相互對準之圖框。此一陣列可對應於用於將一給定電路組件安裝於一PCB上之一墊陣列。 For example, rule 410 may specify that one of the placement angles between the overlay component layer 404 and the corresponding base component layer 402 is allowed to vary. Rule 410 may also control the alignment of multiple overlay components in an overlay component layer 404. Each of the multiple overlay components corresponds to one of the plurality of base components in the base component layer 402. The base component Have a different mutual alignment. For example, a rule can be established to print a frame with a predefined width around the size X x Y of any square shape. This shape may correspond to a pad in a printed circuit board. In addition, a rule can be established to print mutually aligned frames with a predefined width around each of one of the predefined shaped arrays of size X x Y having a square shape. Such an array may correspond to a pad array for mounting a given circuit component on a PCB.
如另一實例,一規則可建立,具有大於R之一縱橫比之所有長形形狀均使用具有一厚度T之一圖框套印。此類型之規則可應用至(例如)長形導體。 As another example, a rule can be established that all oblong shapes with an aspect ratio greater than R are overprinted using a frame with a thickness T. This type of rule can be applied to, for example, elongated conductors.
此外,規則410可包含符合程度規則(compliance rule),其等控管覆疊組件層404及對應之基底組件層402。舉例而言,規則410可包含關於組件層404之一覆疊組件相對於基底組件層402之一基底組件之最小尺寸之規則。因此,將瞭解,操作規則410以修改覆疊組件層404於一對應基底組件層402上方之精確放置。 In addition, the rule 410 may include a compliance rule, which controls the overlapping component layer 404 and the corresponding base component layer 402. For example, the rules 410 may include rules regarding the minimum size of an overlay component of the component layer 404 relative to a base component of the base component layer 402. Therefore, it will be understood that the rules 410 are operated to modify the precise placement of the overlay component layer 404 over a corresponding base component layer 402.
如在圖4B中展示,CAM資料400包含複數個設計層對,該等對之各者較佳地包含一基底組件層402及一覆疊組件層404以書寫至一對應基底組件層402上。基底組件層402及覆疊組件層404可具有不同類型且可經指定用於對所得電路板執行不同功能。 As shown in FIG. 4B, the CAM data 400 includes a plurality of design layer pairs, each of which preferably includes a base component layer 402 and an overlay component layer 404 for writing onto a corresponding base component layer 402. The base component layer 402 and the overlay component layer 404 may be of different types and may be designated to perform different functions on the resulting circuit board.
應瞭解,經封裝於CAM資料400中之資料可規定規則410之修改。舉例而言,經封裝於CAM資料400中之資料可規定組件層404之一覆疊組件相對於基底組件層402之一基底組件之最小尺寸,且藉此可支配規則410之至少一者。此外,CAM資料可用於選擇或確認規則410中之適當規則之正確選擇。 It should be understood that the data encapsulated in the CAM data 400 may provide for modifications to rule 410. For example, the data encapsulated in the CAM data 400 may specify a minimum size of an overlying component of the component layer 404 relative to a base component of the base component layer 402, and thereby may govern at least one of the rules 410. In addition, the CAM data can be used to select or confirm the proper selection of the appropriate rules in rule 410.
較佳地,提供一成像子系統420(諸如圖1A之AOI子系統132及圖1B之AOI子系統232)以用於成像圖案化基板(諸如圖1A之圖案化基板106及圖1B之圖案化基板206)。一旦獲取一圖案化基板影像422(諸如圖1A之圖案化基板影像134及圖1B之圖案化基板影像234),則較佳地採用輪廓化功能性424來提供圖案化基板影像之一輪廓化影像426。在申請人之美國專利案7,181,059中描述此輪廓化程序。 Preferably, an imaging subsystem 420 (such as the AOI subsystem 132 of FIG. 1A and the AOI subsystem 232 of FIG. 1B) is provided for imaging a patterned substrate (such as the patterned substrate 106 of FIG. 1A and the patterning of FIG. 1B). Substrate 206). Once a patterned substrate image 422 is obtained (such as the patterned substrate image 134 of FIG. 1A and the patterned substrate image 234 of FIG. 1B), the contouring functionality 424 is preferably used to provide a contoured image of one of the patterned substrate images. 426. This contouring procedure is described in Applicant's US Patent No. 7,181,059.
較佳地,提供影像重疊功能性428以用於使輪廓化影像426重疊於基底組件層402上方,從而將輪廓化影像426中之現有元素與基底組件層402中之對應元素匹配。影像重疊功能性428可採用在申請人之美國專利案7,388,978中描述之熟知幾何形狀匹配程序或方法。 Preferably, an image overlay function 428 is provided for overlaying the contoured image 426 over the base component layer 402 so as to match existing elements in the contoured image 426 with corresponding elements in the base component layer 402. The image overlay functionality 428 may employ a well-known geometry matching procedure or method described in Applicant's US Patent No. 7,388,978.
較佳地,提供加功能標籤功能性430以用於為基底組件層402之元素加功能標籤。在申請人之美國專利案7,388,978中描述加功能標籤之一方法。 Preferably, a tagging function 430 is provided for tagging elements of the base component layer 402. One method of functional tagging is described in Applicant's US Patent 7,388,978.
接著採用基底組件層402之元素之加功能標籤結合對應覆疊組件層404及規則410以提供一影像設計432。此後,提供影像設計至可操作用於在圖案化基板上書寫之一直接成像子系統440。 Then, the function label of the element of the base component layer 402 is combined with the corresponding overlay component layer 404 and the rule 410 to provide an image design 432. Thereafter, an image design is provided to one of the direct imaging subsystems 440 operable for writing on a patterned substrate.
熟習此項技術者將瞭解,本發明不受在上文中已特定展示及描述之內容所限制。實情係,本發明之範疇包含在上文中描述之各種特徵之組合及子組合兩者,且熟習此項技術者在閱讀以上描述後將認識到其等之修改且該等修改不在先前技術中。 Those skilled in the art will appreciate that the present invention is not limited by what has been specifically shown and described above. In fact, the scope of the present invention includes both the combinations and sub-combinations of various features described above, and those skilled in the art will recognize their modifications after reading the above description and these modifications are not in the prior art.
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