KR101594880B1 - 반도체 응용들을 위한 결정화 프로세싱 - Google Patents
반도체 응용들을 위한 결정화 프로세싱 Download PDFInfo
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- KR101594880B1 KR101594880B1 KR1020127016860A KR20127016860A KR101594880B1 KR 101594880 B1 KR101594880 B1 KR 101594880B1 KR 1020127016860 A KR1020127016860 A KR 1020127016860A KR 20127016860 A KR20127016860 A KR 20127016860A KR 101594880 B1 KR101594880 B1 KR 101594880B1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/38—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
- H10P14/3802—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H10P14/3808—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
- H10P14/3816—Pulsed laser beam
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B13/00—Single-crystal growth by zone-melting; Refining by zone-melting
- C30B13/16—Heating of the molten zone
- C30B13/22—Heating of the molten zone by irradiation or electric discharge
- C30B13/24—Heating of the molten zone by irradiation or electric discharge using electromagnetic waves
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
- H10D48/30—Devices controlled by electric currents or voltages
- H10D48/32—Devices controlled by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H10D48/366—Multistable devices; Devices having two or more distinct operating states
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/131—Recrystallisation; Crystallization of amorphous or microcrystalline semiconductors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3404—Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
- H10P14/3411—Silicon, silicon germanium or germanium
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3436—Deposited materials, e.g. layers characterised by the chemical composition being chalcogenide semiconductor materials not being oxides, e.g. ternary compounds
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
- H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
- H10P34/42—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/90—Thermal treatments, e.g. annealing or sintering
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/548—Amorphous silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Inorganic Chemistry (AREA)
- Recrystallisation Techniques (AREA)
- Photovoltaic Devices (AREA)
- Optics & Photonics (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Led Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US26531209P | 2009-11-30 | 2009-11-30 | |
| US61/265,312 | 2009-11-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20120098839A KR20120098839A (ko) | 2012-09-05 |
| KR101594880B1 true KR101594880B1 (ko) | 2016-02-17 |
Family
ID=44067201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020127016860A Expired - Fee Related KR101594880B1 (ko) | 2009-11-30 | 2010-11-23 | 반도체 응용들을 위한 결정화 프로세싱 |
Country Status (8)
| Country | Link |
|---|---|
| US (5) | US8313965B2 (https=) |
| EP (1) | EP2507819A4 (https=) |
| JP (5) | JP2013512572A (https=) |
| KR (1) | KR101594880B1 (https=) |
| CN (2) | CN102640263B (https=) |
| SG (1) | SG10201407955QA (https=) |
| TW (2) | TWI459444B (https=) |
| WO (1) | WO2011066310A2 (https=) |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080121343A1 (en) | 2003-12-31 | 2008-05-29 | Microfabrica Inc. | Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates |
| TWI459444B (zh) | 2009-11-30 | 2014-11-01 | 應用材料股份有限公司 | 在半導體應用上的結晶處理 |
| DE102012003747B4 (de) * | 2011-03-01 | 2016-08-18 | Infineon Technologies Austria Ag | Ein Verfahren zur Herstellung eines Halbleiterbauelements |
| US9196753B2 (en) * | 2011-04-19 | 2015-11-24 | Micron Technology, Inc. | Select devices including a semiconductive stack having a semiconductive material |
| TW201310551A (zh) * | 2011-07-29 | 2013-03-01 | 應用材料股份有限公司 | 熱處理基材的方法 |
| TWI633587B (zh) | 2011-09-01 | 2018-08-21 | 應用材料股份有限公司 | 結晶化的方法 |
| TW201324818A (zh) * | 2011-10-21 | 2013-06-16 | 應用材料股份有限公司 | 製造矽異質接面太陽能電池之方法與設備 |
| US20130125983A1 (en) * | 2011-11-18 | 2013-05-23 | Integrated Photovoltaic, Inc. | Imprinted Dielectric Structures |
| US11133390B2 (en) * | 2013-03-15 | 2021-09-28 | The Boeing Company | Low temperature, thin film crystallization method and products prepared therefrom |
| JP2014239182A (ja) * | 2013-06-10 | 2014-12-18 | 東京エレクトロン株式会社 | 微細構造形成方法、半導体デバイスの製造方法、及びcmosの形成方法 |
| US9722105B2 (en) * | 2014-03-28 | 2017-08-01 | Sunpower Corporation | Conversion of metal seed layer for buffer material |
| JP2018022712A (ja) * | 2014-12-10 | 2018-02-08 | 東京エレクトロン株式会社 | 微細構造形成方法、半導体デバイスの製造方法、及びcmosの形成方法 |
| CN106298451A (zh) * | 2016-08-18 | 2017-01-04 | 昆山国显光电有限公司 | 激光晶化方法及装置 |
| CN107785454A (zh) * | 2016-08-25 | 2018-03-09 | 西藏民族大学 | 基于Ge/Si虚衬底的GeSn光电探测器及其制备方法 |
| CN107785238B (zh) * | 2016-08-25 | 2020-07-24 | 西安电子科技大学 | InGaAs材料、基于InGaAs材料作为沟道的MOS器件及其制备方法 |
| CN107785451A (zh) * | 2016-08-25 | 2018-03-09 | 西藏民族大学 | 基于Ge/Si虚衬底的Ge PIN光电探测器及其制备方法 |
| CN107785408A (zh) * | 2016-08-25 | 2018-03-09 | 西安电子科技大学 | Ge/Si虚衬底材料及其制备方法 |
| CN108269875A (zh) * | 2016-12-30 | 2018-07-10 | 西安科锐盛创新科技有限公司 | 具有LRC-Ge/Si衬底的GaAs/AlGaAs双结太阳能电池及其制备方法 |
| CN108269879A (zh) * | 2016-12-30 | 2018-07-10 | 西安科锐盛创新科技有限公司 | Ge/Si衬底的GaInP/GaAs/Ge三结太阳能电池及其制备方法 |
| CN108269874A (zh) * | 2016-12-30 | 2018-07-10 | 西安科锐盛创新科技有限公司 | GaInP2/GaAs/Ge三结太阳能电池的制备方法 |
| CN108269880A (zh) * | 2016-12-30 | 2018-07-10 | 西安科锐盛创新科技有限公司 | 激光辅助晶化Ge/Si衬底上Ge/GaAs双结太阳能电池及其制作方法 |
| CN108269881A (zh) * | 2016-12-30 | 2018-07-10 | 西安科锐盛创新科技有限公司 | 激光辅助晶化Ge/Si衬底GaAs单结太阳能电池及其制备工艺 |
| CN108269876A (zh) * | 2016-12-30 | 2018-07-10 | 西安科锐盛创新科技有限公司 | InGaAs/Ge双结太阳能电池及其制备方法 |
| CN107170858A (zh) * | 2017-05-17 | 2017-09-15 | 厦门科锐捷半导体科技有限公司 | 横向结构led及其制备方法 |
| CN107170859A (zh) * | 2017-05-17 | 2017-09-15 | 厦门科锐捷半导体科技有限公司 | 基于横向结构发光二极管 |
| CN107123712B (zh) * | 2017-05-17 | 2019-06-28 | 湛江通用电气有限公司 | 一种红外led及其制备方法 |
| CN107346992A (zh) * | 2017-05-17 | 2017-11-14 | 西安科锐盛创新科技有限公司 | 一种光发射机以及光纤通信系统 |
| CN107046086A (zh) * | 2017-05-17 | 2017-08-15 | 厦门科锐捷半导体科技有限公司 | 发光二极管 |
| CN107332622A (zh) * | 2017-05-17 | 2017-11-07 | 西安科锐盛创新科技有限公司 | Led光发射机 |
| CN107275458A (zh) * | 2017-05-17 | 2017-10-20 | 西安科锐盛创新科技有限公司 | 基于台阶结构的发光二极管 |
| CN107275453A (zh) * | 2017-05-17 | 2017-10-20 | 西安科锐盛创新科技有限公司 | 脊状发光二极管 |
| CN107123711B (zh) * | 2017-05-17 | 2019-02-26 | 深圳市长方集团股份有限公司 | 一种脊状led及其制备方法 |
| CN107221582A (zh) * | 2017-05-17 | 2017-09-29 | 厦门科锐捷半导体科技有限公司 | 一种发光二极管及其制备方法 |
| CN107611003A (zh) * | 2017-08-11 | 2018-01-19 | 西安科锐盛创新科技有限公司 | 基于LRC的直接带隙GeSn互补型TFET器件及其制备方法 |
| CN107564958A (zh) * | 2017-08-11 | 2018-01-09 | 西安科锐盛创新科技有限公司 | 基于LRC的GeSn隧穿场效应晶体管及其制备方法 |
| CN107658339A (zh) * | 2017-08-11 | 2018-02-02 | 西安科锐盛创新科技有限公司 | 基于LRC的直接带隙GeSnP型TFET器件及其制备方法 |
| TWI737004B (zh) * | 2018-12-03 | 2021-08-21 | 日商住友重機械工業股份有限公司 | 退火裝置及退火方法 |
| CN112216603A (zh) * | 2019-07-10 | 2021-01-12 | 创能动力科技有限公司 | 用于晶片的激光处理方法及半导体装置 |
| KR20250083279A (ko) | 2023-11-30 | 2025-06-10 | 삼성디스플레이 주식회사 | 표시 장치의 제조 장치 |
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