KR101518094B1 - 반도체 장치 - Google Patents

반도체 장치 Download PDF

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Publication number
KR101518094B1
KR101518094B1 KR1020110059076A KR20110059076A KR101518094B1 KR 101518094 B1 KR101518094 B1 KR 101518094B1 KR 1020110059076 A KR1020110059076 A KR 1020110059076A KR 20110059076 A KR20110059076 A KR 20110059076A KR 101518094 B1 KR101518094 B1 KR 101518094B1
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South Korea
Prior art keywords
insulating layer
layer
oxide semiconductor
gate insulating
oxide
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KR1020110059076A
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Korean (ko)
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KR20110138192A (ko
Inventor
미쯔히로 이찌조
도시야 엔도
구니히꼬 스즈끼
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가부시키가이샤 한도오따이 에네루기 켄큐쇼
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/6737—Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
    • H10D30/6739—Conductor-insulator-semiconductor electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6758—Thin-film transistors [TFT] characterised by the insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/40—Crystalline structures
    • H10D62/402—Amorphous materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/64—Electrodes comprising a Schottky barrier to a semiconductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/665—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of elemental metal contacting the insulator, e.g. tungsten or molybdenum
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3434—Deposited materials, e.g. layers characterised by the chemical composition being oxide semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering

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  • Thin Film Transistor (AREA)
  • Formation Of Insulating Films (AREA)
KR1020110059076A 2010-06-18 2011-06-17 반도체 장치 Active KR101518094B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010139207 2010-06-18
JPJP-P-2010-139207 2010-06-18

Related Child Applications (1)

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KR1020140046788A Division KR20140057232A (ko) 2010-06-18 2014-04-18 반도체 장치

Publications (2)

Publication Number Publication Date
KR20110138192A KR20110138192A (ko) 2011-12-26
KR101518094B1 true KR101518094B1 (ko) 2015-05-06

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KR1020140046788A Ceased KR20140057232A (ko) 2010-06-18 2014-04-18 반도체 장치

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US (4) US8552425B2 (enExample)
JP (2) JP5917842B2 (enExample)
KR (2) KR101518094B1 (enExample)

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WO2014133722A1 (en) * 2013-03-01 2014-09-04 Applied Materials, Inc. Metal oxide tft stability improvement
JP6211287B2 (ja) * 2013-04-04 2017-10-11 株式会社半導体エネルギー研究所 半導体装置の作製方法
KR20150007000A (ko) 2013-07-10 2015-01-20 삼성디스플레이 주식회사 박막 트랜지스터 기판 및 박막 트랜지스터 기판의 제조 방법
US20170095063A1 (en) * 2014-05-30 2017-04-06 Exxel Outdoors, Llc Articulating load bearing suspension system for use with body armor
JP6392061B2 (ja) * 2014-10-01 2018-09-19 東京エレクトロン株式会社 電子デバイス、その製造方法、及びその製造装置
WO2016063159A1 (en) * 2014-10-20 2016-04-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof, module, and electronic device
WO2016063160A1 (en) * 2014-10-20 2016-04-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method thereof, display device, and display module
US20160155849A1 (en) 2014-12-02 2016-06-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, method for manufacturing semiconductor device, module, and electronic device
JP5790893B1 (ja) * 2015-02-13 2015-10-07 日新電機株式会社 膜形成方法および薄膜トランジスタの作製方法
US10192995B2 (en) 2015-04-28 2019-01-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP2016219483A (ja) * 2015-05-15 2016-12-22 株式会社半導体エネルギー研究所 半導体装置
JP2016225615A (ja) * 2015-05-26 2016-12-28 株式会社半導体エネルギー研究所 半導体装置、該半導体装置の作製方法、または該半導体装置を有する表示装置
WO2017013691A1 (ja) * 2015-07-17 2017-01-26 株式会社Ｊｏｌｅｄ 薄膜トランジスタ及び薄膜トランジスタの製造方法
JP6611521B2 (ja) * 2015-08-25 2019-11-27 三菱電機株式会社 薄膜トランジスタ及びアレイ基板
US9954166B1 (en) * 2016-11-28 2018-04-24 Taiwan Semiconductor Manufacturing Co., Ltd. Embedded memory device with a composite top electrode
JP6763093B2 (ja) * 2017-09-05 2020-09-30 株式会社アルバック 半導体装置の製造方法
KR20190032681A (ko) * 2017-09-18 2019-03-28 삼성디스플레이 주식회사 박막 트랜지스터 표시판 및 표시 장치
JP2019145682A (ja) * 2018-02-21 2019-08-29 株式会社アルバック 誘電体素子の製造方法、および、誘電体素子
JP6753450B2 (ja) * 2018-11-12 2020-09-09 セイコーエプソン株式会社 電気光学装置用基板、電気光学装置、電子機器
JP7147953B2 (ja) * 2019-02-25 2022-10-05 株式会社ニコン 半導体装置、ｐＨセンサ及びバイオセンサ並びに半導体装置の製造方法
KR102844940B1 (ko) * 2020-08-31 2025-08-08 삼성전자주식회사 반도체 장치
JPWO2023189491A1 (enExample) * 2022-03-30 2023-10-05

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