KR101488048B1 - 계측 방법, 스테이지 장치, 및 노광 장치 - Google Patents
계측 방법, 스테이지 장치, 및 노광 장치 Download PDFInfo
- Publication number
- KR101488048B1 KR101488048B1 KR1020107003290A KR20107003290A KR101488048B1 KR 101488048 B1 KR101488048 B1 KR 101488048B1 KR 1020107003290 A KR1020107003290 A KR 1020107003290A KR 20107003290 A KR20107003290 A KR 20107003290A KR 101488048 B1 KR101488048 B1 KR 101488048B1
- Authority
- KR
- South Korea
- Prior art keywords
- scale
- support member
- stage
- wafer
- measurement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
-
- H10P76/00—
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Optical Transform (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Transmission And Conversion Of Sensor Element Output (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2007-187649 | 2007-07-18 | ||
| JP2007187649 | 2007-07-18 | ||
| PCT/JP2008/062802 WO2009011356A1 (ja) | 2007-07-18 | 2008-07-16 | 計測方法、ステージ装置、及び露光装置 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020137018085A Division KR101538245B1 (ko) | 2007-07-18 | 2008-07-16 | 계측 방법, 스테이지 장치, 및 노광 장치 |
| KR1020137018086A Division KR101538246B1 (ko) | 2007-07-18 | 2008-07-16 | 계측 방법, 스테이지 장치, 및 노광 장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20100059799A KR20100059799A (ko) | 2010-06-04 |
| KR101488048B1 true KR101488048B1 (ko) | 2015-01-29 |
Family
ID=40259688
Family Applications (8)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020107003290A Expired - Fee Related KR101488048B1 (ko) | 2007-07-18 | 2008-07-16 | 계측 방법, 스테이지 장치, 및 노광 장치 |
| KR1020157001127A Expired - Fee Related KR101614666B1 (ko) | 2007-07-18 | 2008-07-16 | 계측 방법, 스테이지 장치, 및 노광 장치 |
| KR1020137018085A Expired - Fee Related KR101538245B1 (ko) | 2007-07-18 | 2008-07-16 | 계측 방법, 스테이지 장치, 및 노광 장치 |
| KR1020137018086A Expired - Fee Related KR101538246B1 (ko) | 2007-07-18 | 2008-07-16 | 계측 방법, 스테이지 장치, 및 노광 장치 |
| KR1020187007270A Expired - Fee Related KR101923356B1 (ko) | 2007-07-18 | 2008-07-16 | 계측 방법, 스테이지 장치, 및 노광 장치 |
| KR1020157029261A Expired - Fee Related KR101706884B1 (ko) | 2007-07-18 | 2008-07-16 | 계측 방법, 스테이지 장치, 및 노광 장치 |
| KR1020177003435A Expired - Fee Related KR101843699B1 (ko) | 2007-07-18 | 2008-07-16 | 계측 방법, 스테이지 장치, 및 노광 장치 |
| KR1020187033093A Ceased KR20180126088A (ko) | 2007-07-18 | 2008-07-16 | 계측 방법, 스테이지 장치, 및 노광 장치 |
Family Applications After (7)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020157001127A Expired - Fee Related KR101614666B1 (ko) | 2007-07-18 | 2008-07-16 | 계측 방법, 스테이지 장치, 및 노광 장치 |
| KR1020137018085A Expired - Fee Related KR101538245B1 (ko) | 2007-07-18 | 2008-07-16 | 계측 방법, 스테이지 장치, 및 노광 장치 |
| KR1020137018086A Expired - Fee Related KR101538246B1 (ko) | 2007-07-18 | 2008-07-16 | 계측 방법, 스테이지 장치, 및 노광 장치 |
| KR1020187007270A Expired - Fee Related KR101923356B1 (ko) | 2007-07-18 | 2008-07-16 | 계측 방법, 스테이지 장치, 및 노광 장치 |
| KR1020157029261A Expired - Fee Related KR101706884B1 (ko) | 2007-07-18 | 2008-07-16 | 계측 방법, 스테이지 장치, 및 노광 장치 |
| KR1020177003435A Expired - Fee Related KR101843699B1 (ko) | 2007-07-18 | 2008-07-16 | 계측 방법, 스테이지 장치, 및 노광 장치 |
| KR1020187033093A Ceased KR20180126088A (ko) | 2007-07-18 | 2008-07-16 | 계측 방법, 스테이지 장치, 및 노광 장치 |
Country Status (9)
| Country | Link |
|---|---|
| US (5) | US9316917B2 (enExample) |
| EP (7) | EP3447582A1 (enExample) |
| JP (8) | JPWO2009011356A1 (enExample) |
| KR (8) | KR101488048B1 (enExample) |
| CN (7) | CN101755188A (enExample) |
| HK (2) | HK1201943A1 (enExample) |
| SG (3) | SG10201502625RA (enExample) |
| TW (7) | TWI498683B (enExample) |
| WO (1) | WO2009011356A1 (enExample) |
Families Citing this family (56)
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|---|---|---|---|---|
| JP2009026862A (ja) * | 2007-07-18 | 2009-02-05 | Canon Inc | 光学素子位置決めシステム、投影光学系及び露光装置 |
| KR101488048B1 (ko) * | 2007-07-18 | 2015-01-29 | 가부시키가이샤 니콘 | 계측 방법, 스테이지 장치, 및 노광 장치 |
| JP2009036637A (ja) * | 2007-08-01 | 2009-02-19 | Sony Corp | 変位測定装置 |
| US8760629B2 (en) * | 2008-12-19 | 2014-06-24 | Nikon Corporation | Exposure apparatus including positional measurement system of movable body, exposure method of exposing object including measuring positional information of movable body, and device manufacturing method that includes exposure method of exposing object, including measuring positional information of movable body |
| US8493547B2 (en) * | 2009-08-25 | 2013-07-23 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
| EP3731258A1 (de) * | 2009-09-22 | 2020-10-28 | EV Group E. Thallner GmbH | Vorrichtung zum ausrichten zweier substrate |
| NL2006913A (en) | 2010-07-16 | 2012-01-17 | Asml Netherlands Bv | Lithographic apparatus and method. |
| NL2007155A (en) * | 2010-08-25 | 2012-02-28 | Asml Netherlands Bv | Stage apparatus, lithographic apparatus and method of positioning an object table. |
| JP4846051B1 (ja) * | 2010-11-05 | 2011-12-28 | 株式会社ナナオ | センサユニット作動機構及び当該センサユニット作動機構を備えた液晶表示装置 |
| NL2008272A (en) * | 2011-03-09 | 2012-09-11 | Asml Netherlands Bv | Lithographic apparatus. |
| DE102011005885A1 (de) * | 2011-03-22 | 2012-09-27 | Carl Zeiss Smt Gmbh | Lithographievorrichtung |
| NL2008980A (en) | 2011-07-11 | 2013-01-14 | Asml Netherlands Bv | A fluid handling structure, a lithographic apparatus and a device manufacturing method. |
| JP5922788B2 (ja) * | 2011-11-09 | 2016-05-24 | ザイゴ コーポレーションZygo Corporation | 熱的に安定な光学センサマウント |
| JP6086070B2 (ja) * | 2011-12-28 | 2017-03-01 | 株式会社ニコン | エンコーダ及び駆動装置 |
| JP6093965B2 (ja) | 2012-02-17 | 2017-03-15 | 株式会社ミツトヨ | 光電式エンコーダ |
| JP6251559B2 (ja) * | 2013-02-28 | 2017-12-20 | 株式会社ニューフレアテクノロジー | 試料支持装置 |
| JP6613895B2 (ja) * | 2013-10-02 | 2019-12-04 | 株式会社ニコン | エンコーダ用スケール、エンコーダ、駆動装置及びステージ装置 |
| JP6492086B2 (ja) * | 2013-12-21 | 2019-03-27 | ケーエルエー−テンカー コーポレイション | マスク上の構造体の位置を測定し、それによってマスク製造誤差を決定する方法 |
| JP2016043453A (ja) * | 2014-08-25 | 2016-04-04 | 株式会社ディスコ | 加工装置 |
| NL2015639A (en) | 2014-11-28 | 2016-09-20 | Asml Netherlands Bv | Encoder, position measurement system and lithographic apparatus. |
| TWI702474B (zh) | 2015-02-23 | 2020-08-21 | 日商尼康股份有限公司 | 基板處理系統及基板處理方法、以及元件製造方法 |
| KR102688211B1 (ko) | 2015-02-23 | 2024-07-24 | 가부시키가이샤 니콘 | 계측 장치, 리소그래피 시스템 및 노광 장치, 그리고 디바이스 제조 방법 |
| CN111158220A (zh) | 2015-02-23 | 2020-05-15 | 株式会社尼康 | 测量装置及方法、光刻系统、曝光装置及方法 |
| WO2016150631A1 (en) * | 2015-03-23 | 2016-09-29 | Asml Netherlands B.V. | Lithographic apparatus, and device manufacturing method |
| JP6738542B2 (ja) * | 2015-03-31 | 2020-08-12 | 株式会社ニコン | 露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光方法 |
| US9630836B2 (en) | 2015-09-30 | 2017-04-25 | Mems Drive, Inc. | Simplified MEMS device fabrication process |
| US9617142B1 (en) | 2015-09-30 | 2017-04-11 | Mems Drive, Inc. | MEMS grid for manipulating structural parameters of MEMS devices |
| CN108139678B (zh) | 2015-09-30 | 2022-03-15 | 株式会社尼康 | 曝光装置、平面显示器的制造方法及元件制造方法 |
| US10199912B2 (en) * | 2016-01-26 | 2019-02-05 | Woodward Hrt, Inc. | Torque motor with mechanical flexures establishing armature-to-field gaps |
| JP6752450B2 (ja) * | 2016-09-30 | 2020-09-09 | 株式会社ニコン | 移動体装置、移動方法、露光装置、露光方法、フラットパネルディスプレイの製造方法、並びにデバイス製造方法 |
| CN109791380B (zh) * | 2016-10-04 | 2021-04-16 | Asml荷兰有限公司 | 对准系统的无热化 |
| WO2018074306A1 (ja) * | 2016-10-17 | 2018-04-26 | 株式会社ニコン | 露光システム及びリソグラフィシステム |
| NL2020344A (en) | 2017-02-03 | 2018-08-14 | Asml Netherlands Bv | Exposure apparatus |
| WO2018145849A1 (en) * | 2017-02-10 | 2018-08-16 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US10600614B2 (en) * | 2017-09-29 | 2020-03-24 | Hitachi High-Technologies Corporation | Stage device and charged particle beam device |
| DE102017217967A1 (de) * | 2017-10-09 | 2019-04-11 | Sieb & Meyer Ag | Verfahren zur Bestimmung von Positionsfehlern von Bohrungen und Sicherung des Bohrprozesses |
| JP6493481B2 (ja) * | 2017-10-18 | 2019-04-03 | 株式会社ニコン | 露光装置及びデバイス製造方法 |
| CN108010873B (zh) * | 2017-12-29 | 2024-04-19 | 无锡固电半导体股份有限公司 | 一种晶圆自动扩晶机 |
| TWI699559B (zh) * | 2018-01-16 | 2020-07-21 | 美商伊路米納有限公司 | 結構照明成像系統和使用結構化光來創建高解析度圖像的方法 |
| JP7051455B2 (ja) * | 2018-01-16 | 2022-04-11 | キオクシア株式会社 | パターン形成装置および半導体装置の製造方法 |
| US10281268B1 (en) | 2018-04-20 | 2019-05-07 | Seagate Technology Llc | Automated and accurate high-throughput slider-level flatness inspection |
| JP7056411B2 (ja) * | 2018-06-29 | 2022-04-19 | 株式会社リコー | 読取装置および造形装置 |
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| CN111272089B (zh) * | 2020-03-03 | 2022-06-28 | 中国科学院光电技术研究所 | 一种原位间隙检测装置与检测方法 |
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| KR102826407B1 (ko) * | 2020-07-17 | 2025-06-27 | 도쿄엘렉트론가부시키가이샤 | 접합 장치, 접합 시스템 및 접합 방법 |
| JP7565179B2 (ja) * | 2020-09-14 | 2024-10-10 | 株式会社ミツトヨ | スケール |
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| HK1222716B (en) | Exposure apparatus, exposure method and device manufacturing method | |
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| HK1220514B (en) | Exposure appratatus, exposure method and device manufacuring method | |
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