KR101432009B1 - 기판의 처리 장치 및 처리 방법 - Google Patents

기판의 처리 장치 및 처리 방법 Download PDF

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Publication number
KR101432009B1
KR101432009B1 KR1020140016981A KR20140016981A KR101432009B1 KR 101432009 B1 KR101432009 B1 KR 101432009B1 KR 1020140016981 A KR1020140016981 A KR 1020140016981A KR 20140016981 A KR20140016981 A KR 20140016981A KR 101432009 B1 KR101432009 B1 KR 101432009B1
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KR
South Korea
Prior art keywords
semiconductor wafer
etching
substrate
thickness
etching liquid
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KR1020140016981A
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English (en)
Korean (ko)
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KR20140024948A (ko
Inventor
고노스케 하야시
에미 마츠이
다카시 오오타가키
요스케 히모리
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시바우라 메카트로닉스 가부시끼가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
    • H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020140016981A 2011-12-27 2014-02-14 기판의 처리 장치 및 처리 방법 Active KR101432009B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2011285877 2011-12-27
JPJP-P-2011-285877 2011-12-27
JPJP-P-2012-263347 2012-11-30
JP2012263347A JP6091193B2 (ja) 2011-12-27 2012-11-30 基板の処理装置及び処理方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020120153537A Division KR101380494B1 (ko) 2011-12-27 2012-12-26 기판의 처리 장치 및 처리 방법

Publications (2)

Publication Number Publication Date
KR20140024948A KR20140024948A (ko) 2014-03-03
KR101432009B1 true KR101432009B1 (ko) 2014-08-20

Family

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KR1020140016981A Active KR101432009B1 (ko) 2011-12-27 2014-02-14 기판의 처리 장치 및 처리 방법

Country Status (4)

Country Link
JP (2) JP6091193B2 (enrdf_load_stackoverflow)
KR (1) KR101432009B1 (enrdf_load_stackoverflow)
CN (1) CN105070673A (enrdf_load_stackoverflow)
TW (2) TWI601202B (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6289961B2 (ja) 2014-03-27 2018-03-07 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
KR20160045299A (ko) * 2014-10-17 2016-04-27 도쿄엘렉트론가부시키가이샤 기판 처리 장치, 연계 처리 시스템 및 기판 처리 방법
KR101680214B1 (ko) * 2015-01-22 2016-11-28 주식회사 엘지실트론 웨이퍼 이송 장치
DE102017212887A1 (de) 2017-07-26 2019-01-31 Gebr. Schmid Gmbh Verfahren, Vorrichtung und Anlage zur Leiterplattenherstellung
JP7130524B2 (ja) * 2018-10-26 2022-09-05 東京エレクトロン株式会社 基板処理装置の制御装置および基板処理装置の制御方法
JP7273660B2 (ja) 2019-08-30 2023-05-15 キオクシア株式会社 半導体製造装置、および半導体装置の製造方法
JP7544625B2 (ja) * 2021-03-04 2024-09-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、及び基板処理方法
CN117448748A (zh) * 2023-11-02 2024-01-26 浙江众凌科技有限公司 一种用于掩膜版生产用的喷压设备及其生产工艺

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09223680A (ja) * 1996-02-16 1997-08-26 Disco Abrasive Syst Ltd エッチング機能付き研磨装置
KR20060127115A (ko) * 2004-01-30 2006-12-11 램 리써치 코포레이션 동적 액체 메니스커스와 공동 동작하는 무응력 에칭프로세스

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JPS63256342A (ja) * 1987-04-10 1988-10-24 Sumitomo Electric Ind Ltd 半導体ウエ−ハの研削方法
JPH03265586A (ja) * 1990-03-15 1991-11-26 Toshiba Corp 窒化アルミニウム基板の製造方法
JP3748527B2 (ja) * 2001-09-26 2006-02-22 大日本スクリーン製造株式会社 エッチング装置およびエッチング方法
JP2003203897A (ja) * 2002-01-08 2003-07-18 Toshiba Corp ノズル、基板処理装置、基板処理方法、及び基板処理プログラム
JP4192482B2 (ja) * 2002-03-22 2008-12-10 株式会社Ｓｕｍｃｏ シリコンウェーハの製造方法
KR100452918B1 (ko) * 2002-04-12 2004-10-14 한국디엔에스 주식회사 두께측정시스템이 구비된 회전식각장치
JP2005262406A (ja) * 2004-03-19 2005-09-29 Toshiba Corp 研磨装置および半導体装置の製造方法
JPWO2005104638A1 (ja) * 2004-04-23 2008-03-13 松下電工株式会社 配線基板およびその製造方法
JP3638020B1 (ja) * 2004-09-17 2005-04-13 孝昭 鈴木 ウエハの薄厚化方法、及びウエハの薄厚化装置
CN1632165A (zh) * 2004-12-28 2005-06-29 北京科技大学 一种在硬质合金工具上制备金刚石涂层的方法
JP2008166576A (ja) * 2006-12-28 2008-07-17 Rohm Co Ltd 半導体装置の製造方法
JP4937674B2 (ja) * 2006-08-16 2012-05-23 株式会社ディスコ ウエーハのエッチング方法
JP2009224511A (ja) * 2008-03-14 2009-10-01 Fuji Electric Device Technology Co Ltd 半導体装置の製造方法
JP5422907B2 (ja) * 2008-04-11 2014-02-19 富士電機株式会社 半導体装置の製造方法
JP5012632B2 (ja) * 2008-04-15 2012-08-29 富士電機株式会社 半導体装置の製造方法
JP2010040543A (ja) * 2008-07-31 2010-02-18 Sumco Corp 半導体ウェーハの加工装置
JP2010171330A (ja) * 2009-01-26 2010-08-05 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 エピタキシャルウェハの製造方法、欠陥除去方法およびエピタキシャルウェハ
JP2011086654A (ja) * 2009-10-13 2011-04-28 Seiko Epson Corp 基板の加工方法及び基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09223680A (ja) * 1996-02-16 1997-08-26 Disco Abrasive Syst Ltd エッチング機能付き研磨装置
KR20060127115A (ko) * 2004-01-30 2006-12-11 램 리써치 코포레이션 동적 액체 메니스커스와 공동 동작하는 무응력 에칭프로세스

Also Published As

Publication number Publication date
JP6091193B2 (ja) 2017-03-08
JP2013153141A (ja) 2013-08-08
JP6321234B2 (ja) 2018-05-09
TWI601202B (zh) 2017-10-01
KR20140024948A (ko) 2014-03-03
TW201334055A (zh) 2013-08-16
JP2017085174A (ja) 2017-05-18
TW201535506A (zh) 2015-09-16
CN105070673A (zh) 2015-11-18
TWI494992B (zh) 2015-08-01

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