KR101392539B1 - 폴리이미드 전구체 및 이 폴리이미드 전구체를 포함하는 감광성 수지 조성물 - Google Patents

폴리이미드 전구체 및 이 폴리이미드 전구체를 포함하는 감광성 수지 조성물 Download PDF

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KR101392539B1
KR101392539B1 KR1020127009908A KR20127009908A KR101392539B1 KR 101392539 B1 KR101392539 B1 KR 101392539B1 KR 1020127009908 A KR1020127009908 A KR 1020127009908A KR 20127009908 A KR20127009908 A KR 20127009908A KR 101392539 B1 KR101392539 B1 KR 101392539B1
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resin composition
bis
polyimide precursor
mass
photosensitive resin
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KR1020127009908A
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Korean (ko)
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KR20120068923A (ko
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오사무 야마자키
다케키 시미즈
신지 아리히사
아키히로 가토
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아사히 가세이 이-매터리얼즈 가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085—Unsaturated polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020127009908A 2009-11-16 2010-11-15 폴리이미드 전구체 및 이 폴리이미드 전구체를 포함하는 감광성 수지 조성물 KR101392539B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2009-261102 2009-11-16
JP2009261102 2009-11-16
PCT/JP2010/070306 WO2011059089A1 (ja) 2009-11-16 2010-11-15 ポリイミド前駆体及び該ポリイミド前駆体を含む感光性樹脂組成物

Publications (2)

Publication Number Publication Date
KR20120068923A KR20120068923A (ko) 2012-06-27
KR101392539B1 true KR101392539B1 (ko) 2014-05-07

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Country Status (5)

Country Link
JP (1) JP5758300B2 (zh)
KR (1) KR101392539B1 (zh)
CN (1) CN102597061B (zh)
TW (1) TWI440656B (zh)
WO (1) WO2011059089A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
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WO2021095976A1 (ko) * 2019-11-13 2021-05-20 피아이첨단소재 주식회사 고탄성 및 고내열 폴리이미드 필름 및 그 제조방법
KR20210057939A (ko) * 2019-11-13 2021-05-24 피아이첨단소재 주식회사 저유전 폴리이미드 필름 및 이의 제조방법

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KR101304590B1 (ko) * 2010-03-11 2013-09-05 주식회사 엘지화학 Ｏｌｅｄ 디바이스용 감광성 유기 절연재 조성물
JP6094137B2 (ja) * 2011-10-18 2017-03-15 大日本印刷株式会社 回路基板、サスペンション用基板、サスペンション、素子付サスペンションおよびハードディスクドライブ
JP5748638B2 (ja) * 2011-11-04 2015-07-15 旭化成イーマテリアルズ株式会社 ポリイミド前駆体又はポリイミド及び感光性樹脂組成物
CN104053724B (zh) * 2012-01-20 2018-05-08 旭化成株式会社 树脂组合物、层积体、多层印刷线路板和多层柔性线路板及其制造方法
JP5928705B2 (ja) * 2012-04-09 2016-06-01 住友電気工業株式会社 ポリイミド前駆体溶液の製造方法及びこれを用いたポリイミド前駆体溶液、多孔質ポリイミド
CN102768439B (zh) * 2012-06-14 2014-12-10 北京京东方光电科技有限公司 一种母板取向膜的制作方法及转印版、取向液
KR102130430B1 (ko) * 2012-08-08 2020-07-07 아사히 가세이 이-매터리얼즈 가부시키가이샤 감광성 필름 적층체, 플렉시블 프린트 배선판 및 그 제조 방법
SG11201501594UA (en) 2012-09-25 2015-05-28 Toray Industries Positive photosensitive resin composition, and method for producing semiconductor device containing a cured film using said composition
TWI548524B (zh) * 2012-09-28 2016-09-11 Dainippon Ink & Chemicals Laminated body, conductive pattern and circuit
JP6080620B2 (ja) * 2013-03-08 2017-02-15 旭化成株式会社 ポリイミド前駆体、ポリイミド及び感光性樹脂組成物
CN103289593B (zh) * 2013-04-23 2014-12-24 深圳丹邦科技股份有限公司 一种用于cof的耐高温压敏胶膜及其制备方法
JP6627510B2 (ja) * 2013-11-27 2020-01-08 宇部興産株式会社 ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板
CN110941142B (zh) * 2014-03-17 2021-05-25 旭化成株式会社 感光性树脂组合物、固化浮雕图案的制造方法、以及半导体装置
WO2016043203A1 (ja) * 2014-09-17 2016-03-24 富士フイルム株式会社 ポジ型感光性樹脂組成物、硬化膜の製造方法、硬化膜、液晶表示装置、有機エレクトロルミネッセンス表示装置およびタッチパネル
CN105739239B (zh) * 2014-12-10 2020-04-03 太阳油墨（苏州）有限公司 光固化性热固化性树脂组合物、干膜、固化物、及印刷电路板
US10896942B2 (en) * 2015-03-11 2021-01-19 Toray Industries, Inc. Organic EL display device and method for manufacturing same
WO2016172089A1 (en) * 2015-04-21 2016-10-27 Fujifilm Electronic Materials U.S.A., Inc. Photosensitive polyimide compositions
JP6681888B2 (ja) * 2015-05-29 2020-04-15 富士フイルム株式会社 ポリイミド前駆体組成物、感光性樹脂組成物、硬化膜、硬化膜の製造方法、半導体デバイスおよびポリイミド前駆体組成物の製造方法
CN111234219B (zh) * 2015-10-19 2021-05-28 宇部兴产株式会社 聚酰亚胺前体、具有交联结构的聚酰亚胺及其制造方法
JP6982786B2 (ja) 2016-03-28 2021-12-17 東レ株式会社 感光性フィルム
JP7106863B2 (ja) 2016-06-16 2022-07-27 東レ株式会社 有機ｅｌ表示装置用感光性樹脂組成物
WO2018117047A1 (ja) * 2016-12-20 2018-06-28 旭化成株式会社 ２層感光層ロール
KR102402138B1 (ko) * 2017-11-28 2022-05-25 아사히 가세이 가부시키가이샤 네거티브형 감광성 수지 조성물 및 그 제조 방법, 그리고 경화 릴리프 패턴의 제조 방법
TW202028865A (zh) * 2018-10-15 2020-08-01 日商日產化學股份有限公司 感光性絕緣膜組成物
KR102207604B1 (ko) * 2018-11-06 2021-01-26 (주)이녹스첨단소재 Fpic 필름 및 이의 제조방법
US11572442B2 (en) 2020-04-14 2023-02-07 International Business Machines Corporation Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component
US11333975B2 (en) 2020-04-14 2022-05-17 International Business Machines Corporation Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021095976A1 (ko) * 2019-11-13 2021-05-20 피아이첨단소재 주식회사 고탄성 및 고내열 폴리이미드 필름 및 그 제조방법
KR20210057939A (ko) * 2019-11-13 2021-05-24 피아이첨단소재 주식회사 저유전 폴리이미드 필름 및 이의 제조방법
KR102347632B1 (ko) 2019-11-13 2022-01-10 피아이첨단소재 주식회사 저유전 폴리이미드 필름 및 이의 제조방법

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KR20120068923A (ko) 2012-06-27
TW201134855A (en) 2011-10-16
WO2011059089A1 (ja) 2011-05-19
TWI440656B (zh) 2014-06-11
JP5758300B2 (ja) 2015-08-05
CN102597061B (zh) 2014-06-04
JPWO2011059089A1 (ja) 2013-04-04
CN102597061A (zh) 2012-07-18

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