KR101287360B1 - 기판 표면의 밀봉 장치와 유기 ｅｌ 패널의 제조 방법 - Google Patents

기판 표면의 밀봉 장치와 유기 ｅｌ 패널의 제조 방법 Download PDF

Info

Publication number
KR101287360B1
KR101287360B1 KR1020117020569A KR20117020569A KR101287360B1 KR 101287360 B1 KR101287360 B1 KR 101287360B1 KR 1020117020569 A KR1020117020569 A KR 1020117020569A KR 20117020569 A KR20117020569 A KR 20117020569A KR 101287360 B1 KR101287360 B1 KR 101287360B1
Authority
KR
South Korea
Prior art keywords
substrate
film
chamber
sheet
sealing material
Prior art date
Application number
KR1020117020569A
Other languages
English (en)
Korean (ko)
Other versions
KR20110111535A (ko
Inventor
다쯔또 구니히로
가즈오 다까하시
요시후미 오따
Original Assignee
샤프 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 샤프 가부시키가이샤 filed Critical 샤프 가부시키가이샤
Publication of KR20110111535A publication Critical patent/KR20110111535A/ko
Application granted granted Critical
Publication of KR101287360B1 publication Critical patent/KR101287360B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B32B37/182—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only one or more of the layers being plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/03—After-treatments in the joint area
    • B29C66/034—Thermal after-treatments
    • B29C66/0342—Cooling, e.g. transporting through welding and cooling zone
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/74—Joining plastics material to non-plastics material
    • B29C66/746—Joining plastics material to non-plastics material to inorganic materials not provided for in groups B29C66/742 - B29C66/744
    • B29C66/7465—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/84—Specific machine types or machines suitable for specific applications
    • B29C66/843—Machines for making separate joints at the same time in different planes; Machines for making separate joints at the same time mounted in parallel or in series
    • B29C66/8432—Machines for making separate joints at the same time mounted in parallel or in series
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2101/00—Use of unspecified macromolecular compounds as moulding material
    • B29K2101/10—Thermosetting resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2309/00—Use of inorganic materials not provided for in groups B29K2303/00 - B29K2307/00, as reinforcement
    • B29K2309/08—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/62—Inert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
KR1020117020569A 2009-02-05 2010-02-03 기판 표면의 밀봉 장치와 유기 ｅｌ 패널의 제조 방법 KR101287360B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2009-024948 2009-02-05
JP2009024948A JP5326098B2 (ja) 2009-02-05 2009-02-05 基板表面の封止装置と有機ｅｌパネルの製造方法
PCT/JP2010/051517 WO2010090223A1 (ja) 2009-02-05 2010-02-03 基板表面の封止装置と有機ｅｌパネルの製造方法

Publications (2)

Publication Number Publication Date
KR20110111535A KR20110111535A (ko) 2011-10-11
KR101287360B1 true KR101287360B1 (ko) 2013-07-23

Family

ID=42542116

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117020569A KR101287360B1 (ko) 2009-02-05 2010-02-03 기판 표면의 밀봉 장치와 유기 ｅｌ 패널의 제조 방법

Country Status (5)

Country Link
JP (1) JP5326098B2 (zh)
KR (1) KR101287360B1 (zh)
CN (1) CN102326449B (zh)
TW (1) TWI421985B (zh)
WO (1) WO2010090223A1 (zh)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5990745B2 (ja) 2011-05-31 2016-09-14 株式会社Ｊｏｌｅｄ 接合体の製造方法及び接合体
KR101859964B1 (ko) * 2011-06-29 2018-05-24 삼성디스플레이 주식회사 기판 밀봉장치 및 이를 이용한 기판의 밀봉방법
JP5189194B2 (ja) * 2011-09-05 2013-04-24 ミカドテクノス株式会社 真空加熱接合装置及び真空加熱接合方法
KR101318177B1 (ko) * 2011-11-29 2013-10-16 주식회사 에스에프에이 Ｏｌｅｄ패널의 봉지장치
KR101306609B1 (ko) * 2011-11-29 2013-09-11 주식회사 에스에프에이 플라즈마 발생기 및 이를 구비하는 ｏｌｅｄ패널의 봉지장치
KR101838756B1 (ko) 2011-12-22 2018-03-15 엘지디스플레이 주식회사 유기전계발광 표시장치의 봉지방법
WO2014024478A1 (ja) * 2012-08-07 2014-02-13 パナソニック株式会社 接合体の製造方法及び接合体
JP6281770B2 (ja) * 2012-08-07 2018-02-21 株式会社Ｊｏｌｅｄ 接合体の製造方法
JP6135062B2 (ja) 2012-08-07 2017-05-31 セイコーエプソン株式会社 発光装置、発光装置の製造方法、電子機器
JP6066054B2 (ja) * 2012-12-06 2017-01-25 Ａｉメカテック株式会社 有機ｅｌ封止装置、封止ロールフィルム製作装置及び有機ｅｌ封止システム
JP6015422B2 (ja) * 2012-12-21 2016-10-26 コニカミノルタ株式会社 有機エレクトロルミネッセンスパネルの製造方法と製造装置
CN103050417B (zh) * 2012-12-25 2015-10-28 王奉瑾 用于半导体集成制造生产线中的动态密封模块
CN103077910A (zh) * 2012-12-25 2013-05-01 王奉瑾 用于半导体集成制造生产线中的动态隔离模块
KR102069851B1 (ko) * 2013-03-26 2020-01-28 삼성디스플레이 주식회사 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템
KR101587775B1 (ko) * 2013-03-29 2016-02-02 다이니폰 인사츠 가부시키가이샤 소자 제조 방법 및 소자 제조 장치
CN106597697A (zh) * 2013-12-02 2017-04-26 株式会社半导体能源研究所 显示装置及其制造方法
US20170025636A1 (en) * 2014-03-19 2017-01-26 Lintec Corporation Laminated sheet for sealing electronic elements and production method for electronic devices
KR102241849B1 (ko) 2014-09-24 2021-04-20 삼성디스플레이 주식회사 표시 장치의 제조 장치 및 이를 이용한 표시 장치의 제조 방법
CN105984745A (zh) * 2015-02-09 2016-10-05 住化电子材料科技（无锡）有限公司 膜层叠体的制造装置及膜层叠体的制造方法
JP6559758B2 (ja) * 2017-12-01 2019-08-14 住友化学株式会社 電子デバイスの製造方法
CN108839352B (zh) * 2018-07-03 2023-10-03 华玻视讯(珠海)科技有限公司 用于保护显示玻璃屏ir孔的多级覆膜机
KR102534660B1 (ko) * 2018-07-26 2023-05-25 주식회사 좋은에너지기술 합지장치를 이용한 기판 합지방법
KR102552270B1 (ko) 2018-11-22 2023-07-07 삼성디스플레이 주식회사 원장보호필름의 박리방법 및 유기발광 표시장치의 제조방법
CN114516444B (zh) * 2022-03-04 2023-11-14 江苏创源电子有限公司 一种贴膜装置及贴膜方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001010005A (ja) * 1999-06-30 2001-01-16 Hitachi Techno Eng Co Ltd フィルム貼付方法
JP2005206852A (ja) * 2004-01-20 2005-08-04 Ulvac Japan Ltd インライン式真空処理装置
JP2005212488A (ja) * 2005-03-15 2005-08-11 Hitachi Industries Co Ltd フィルムラミネート方法とその装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6867539B1 (en) * 2000-07-12 2005-03-15 3M Innovative Properties Company Encapsulated organic electronic devices and method for making same
US6695030B1 (en) * 2002-08-20 2004-02-24 Eastman Kodak Company Apparatus for permitting transfer of organic material from a donor web to form a layer in an OLED device
JP2004146184A (ja) * 2002-10-24 2004-05-20 Konica Minolta Holdings Inc 有機ｅｌ素子の製造装置
US20060145603A1 (en) * 2003-06-25 2006-07-06 Yoshio Taniguchi Organic electroluminescence element, process for fabricating the same and electrode film
CN100531485C (zh) * 2003-06-25 2009-08-19 东海橡胶工业株式会社 有机电致发光元件、制备有机电致发光元件的方法和电极薄膜
JP4820536B2 (ja) * 2003-06-25 2011-11-24 彬雄 谷口 有機エレクトロルミネッセンス素子の製造方法
JP4107316B2 (ja) * 2005-09-02 2008-06-25 株式会社日立プラントテクノロジー 基板貼合装置
JP2007112073A (ja) * 2005-10-24 2007-05-10 Hitachi Plant Technologies Ltd フィルム貼付装置
JP4378711B2 (ja) * 2006-03-29 2009-12-09 株式会社日立プラントテクノロジー 有機ｅｌパネルの製造設備における湿度管理方法および湿度管理システム
JP2008050638A (ja) * 2006-08-23 2008-03-06 Toray Advanced Film Co Ltd 金属化プラスチックフィルム基材の製造方法および真空成膜装置
JPWO2008032526A1 (ja) * 2006-09-15 2010-01-21 コニカミノルタホールディングス株式会社 可撓性封止フィルムの製造方法及びそれを用いた有機エレクトロルミネッセンス素子
WO2008102695A1 (ja) * 2007-02-21 2008-08-28 Ulvac, Inc. 樹脂膜形成装置、樹脂膜形成方法、表示装置、表示装置用の製造装置、及び表示装置の製造方法
JP4881789B2 (ja) * 2007-05-16 2012-02-22 株式会社Ｈａｒｍｏｎｉｃ Ｕｎｉ−Ｂｒａｉｎ 有機エレクトロルミネッセンス素子の製造方法及び有機エレクトロルミネッセンス素子の製造装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001010005A (ja) * 1999-06-30 2001-01-16 Hitachi Techno Eng Co Ltd フィルム貼付方法
JP2005206852A (ja) * 2004-01-20 2005-08-04 Ulvac Japan Ltd インライン式真空処理装置
JP2005212488A (ja) * 2005-03-15 2005-08-11 Hitachi Industries Co Ltd フィルムラミネート方法とその装置

Also Published As

Publication number Publication date
WO2010090223A1 (ja) 2010-08-12
CN102326449B (zh) 2014-06-11
CN102326449A (zh) 2012-01-18
JP5326098B2 (ja) 2013-10-30
KR20110111535A (ko) 2011-10-11
TW201044519A (en) 2010-12-16
JP2010182530A (ja) 2010-08-19
TWI421985B (zh) 2014-01-01

Similar Documents

Publication Publication Date Title
KR101287360B1 (ko) 기판 표면의 밀봉 장치와 유기 ｅｌ 패널의 제조 방법
JP5339550B2 (ja) 真空積層システムおよび真空積層成形方法
JP3882004B2 (ja) 粘着チャック装置
JP5151653B2 (ja) 貼合装置及び貼合方法
JP2003086355A (ja) 有機ｅｌ素子の封止構造並びに封止方法及び封止装置
JP2000082833A (ja) ラミネート装置における搬送装置
JP2008012918A (ja) 積層装置およびそれを用いた積層方法
JP2009194064A (ja) 基板への接着フィルム貼付け装置及び貼付け方法
WO2016017807A1 (ja) 可撓性薄膜構造の表示セルを取り扱う方法
US20130068374A1 (en) APPARATUS AND METHOD FOR LARGE AREA HERMETIC ENCAPSULATION OF ONE OR MORE ORGANIC LIGHT EMITTING DIODES (OLEDs)
JP2019171696A (ja) ラミネート装置およびフレキシブルプリント基板の製造方法
JP2010212590A (ja) 太陽電池のラミネート装置及びラミネート方法
JP2007261188A (ja) ラミネート装置
WO2018072297A1 (zh) Oled显示面板的制作方法
JP2012133098A (ja) 基板組立装置
JP5176642B2 (ja) アライメント貼合装置及びアライメント貼合方法
JP3546346B2 (ja) 真空式ラミネータ装置及びその方法
WO2011039894A1 (ja) 液晶ディスプレイ製造装置及び液晶ディスプレイの製造方法
JP6203566B2 (ja) 封止装置および封止方法
JP6269674B2 (ja) 有機エレクトロルミネッセンス素子の製造方法、及び、製造装置
JP6098644B2 (ja) 有機ｅｌ発光モジュールの製造システム、および有機ｅｌ発光モジュールの製造方法
JP4423966B2 (ja) 連続真空成膜装置
JP2012178471A (ja) シート貼付装置および貼付方法
JP2011007968A (ja) ウェブ加工装置及び電子装置の製造方法
JP5239481B2 (ja) アライメント貼合装置

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
N231 Notification of change of applicant
N231 Notification of change of applicant
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20160705

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20180628

Year of fee payment: 6