CN102326449A - 基板表面的封闭装置和有机el面板的制造方法 - Google Patents
基板表面的封闭装置和有机el面板的制造方法 Download PDFInfo
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- CN102326449A CN102326449A CN2010800066352A CN201080006635A CN102326449A CN 102326449 A CN102326449 A CN 102326449A CN 2010800066352 A CN2010800066352 A CN 2010800066352A CN 201080006635 A CN201080006635 A CN 201080006635A CN 102326449 A CN102326449 A CN 102326449A
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- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H—ELECTRICITY
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Abstract
Description
Claims (5)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009-024948 | 2009-02-05 | ||
JP2009024948A JP5326098B2 (ja) | 2009-02-05 | 2009-02-05 | 基板表面の封止装置と有機elパネルの製造方法 |
PCT/JP2010/051517 WO2010090223A1 (ja) | 2009-02-05 | 2010-02-03 | 基板表面の封止装置と有機elパネルの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102326449A true CN102326449A (zh) | 2012-01-18 |
CN102326449B CN102326449B (zh) | 2014-06-11 |
Family
ID=42542116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201080006635.2A Active CN102326449B (zh) | 2009-02-05 | 2010-02-03 | 基板表面的封闭装置和有机el面板的制造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5326098B2 (zh) |
KR (1) | KR101287360B1 (zh) |
CN (1) | CN102326449B (zh) |
TW (1) | TWI421985B (zh) |
WO (1) | WO2010090223A1 (zh) |
Cited By (7)
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CN103050417A (zh) * | 2012-12-25 | 2013-04-17 | 王奉瑾 | 用于半导体集成制造生产线中的动态密封模块 |
CN103077910A (zh) * | 2012-12-25 | 2013-05-01 | 王奉瑾 | 用于半导体集成制造生产线中的动态隔离模块 |
CN105984745A (zh) * | 2015-02-09 | 2016-10-05 | 住化电子材料科技(无锡)有限公司 | 膜层叠体的制造装置及膜层叠体的制造方法 |
CN106134288A (zh) * | 2014-03-19 | 2016-11-16 | 琳得科株式会社 | 电子元件封装用层叠片以及电子器件的制造方法 |
CN105027676B (zh) * | 2013-03-29 | 2017-03-08 | 大日本印刷株式会社 | 元件制造方法以及元件制造装置 |
CN110676395A (zh) * | 2013-12-02 | 2020-01-10 | 株式会社半导体能源研究所 | 显示装置及其制造方法 |
CN114516444A (zh) * | 2022-03-04 | 2022-05-20 | 江苏创源电子有限公司 | 一种贴膜装置 |
Families Citing this family (17)
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JP5990745B2 (ja) | 2011-05-31 | 2016-09-14 | 株式会社Joled | 接合体の製造方法及び接合体 |
KR101859964B1 (ko) * | 2011-06-29 | 2018-05-24 | 삼성디스플레이 주식회사 | 기판 밀봉장치 및 이를 이용한 기판의 밀봉방법 |
JP5189194B2 (ja) * | 2011-09-05 | 2013-04-24 | ミカドテクノス株式会社 | 真空加熱接合装置及び真空加熱接合方法 |
KR101318177B1 (ko) * | 2011-11-29 | 2013-10-16 | 주식회사 에스에프에이 | Oled패널의 봉지장치 |
KR101306609B1 (ko) * | 2011-11-29 | 2013-09-11 | 주식회사 에스에프에이 | 플라즈마 발생기 및 이를 구비하는 oled패널의 봉지장치 |
KR101838756B1 (ko) | 2011-12-22 | 2018-03-15 | 엘지디스플레이 주식회사 | 유기전계발광 표시장치의 봉지방법 |
WO2014024478A1 (ja) * | 2012-08-07 | 2014-02-13 | パナソニック株式会社 | 接合体の製造方法及び接合体 |
JP6281770B2 (ja) * | 2012-08-07 | 2018-02-21 | 株式会社Joled | 接合体の製造方法 |
JP6135062B2 (ja) | 2012-08-07 | 2017-05-31 | セイコーエプソン株式会社 | 発光装置、発光装置の製造方法、電子機器 |
JP6066054B2 (ja) * | 2012-12-06 | 2017-01-25 | Aiメカテック株式会社 | 有機el封止装置、封止ロールフィルム製作装置及び有機el封止システム |
JP6015422B2 (ja) * | 2012-12-21 | 2016-10-26 | コニカミノルタ株式会社 | 有機エレクトロルミネッセンスパネルの製造方法と製造装置 |
KR102069851B1 (ko) * | 2013-03-26 | 2020-01-28 | 삼성디스플레이 주식회사 | 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템 |
KR102241849B1 (ko) | 2014-09-24 | 2021-04-20 | 삼성디스플레이 주식회사 | 표시 장치의 제조 장치 및 이를 이용한 표시 장치의 제조 방법 |
JP6559758B2 (ja) * | 2017-12-01 | 2019-08-14 | 住友化学株式会社 | 電子デバイスの製造方法 |
CN108839352B (zh) * | 2018-07-03 | 2023-10-03 | 华玻视讯(珠海)科技有限公司 | 用于保护显示玻璃屏ir孔的多级覆膜机 |
KR102534660B1 (ko) * | 2018-07-26 | 2023-05-25 | 주식회사 좋은에너지기술 | 합지장치를 이용한 기판 합지방법 |
KR102552270B1 (ko) | 2018-11-22 | 2023-07-07 | 삼성디스플레이 주식회사 | 원장보호필름의 박리방법 및 유기발광 표시장치의 제조방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1485218A (zh) * | 2002-08-20 | 2004-03-31 | ��˹���´﹫˾ | 从给体卷材转印有机材料而在oled器件中成层的设备 |
CN1843060A (zh) * | 2003-06-25 | 2006-10-04 | 东海橡胶工业株式会社 | 有机电致发光元件、制备有机电致发光元件的方法和电极薄膜 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001010005A (ja) * | 1999-06-30 | 2001-01-16 | Hitachi Techno Eng Co Ltd | フィルム貼付方法 |
US6867539B1 (en) * | 2000-07-12 | 2005-03-15 | 3M Innovative Properties Company | Encapsulated organic electronic devices and method for making same |
JP2004146184A (ja) * | 2002-10-24 | 2004-05-20 | Konica Minolta Holdings Inc | 有機el素子の製造装置 |
US20060145603A1 (en) * | 2003-06-25 | 2006-07-06 | Yoshio Taniguchi | Organic electroluminescence element, process for fabricating the same and electrode film |
JP4820536B2 (ja) * | 2003-06-25 | 2011-11-24 | 彬雄 谷口 | 有機エレクトロルミネッセンス素子の製造方法 |
JP4417734B2 (ja) * | 2004-01-20 | 2010-02-17 | 株式会社アルバック | インライン式真空処理装置 |
JP4111200B2 (ja) * | 2005-03-15 | 2008-07-02 | 株式会社日立プラントテクノロジー | フィルムラミネート方法とその装置 |
JP4107316B2 (ja) * | 2005-09-02 | 2008-06-25 | 株式会社日立プラントテクノロジー | 基板貼合装置 |
JP2007112073A (ja) * | 2005-10-24 | 2007-05-10 | Hitachi Plant Technologies Ltd | フィルム貼付装置 |
JP4378711B2 (ja) * | 2006-03-29 | 2009-12-09 | 株式会社日立プラントテクノロジー | 有機elパネルの製造設備における湿度管理方法および湿度管理システム |
JP2008050638A (ja) * | 2006-08-23 | 2008-03-06 | Toray Advanced Film Co Ltd | 金属化プラスチックフィルム基材の製造方法および真空成膜装置 |
JPWO2008032526A1 (ja) * | 2006-09-15 | 2010-01-21 | コニカミノルタホールディングス株式会社 | 可撓性封止フィルムの製造方法及びそれを用いた有機エレクトロルミネッセンス素子 |
WO2008102695A1 (ja) * | 2007-02-21 | 2008-08-28 | Ulvac, Inc. | 樹脂膜形成装置、樹脂膜形成方法、表示装置、表示装置用の製造装置、及び表示装置の製造方法 |
JP4881789B2 (ja) * | 2007-05-16 | 2012-02-22 | 株式会社Harmonic Uni−Brain | 有機エレクトロルミネッセンス素子の製造方法及び有機エレクトロルミネッセンス素子の製造装置 |
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2009
- 2009-02-05 JP JP2009024948A patent/JP5326098B2/ja not_active Expired - Fee Related
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2010
- 2010-02-02 TW TW099103011A patent/TWI421985B/zh not_active IP Right Cessation
- 2010-02-03 KR KR1020117020569A patent/KR101287360B1/ko active IP Right Grant
- 2010-02-03 WO PCT/JP2010/051517 patent/WO2010090223A1/ja active Application Filing
- 2010-02-03 CN CN201080006635.2A patent/CN102326449B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1485218A (zh) * | 2002-08-20 | 2004-03-31 | ��˹���´﹫˾ | 从给体卷材转印有机材料而在oled器件中成层的设备 |
CN1843060A (zh) * | 2003-06-25 | 2006-10-04 | 东海橡胶工业株式会社 | 有机电致发光元件、制备有机电致发光元件的方法和电极薄膜 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103050417A (zh) * | 2012-12-25 | 2013-04-17 | 王奉瑾 | 用于半导体集成制造生产线中的动态密封模块 |
CN103077910A (zh) * | 2012-12-25 | 2013-05-01 | 王奉瑾 | 用于半导体集成制造生产线中的动态隔离模块 |
CN103050417B (zh) * | 2012-12-25 | 2015-10-28 | 王奉瑾 | 用于半导体集成制造生产线中的动态密封模块 |
CN105027676B (zh) * | 2013-03-29 | 2017-03-08 | 大日本印刷株式会社 | 元件制造方法以及元件制造装置 |
CN110676395A (zh) * | 2013-12-02 | 2020-01-10 | 株式会社半导体能源研究所 | 显示装置及其制造方法 |
US11672148B2 (en) | 2013-12-02 | 2023-06-06 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
CN106134288A (zh) * | 2014-03-19 | 2016-11-16 | 琳得科株式会社 | 电子元件封装用层叠片以及电子器件的制造方法 |
CN106134288B (zh) * | 2014-03-19 | 2018-01-02 | 琳得科株式会社 | 电子元件封装用层叠片以及电子器件的制造方法 |
CN105984745A (zh) * | 2015-02-09 | 2016-10-05 | 住化电子材料科技(无锡)有限公司 | 膜层叠体的制造装置及膜层叠体的制造方法 |
CN114516444A (zh) * | 2022-03-04 | 2022-05-20 | 江苏创源电子有限公司 | 一种贴膜装置 |
CN114516444B (zh) * | 2022-03-04 | 2023-11-14 | 江苏创源电子有限公司 | 一种贴膜装置及贴膜方法 |
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WO2010090223A1 (ja) | 2010-08-12 |
CN102326449B (zh) | 2014-06-11 |
KR101287360B1 (ko) | 2013-07-23 |
JP5326098B2 (ja) | 2013-10-30 |
KR20110111535A (ko) | 2011-10-11 |
TW201044519A (en) | 2010-12-16 |
JP2010182530A (ja) | 2010-08-19 |
TWI421985B (zh) | 2014-01-01 |
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