WO2018072297A1 - Oled显示面板的制作方法 - Google Patents

Oled显示面板的制作方法 Download PDF

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Publication number
WO2018072297A1
WO2018072297A1 PCT/CN2016/110908 CN2016110908W WO2018072297A1 WO 2018072297 A1 WO2018072297 A1 WO 2018072297A1 CN 2016110908 W CN2016110908 W CN 2016110908W WO 2018072297 A1 WO2018072297 A1 WO 2018072297A1
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Prior art keywords
encapsulant
oled substrate
oled
display panel
oled display
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PCT/CN2016/110908
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English (en)
French (fr)
Inventor
曾维静
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深圳市华星光电技术有限公司
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Priority to US15/505,106 priority Critical patent/US10505153B2/en
Publication of WO2018072297A1 publication Critical patent/WO2018072297A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate

Definitions

  • the present invention relates to the field of flat panel display technologies, and in particular, to a method for fabricating an OLED display panel.
  • OLED Organic Light-Emitting Diode
  • LCD liquid crystal display
  • OLED display technology eliminates the need for backlights and uses very thin organic coatings and glass substrates that illuminate when current is passed through.
  • the organic material is easily reacted with water and oxygen, a small amount of water vapor and oxygen can damage the organic light-emitting material, deteriorating the luminescent properties of the device.
  • the commonly used OLED packaging technologies mainly include: ultraviolet (UV) curing frame seal package, glass powder laser seal (laser sealing), face seal (face seal), sealant and desiccant filling package (dam and fill), film package Wait.
  • UV ultraviolet
  • the package method of the surface package is often used on a large-sized OLED display panel.
  • a plurality of panels of a desired size are generally formed on a high-generation glass substrate, and when packaged by a surface package, the patterning of the packaged adhesive material becomes an urgent problem to be solved.
  • a method for fabricating an OLED display panel using a surface package includes the following steps:
  • Step 10 The OLED substrate 100, the plurality of cover plates 210, and the plurality of package adhesives 310 are provided.
  • the OLED substrate 100 includes a plurality of arrayed OLED substrate units 110, and each package adhesive 310 includes an encapsulant 311. And two separate release films 312 respectively adhered to opposite sides of the encapsulant 311, wherein each of the cover plates 210 and each of the encapsulants 310 correspond to a single OLED substrate unit 110 on the OLED substrate 100 .
  • Step 20 as shown in FIG. 1, the release film 312 on the side of each of the encapsulants 311 is removed.
  • Step 30 As shown in FIG. 2, each of the encapsulants 311 is bonded to one of the cover plates 210 from the side by using a laminating machine, and a plurality of encapsulants 310 are attached to the plurality of cover plates 210.
  • Step 40 as shown in FIG. 3, a plurality of packaged adhesive materials 310 and a cover plate 210 are placed on the bearing fixture 500 through a robot, wherein the plurality of packaged packages are assembled.
  • the position of the adhesive material 310 and the cover plate 210 on the bearing fixture 500 needs to be in one-to-one correspondence with the positions of the plurality of OLED substrate units 110 on the OLED substrate 100.
  • this step has high requirements on the flatness of the carrying jig 500, the control precision of the manipulator, the positional accuracy of the encapsulating material 310 and the cover 210 on the carrying jig.
  • Step 50 as shown in FIG. 4, the release film 312 on the other side of each of the encapsulants 311 is removed.
  • Step 60 as shown in FIG. 5, under the bearing of the carrying fixture 500, a plurality of encapsulants 311 are attached to the OLED substrate 100 from the other side, and the plurality of encapsulants 311 and the OLED substrate are respectively The plurality of OLED substrate units 110 on the 100 are bonded one by one.
  • Step 70 as shown in FIG. 6, the carrier fixture 500 is removed, and the OLED substrate 100 bonded to the plurality of package colloids 311 is cut corresponding to the plurality of OLED substrate units 110 to obtain a plurality of target products. That is, an OLED display panel.
  • each cover plate 210 and each package adhesive 310 corresponds to the size of the target product, and is compatible with the production of different size products.
  • the laminating machine used in the step 30 needs to be compatible.
  • the carrier fixture 500 is used to carry a plurality of packaged adhesive materials 310 and the cover plate 210.
  • the use of the carrier fixture 500 requires additional operations of transportation, cleaning, storage, etc., and increases The cost of the device also complicates the process, and the alignment accuracy of the cover plate 210 and the OLED substrate unit 110 is lowered.
  • the object of the present invention is to provide a method for manufacturing an OLED display panel, which reduces equipment cost and process difficulty, and is simple and easy to manufacture, and can realize automatic production.
  • the present invention provides a method for fabricating an OLED display panel, including:
  • the step of providing an OLED substrate, a cover plate, and an encapsulant wherein the OLED substrate comprises a plurality of arrayed OLED substrate units, the encapsulant comprises an encapsulant, and two oppositely attached to the encapsulant Two release films on one side;
  • step of performing a patterning process on the encapsulant of the encapsulant wherein the step is specifically: dividing a plurality of target package regions corresponding to the plurality of OLED substrate units on the encapsulant, and remaining A portion of the plurality of target package regions is subjected to a surface damage treatment on a portion of the encapsulant that belongs to the spacer region, so that the surface of the portion is lost in viscosity.
  • the manufacturing method of the OLED display panel specifically includes the following steps:
  • Step 1 Providing an OLED substrate, a cover plate, and a package adhesive
  • Step 2 tearing off the release film on the side of the encapsulant
  • Step 3 bonding the encapsulant from the entire surface of the cover from the one side;
  • Step 4 tearing off the release film on the other side of the encapsulant
  • Step 5 performing patterning processing on the encapsulant of the encapsulant, and dividing, on the encapsulation, a plurality of target encapsulation regions corresponding to the plurality of OLED substrate units, and a plurality of remaining target encapsulation regions An outer spacer region from which the portion belonging to the spacer region on the encapsulant is subjected to surface damage treatment, so that the surface of the portion loses viscosity;
  • Step 6 bonding the encapsulant to the OLED substrate from the other side;
  • Step 7 Corresponding to the plurality of OLED substrate units, the OLED substrate and the cover plate bonded to the encapsulant are cut to obtain a plurality of OLED display panels.
  • the manufacturing method of the OLED display panel specifically includes the following steps:
  • Step 1' providing an OLED substrate, a cover plate, and an encapsulant
  • Step 2' tearing off the release film on the side of the encapsulant
  • Step 3 ′ performing a patterning process on the encapsulant of the encapsulant, and dividing a plurality of target encapsulation regions corresponding to the plurality of OLED substrate units and the remaining target encapsulation regions on the encapsulation colloid a spacer region outside the surface from which a portion belonging to the spacer region on the encapsulant is subjected to surface damage treatment, thereby causing the surface of the portion to lose its viscosity;
  • Step 4' bonding the encapsulant to the entire surface of the cover from the side;
  • Step 5' tearing off the release film on the other side of the encapsulant
  • Step 6' bonding the encapsulant to the OLED substrate from the other side;
  • step 7' the OLED substrate and the cover plate bonded to the encapsulant are cut corresponding to the plurality of OLED substrate units to obtain a plurality of OLED display panels.
  • the portion of the spacer on the encapsulant is subjected to surface damage treatment by particle beam bombardment, so that the surface of the portion loses its viscosity.
  • the portion of the spacer on the encapsulant is subjected to surface damage treatment by ultraviolet light irradiation, so that the surface of the portion loses its viscosity.
  • a plurality of target encapsulation regions on the encapsulant are scanned by laser, and the encapsulant is separated between the target encapsulation region and the spacer region.
  • the encapsulant is bonded to the entire surface of the cover by a bonding machine.
  • step 6 the bonding of the encapsulant and the OLED substrate is completed in a vacuum environment.
  • the encapsulant is bonded to the entire surface of the cover by a bonding machine.
  • the bonding of the encapsulant to the OLED substrate is completed in a vacuum environment.
  • the invention also provides a method for manufacturing an OLED display panel, comprising:
  • the step of providing an OLED substrate, a cover plate, and an encapsulant wherein the OLED substrate comprises a plurality of arrayed OLED substrate units, the encapsulant comprises an encapsulant, and two oppositely attached to the encapsulant Two release films on one side;
  • step of performing a patterning process on the encapsulant of the encapsulant wherein the step is specifically: dividing a plurality of target package regions corresponding to the plurality of OLED substrate units on the encapsulant, and remaining a portion of the plurality of target package regions, the surface of the encapsulant that belongs to the spacer region is subjected to surface damage treatment, so that the surface of the portion is lost in viscosity;
  • the specific steps include the following steps:
  • Step 1 Providing an OLED substrate, a cover plate, and a package adhesive
  • Step 2 tearing off the release film on the side of the encapsulant
  • Step 3 bonding the encapsulant from the entire surface of the cover from the one side;
  • Step 4 tearing off the release film on the other side of the encapsulant
  • Step 5 performing patterning processing on the encapsulant of the encapsulant, and dividing, on the encapsulation, a plurality of target encapsulation regions corresponding to the plurality of OLED substrate units, and a plurality of remaining target encapsulation regions An outer spacer region from which the portion belonging to the spacer region on the encapsulant is subjected to surface damage treatment, so that the surface of the portion loses viscosity;
  • Step 6 bonding the encapsulant to the OLED substrate from the other side;
  • Step 7 corresponding to the plurality of OLED substrate units, the OLED substrate and the cover plate bonded to the encapsulant are cut to obtain a plurality of OLED display panels;
  • the portion of the spacer on the encapsulant is subjected to surface damage treatment by particle beam bombardment, so that the surface of the portion loses its viscosity.
  • the encapsulant of the encapsulant is patterned, and a plurality of OLED substrate units on the OLED substrate are divided on the encapsulant. a corresponding target package area and a remaining area outside the plurality of target package areas, surface-destroying the part of the encapsulant belonging to the spacer area, so that the surface of the part is lost in viscosity, and then the package is packaged
  • the colloid is bonded to the OLED substrate, and finally several OLED display panels are obtained by cutting.
  • the method is simple and easy, reduces the dimensional compatibility requirements of the bonding machine, and avoids the use of additional robots and bearing fixtures, thereby reducing the use.
  • FIG. 1 is a schematic diagram of a step 20 of a method for fabricating an OLED display panel using a surface package method
  • FIG. 2 is a schematic diagram of a step 30 of a method for fabricating an OLED display panel using a surface package method
  • FIG. 3 is a schematic diagram of a step 40 of a method for fabricating an OLED display panel using a surface package method
  • FIG. 4 is a schematic diagram of a step 50 of a method for fabricating an OLED display panel using a surface package method
  • FIG. 5 is a schematic diagram of a step 60 of a method for fabricating an OLED display panel using a surface package method
  • FIG. 6 is a schematic diagram of a step 70 of a method for fabricating an OLED display panel using a surface package method
  • FIG. 7 is a schematic flow chart of a first embodiment of a method for fabricating an OLED display panel of the present invention.
  • step 3 is a schematic diagram of step 3 of the first embodiment of the method for fabricating an OLED display panel of the present invention.
  • step 4 is a schematic diagram of step 4 of the first embodiment of the method for fabricating an OLED display panel of the present invention.
  • step 5 is a schematic diagram of step 5 of the first embodiment of the method for fabricating an OLED display panel of the present invention.
  • step 6 is a schematic diagram of step 6 of the first embodiment of the method for fabricating an OLED display panel of the present invention.
  • FIG. 13 is a step 7 of the first embodiment of the method for fabricating an OLED display panel of the present invention.
  • FIG. 14 is a schematic flow chart of a second embodiment of a method for fabricating an OLED display panel of the present invention.
  • Figure 15 is a schematic view showing a step 2' of the second embodiment of the method of fabricating the OLED display panel of the present invention.
  • Figure 16 is a schematic view showing a step 3' of the first embodiment of the method for fabricating an OLED display panel of the present invention.
  • Figure 17 is a schematic view showing a step 4' of the first embodiment of the method for fabricating an OLED display panel of the present invention.
  • Figure 18 is a schematic view showing the step 5' of the second embodiment of the method for fabricating the OLED display panel of the present invention.
  • Figure 19 is a schematic view showing a step 6' of the second embodiment of the method for fabricating an OLED display panel of the present invention.
  • Figure 20 is a schematic view showing the step 7' of the second embodiment of the method of fabricating the OLED display panel of the present invention.
  • a first embodiment of a method for fabricating an OLED display panel of the present invention includes the following steps:
  • Step 1 Providing an OLED substrate 1, a cover plate 2, and an encapsulant 3 .
  • the OLED substrate 1 includes a plurality of arrayed OLED substrate units 11 , and the encapsulant 3 includes an encapsulant 31 and two release films respectively adhered to opposite sides of the encapsulant 31 . 32.
  • Step 2 As shown in FIG. 8, the release film 32 on the side of the encapsulant 31 is removed.
  • Step 3 As shown in FIG. 9, the encapsulant 31 and the cover 2 are bonded to the entire surface from the side.
  • the encapsulant 31 is attached to the entire surface of the cover 2 by a bonding machine.
  • the cover plate 2 and the encapsulant 3 provided in the step 1 correspond to the OLED substrate 1 as a whole, instead of the single OLED substrate unit 11 on the OLED substrate 1 in the prior art, for different sizes.
  • the target product reduces the size compatibility requirements of the laminator.
  • Step 4 As shown in FIG. 10, the release film 32 on the other side of the encapsulant 31 is removed.
  • Step 5 as shown in FIG. 11, the encapsulation 31 of the encapsulant 3 is patterned.
  • a plurality of target package regions 301 corresponding to the plurality of OLED substrate units 11 and a spacer region 302 other than the remaining plurality of target package regions 301 are divided on the package body 31, from the other side
  • a portion of the encapsulant 31 that belongs to the spacer region 302 is subjected to a surface damage treatment to lose the viscosity of the surface of the portion.
  • the surface of the spacer 302 on the encapsulant 31 is subjected to surface damage by means of particle beam bombardment or ultraviolet light irradiation.
  • the treatment is such that the surface of the portion loses its viscosity.
  • a plurality of target package regions 301 on the encapsulant 31 need to be scanned by laser, the purpose of which is to make the encapsulant 31
  • a partition is formed between the target package region 301 and the spacer region 302, so that the subsequent cutting of the cover 2 can be smoothly performed.
  • Step 6 As shown in FIG. 12, the encapsulant 31 is bonded to the OLED substrate 1 from the other side.
  • the bonding of the encapsulant 31 and the OLED substrate 1 is completed in a vacuum environment.
  • the plurality of target package regions 301 of the encapsulant 31 are respectively corresponding to the plurality of OLED substrate units 11 of the OLED substrate 1.
  • Step 7 As shown in FIG. 13 , the OLED substrate 1 and the cover 2 bonded to the encapsulant 31 are cut corresponding to the plurality of OLED substrate units 11 to obtain a plurality of OLED display panels.
  • the portion of the encapsulant 31 belonging to the spacer region 302 is removed along with the portion of the cover 2 that needs to be removed during the cutting process of the cover 2;
  • the portion of the encapsulant 31 that belongs to the spacer region 302 is peeled off before the portion of the cover 2 that needs to be removed is removed.
  • a second embodiment of the method for fabricating an OLED display panel of the present invention is compared with the first embodiment described above, and the main difference is that the package body 31 is packaged before being applied to the entire surface of the cover 2 .
  • the colloid 31 is patterned, and specifically, the embodiment includes the following steps:
  • Step 1' providing an OLED substrate 1, a cover plate 2, and an encapsulant 3.
  • the OLED substrate 1 includes a plurality of arrayed OLED substrate units 11 , and the encapsulant 3 includes an encapsulant 31 and two release films respectively adhered to opposite sides of the encapsulant 31 . 32.
  • Step 2' as shown in Fig. 15, the release film 32 on the side of the encapsulant 31 is removed.
  • Step 3' as shown in FIG. 16, the encapsulation 31 of the encapsulant 3 is patterned.
  • a plurality of target package regions 301 corresponding to the plurality of OLED substrate units 11 and a spacer region 302 other than the remaining plurality of target package regions 301 are defined on the encapsulant 31, from which the pair is
  • the portion of the encapsulant 31 that belongs to the spacer region 302 is subjected to surface damage treatment, so that the surface of the portion loses its viscosity.
  • the surface of the spacer 302 on the encapsulant 31 is subjected to surface damage by means of particle beam bombardment or ultraviolet light irradiation.
  • the treatment is such that the surface of the portion loses its viscosity.
  • a plurality of target package regions 301 on the encapsulant 31 need to be scanned by laser, the purpose of which is to make the encapsulant 31
  • a partition is formed between the target package region 301 and the spacer region 302, so that the subsequent cutting of the cover 2 can be smoothly performed.
  • step 4' as shown in Fig. 17, the encapsulant 31 is bonded to the entire surface of the cover 2 from the side.
  • the encapsulant 31 is bonded to the cover 2 over the entire surface by a bonding machine.
  • Step 5' as shown in Fig. 18, the release film 32 on the other side of the encapsulant 31 is removed.
  • the encapsulant 31 of the encapsulant 3 has been patterned, and the surface tack of the portion of the encapsulant 31 belonging to the spacer 302 has been destroyed, so the portion In the step 5', it can be peeled off together with the release film 32, and the portion of the encapsulant 31 left on the cover 2 is a portion belonging to the target package region 301.
  • Step 6' as shown in Fig. 19, the encapsulant 31 is bonded to the OLED substrate 1 from the other side.
  • the bonding of the encapsulant 31 to the OLED substrate 1 is completed in a vacuum environment.
  • the plurality of target package regions 301 of the encapsulant 31 are respectively attached to the plurality of OLED substrate units 11 of the OLED substrate 1.
  • step 7' as shown in FIG. 20, the OLED substrate 1 and the cover 2 bonded to the encapsulant 31 are cut corresponding to the plurality of OLED substrate units 11, and a plurality of OLED display panels are obtained.
  • the encapsulant of the encapsulant is patterned, and a plurality of OLED substrate units on the OLED substrate are divided on the encapsulant.
  • performing surface damage treatment on the portion of the encapsulant that belongs to the spacer area, so that the surface of the part is lost in viscosity, and then the encapsulant is encapsulated The OLED substrate is bonded, and finally several OLED display panels are obtained by cutting.
  • the method is simple and easy, reduces the dimensional compatibility requirements of the bonding machine, and avoids the use of additional robots and bearing fixtures. Thereby, the huge cost of equipment caused by complicated operations such as cleaning, transmission and storage of the jig is reduced, and the alignment fit precision of the product is improved, and automatic production can be realized.

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Abstract

一种OLED显示面板的制作方法，首先对封装胶材（3）的封装胶体（31）进行图形化处理，在该封装胶体（31）上划分出数个与OLED基板（1）上的数个OLED基板单元（11）一一对应的目标封装区域（301）、及剩余的数个目标封装区域（301）之外的间隔区域（302），对该封装胶体（31）上属于间隔区域（302）的部分进行表面破坏处理，而使该部分的表面失去粘性，然后再将封装胶体（31）与OLED基板（1）进行贴合，最后通过切割得到数个OLED显示面板。该方法简单易行，降低了贴合机的尺寸兼容性要求，以及避免了额外机械手、承载治具的使用，从而降低了治具清洗、传输、存放等复杂操作引起的设备巨额成本，提高了产品的对位贴合精度，可实现自动化。

Description

OLED显示面板的制作方法 技术领域
本发明涉及平板显示技术领域，尤其涉及一种OLED显示面板的制作方法。
背景技术
有机发光二极管(Organic Light-Emitting Diode，OLED)显示器，具备自发光、高亮度、宽视角、高对比度、可挠曲、低能耗等特性，因此受到广泛的关注，并作为新一代的显示方式，已开始逐渐取代传统的液晶显示器(Liquid Crystal Display，LCD)，被广泛应用在手机屏幕、电脑显示器、全彩电视等。OLED显示技术与传统的LCD显示方式不同，无需背光灯，采用非常薄的有机材料涂层和玻璃基板，当有电流通过时，这些有机材料就会发光。但是由于有机材料易与水氧反应，很少量的水蒸气和氧气就能损害有机发光材料，使器件的发光性能劣化。因此，如何减少水蒸气和氧气对器件封装材料的渗透，消除器件内部的水蒸气和氧气，是有机电致发光器件封装技术要解决的重要问题。为了实现OLED显示面板商业化，与之相关的封装技术成为了研究热点。
目前常用的OLED封装技术主要有：紫外光(UV)固化框胶封装、玻璃粉末镭射封装(laser sealing)、面封装(face seal)、框胶及干燥剂填充封装(dam and fill)、薄膜封装等。其中，面封装的封装方式常用于大尺寸的OLED显示面板上。为节省生产成本，一般会在高世代的玻璃基板上形成多个所需尺寸的面板，而采用面封装方式进行封装时，封装胶材的图形化成了一个亟需解决的难题。请参阅图1-6，目前采用面封装方式的OLED显示面板的制作方法包括以下步骤：
步骤10、提供OLED基板100、数个盖板210、及数个封装胶材310，所述OLED基板100包括数个阵列排布的OLED基板单元110，每一封装胶材310包括封装胶体311、及分别粘贴在该封装胶体311的相对两个侧面上的两层离型膜312，其中，每一盖板210、及每一封装胶材310与OLED基板100上的单个OLED基板单元110相对应。
步骤20、如图1所示，撕除每一封装胶体311一侧的离型膜312。
步骤30、如图2所示，使用贴合机从该一侧使每一封装胶体311与一个盖板210对应贴合，进而将数个封装胶材310与数个盖板210对应贴合。
步骤40、如图3所示，将数个已贴合好的封装胶材310与盖板210，通过机械手，一一放置在承载治具500上，其中，该数个已贴合好的封装胶材310与盖板210在承载治具500上的位置需要与所述OLED基板100上数个OLED基板单元110的位置一一对应。此时，该步骤对承载治具500的平坦度、机械手的控制精度、封装胶材310与盖板210在承载治具上的位置精度等要求较高。
步骤50、如图4所示，撕除每一封装胶体311另一侧的离型膜312。
步骤60、如图5所示，在所述承载治具500的承载下，从该另一侧使数个封装胶体311均与OLED基板100贴合，此时数个封装胶体311分别与OLED基板100上的数个OLED基板单元110一一对应贴合。
步骤70、如图6所示，移除承载治具500，对应所述数个OLED基板单元110，对与所述数个封装胶体311贴合后的OLED基板100进行切割，得到数个目标产品即OLED显示面板。
在实际生产中，每一盖板210、及每一封装胶材310的尺寸均与目标产品的尺寸相对应，为兼容不同尺寸产品的生产，所述步骤30中所使用贴合机需要兼容不同尺寸的封装胶材100的贴合。
另外，现有技术中，使用承载治具500承载数个已贴合好的封装胶材310与盖板210，然而承载治具500的使用，需要额外的传输、清洗、存放等操作，增加了设备成本，也使工艺变得复杂，使盖板210与OLED基板单元110的对位贴合精度降低。
发明内容
本发明的目的在于提供一种OLED显示面板的制作方法，降低设备成本以及工艺难度，制作方法简单易行，可实现自动化生产。
为实现上述目的，本发明提供一种OLED显示面板的制作方法，包括：
提供OLED基板、盖板、及封装胶材的步骤，其中，所述OLED基板包括数个阵列排布的OLED基板单元，所述封装胶材包括封装胶体、及分别粘贴在该封装胶体的相对两个侧面上的两层离型膜；
及对封装胶材的封装胶体进行图形化处理的步骤，其中，该步骤具体为，在所述封装胶体上划分出数个与所述数个OLED基板单元一一对应的目标封装区域、及剩余的数个目标封装区域之外的间隔区域，对所述封装胶体上属于间隔区域的部分进行表面破坏处理，从而使该部分的表面失去粘性。
可选地，所述的OLED显示面板的制作方法具体包括如下步骤：
步骤1、提供OLED基板、盖板、及封装胶材；
步骤2、撕除封装胶体一侧的离型膜；
步骤3、从该一侧使封装胶体与盖板整面贴合；
步骤4、撕除封装胶体另一侧的离型膜；
步骤5、对封装胶材的封装胶体进行图形化处理，在所述封装胶体上划分出数个与所述数个OLED基板单元一一对应的目标封装区域、及剩余的数个目标封装区域之外的间隔区域，从该另一侧对所述封装胶体上属于间隔区域的部分进行表面破坏处理，从而使该部分的表面失去粘性；
步骤6、从该另一侧使封装胶体与OLED基板贴合；
步骤7、对应所述数个OLED基板单元，对与封装胶体贴合后的OLED基板、及盖板进行切割，得到数个OLED显示面板。
可选地，所述的OLED显示面板的制作方法，具体包括如下步骤：
步骤1’、提供OLED基板、盖板、及封装胶材；
步骤2’、撕除封装胶体一侧的离型膜；
步骤3’、对封装胶材的封装胶体进行图形化处理，在所述封装胶体上划分出数个与所述数个OLED基板单元一一对应的目标封装区域、及剩余的数个目标封装区域之外的间隔区域，从该一侧对所述封装胶体上属于间隔区域的部分进行表面破坏处理，从而使该部分的表面失去粘性；
步骤4’、从该一侧使封装胶体与盖板整面贴合；
步骤5’、撕除封装胶体另一侧的离型膜；
步骤6’、从该另一侧使封装胶体与OLED基板贴合；
步骤7’、对应所述数个OLED基板单元，对与封装胶体贴合后的OLED基板、及盖板进行切割，得到数个OLED显示面板。
在对封装胶材的封装胶体进行图形化处理的步骤中，通过粒子束轰击的方式，对所述封装胶体上间隔区域的部分进行表面破坏处理，从而使该部分的表面失去粘性。
在对封装胶材的封装胶体进行图形化处理的步骤中，通过紫外光照射的方式，对所述封装胶体上间隔区域的部分进行表面破坏处理，从而使该部分的表面失去粘性。
在对封装胶材的封装胶体进行图形化处理的步骤中，通过镭射扫描出所述封装胶体上的数个目标封装区域，并使得所述封装胶体在目标封装区域与间隔区域之间产生隔断。
所述步骤3中，利用贴合机使封装胶体与盖板整面贴合。
所述步骤6中，在真空环境下完成封装胶体与OLED基板的贴合。
所述步骤4’中，利用贴合机使封装胶体与盖板整面贴合。
所述步骤6’中，在真空环境下完成封装胶体与OLED基板的贴合。
本发明还提供一种OLED显示面板的制作方法，包括：
提供OLED基板、盖板、及封装胶材的步骤，其中，所述OLED基板包括数个阵列排布的OLED基板单元，所述封装胶材包括封装胶体、及分别粘贴在该封装胶体的相对两个侧面上的两层离型膜；
及对封装胶材的封装胶体进行图形化处理的步骤，其中，该步骤具体为，在所述封装胶体上划分出数个与所述数个OLED基板单元一一对应的目标封装区域、及剩余的数个目标封装区域之外的间隔区域，对所述封装胶体上属于间隔区域的部分进行表面破坏处理，从而使该部分的表面失去粘性；
其中，具体包括如下步骤：
步骤1、提供OLED基板、盖板、及封装胶材；
步骤2、撕除封装胶体一侧的离型膜；
步骤3、从该一侧使封装胶体与盖板整面贴合；
步骤4、撕除封装胶体另一侧的离型膜；
步骤5、对封装胶材的封装胶体进行图形化处理，在所述封装胶体上划分出数个与所述数个OLED基板单元一一对应的目标封装区域、及剩余的数个目标封装区域之外的间隔区域，从该另一侧对所述封装胶体上属于间隔区域的部分进行表面破坏处理，从而使该部分的表面失去粘性；
步骤6、从该另一侧使封装胶体与OLED基板贴合；
步骤7、对应所述数个OLED基板单元，对与封装胶体贴合后的OLED基板、及盖板进行切割，得到数个OLED显示面板；
其中，在对封装胶材的封装胶体进行图形化处理的步骤中，通过粒子束轰击的方式，对所述封装胶体上间隔区域的部分进行表面破坏处理，从而使该部分的表面失去粘性。
本发明的有益效果：本发明的OLED显示面板的制作方法，首先对封装胶材的封装胶体进行图形化处理，在所述封装胶体上划分出数个与OLED基板上的数个OLED基板单元一一对应的目标封装区域、及剩余的数个目标封装区域之外的间隔区域，对所述封装胶体上属于间隔区域的部分进行表面破坏处理，从而使该部分的表面失去粘性，然后再将封装胶体与OLED基板进行贴合，最后通过切割得到数个OLED显示面板，该方法简单易行，降低了贴合机的尺寸兼容性要求，以及避免了额外机械手、承载治具的使用，从而降低了治具清洗、传输、存放等复杂操作引起的设备巨额成本， 并提高了产品的对位贴合精度，可实现自动化生产。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其他有益效果显而易见。
附图中，
图1为现有一种采用面封装方式的OLED显示面板的制作方法的步骤20的示意图；
图2为现有一种采用面封装方式的OLED显示面板的制作方法的步骤30的示意图；
图3为现有一种采用面封装方式的OLED显示面板的制作方法的步骤40的示意图；
图4为现有一种采用面封装方式的OLED显示面板的制作方法的步骤50的示意图；
图5为现有一种采用面封装方式的OLED显示面板的制作方法的步骤60的示意图；
图6为现有一种采用面封装方式的OLED显示面板的制作方法的步骤70的示意图；
图7为本发明的OLED显示面板的制作方法的第一实施例的流程示意图；
图8为本发明的OLED显示面板的制作方法的第一实施例的步骤2的示意图；
图9为本发明的OLED显示面板的制作方法的第一实施例的步骤3的示意图；
图10为本发明的OLED显示面板的制作方法的第一实施例的步骤4的示意图；
图11为本发明的OLED显示面板的制作方法的第一实施例的步骤5的示意图；
图12为本发明的OLED显示面板的制作方法的第一实施例的步骤6的示意图；
图13为本发明的OLED显示面板的制作方法的第一实施例的步骤7的 示意图；
图14为本发明的OLED显示面板的制作方法的第二实施例的流程示意图；
图15为本发明的OLED显示面板的制作方法的第二实施例的步骤2’的示意图；
图16为本发明的OLED显示面板的制作方法的第一实施例的步骤3’的示意图；
图17为本发明的OLED显示面板的制作方法的第一实施例的步骤4’的示意图；
图18为本发明的OLED显示面板的制作方法的第二实施例的步骤5’的示意图；
图19为本发明的OLED显示面板的制作方法的第二实施例的步骤6’的示意图；
图20为本发明的OLED显示面板的制作方法的第二实施例的步骤7’的示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图7，本发明的OLED显示面板的制作方法第一实施例，具体包括如下步骤：
步骤1、提供OLED基板1、盖板2、及封装胶材3。
其中，所述OLED基板1包括数个阵列排布的OLED基板单元11，所述封装胶材3包括封装胶体31、及分别粘贴在该封装胶体31的相对两个侧面上的两层离型膜32。
步骤2、如图8所示，撕除封装胶体31一侧的离型膜32。
步骤3、如图9所示，从该一侧使封装胶体31与盖板2整面贴合。
具体地，所述步骤3中，利用贴合机使封装胶体31与盖板2整面贴合。
具体地，由于步骤1中所提供的盖板2与封装胶材3均为整体对应OLED基板1，而非现有技术中与OLED基板1上的单个OLED基板单元11相对应，从而对于不同尺寸的目标产品，降低了贴合机的尺寸兼容性要求。
步骤4、如图10所示，撕除封装胶体31另一侧的离型膜32。
步骤5、如图11所示，对封装胶材3的封装胶体31进行图形化处理， 在所述封装胶体31上划分出数个与所述数个OLED基板单元11一一对应的目标封装区域301、及剩余的数个目标封装区域301之外的间隔区域302，从该另一侧对所述封装胶体31上属于间隔区域302的部分进行表面破坏处理，从而使该部分的表面失去粘性。
具体地，在对封装胶材3的封装胶体31进行图形化处理的步骤中，通过粒子束轰击的方式、或紫外光照射的方式，对所述封装胶体31上间隔区域302的部分进行表面破坏处理，从而使该部分的表面失去粘性。
具体地，在对封装胶材3的封装胶体31进行图形化处理的步骤中，需要通过镭射扫描出所述封装胶体31上的数个目标封装区域301，其目的在于使得所述封装胶体31在目标封装区域301与间隔区域302之间产生隔断，从而使后续对盖板2的切割可以顺利进行。
步骤6、如图12所示，从该另一侧使封装胶体31与OLED基板1贴合。
具体地，所述步骤6中，在真空环境下完成封装胶体31与OLED基板1的贴合。
具体地，所述步骤6中，封装胶体31的数个目标封装区域301与OLED基板1的数个OLED基板单元11分别对应贴合。
步骤7、如图13所示，对应所述数个OLED基板单元11，对与封装胶体31贴合后的OLED基板1、及盖板2进行切割，得到数个OLED显示面板。
具体地，所述步骤7中，所述封装胶体31上属于间隔区域302的部分在对盖板2进行切割过程中，随同盖板2上需要被去除的部分一同去除；或者，
在去除盖板2上需要被去除的部分之前，将所述封装胶体31上属于间隔区域302的部分剥离。
请参阅图14，本发明的OLED显示面板的制作方法第二实施例，与上述第一实施例相比，主要区别在于，在使封装胶体31与盖板2整面贴合之前，先对封装胶体31进行图形化处理，具体地，本实施例包括如下步骤：
步骤1’、提供OLED基板1、盖板2、及封装胶材3。
其中，所述OLED基板1包括数个阵列排布的OLED基板单元11，所述封装胶材3包括封装胶体31、及分别粘贴在该封装胶体31的相对两个侧面上的两层离型膜32。
步骤2’、如图15所示，撕除封装胶体31一侧的离型膜32。
步骤3’、如图16所示，对封装胶材3的封装胶体31进行图形化处理， 在所述封装胶体31上划分出数个与所述数个OLED基板单元11一一对应的目标封装区域301、及剩余的数个目标封装区域301之外的间隔区域302，从该一侧对所述封装胶体31上属于间隔区域302的部分进行表面破坏处理，从而使该部分的表面失去粘性。
具体地，在对封装胶材3的封装胶体31进行图形化处理的步骤中，通过粒子束轰击的方式、或紫外光照射的方式，对所述封装胶体31上间隔区域302的部分进行表面破坏处理，从而使该部分的表面失去粘性。
具体地，在对封装胶材3的封装胶体31进行图形化处理的步骤中，需要通过镭射扫描出所述封装胶体31上的数个目标封装区域301，其目的在于使得所述封装胶体31在目标封装区域301与间隔区域302之间产生隔断，从而使后续对盖板2的切割可以顺利进行。
步骤4’、如图17所示，从该一侧使封装胶体31与盖板2整面贴合。
具体地，所述步骤4’中，利用贴合机使封装胶体31与盖板2整面贴合。
步骤5’、如图18所示，撕除封装胶体31另一侧的离型膜32。
具体地，在所述步骤5’中，所述封装胶材3的封装胶体31已经进行过图形化处理，所述封装胶体31上属于间隔区域302的部分的表面粘性已被破坏，因此该部分在所述步骤5’中可与离型膜32一并被撕除，所述封装胶体31留在盖板2上的部分为属于目标封装区域301的部分。
步骤6’、如图19所示，从该另一侧使封装胶体31与OLED基板1贴合。
具体地，所述步骤6’中，在真空环境下完成封装胶体31与OLED基板1的贴合。
具体地，所述步骤6’中，封装胶体31的数个目标封装区域301与OLED基板1的数个OLED基板单元11分别对应贴合。
步骤7’、如图20所示，对应所述数个OLED基板单元11，对与封装胶体31贴合后的OLED基板1、及盖板2进行切割，得到数个OLED显示面板。
综上所述，本发明的OLED显示面板的制作方法，首先对封装胶材的封装胶体进行图形化处理，在所述封装胶体上划分出数个与OLED基板上的数个OLED基板单元一一对应的目标封装区域、及剩余的数个目标封装区域之外的间隔区域，对所述封装胶体上属于间隔区域的部分进行表面破坏处理，从而使该部分的表面失去粘性，然后再将封装胶体与OLED基板进行贴合，最后通过切割得到数个OLED显示面板，该方法简单易行，降低了贴合机的尺寸兼容性要求，以及避免了额外机械手、承载治具的使用， 从而降低了治具清洗、传输、存放等复杂操作引起的设备巨额成本，并提高了产品的对位贴合精度，可实现自动化生产。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明后附的权利要求的保护范围。

Claims (14)

  1. 一种OLED显示面板的制作方法，包括：
    提供OLED基板、盖板、及封装胶材的步骤，其中，所述OLED基板包括数个阵列排布的OLED基板单元，所述封装胶材包括封装胶体、及分别粘贴在该封装胶体的相对两个侧面上的两层离型膜；
    及对封装胶材的封装胶体进行图形化处理的步骤，其中，该步骤具体为，在所述封装胶体上划分出数个与所述数个OLED基板单元一一对应的目标封装区域、及剩余的数个目标封装区域之外的间隔区域，对所述封装胶体上属于间隔区域的部分进行表面破坏处理，从而使该部分的表面失去粘性。
  2. 如权利要求1所述的OLED显示面板的制作方法，其中，具体包括如下步骤：
    步骤1、提供OLED基板、盖板、及封装胶材；
    步骤2、撕除封装胶体一侧的离型膜；
    步骤3、从该一侧使封装胶体与盖板整面贴合；
    步骤4、撕除封装胶体另一侧的离型膜；
    步骤5、对封装胶材的封装胶体进行图形化处理，在所述封装胶体上划分出数个与所述数个OLED基板单元一一对应的目标封装区域、及剩余的数个目标封装区域之外的间隔区域，从该另一侧对所述封装胶体上属于间隔区域的部分进行表面破坏处理，从而使该部分的表面失去粘性；
    步骤6、从该另一侧使封装胶体与OLED基板贴合；
    步骤7、对应所述数个OLED基板单元，对与封装胶体贴合后的OLED基板、及盖板进行切割，得到数个OLED显示面板。
  3. 如权利要求1所述的OLED显示面板的制作方法，其中，具体包括如下步骤：
    步骤1’、提供OLED基板、盖板、及封装胶材；
    步骤2’、撕除封装胶体一侧的离型膜；
    步骤3’、对封装胶材的封装胶体进行图形化处理，在所述封装胶体上划分出数个与所述数个OLED基板单元一一对应的目标封装区域、及剩余的数个目标封装区域之外的间隔区域，从该一侧对所述封装胶体上属于间隔区域的部分进行表面破坏处理，从而使该部分的表面失去粘性；
    步骤4’、从该一侧使封装胶体与盖板整面贴合；
    步骤5’、撕除封装胶体另一侧的离型膜；
    步骤6’、从该另一侧使封装胶体与OLED基板贴合；
    步骤7’、对应所述数个OLED基板单元，对与封装胶体贴合后的OLED基板、及盖板进行切割，得到数个OLED显示面板。
  4. 如权利要求1所述的OLED显示面板的制作方法，其中，在对封装胶材的封装胶体进行图形化处理的步骤中，通过粒子束轰击的方式，对所述封装胶体上间隔区域的部分进行表面破坏处理，从而使该部分的表面失去粘性。
  5. 如权利要求1所述的OLED显示面板的制作方法，其中，在对封装胶材的封装胶体进行图形化处理的步骤中，通过紫外光照射的方式，对所述封装胶体上间隔区域的部分进行表面破坏处理，从而使该部分的表面失去粘性。
  6. 如权利要求1所述的OLED显示面板的制作方法，其中，在对封装胶材的封装胶体进行图形化处理的步骤中，通过镭射扫描出所述封装胶体上的数个目标封装区域，并使得所述封装胶体在目标封装区域与间隔区域之间产生隔断。
  7. 如权利要求2所述的OLED显示面板的制作方法，其中，所述步骤3中，利用贴合机使封装胶体与盖板整面贴合。
  8. 如权利要求2所述的OLED显示面板的制作方法，其中，所述步骤6中，在真空环境下完成封装胶体与OLED基板的贴合。
  9. 如权利要求3所述的OLED显示面板的制作方法，其中，所述步骤4’中，利用贴合机使封装胶体与盖板整面贴合。
  10. 如权利要求3所述的OLED显示面板的制作方法，其中，所述步骤6’中，在真空环境下完成封装胶体与OLED基板的贴合。
  11. 一种OLED显示面板的制作方法，包括：
    提供OLED基板、盖板、及封装胶材的步骤，其中，所述OLED基板包括数个阵列排布的OLED基板单元，所述封装胶材包括封装胶体、及分别粘贴在该封装胶体的相对两个侧面上的两层离型膜；
    及对封装胶材的封装胶体进行图形化处理的步骤，其中，该步骤具体为，在所述封装胶体上划分出数个与所述数个OLED基板单元一一对应的目标封装区域、及剩余的数个目标封装区域之外的间隔区域，对所述封装胶体上属于间隔区域的部分进行表面破坏处理，从而使该部分的表面失去粘性；
    其中，具体包括如下步骤：
    步骤1、提供OLED基板、盖板、及封装胶材；
    步骤2、撕除封装胶体一侧的离型膜；
    步骤3、从该一侧使封装胶体与盖板整面贴合；
    步骤4、撕除封装胶体另一侧的离型膜；
    步骤5、对封装胶材的封装胶体进行图形化处理，在所述封装胶体上划分出数个与所述数个OLED基板单元一一对应的目标封装区域、及剩余的数个目标封装区域之外的间隔区域，从该另一侧对所述封装胶体上属于间隔区域的部分进行表面破坏处理，从而使该部分的表面失去粘性；
    步骤6、从该另一侧使封装胶体与OLED基板贴合；
    步骤7、对应所述数个OLED基板单元，对与封装胶体贴合后的OLED基板、及盖板进行切割，得到数个OLED显示面板；
    其中，在对封装胶材的封装胶体进行图形化处理的步骤中，通过粒子束轰击的方式，对所述封装胶体上间隔区域的部分进行表面破坏处理，从而使该部分的表面失去粘性。
  12. 如权利要求11所述的OLED显示面板的制作方法，其中，在对封装胶材的封装胶体进行图形化处理的步骤中，通过镭射扫描出所述封装胶体上的数个目标封装区域，并使得所述封装胶体在目标封装区域与间隔区域之间产生隔断。
  13. 如权利要求11所述的OLED显示面板的制作方法，其中，所述步骤3中，利用贴合机使封装胶体与盖板整面贴合。
  14. 如权利要求11所述的OLED显示面板的制作方法，其中，所述步骤6中，在真空环境下完成封装胶体与OLED基板的贴合。
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