KR101191632B1 - 대형 나노 인에이블 매크로전자 기판 및 그 사용 - Google Patents
대형 나노 인에이블 매크로전자 기판 및 그 사용 Download PDFInfo
- Publication number
- KR101191632B1 KR101191632B1 KR1020057005436A KR20057005436A KR101191632B1 KR 101191632 B1 KR101191632 B1 KR 101191632B1 KR 1020057005436 A KR1020057005436 A KR 1020057005436A KR 20057005436 A KR20057005436 A KR 20057005436A KR 101191632 B1 KR101191632 B1 KR 101191632B1
- Authority
- KR
- South Korea
- Prior art keywords
- nanowires
- delete delete
- nanowire
- abandoned
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/501—FETs having stacked nanowire, nanosheet or nanoribbon channels
- H10D30/502—FETs having stacked nanowire, nanosheet or nanoribbon channels characterised by the stacked channels
- H10D30/504—FETs having stacked nanowire, nanosheet or nanoribbon channels characterised by the stacked channels wherein the stacked channels have different properties
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
- H10D62/118—Nanostructure semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
- H10D62/118—Nanostructure semiconductor bodies
- H10D62/119—Nanowire, nanosheet or nanotube semiconductor bodies
- H10D62/121—Nanowire, nanosheet or nanotube semiconductor bodies oriented parallel to substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
- H10D62/118—Nanostructure semiconductor bodies
- H10D62/119—Nanowire, nanosheet or nanotube semiconductor bodies
- H10D62/123—Nanowire, nanosheet or nanotube semiconductor bodies comprising junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/817—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous
- H10H20/818—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous within the light-emitting regions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/191—Deposition of organic active material characterised by provisions for the orientation or alignment of the layer to be deposited
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
- H10K85/221—Carbon nanotubes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/857—Thermoelectric active materials comprising compositions changing continuously or discontinuously inside the material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/076—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/077—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/702—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive fibres
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/0036—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties showing low dimensional magnetism, i.e. spin rearrangements due to a restriction of dimensions, e.g. showing giant magnetoresistivity
- H01F1/0072—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties showing low dimensional magnetism, i.e. spin rearrangements due to a restriction of dimensions, e.g. showing giant magnetoresistivity one dimensional, i.e. linear or dendritic nanostructures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/701—Organic molecular electronic devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thin Film Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Bipolar Transistors (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Photovoltaic Devices (AREA)
- Led Devices (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (11)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US41432302P | 2002-09-30 | 2002-09-30 | |
| US41435902P | 2002-09-30 | 2002-09-30 | |
| US60/414,359 | 2002-09-30 | ||
| US60/414,323 | 2002-09-30 | ||
| US46827603P | 2003-05-07 | 2003-05-07 | |
| US60/468,276 | 2003-05-07 | ||
| US47406503P | 2003-05-29 | 2003-05-29 | |
| US60/474,065 | 2003-05-29 | ||
| US48880103P | 2003-07-22 | 2003-07-22 | |
| US60/488,801 | 2003-07-22 | ||
| PCT/US2003/030721 WO2004032193A2 (en) | 2002-09-30 | 2003-09-30 | Large-area nanoenabled macroelectronic substrates and uses therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20050060080A KR20050060080A (ko) | 2005-06-21 |
| KR101191632B1 true KR101191632B1 (ko) | 2012-10-17 |
Family
ID=32074780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020057005436A Expired - Lifetime KR101191632B1 (ko) | 2002-09-30 | 2003-09-30 | 대형 나노 인에이블 매크로전자 기판 및 그 사용 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US8030186B2 (https=) |
| EP (2) | EP1547139A4 (https=) |
| JP (4) | JP5336031B2 (https=) |
| KR (1) | KR101191632B1 (https=) |
| AU (1) | AU2003283973B2 (https=) |
| CA (1) | CA2499965C (https=) |
| TW (1) | TWI309845B (https=) |
| WO (1) | WO2004032193A2 (https=) |
Families Citing this family (177)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7301199B2 (en) | 2000-08-22 | 2007-11-27 | President And Fellows Of Harvard College | Nanoscale wires and related devices |
| CN101887935B (zh) | 2000-08-22 | 2013-09-11 | 哈佛学院董事会 | 掺杂的拉长半导体,其生长,包含这类半导体的器件及其制造 |
| KR20030055346A (ko) | 2000-12-11 | 2003-07-02 | 프레지던트 앤드 펠로우즈 오브 하버드 칼리지 | 나노센서 |
| AU2003261205A1 (en) | 2002-07-19 | 2004-02-09 | President And Fellows Of Harvard College | Nanoscale coherent optical components |
| CA2499965C (en) * | 2002-09-30 | 2013-03-19 | Nanosys, Inc. | Large-area nanoenabled macroelectronic substrates and uses therefor |
| JP2007501525A (ja) | 2003-08-04 | 2007-01-25 | ナノシス・インコーポレイテッド | ナノワイヤ複合体およびこれらに由来する電子基板を作製するためのシステムおよび方法 |
| US7012279B2 (en) | 2003-10-21 | 2006-03-14 | Lumileds Lighting U.S., Llc | Photonic crystal light emitting device |
| US20050205883A1 (en) | 2004-03-19 | 2005-09-22 | Wierer Jonathan J Jr | Photonic crystal light emitting device |
| US7115971B2 (en) | 2004-03-23 | 2006-10-03 | Nanosys, Inc. | Nanowire varactor diode and methods of making same |
| US7195733B2 (en) | 2004-04-27 | 2007-03-27 | The Board Of Trustees Of The University Of Illinois | Composite patterning devices for soft lithography |
| US20050279274A1 (en) | 2004-04-30 | 2005-12-22 | Chunming Niu | Systems and methods for nanowire growth and manufacturing |
| KR20070011550A (ko) | 2004-04-30 | 2007-01-24 | 나노시스, 인크. | 나노와이어 성장 및 획득 시스템 및 방법 |
| US7943491B2 (en) | 2004-06-04 | 2011-05-17 | The Board Of Trustees Of The University Of Illinois | Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp |
| US8217381B2 (en) | 2004-06-04 | 2012-07-10 | The Board Of Trustees Of The University Of Illinois | Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics |
| US7799699B2 (en) | 2004-06-04 | 2010-09-21 | The Board Of Trustees Of The University Of Illinois | Printable semiconductor structures and related methods of making and assembling |
| US7521292B2 (en) | 2004-06-04 | 2009-04-21 | The Board Of Trustees Of The University Of Illinois | Stretchable form of single crystal silicon for high performance electronics on rubber substrates |
| CN102683391B (zh) | 2004-06-04 | 2015-11-18 | 伊利诺伊大学评议会 | 用于制造并组装可印刷半导体元件的方法和设备 |
| JP2008506254A (ja) | 2004-07-07 | 2008-02-28 | ナノシス・インコーポレイテッド | ナノワイヤーの集積及び組み込みのためのシステムおよび方法 |
| US7442964B2 (en) | 2004-08-04 | 2008-10-28 | Philips Lumileds Lighting Company, Llc | Photonic crystal light emitting device with multiple lattices |
| US7365395B2 (en) * | 2004-09-16 | 2008-04-29 | Nanosys, Inc. | Artificial dielectrics using nanostructures |
| WO2006124055A2 (en) * | 2004-10-12 | 2006-11-23 | Nanosys, Inc. | Fully integrated organic layered processes for making plastic electronics based on conductive polymers and semiconductor nanowires |
| CN101124638A (zh) | 2004-12-06 | 2008-02-13 | 哈佛大学 | 基于纳米尺度线的数据存储 |
| WO2006070670A1 (ja) | 2004-12-28 | 2006-07-06 | Matsushita Electric Industrial Co., Ltd. | 半導体ナノワイヤ、および当該ナノワイヤを備えた半導体装置 |
| US20060169585A1 (en) * | 2005-01-31 | 2006-08-03 | Nagahara Larry A | Carbon nanotube sensor |
| KR101100887B1 (ko) * | 2005-03-17 | 2012-01-02 | 삼성전자주식회사 | 박막 트랜지스터, 박막 트랜지스터 표시판 및 그 제조 방법 |
| KR101109623B1 (ko) | 2005-04-07 | 2012-01-31 | 엘지디스플레이 주식회사 | 박막트랜지스터와 그 제조방법. |
| US7745498B2 (en) | 2005-04-13 | 2010-06-29 | Nanosys, Inc. | Nanowire dispersion compositions and uses thereof |
| US20100227382A1 (en) | 2005-05-25 | 2010-09-09 | President And Fellows Of Harvard College | Nanoscale sensors |
| WO2006132659A2 (en) | 2005-06-06 | 2006-12-14 | President And Fellows Of Harvard College | Nanowire heterostructures |
| WO2006135336A1 (en) * | 2005-06-16 | 2006-12-21 | Qunano Ab | Semiconductor nanowire transistor |
| US8163575B2 (en) | 2005-06-17 | 2012-04-24 | Philips Lumileds Lighting Company Llc | Grown photonic crystals in semiconductor light emitting devices |
| KR101106134B1 (ko) * | 2005-07-11 | 2012-01-20 | 서울옵토디바이스주식회사 | 나노와이어 형광체를 채택한 발광소자 |
| JP5116961B2 (ja) * | 2005-09-29 | 2013-01-09 | 国立大学法人名古屋大学 | カーボンナノウォールを用いたダイオード |
| WO2007037343A1 (ja) * | 2005-09-29 | 2007-04-05 | Nu Eco Engineering Co., Ltd. | カーボンナノ構造体を用いたダイオード及び光起電力素子 |
| US7821079B2 (en) | 2005-11-23 | 2010-10-26 | William Marsh Rice University | Preparation of thin film transistors (TFTs) or radio frequency identification (RFID) tags or other printable electronics using ink-jet printer and carbon nanotube inks |
| EP1791186A1 (en) | 2005-11-25 | 2007-05-30 | Stormled AB | Light emitting diode and method for manufacturing the same |
| KR101232050B1 (ko) * | 2005-12-31 | 2013-02-15 | 엘지디스플레이 주식회사 | 액정표시소자 제조방법 |
| JP5271541B2 (ja) * | 2006-01-16 | 2013-08-21 | パナソニック株式会社 | 半導体小片の製造方法ならびに電界効果トランジスタおよびその製造方法 |
| JP4574634B2 (ja) * | 2006-04-03 | 2010-11-04 | キヤノン株式会社 | シリコンワイヤを含み構成される物品の製造方法 |
| JP5060740B2 (ja) * | 2006-05-26 | 2012-10-31 | シャープ株式会社 | 集積回路装置およびその製造方法、ならびに表示装置 |
| US9102521B2 (en) | 2006-06-12 | 2015-08-11 | President And Fellows Of Harvard College | Nanosensors and related technologies |
| JP5312938B2 (ja) * | 2006-06-21 | 2013-10-09 | パナソニック株式会社 | 電界効果トランジスタ |
| JP2008066557A (ja) * | 2006-09-08 | 2008-03-21 | Matsushita Electric Ind Co Ltd | 半導体発光装置および半導体発光装置の製造方法 |
| US8058640B2 (en) | 2006-09-11 | 2011-11-15 | President And Fellows Of Harvard College | Branched nanoscale wires |
| US7776760B2 (en) | 2006-11-07 | 2010-08-17 | Nanosys, Inc. | Systems and methods for nanowire growth |
| KR100819004B1 (ko) | 2006-11-15 | 2008-04-02 | 삼성전자주식회사 | 미세 전자 소자 및 그 제조 방법 |
| WO2008059940A1 (en) * | 2006-11-17 | 2008-05-22 | Semiconductor Energy Laboratory Co., Ltd. | Memory element and method for manufacturing the same, and semiconductor device |
| WO2008127314A1 (en) | 2006-11-22 | 2008-10-23 | President And Fellows Of Harvard College | High-sensitivity nanoscale wire sensors |
| KR101519038B1 (ko) | 2007-01-17 | 2015-05-11 | 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 | 프린팅기반 어셈블리에 의해 제조되는 광학 시스템 |
| US8283724B2 (en) | 2007-02-26 | 2012-10-09 | Semiconductor Energy Laboratory Co., Ltd. | Memory element and semiconductor device, and method for manufacturing the same |
| US7892610B2 (en) * | 2007-05-07 | 2011-02-22 | Nanosys, Inc. | Method and system for printing aligned nanowires and other electrical devices |
| KR101356694B1 (ko) * | 2007-05-10 | 2014-01-29 | 삼성전자주식회사 | 실리콘 나노와이어를 이용한 발광 다이오드 및 그 제조방법 |
| KR100857542B1 (ko) | 2007-07-19 | 2008-09-08 | 삼성전자주식회사 | 탄소 나노튜브 발광소자 및 그 제조방법 |
| DE102007043360A1 (de) * | 2007-09-12 | 2009-03-19 | Forschungszentrum Karlsruhe Gmbh | Elektronisches Bauelement, Verfahren zu seiner Herstellung und seine Verwendung |
| WO2009045473A2 (en) * | 2007-10-02 | 2009-04-09 | President And Fellows Of Harvard College | Carbon nanotube synthesis for nanopore devices |
| WO2009087793A1 (ja) * | 2008-01-11 | 2009-07-16 | National Institute Of Japan Science And Technology Agency | 電界効果トランジスタ、電界効果トランジスタの製造方法、中間体及び第2中間体 |
| KR101475520B1 (ko) | 2008-01-14 | 2014-12-23 | 삼성전자주식회사 | 잉크젯 프린트용 양자점 잉크 조성물 및 그를 이용한전자소자 |
| KR101006823B1 (ko) * | 2008-01-29 | 2011-01-12 | 연세대학교 산학협력단 | 나노 와이어가 함입된 고분자 박막 구조체의 제조 방법 |
| KR101424816B1 (ko) * | 2008-02-18 | 2014-07-31 | 삼성전자주식회사 | 나노와이어를 포함하는 박막 트랜지스터 및 그의 제조방법 |
| CN103872002B (zh) | 2008-03-05 | 2017-03-01 | 伊利诺伊大学评议会 | 可拉伸和可折叠的电子器件 |
| GB2459251A (en) * | 2008-04-01 | 2009-10-21 | Sharp Kk | Semiconductor nanowire devices |
| CN101582444A (zh) | 2008-05-14 | 2009-11-18 | 清华大学 | 薄膜晶体管 |
| CN101593699B (zh) | 2008-05-30 | 2010-11-10 | 清华大学 | 薄膜晶体管的制备方法 |
| CN101587839B (zh) | 2008-05-23 | 2011-12-21 | 清华大学 | 薄膜晶体管的制备方法 |
| CN101582382B (zh) | 2008-05-14 | 2011-03-23 | 鸿富锦精密工业(深圳)有限公司 | 薄膜晶体管的制备方法 |
| CN101582446B (zh) | 2008-05-14 | 2011-02-02 | 鸿富锦精密工业(深圳)有限公司 | 薄膜晶体管 |
| CN101582449B (zh) | 2008-05-14 | 2011-12-14 | 清华大学 | 薄膜晶体管 |
| CN101582447B (zh) | 2008-05-14 | 2010-09-29 | 清华大学 | 薄膜晶体管 |
| CN101582450B (zh) | 2008-05-16 | 2012-03-28 | 清华大学 | 薄膜晶体管 |
| CN101582448B (zh) | 2008-05-14 | 2012-09-19 | 清华大学 | 薄膜晶体管 |
| CN101582445B (zh) | 2008-05-14 | 2012-05-16 | 清华大学 | 薄膜晶体管 |
| WO2010005707A1 (en) | 2008-06-16 | 2010-01-14 | The Board Of Trustees Of The University Of Illinois | Medium scale carbon nanotube thin film integrated circuits on flexible plastic substrates |
| JP5444342B2 (ja) * | 2008-07-18 | 2014-03-19 | パナソニック株式会社 | 半導体デバイスおよびチャネル形成方法 |
| US8546742B2 (en) * | 2009-06-04 | 2013-10-01 | Zena Technologies, Inc. | Array of nanowires in a single cavity with anti-reflective coating on substrate |
| US8886334B2 (en) | 2008-10-07 | 2014-11-11 | Mc10, Inc. | Systems, methods, and devices using stretchable or flexible electronics for medical applications |
| US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
| US9289132B2 (en) | 2008-10-07 | 2016-03-22 | Mc10, Inc. | Catheter balloon having stretchable integrated circuitry and sensor array |
| JP5442234B2 (ja) | 2008-10-24 | 2014-03-12 | 株式会社半導体エネルギー研究所 | 半導体装置及び表示装置 |
| WO2010061474A1 (ja) * | 2008-11-28 | 2010-06-03 | 独立行政法人国立病院機構 西多賀病院 | 連結磁性体、連結磁性体製造方法、連結磁性体注入装置、連結磁性体注入制御システム、磁場制御装置、および、連結磁性体注入制御方法 |
| WO2010080282A1 (en) * | 2008-12-18 | 2010-07-15 | First Solar, Inc. | Photovoltaic devices including back metal contacts |
| TWI592996B (zh) | 2009-05-12 | 2017-07-21 | 美國伊利諾大學理事會 | 用於可變形及半透明顯示器之超薄微刻度無機發光二極體之印刷總成 |
| JP2012528020A (ja) | 2009-05-26 | 2012-11-12 | ナノシス・インク. | ナノワイヤおよび他のデバイスの電場沈着のための方法およびシステム |
| US8623288B1 (en) | 2009-06-29 | 2014-01-07 | Nanosys, Inc. | Apparatus and methods for high density nanowire growth |
| US9297796B2 (en) | 2009-09-24 | 2016-03-29 | President And Fellows Of Harvard College | Bent nanowires and related probing of species |
| US9723122B2 (en) | 2009-10-01 | 2017-08-01 | Mc10, Inc. | Protective cases with integrated electronics |
| JP4996660B2 (ja) * | 2009-10-15 | 2012-08-08 | シャープ株式会社 | 発光装置およびその製造方法 |
| JP4887414B2 (ja) * | 2009-10-19 | 2012-02-29 | シャープ株式会社 | 発光装置、バックライト、照明装置および表示装置 |
| US8872214B2 (en) | 2009-10-19 | 2014-10-28 | Sharp Kabushiki Kaisha | Rod-like light-emitting device, method of manufacturing rod-like light-emitting device, backlight, illuminating device, and display device |
| JP5094824B2 (ja) * | 2009-10-19 | 2012-12-12 | シャープ株式会社 | 棒状構造発光素子、バックライト、照明装置および表示装置 |
| JP5014403B2 (ja) * | 2009-11-19 | 2012-08-29 | シャープ株式会社 | 棒状構造発光素子、発光装置、発光装置の製造方法、バックライト、照明装置および表示装置 |
| JP4912448B2 (ja) * | 2009-10-22 | 2012-04-11 | シャープ株式会社 | 発光装置およびその製造方法 |
| KR101588318B1 (ko) * | 2009-11-23 | 2016-01-25 | 삼성전자주식회사 | 튜브형 압전 에너지 발생 장치 및 그 제조방법 |
| JP5256176B2 (ja) * | 2009-11-25 | 2013-08-07 | シャープ株式会社 | 基板へのナノ構造体の塗布方法及びその装置 |
| US8666471B2 (en) | 2010-03-17 | 2014-03-04 | The Board Of Trustees Of The University Of Illinois | Implantable biomedical devices on bioresorbable substrates |
| US10918298B2 (en) | 2009-12-16 | 2021-02-16 | The Board Of Trustees Of The University Of Illinois | High-speed, high-resolution electrophysiology in-vivo using conformal electronics |
| US10441185B2 (en) | 2009-12-16 | 2019-10-15 | The Board Of Trustees Of The University Of Illinois | Flexible and stretchable electronic systems for epidermal electronics |
| US9936574B2 (en) | 2009-12-16 | 2018-04-03 | The Board Of Trustees Of The University Of Illinois | Waterproof stretchable optoelectronics |
| JP4814394B2 (ja) * | 2010-03-05 | 2011-11-16 | シャープ株式会社 | 発光装置の製造方法 |
| JP4848464B2 (ja) * | 2010-03-12 | 2011-12-28 | シャープ株式会社 | 発光装置の製造方法 |
| JP5616659B2 (ja) * | 2010-03-19 | 2014-10-29 | シャープ株式会社 | 液晶表示装置 |
| EP2546900A4 (en) | 2010-03-12 | 2016-02-17 | Sharp Kk | DEVICE FOR PRODUCING A LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE, LIGHTING DEVICE, TAIL LIGHT, LIQUID CRYSTAL PANEL, DISPLAY DEVICE, METHOD FOR PRODUCING THE DISPLAY DEVICE, METHOD FOR CONTROLLING THE DISPLAY DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE |
| JP2011211047A (ja) * | 2010-03-30 | 2011-10-20 | Sharp Corp | 表示装置、表示装置の製造方法および表示装置の駆動方法 |
| JP2011198697A (ja) * | 2010-03-23 | 2011-10-06 | Sharp Corp | 発光装置、発光装置の製造方法、照明装置およびバックライト |
| FR2959867B1 (fr) * | 2010-05-05 | 2013-08-16 | Commissariat Energie Atomique | Dispositif microelectronique a portions disjointes de semi-conducteur et procede de realisation d'un tel dispositif |
| KR101359349B1 (ko) * | 2010-05-12 | 2014-02-11 | 전자부품연구원 | 나노 와이어 복합체 및 이를 이용한 바이오 센서 |
| US8394710B2 (en) * | 2010-06-21 | 2013-03-12 | International Business Machines Corporation | Semiconductor devices fabricated by doped material layer as dopant source |
| US9442285B2 (en) | 2011-01-14 | 2016-09-13 | The Board Of Trustees Of The University Of Illinois | Optical component array having adjustable curvature |
| JP5713472B2 (ja) * | 2011-03-04 | 2015-05-07 | 独立行政法人産業技術総合研究所 | 熱電変換材料及び該材料を用いたフレキシブル熱電変換素子 |
| JP2014123583A (ja) * | 2011-04-11 | 2014-07-03 | Sharp Corp | 発光装置、発光装置の製造方法、照明装置、バックライトおよび表示装置 |
| WO2012158709A1 (en) | 2011-05-16 | 2012-11-22 | The Board Of Trustees Of The University Of Illinois | Thermally managed led arrays assembled by printing |
| US9159635B2 (en) | 2011-05-27 | 2015-10-13 | Mc10, Inc. | Flexible electronic structure |
| US8934965B2 (en) | 2011-06-03 | 2015-01-13 | The Board Of Trustees Of The University Of Illinois | Conformable actively multiplexed high-density surface electrode array for brain interfacing |
| US8356262B1 (en) * | 2011-06-22 | 2013-01-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Cell architecture and method |
| JP2013021165A (ja) * | 2011-07-12 | 2013-01-31 | Sony Corp | 蒸着用マスク、蒸着用マスクの製造方法、電子素子および電子素子の製造方法 |
| US8852998B1 (en) * | 2011-08-30 | 2014-10-07 | Sandia Corporation | Method to fabricate micro and nano diamond devices |
| JP5422628B2 (ja) * | 2011-10-17 | 2014-02-19 | シャープ株式会社 | 発光装置の製造方法 |
| CA2856380C (en) | 2011-11-22 | 2020-05-12 | Siemens Healthcare Diagnostics Inc. | Interdigitated array and method of manufacture |
| CN108389893A (zh) | 2011-12-01 | 2018-08-10 | 伊利诺伊大学评议会 | 经设计以经历可编程转变的瞬态器件 |
| US8575009B2 (en) * | 2012-03-08 | 2013-11-05 | International Business Machines Corporation | Two-step hydrogen annealing process for creating uniform non-planar semiconductor devices at aggressive pitch |
| EP2830492B1 (en) | 2012-03-30 | 2021-05-19 | The Board of Trustees of the University of Illinois | Appendage mountable electronic devices conformable to surfaces and method of making the same |
| US9237646B2 (en) * | 2012-05-14 | 2016-01-12 | The Hong Kong University Of Science And Technology | Electrical and thermal conductive thin film with double layer structure provided as a one-dimensional nanomaterial network with graphene/graphene oxide coating |
| JP2015527259A (ja) * | 2012-06-18 | 2015-09-17 | イノーバ ダイナミクス インコーポレイテッド | 容器内に貯蔵されたナノワイヤ懸濁液における凝集体の低減 |
| US20140034905A1 (en) | 2012-08-01 | 2014-02-06 | International Business Machines Corporation | Epitaxially Thickened Doped or Undoped Core Nanowire FET Structure and Method for Increasing Effective Device Width |
| JP6122598B2 (ja) * | 2012-09-27 | 2017-04-26 | シャープ株式会社 | Ledプリントヘッド |
| US9171794B2 (en) | 2012-10-09 | 2015-10-27 | Mc10, Inc. | Embedding thin chips in polymer |
| WO2014093938A1 (en) * | 2012-12-13 | 2014-06-19 | California Institute Of Technology | Fabrication of three-dimensional high surface area electrodes |
| US10376146B2 (en) | 2013-02-06 | 2019-08-13 | California Institute Of Technology | Miniaturized implantable electrochemical sensor devices |
| US8994077B2 (en) | 2012-12-21 | 2015-03-31 | International Business Machines Corporation | Field effect transistor-based bio sensor |
| WO2014126211A1 (ja) * | 2013-02-15 | 2014-08-21 | 国立大学法人奈良先端科学技術大学院大学 | n型熱電変換材料および熱電変換素子、ならびにn型熱電変換材料の製造方法 |
| US20200191655A1 (en) * | 2018-12-15 | 2020-06-18 | William N. Carr | Photonic- and Phononic-structured pixel for electromagnetic radiation and detection |
| US9429769B2 (en) * | 2013-05-09 | 2016-08-30 | Johnson & Johnson Vision Care, Inc. | Ophthalmic device with thin film nanocrystal integrated circuits |
| US20160072034A1 (en) * | 2013-05-21 | 2016-03-10 | The Regents Of The University Of California | Metals-semiconductor nanowire composites |
| CN104211024B (zh) * | 2013-06-04 | 2016-02-10 | 中国科学院上海硅酸盐研究所 | P型可逆相变高性能热电材料及其制备方法 |
| US8863311B1 (en) * | 2013-07-18 | 2014-10-14 | National Taiwan University | Radio-frequency reflectometry scanning tunneling microscope |
| JP6256912B2 (ja) * | 2013-11-12 | 2018-01-10 | 国立研究開発法人産業技術総合研究所 | カーボンナノチューブ集合体を用いた電界効果トランジスタ |
| US9455421B2 (en) | 2013-11-21 | 2016-09-27 | Atom Nanoelectronics, Inc. | Devices, structures, materials and methods for vertical light emitting transistors and light emitting displays |
| US9287516B2 (en) * | 2014-04-07 | 2016-03-15 | International Business Machines Corporation | Forming pn junction contacts by different dielectrics |
| US9917240B2 (en) | 2014-07-24 | 2018-03-13 | Samsung Electronics Co., Ltd. | Thermoelectric element, method of manufacturing the same and semiconductor device including the same |
| US10276370B2 (en) * | 2014-12-29 | 2019-04-30 | Georgia Tech Research Corporation | Methods for the continuous, large-scale manufacture of functional nanostructures |
| EP3054486B1 (en) * | 2015-02-04 | 2021-07-07 | Nokia Technologies Oy | A field-effect apparatus, associated apparatus and methods |
| CN107851208B (zh) | 2015-06-01 | 2021-09-10 | 伊利诺伊大学评议会 | 具有无线供电和近场通信能力的小型化电子系统 |
| WO2016196673A1 (en) | 2015-06-01 | 2016-12-08 | The Board Of Trustees Of The University Of Illinois | Alternative approach to uv sensing |
| WO2017004055A1 (en) | 2015-07-02 | 2017-01-05 | Sabic Global Technologies B.V. | Process and material for growth of adsorbed compound via nanoscale-controlled resistive heating and uses thereof |
| US10820844B2 (en) | 2015-07-23 | 2020-11-03 | California Institute Of Technology | Canary on a chip: embedded sensors with bio-chemical interfaces |
| US10925543B2 (en) | 2015-11-11 | 2021-02-23 | The Board Of Trustees Of The University Of Illinois | Bioresorbable silicon electronics for transient implants |
| WO2017085606A1 (en) | 2015-11-17 | 2017-05-26 | Sabic Global Technologies B.V. | Porous polymer nanocomposites with ordered and tunable crystalline and amorphous phase domains |
| CN106783669B (zh) * | 2015-11-25 | 2019-04-12 | 无锡华瑛微电子技术有限公司 | 半导体处理装置及方法 |
| US10505094B2 (en) * | 2015-12-29 | 2019-12-10 | Massachusetts Institute Of Technology | Superconducting nanowire avalanche photodetectors with reduced current crowding |
| US11231382B2 (en) | 2016-06-15 | 2022-01-25 | William N. Carr | Integrated thermal sensor comprising a photonic crystal |
| US11300453B2 (en) | 2017-06-18 | 2022-04-12 | William N. Carr | Photonic- and phononic-structured pixel for electromagnetic radiation and detection |
| CN107564948B (zh) * | 2016-07-01 | 2021-01-05 | 清华大学 | 纳米异质结构及纳米晶体管的制备方法 |
| JP6893344B2 (ja) * | 2016-10-18 | 2021-06-23 | 国立研究開発法人物質・材料研究機構 | 銅ガリウムテルル系p型熱電半導体、及びそれを用いた熱電発電素子 |
| CN108336142B (zh) * | 2017-01-20 | 2020-09-25 | 清华大学 | 薄膜晶体管 |
| EP3373347A1 (en) | 2017-03-09 | 2018-09-12 | Riccardo Raccis | Conversion material |
| US10873026B2 (en) * | 2017-03-10 | 2020-12-22 | Wisconsin Alumni Research Foundation | Alignment of carbon nanotubes in confined channels |
| US10847757B2 (en) | 2017-05-04 | 2020-11-24 | Carbon Nanotube Technologies, Llc | Carbon enabled vertical organic light emitting transistors |
| US10978640B2 (en) | 2017-05-08 | 2021-04-13 | Atom H2O, Llc | Manufacturing of carbon nanotube thin film transistor backplanes and display integration thereof |
| US20190011477A1 (en) * | 2017-06-26 | 2019-01-10 | William N. Carr | Convective inertial accelerometer with metamaterial thermal structure |
| CN109428008B (zh) * | 2017-08-30 | 2020-01-07 | 清华大学 | 有机发光二极管的制备方法 |
| DE112019000577T5 (de) * | 2018-01-29 | 2020-11-12 | Massachusetts Institute Of Technology | Back-gate-feldeffekttransistoren und verfahren zu deren herstellung |
| CN110118725B (zh) * | 2018-02-07 | 2021-08-31 | 清华大学 | 光电流扫描系统 |
| US11451189B1 (en) * | 2018-02-16 | 2022-09-20 | The United States Of America As Represented By The Secretary Of The Navy | Method for improving mechanical integrity of crystalline silicon solar cells |
| CN112585457A (zh) | 2018-06-08 | 2021-03-30 | 麻省理工学院 | 用于气体感测的系统、装置和方法 |
| KR20180077114A (ko) * | 2018-06-22 | 2018-07-06 | 피에스아이 주식회사 | 전기적 컨택이 향상된 초소형 led 전극 어셈블리 |
| JP7209952B2 (ja) * | 2018-07-05 | 2023-01-23 | 一般財団法人ファインセラミックスセンター | 強誘電体ナノ粒子集積方法及び電子部品の製造方法 |
| US10749036B2 (en) * | 2018-08-03 | 2020-08-18 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Oxide semiconductor thin film transistor having spaced channel and barrier strips and manufacturing method thereof |
| KR102626051B1 (ko) | 2018-08-14 | 2024-01-19 | 삼성디스플레이 주식회사 | 발광 소자, 발광 소자를 포함하는 픽셀 구조체 및 그 제조 방법 |
| CN113544688B (zh) | 2018-09-10 | 2022-08-26 | 麻省理工学院 | 用于设计集成电路的系统和方法 |
| CN112840448B (zh) | 2018-09-24 | 2024-10-11 | 麻省理工学院 | 通过工程化原子层沉积对碳纳米管的可调掺杂 |
| CN113632254A (zh) | 2019-01-04 | 2021-11-09 | 阿汤姆H20有限责任公司 | 基于碳纳米管的射频设备 |
| CN121815843A (zh) * | 2019-01-29 | 2026-04-07 | 奥斯兰姆奥普托半导体股份有限两合公司 | 微型发光二极管、微型发光二极管装置、显示器及其方法 |
| US11016055B2 (en) * | 2019-07-09 | 2021-05-25 | Globalfoundries Singapore Pte. Ltd. | Sensors with a front-end-of-line solution-receiving cavity |
| US20240081150A1 (en) * | 2019-10-10 | 2024-03-07 | Sony Semiconductor Solutions Corporation | Electromagnetic wave detection device, electromagnetic wave detection system, and electromagnetic wave detection method |
| CN115362529B (zh) * | 2020-03-31 | 2026-03-17 | 北京大学 | 在基底上沉积纳米结构的方法和纳米结构阵列 |
| WO2021237180A1 (en) * | 2020-05-22 | 2021-11-25 | Roswell Biotechnologies, Inc. | Near-room-temperature processable amorphous semiconductor nano-ribbon bridge biosensors and memory devices |
| KR102812357B1 (ko) | 2020-10-16 | 2025-05-23 | 삼성전자주식회사 | 반도체 소자 및 그 동작방법 |
| ES3058538T3 (en) * | 2023-06-20 | 2026-03-11 | Ideaded S L | Vertical field effect device and method of manufacturing |
Family Cites Families (90)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6267872A (ja) * | 1985-09-20 | 1987-03-27 | Toshiba Corp | 非晶質シリコン薄膜トランジスタ |
| US4769683A (en) * | 1987-06-22 | 1988-09-06 | Motorola Inc. | Superlattice gate field effect transistor |
| US4817842A (en) * | 1988-01-29 | 1989-04-04 | International Business Machines Corporation | Door and spring assembly for a paper feed mechanism |
| JPH0214578A (ja) * | 1988-07-01 | 1990-01-18 | Fujitsu Ltd | 半導体装置 |
| US5274602A (en) * | 1991-10-22 | 1993-12-28 | Florida Atlantic University | Large capacity solid-state memory |
| JPH07109881B2 (ja) * | 1993-03-22 | 1995-11-22 | 株式会社日立製作所 | 量子細線導波路 |
| US5962863A (en) * | 1993-09-09 | 1999-10-05 | The United States Of America As Represented By The Secretary Of The Navy | Laterally disposed nanostructures of silicon on an insulating substrate |
| JP3165324B2 (ja) * | 1994-04-13 | 2001-05-14 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| EP0661733A2 (en) * | 1993-12-21 | 1995-07-05 | International Business Machines Corporation | One dimensional silicon quantum wire devices and the method of manufacture thereof |
| US5581091A (en) * | 1994-12-01 | 1996-12-03 | Moskovits; Martin | Nanoelectric devices |
| CA2183638C (en) * | 1995-03-20 | 2001-03-20 | Precision System Science Co., Ltd | Liquid processing method making use of pipette device and apparatus for same |
| JP3734183B2 (ja) * | 1995-05-11 | 2006-01-11 | 株式会社ルネサステクノロジ | 電子デバイスの製造方法及び電子デバイス |
| US6445006B1 (en) * | 1995-12-20 | 2002-09-03 | Advanced Technology Materials, Inc. | Microelectronic and microelectromechanical devices comprising carbon nanotube components, and methods of making same |
| WO1997049132A1 (en) * | 1996-06-20 | 1997-12-24 | Jeffrey Frey | Light-emitting semiconductor device |
| US5858256A (en) * | 1996-07-11 | 1999-01-12 | The Board Of Trustees Of The Leland Stanford, Jr. University | Method of forming small aperture |
| US7193124B2 (en) * | 1997-07-22 | 2007-03-20 | Battelle Memorial Institute | Method for forming material |
| US20030077625A1 (en) * | 1997-05-27 | 2003-04-24 | Hutchison James E. | Particles by facile ligand exchange reactions |
| US6890624B1 (en) * | 2000-04-25 | 2005-05-10 | Nanogram Corporation | Self-assembled structures |
| US6074725A (en) * | 1997-12-10 | 2000-06-13 | Caliper Technologies Corp. | Fabrication of microfluidic circuits by printing techniques |
| JP3902883B2 (ja) * | 1998-03-27 | 2007-04-11 | キヤノン株式会社 | ナノ構造体及びその製造方法 |
| KR100277881B1 (ko) * | 1998-06-16 | 2001-02-01 | 김영환 | 트랜지스터 |
| US6294401B1 (en) * | 1998-08-19 | 2001-09-25 | Massachusetts Institute Of Technology | Nanoparticle-based electrical, chemical, and mechanical structures and methods of making same |
| JP4403321B2 (ja) * | 1999-01-25 | 2010-01-27 | ソニー株式会社 | 酸化膜の形成方法及びp形半導体素子の製造方法 |
| US6256767B1 (en) * | 1999-03-29 | 2001-07-03 | Hewlett-Packard Company | Demultiplexer for a molecular wire crossbar network (MWCN DEMUX) |
| US6559468B1 (en) * | 1999-03-29 | 2003-05-06 | Hewlett-Packard Development Company Lp | Molecular wire transistor (MWT) |
| US6815218B1 (en) * | 1999-06-09 | 2004-11-09 | Massachusetts Institute Of Technology | Methods for manufacturing bioelectronic devices |
| US6536106B1 (en) * | 1999-06-30 | 2003-03-25 | The Penn State Research Foundation | Electric field assisted assembly process |
| WO2001003208A1 (en) * | 1999-07-02 | 2001-01-11 | President And Fellows Of Harvard College | Nanoscopic wire-based devices, arrays, and methods of their manufacture |
| US6438025B1 (en) * | 1999-09-08 | 2002-08-20 | Sergei Skarupo | Magnetic memory device |
| EP1221179A4 (en) * | 1999-09-10 | 2006-12-13 | Starmega Corp | STRONG TEXTURED ATOMIC EDGES AND POINTS |
| US6340822B1 (en) * | 1999-10-05 | 2002-01-22 | Agere Systems Guardian Corp. | Article comprising vertically nano-interconnected circuit devices and method for making the same |
| US20020096246A1 (en) * | 1999-10-06 | 2002-07-25 | Michael S. Sennet | Non-woven elastic microporous membranes |
| US6790425B1 (en) * | 1999-10-27 | 2004-09-14 | Wiliam Marsh Rice University | Macroscopic ordered assembly of carbon nanotubes |
| RU2173003C2 (ru) * | 1999-11-25 | 2001-08-27 | Септре Электроникс Лимитед | Способ образования кремниевой наноструктуры, решетки кремниевых квантовых проводков и основанных на них устройств |
| DE19960076C2 (de) * | 1999-12-13 | 2002-12-05 | November Ag Molekulare Medizin | Verfahren und Vorrichtung zum Nachweis und zur Quantifizierung von Biomolekülen |
| BR0016661B1 (pt) * | 1999-12-21 | 2013-11-26 | Métodos para formação de um dispositivo eletrônico, dispositivo eletrônico e dispositivo de exibição | |
| JP2001180920A (ja) * | 1999-12-24 | 2001-07-03 | Nec Corp | ナノチューブの加工方法及び電界放出型冷陰極の製造方法並びに表示装置の製造方法 |
| US6659598B2 (en) * | 2000-04-07 | 2003-12-09 | University Of Kentucky Research Foundation | Apparatus and method for dispersing nano-elements to assemble a device |
| ATE405352T1 (de) * | 2000-05-16 | 2008-09-15 | Univ Minnesota | Partikelerzeugung für einen hohen massedurchsatz mit einer mehrfachdüsenanordnung |
| KR100360476B1 (ko) * | 2000-06-27 | 2002-11-08 | 삼성전자 주식회사 | 탄소나노튜브를 이용한 나노 크기 수직 트랜지스터 및 그제조방법 |
| WO2002003430A2 (en) * | 2000-06-29 | 2002-01-10 | California Institute Of Technology | Aerosol process for fabricating discontinuous floating gate microelectronic devices |
| EP1299914B1 (de) * | 2000-07-04 | 2008-04-02 | Qimonda AG | Feldeffekttransistor |
| EP1170799A3 (de) * | 2000-07-04 | 2009-04-01 | Infineon Technologies AG | Elektronisches Bauelement und Verfahren zum Herstellen eines elektronischen Bauelements |
| DE10134866B4 (de) * | 2000-07-18 | 2005-08-11 | Lg Electronics Inc. | Verfahren zum horizontalen Wachsenlassen von Kohlenstoff-Nanoröhren und Feldeffekttransistor, der die durch das Verfahren gewachsenen Kohlenstoff-Nanoröhren verwendet |
| US6447663B1 (en) * | 2000-08-01 | 2002-09-10 | Ut-Battelle, Llc | Programmable nanometer-scale electrolytic metal deposition and depletion |
| CN101887935B (zh) | 2000-08-22 | 2013-09-11 | 哈佛学院董事会 | 掺杂的拉长半导体,其生长,包含这类半导体的器件及其制造 |
| US7301199B2 (en) * | 2000-08-22 | 2007-11-27 | President And Fellows Of Harvard College | Nanoscale wires and related devices |
| JP2002082082A (ja) * | 2000-09-07 | 2002-03-22 | Matsushita Refrig Co Ltd | 臭気センサー及びその製造方法 |
| KR20030055346A (ko) * | 2000-12-11 | 2003-07-02 | 프레지던트 앤드 펠로우즈 오브 하버드 칼리지 | 나노센서 |
| US6423583B1 (en) * | 2001-01-03 | 2002-07-23 | International Business Machines Corporation | Methodology for electrically induced selective breakdown of nanotubes |
| US6444495B1 (en) * | 2001-01-11 | 2002-09-03 | Honeywell International, Inc. | Dielectric films for narrow gap-fill applications |
| WO2002063693A1 (en) * | 2001-02-08 | 2002-08-15 | Hitachi, Ltd. | Carbon nanotube electronic device and electron source |
| US6593065B2 (en) * | 2001-03-12 | 2003-07-15 | California Institute Of Technology | Method of fabricating nanometer-scale flowchannels and trenches with self-aligned electrodes and the structures formed by the same |
| EP1374309A1 (en) * | 2001-03-30 | 2004-01-02 | The Regents Of The University Of California | Methods of fabricating nanostructures and nanowires and devices fabricated therefrom |
| JP4091265B2 (ja) * | 2001-03-30 | 2008-05-28 | 株式会社東芝 | 半導体装置及びその製造方法 |
| US20020146745A1 (en) * | 2001-04-03 | 2002-10-10 | Surromed, Inc. | Methods and reagents for multiplexed analyte capture, surface array self-assembly, and analysis of complex biological samples |
| CN100399487C (zh) * | 2001-04-24 | 2008-07-02 | 松下电工株式会社 | 场致发射型电子源及其制法 |
| US7084507B2 (en) * | 2001-05-02 | 2006-08-01 | Fujitsu Limited | Integrated circuit device and method of producing the same |
| JP2003017508A (ja) * | 2001-07-05 | 2003-01-17 | Nec Corp | 電界効果トランジスタ |
| US6896864B2 (en) * | 2001-07-10 | 2005-05-24 | Battelle Memorial Institute | Spatial localization of dispersed single walled carbon nanotubes into useful structures |
| CN101108783B (zh) * | 2001-08-09 | 2012-04-04 | 旭化成株式会社 | 有机半导体元件 |
| US6672925B2 (en) * | 2001-08-17 | 2004-01-06 | Motorola, Inc. | Vacuum microelectronic device and method |
| NZ513637A (en) * | 2001-08-20 | 2004-02-27 | Canterprise Ltd | Nanoscale electronic devices & fabrication methods |
| AUPR725601A0 (en) * | 2001-08-24 | 2001-09-20 | Commonwealth Scientific And Industrial Research Organisation | Strain gauges |
| JP2005501404A (ja) * | 2001-08-30 | 2005-01-13 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 磁気抵抗装置および電子装置 |
| JP2003108021A (ja) * | 2001-09-28 | 2003-04-11 | Hitachi Ltd | 表示装置 |
| AU2002364157A1 (en) * | 2001-12-12 | 2003-06-23 | The Pennsylvania State University | Chemical reactor templates: sacrificial layer fabrication and template use |
| US6882767B2 (en) * | 2001-12-27 | 2005-04-19 | The Regents Of The University Of California | Nanowire optoelectric switching device and method |
| US6887450B2 (en) * | 2002-01-02 | 2005-05-03 | Zyvex Corporation | Directional assembly of carbon nanotube strings |
| JP4148517B2 (ja) * | 2002-01-15 | 2008-09-10 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 微細構造 |
| US20030236760A1 (en) * | 2002-06-05 | 2003-12-25 | Alex Nugent | Multi-layer training in a physical neural network formed utilizing nanotechnology |
| US7049625B2 (en) * | 2002-03-18 | 2006-05-23 | Max-Planck-Gesellschaft Zur Fonderung Der Wissenschaften E.V. | Field effect transistor memory cell, memory device and method for manufacturing a field effect transistor memory cell |
| US6891227B2 (en) * | 2002-03-20 | 2005-05-10 | International Business Machines Corporation | Self-aligned nanotube field effect transistor and method of fabricating same |
| US6872645B2 (en) * | 2002-04-02 | 2005-03-29 | Nanosys, Inc. | Methods of positioning and/or orienting nanostructures |
| US6831017B1 (en) * | 2002-04-05 | 2004-12-14 | Integrated Nanosystems, Inc. | Catalyst patterning for nanowire devices |
| US20030189202A1 (en) * | 2002-04-05 | 2003-10-09 | Jun Li | Nanowire devices and methods of fabrication |
| WO2003091458A1 (en) * | 2002-04-26 | 2003-11-06 | The Penn State Research Foundation | Integrated nanomechanical sensor array chips |
| US6760245B2 (en) * | 2002-05-01 | 2004-07-06 | Hewlett-Packard Development Company, L.P. | Molecular wire crossbar flash memory |
| AU2003261205A1 (en) * | 2002-07-19 | 2004-02-09 | President And Fellows Of Harvard College | Nanoscale coherent optical components |
| JP2006512782A (ja) * | 2002-07-25 | 2006-04-13 | カリフォルニア インスティテュート オヴ テクノロジー | サブパターン転写ナノスケールインターフェースの確率的組立体 |
| JP4338948B2 (ja) * | 2002-08-01 | 2009-10-07 | 株式会社半導体エネルギー研究所 | カーボンナノチューブ半導体素子の作製方法 |
| US6784017B2 (en) * | 2002-08-12 | 2004-08-31 | Precision Dynamics Corporation | Method of creating a high performance organic semiconductor device |
| US7358121B2 (en) * | 2002-08-23 | 2008-04-15 | Intel Corporation | Tri-gate devices and methods of fabrication |
| US7115916B2 (en) * | 2002-09-26 | 2006-10-03 | International Business Machines Corporation | System and method for molecular optical emission |
| CA2499965C (en) * | 2002-09-30 | 2013-03-19 | Nanosys, Inc. | Large-area nanoenabled macroelectronic substrates and uses therefor |
| US7135728B2 (en) * | 2002-09-30 | 2006-11-14 | Nanosys, Inc. | Large-area nanoenabled macroelectronic substrates and uses therefor |
| US7067867B2 (en) * | 2002-09-30 | 2006-06-27 | Nanosys, Inc. | Large-area nonenabled macroelectronic substrates and uses therefor |
| US20040071951A1 (en) * | 2002-09-30 | 2004-04-15 | Sungho Jin | Ultra-high-density information storage media and methods for making the same |
| US20050253137A1 (en) * | 2003-11-20 | 2005-11-17 | President And Fellows Of Harvard College | Nanoscale arrays, robust nanostructures, and related devices |
| KR20070011550A (ko) * | 2004-04-30 | 2007-01-24 | 나노시스, 인크. | 나노와이어 성장 및 획득 시스템 및 방법 |
-
2003
- 2003-09-30 CA CA2499965A patent/CA2499965C/en not_active Expired - Fee Related
- 2003-09-30 JP JP2005500333A patent/JP5336031B2/ja not_active Expired - Fee Related
- 2003-09-30 WO PCT/US2003/030721 patent/WO2004032193A2/en not_active Ceased
- 2003-09-30 TW TW092127075A patent/TWI309845B/zh not_active IP Right Cessation
- 2003-09-30 KR KR1020057005436A patent/KR101191632B1/ko not_active Expired - Lifetime
- 2003-09-30 EP EP03776200A patent/EP1547139A4/en not_active Withdrawn
- 2003-09-30 AU AU2003283973A patent/AU2003283973B2/en not_active Ceased
- 2003-09-30 EP EP10156269A patent/EP2194026A1/en not_active Withdrawn
-
2010
- 2010-11-05 US US12/940,789 patent/US8030186B2/en not_active Expired - Fee Related
-
2011
- 2011-01-27 JP JP2011015801A patent/JP2011101047A/ja not_active Withdrawn
- 2011-08-25 US US13/218,286 patent/US8293624B2/en not_active Expired - Fee Related
-
2014
- 2014-09-11 JP JP2014184819A patent/JP6047533B2/ja not_active Expired - Lifetime
-
2016
- 2016-09-23 JP JP2016185264A patent/JP2016225659A/ja active Pending
Non-Patent Citations (1)
| Title |
|---|
| Science, 291 851 (2001) |
Also Published As
| Publication number | Publication date |
|---|---|
| US20110045660A1 (en) | 2011-02-24 |
| US8293624B2 (en) | 2012-10-23 |
| WO2004032193A3 (en) | 2005-01-27 |
| EP2194026A1 (en) | 2010-06-09 |
| JP2016225659A (ja) | 2016-12-28 |
| AU2003283973B2 (en) | 2008-10-30 |
| AU2003283973A1 (en) | 2004-04-23 |
| TW200416786A (en) | 2004-09-01 |
| JP5336031B2 (ja) | 2013-11-06 |
| US8030186B2 (en) | 2011-10-04 |
| JP6047533B2 (ja) | 2016-12-21 |
| WO2004032193A2 (en) | 2004-04-15 |
| EP1547139A2 (en) | 2005-06-29 |
| JP2015046600A (ja) | 2015-03-12 |
| JP2011101047A (ja) | 2011-05-19 |
| EP1547139A4 (en) | 2009-08-26 |
| CA2499965A1 (en) | 2004-04-15 |
| CA2499965C (en) | 2013-03-19 |
| TWI309845B (en) | 2009-05-11 |
| US20110312163A1 (en) | 2011-12-22 |
| KR20050060080A (ko) | 2005-06-21 |
| JP2006507692A (ja) | 2006-03-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101191632B1 (ko) | 대형 나노 인에이블 매크로전자 기판 및 그 사용 | |
| US7262501B2 (en) | Large-area nanoenabled macroelectronic substrates and uses therefor | |
| US7233041B2 (en) | Large-area nanoenabled macroelectronic substrates and uses therefor | |
| CN1745468B (zh) | 大面积纳米启动宏电子衬底及其用途 | |
| CN101401210B (zh) | 在以纳米线为基础的电子装置中用于栅极构造和改进触点的方法、系统和设备 | |
| EP2218681A2 (en) | Applications of Nano-Enabled Large Area Macroelectronic Substrates Incorporating Nanowires and Nanowire Composites | |
| US20240191396A1 (en) | Transferable Networks and Arrays of Nanostructures | |
| Duan et al. | Chemically Synthesized Semiconductor Nanowires for High-Performance Electronics and Optoelectronics |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20050329 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| AMND | Amendment | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20080930 Comment text: Request for Examination of Application |
|
| AMND | Amendment | ||
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20101014 Patent event code: PE09021S01D |
|
| AMND | Amendment | ||
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20110630 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20101014 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |
|
| AMND | Amendment | ||
| J201 | Request for trial against refusal decision | ||
| PJ0201 | Trial against decision of rejection |
Patent event date: 20110930 Comment text: Request for Trial against Decision on Refusal Patent event code: PJ02012R01D Patent event date: 20110630 Comment text: Decision to Refuse Application Patent event code: PJ02011S01I Appeal kind category: Appeal against decision to decline refusal Decision date: 20120731 Appeal identifier: 2011101007195 Request date: 20110930 |
|
| PB0901 | Examination by re-examination before a trial |
Comment text: Amendment to Specification, etc. Patent event date: 20110930 Patent event code: PB09011R02I Comment text: Request for Trial against Decision on Refusal Patent event date: 20110930 Patent event code: PB09011R01I Comment text: Amendment to Specification, etc. Patent event date: 20101214 Patent event code: PB09011R02I Comment text: Amendment to Specification, etc. Patent event date: 20081027 Patent event code: PB09011R02I Comment text: Amendment to Specification, etc. Patent event date: 20080930 Patent event code: PB09011R02I |
|
| B701 | Decision to grant | ||
| PB0701 | Decision of registration after re-examination before a trial |
Patent event date: 20120731 Comment text: Decision to Grant Registration Patent event code: PB07012S01D Patent event date: 20111101 Comment text: Transfer of Trial File for Re-examination before a Trial Patent event code: PB07011S01I |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20121010 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20121011 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration | ||
| FPAY | Annual fee payment |
Payment date: 20150930 Year of fee payment: 4 |
|
| PR1001 | Payment of annual fee |
Payment date: 20150930 Start annual number: 4 End annual number: 4 |
|
| FPAY | Annual fee payment |
Payment date: 20160929 Year of fee payment: 5 |
|
| PR1001 | Payment of annual fee |
Payment date: 20160929 Start annual number: 5 End annual number: 5 |
|
| FPAY | Annual fee payment |
Payment date: 20180928 Year of fee payment: 7 |
|
| PR1001 | Payment of annual fee |
Payment date: 20180928 Start annual number: 7 End annual number: 7 |
|
| FPAY | Annual fee payment |
Payment date: 20190924 Year of fee payment: 8 |
|
| PR1001 | Payment of annual fee |
Payment date: 20190924 Start annual number: 8 End annual number: 8 |
|
| PR1001 | Payment of annual fee |
Payment date: 20210929 Start annual number: 10 End annual number: 10 |
|
| PC1801 | Expiration of term |
Termination date: 20240331 Termination category: Expiration of duration |