JP5444342B2 - 半導体デバイスおよびチャネル形成方法 - Google Patents
半導体デバイスおよびチャネル形成方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 84
- 238000000034 method Methods 0.000 title claims description 42
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- 239000002184 metal Substances 0.000 claims description 21
- 239000002105 nanoparticle Substances 0.000 claims description 21
- 239000000470 constituent Substances 0.000 claims description 14
- 239000002073 nanorod Substances 0.000 claims description 13
- 150000001875 compounds Chemical class 0.000 claims description 11
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- 230000015572 biosynthetic process Effects 0.000 claims description 10
- 239000010408 film Substances 0.000 claims description 10
- 229910044991 metal oxide Inorganic materials 0.000 claims description 10
- 239000010409 thin film Substances 0.000 claims description 10
- 150000004706 metal oxides Chemical class 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 7
- 238000005245 sintering Methods 0.000 claims description 5
- 238000009792 diffusion process Methods 0.000 claims description 4
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- 239000013081 microcrystal Substances 0.000 claims description 2
- 239000013078 crystal Substances 0.000 claims 10
- 239000007788 liquid Substances 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 239000002159 nanocrystal Substances 0.000 claims 1
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- 239000000758 substrate Substances 0.000 description 7
- 239000011162 core material Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 238000000137 annealing Methods 0.000 description 5
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000002086 nanomaterial Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 150000004770 chalcogenides Chemical class 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000007725 thermal activation Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910005540 GaP Inorganic materials 0.000 description 1
- 229910005542 GaSb Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
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- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 239000002082 metal nanoparticle Substances 0.000 description 1
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- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 150000002843 nonmetals Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000009489 vacuum treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
- H01L29/0669—Nanowires or nanotubes
- H01L29/0673—Nanowires or nanotubes oriented parallel to a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
Description
Claims (22)
- 半導体デバイスであって、
結晶ミクロ粒子、ミクロロッド、結晶ナノ粒子、または、ナノロッドの形状で半導体チャネル構成物質から形成されたチャネル層と、
前記チャネル層に電気的に結合された電極とを備え、
前記チャネル層は、隣接する、結晶ミクロ粒子、ミクロロッド、結晶ナノ粒子、またはナノロッド間の界面を少なくとも1つ含み、
前記結晶ミクロ粒子、ミクロロッド、結晶ナノ粒子、またはナノロッドのそれぞれは、 前記半導体チャネル物質を含有するコアと、
前記半導体チャネル構成物質を含有し、かつ、前記コアの周りに配置されたシェルとを含み、当該シェルだけが半導体ドーパントでドープされ、当該ドープされたシェルは前記少なくとも1つの界面を構成し、
前記少なくとも1つの界面の電気抵抗率は、本来の界面の抵抗率より小さく、
前記チャネル層は、チャネル厚さの方向に、バックチャネルの導電率がチャネルの導電率よりも低くなるようにドープ濃度勾配を有する
半導体デバイス。 - 結晶粒子間の前記界面は、結晶物質から構成される
請求項1記載の半導体デバイス。 - 結晶粒子間の前記界面は、非晶質物質から構成される
請求項1記載の半導体デバイス。 - 前記デバイスは、薄膜トランジスタ、ダイオード、または太陽電池のうちのいずれか1つである
請求項1〜3のいずれか1項に記載の半導体デバイス。 - 前記半導体チャネル構成物質は、結晶構造、ミクロ結晶構造、ナノ結晶構造、多形性構造、またはそれらの混合物である
請求項1〜4のいずれか1項に記載の半導体デバイス。 - 前記半導体チャネル構成物質は、元素半導体または化合物半導体である
請求項1〜5のいずれか1項に記載の半導体デバイス。 - 前記元素半導体は、IVb族元素のうちの1つから成る
請求項6に記載の半導体デバイス。 - 前記化合物半導体は、酸化物化合物、炭化物化合物、または窒化物化合物のうちのいずれか1つから成る
請求項1に記載の半導体デバイス。 - 前記チャネルは、第1金属原子を含む金属酸化物半導体から構成され、前記半導体ドーパントは、第2金属原子を含み、前記第1金属原子の電子親和力は、前記第2金属原子の電子親和力よりも0.05電子ボルトより大きい
請求項1に記載の半導体デバイス。 - 薄膜デバイスで用いられる半導体物質のチャネル形成方法であって、
前記半導体物質を含むコアと前記半導体物質を含むシェルとをそれぞれが含む、結晶ミクロ粒子、ミクロロッド、結晶ナノ粒子、または、ナノロッドの形状でチャネル構成物質を与える提供ステップと、
前記結晶ミクロ粒子、ミクロロッド、結晶ナノ粒子、または、ナノロッドのシェルを含む少なくとも1つの界面で、隣接する前記粒子またはロッドが互いに接触するようにチャネル層を形成する、前記粒子またはロッドの処理ステップと、
前記少なくとも1つの界面の電気抵抗率が、本来の界面の抵抗率より小さくなるように、前記チャネル層を半導体ドーパントと接触させることによって、前記結晶ミクロ粒子、ミクロロッド、結晶ナノ粒子、または、ナノロッドのシェルのみを、前記チャネル層のチャネル厚さの方向に、バックチャネルの導電率がチャネルの導電率よりも低くなるように、ドープ濃度勾配をつけてドーピングするドーピングステップと、
前記チャネル層に電極を接続する接続ステップとを含む
チャネル形成方法。 - 前記デバイスは、薄膜トランジスタ、ダイオード、または太陽電池のうちのいずれかで
ある
請求項10項に記載のチャネル形成方法。 - 前記チャネル構成物質は、結晶構造、ミクロ結晶構造、ナノ結晶構造、多形性構造、またはそれらの混合物である
請求項10または11に記載のチャネル形成方法。 - 前記半導体構成物質は、元素半導体または化合物半導体である
請求項10、11または12に記載のチャネル形成方法。 - 前記ドーピングステップは、バルクまたは表面ドーピングである
請求項10〜13のいずれか1項に記載のチャネル形成方法。 - 前記処理ステップは、前記チャネル構成物質のヒュージング処理または焼結処理を含む
請求項10〜14のいずれか1項に記載のチャネル形成方法。 - 前記シェルのみにドーピングする前記ドーピングステップは、前記半導体ドーパントを含有する液体の成膜処理を含む
請求項10〜15のいずれか1項に記載のチャネル形成方法。 - 前記半導体物質は、第1金属原子を含む金属酸化物であり、前記液体は、前記第1金属原子の電子親和力より小さく、少なくとも0.05電子ボルトより大きな電子親和力を有する第2金属原子を含む
請求項14に記載のチャネル形成方法。 - 前記半導体物質はZnOであり、前記第2金属原子はAlである
請求項17に記載のチャネル形成方法。 - 前記シェルのみにドーピングする前記ドーピングステップは、ドーピングの時間および温度の両方または一方を制御することによって、前記結晶ミクロ粒子、ミクロロッド、結晶ナノ粒子、または、ナノロッド内に前記半導体ドーパントが拡散する度合いと深度とに影響を与える処理を含む
請求項10に記載のチャネル形成方法。 - 前記ドーピングの時間および温度の両方または一方を制御して、チャネル層の厚さ方向にドーピング濃度の勾配をつける
請求項19に記載のチャネル形成方法。 - 結晶粒子間の前記少なくとも1つの界面は、結晶物質から構成される
請求項10に記載のチャネル形成方法。 - 結晶粒子間の前記少なくとも1つの界面は、非晶質物質から構成される
請求項10に記載のチャネル形成方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/GB2008/002471 WO2010007333A1 (en) | 2008-07-18 | 2008-07-18 | Semiconductor material |
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JP2011528496A JP2011528496A (ja) | 2011-11-17 |
JP5444342B2 true JP5444342B2 (ja) | 2014-03-19 |
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JP2011517986A Expired - Fee Related JP5444342B2 (ja) | 2008-07-18 | 2008-07-18 | 半導体デバイスおよびチャネル形成方法 |
Country Status (4)
Country | Link |
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US (1) | US8362479B2 (ja) |
EP (1) | EP2304802B8 (ja) |
JP (1) | JP5444342B2 (ja) |
WO (1) | WO2010007333A1 (ja) |
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JP5552547B2 (ja) | 2010-09-13 | 2014-07-16 | パナソニック株式会社 | 金属酸化物半導体の製造方法 |
JP5597510B2 (ja) * | 2010-10-14 | 2014-10-01 | 出光興産株式会社 | コアシェル半導体微粒子 |
CN103123902A (zh) * | 2013-01-16 | 2013-05-29 | 京东方科技集团股份有限公司 | 半导体层结构、多晶硅薄膜晶体管、制作方法、显示装置 |
GB201418610D0 (en) * | 2014-10-20 | 2014-12-03 | Cambridge Entpr Ltd | Transistor devices |
TWI591809B (zh) * | 2015-08-04 | 2017-07-11 | 國立交通大學 | 光感測裝置及其應用 |
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JP2004532133A (ja) * | 2001-03-30 | 2004-10-21 | ザ・リージェンツ・オブ・ザ・ユニバーシティ・オブ・カリフォルニア | ナノ構造及びナノワイヤーの組立方法並びにそれらから組立てられた装置 |
JP4310076B2 (ja) * | 2001-05-31 | 2009-08-05 | キヤノン株式会社 | 結晶性薄膜の製造方法 |
US7067867B2 (en) * | 2002-09-30 | 2006-06-27 | Nanosys, Inc. | Large-area nonenabled macroelectronic substrates and uses therefor |
CN102569349A (zh) * | 2002-09-30 | 2012-07-11 | 纳米系统公司 | 使用纳米线晶体管的集成显示器 |
AU2003283973B2 (en) * | 2002-09-30 | 2008-10-30 | Oned Material Llc | Large-area nanoenabled macroelectronic substrates and uses therefor |
AU2003277033A1 (en) * | 2002-09-30 | 2004-04-23 | Nanosys, Inc. | Applications of nano-enabled large area macroelectronic substrates incorporating nanowires and nanowire composites |
US7087920B1 (en) * | 2005-01-21 | 2006-08-08 | Hewlett-Packard Development Company, L.P. | Nanowire, circuit incorporating nanowire, and methods of selecting conductance of the nanowire and configuring the circuit |
US7218004B2 (en) * | 2005-03-11 | 2007-05-15 | Hewlett-Packard Development Company, L.P. | Fusing nanowires using in situ crystal growth |
WO2007017689A2 (en) | 2005-08-09 | 2007-02-15 | Cambridge Enterprise Limited | Nanorod thin-film transistors |
GB0516401D0 (en) * | 2005-08-09 | 2005-09-14 | Univ Cambridge Tech | Nanorod field-effect transistors |
JP4169073B2 (ja) * | 2006-03-13 | 2008-10-22 | ソニー株式会社 | 薄膜半導体装置および薄膜半導体装置の製造方法 |
JP5207598B2 (ja) * | 2006-05-24 | 2013-06-12 | パナソニック株式会社 | 窒化物半導体材料、半導体素子およびその製造方法 |
-
2008
- 2008-07-18 JP JP2011517986A patent/JP5444342B2/ja not_active Expired - Fee Related
- 2008-07-18 WO PCT/GB2008/002471 patent/WO2010007333A1/en active Application Filing
- 2008-07-18 EP EP08775996.5A patent/EP2304802B8/en not_active Not-in-force
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2011
- 2011-01-07 US US12/986,535 patent/US8362479B2/en active Active
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US20110101344A1 (en) | 2011-05-05 |
JP2011528496A (ja) | 2011-11-17 |
US8362479B2 (en) | 2013-01-29 |
WO2010007333A1 (en) | 2010-01-21 |
EP2304802A1 (en) | 2011-04-06 |
EP2304802B1 (en) | 2013-08-28 |
EP2304802B8 (en) | 2013-12-04 |
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