KR101148317B1 - 다층회로기판 및 다층회로기판의 제조방법 - Google Patents

다층회로기판 및 다층회로기판의 제조방법 Download PDF

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Publication number
KR101148317B1
KR101148317B1 KR1020050120326A KR20050120326A KR101148317B1 KR 101148317 B1 KR101148317 B1 KR 101148317B1 KR 1020050120326 A KR1020050120326 A KR 1020050120326A KR 20050120326 A KR20050120326 A KR 20050120326A KR 101148317 B1 KR101148317 B1 KR 101148317B1
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KR
South Korea
Prior art keywords
hole
conductor layer
circuit board
layer
plating
Prior art date
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Expired - Lifetime
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KR1020050120326A
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English (en)
Korean (ko)
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KR20060065539A (ko
Inventor
야스히코 가나야
아키라 이리에
가츠히로 나가사와
도루 유키
Original Assignee
히다치 비아 메카닉스 가부시키가이샤
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Publication of KR20060065539A publication Critical patent/KR20060065539A/ko
Application granted granted Critical
Publication of KR101148317B1 publication Critical patent/KR101148317B1/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/092—Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09718—Clearance holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0242—Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020050120326A 2004-12-10 2005-12-09 다층회로기판 및 다층회로기판의 제조방법 Expired - Lifetime KR101148317B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00359169 2004-12-10
JP2004359169A JP4611010B2 (ja) 2004-12-10 2004-12-10 多層回路基板の製造方法

Publications (2)

Publication Number Publication Date
KR20060065539A KR20060065539A (ko) 2006-06-14
KR101148317B1 true KR101148317B1 (ko) 2012-05-21

Family

ID=36584293

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050120326A Expired - Lifetime KR101148317B1 (ko) 2004-12-10 2005-12-09 다층회로기판 및 다층회로기판의 제조방법

Country Status (5)

Country Link
US (1) US7488676B2 (enExample)
JP (1) JP4611010B2 (enExample)
KR (1) KR101148317B1 (enExample)
CN (1) CN1791300B (enExample)
TW (1) TWI372589B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
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WO2018221976A1 (ko) * 2017-05-31 2018-12-06 (주)피코팩 빌드업 다층 인쇄회로기판을 이용한 구강센서 제조방법 및 이로부터 제조된 인트라 오랄 센서

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CN101123846B (zh) * 2006-08-09 2010-06-23 亿光电子工业股份有限公司 印刷电路板的盲孔结构及其制造方法
JP4901602B2 (ja) * 2007-06-22 2012-03-21 日立ビアメカニクス株式会社 プリント基板の製造方法及びプリント基板
US20090188710A1 (en) * 2008-01-30 2009-07-30 Cisco Technology, Inc. System and method for forming filled vias and plated through holes
CN101583250B (zh) * 2008-05-15 2011-04-13 华为技术有限公司 印刷线路板过孔加工方法及印刷线路板、通信设备
US8232115B2 (en) 2009-09-25 2012-07-31 International Business Machines Corporation Test structure for determination of TSV depth
JP5660044B2 (ja) 2009-10-20 2015-01-28 日本電気株式会社 配線基板設計支援装置、配線基板設計方法、及びプログラム
CN102548249B (zh) * 2010-12-13 2014-02-05 富葵精密组件(深圳)有限公司 电路板的制作方法
US8816218B2 (en) * 2012-05-29 2014-08-26 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Multilayer electronic structures with vias having different dimensions
CN103517581B (zh) * 2012-06-15 2016-08-03 深南电路有限公司 一种多层pcb板制造方法及多层pcb板
CN103796415B (zh) * 2012-10-31 2017-02-08 碁鼎科技秦皇岛有限公司 多层电路板及其制作方法
CN104227060A (zh) * 2013-06-21 2014-12-24 北大方正集团有限公司 一种钻孔方法和钻孔机
CN104470203A (zh) * 2013-09-25 2015-03-25 深南电路有限公司 Hdi电路板及其层间互连结构以及加工方法
KR101492192B1 (ko) * 2013-10-07 2015-02-10 (주)에이티씨 다층기판 및 이의 제조방법
US9341670B2 (en) 2014-05-20 2016-05-17 International Business Machines Corporation Residual material detection in backdrilled stubs
US9354270B2 (en) * 2014-06-13 2016-05-31 Oracle International Corporation Step drill test structure of layer depth sensing on printed circuit board
JP6383252B2 (ja) * 2014-10-30 2018-08-29 ルネサスエレクトロニクス株式会社 電子装置およびその製造方法
US9967984B1 (en) 2015-01-14 2018-05-08 Vlt, Inc. Power adapter packaging
US10264664B1 (en) 2015-06-04 2019-04-16 Vlt, Inc. Method of electrically interconnecting circuit assemblies
TWI578416B (zh) * 2015-09-18 2017-04-11 旭德科技股份有限公司 封裝載板及其製作方法
CN105472892A (zh) * 2015-12-30 2016-04-06 东莞生益电子有限公司 一种电路板的制作方法
EP3346809A4 (en) * 2016-03-04 2018-11-21 Alps Electric Co., Ltd. Electronic circuit module and method for testing electronic circuit module
US10785871B1 (en) 2018-12-12 2020-09-22 Vlt, Inc. Panel molded electronic assemblies with integral terminals
US10903734B1 (en) 2016-04-05 2021-01-26 Vicor Corporation Delivering power to semiconductor loads
US10158357B1 (en) 2016-04-05 2018-12-18 Vlt, Inc. Method and apparatus for delivering power to semiconductors
US11336167B1 (en) 2016-04-05 2022-05-17 Vicor Corporation Delivering power to semiconductor loads
US9872399B1 (en) 2016-07-22 2018-01-16 International Business Machines Corporation Implementing backdrilling elimination utilizing anti-electroplate coating
EP3555980B1 (en) * 2016-12-19 2022-08-17 ABB Schweiz AG Method of manufacturing a multi-phase busbar and arrangement for arrangement for carrying out the method
DE102018217349A1 (de) 2018-10-10 2020-04-16 Conti Temic Microelectronic Gmbh Leiterplatte
CN114731758A (zh) * 2019-11-06 2022-07-08 迅达科技公司 用于从印刷电路板去除过孔内的不想要的金属的系统和方法
CN113727518B (zh) * 2020-05-26 2023-04-18 深圳市大族数控科技股份有限公司 印制电路预制板及背钻方法、印制电路板
CN112140229B (zh) * 2020-09-28 2021-06-18 广东鼎泰高科技术股份有限公司 一种背钻刀具及其制备方法
CN113840479B (zh) * 2021-11-29 2022-02-11 深圳市大族数控科技股份有限公司 背钻深度确定方法、背钻方法及钻孔系统
TWI808859B (zh) * 2022-02-15 2023-07-11 欣興電子股份有限公司 電路板結構

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Publication number Priority date Publication date Assignee Title
WO2018221976A1 (ko) * 2017-05-31 2018-12-06 (주)피코팩 빌드업 다층 인쇄회로기판을 이용한 구강센서 제조방법 및 이로부터 제조된 인트라 오랄 센서

Also Published As

Publication number Publication date
KR20060065539A (ko) 2006-06-14
JP2006173146A (ja) 2006-06-29
TW200635469A (en) 2006-10-01
US20060127652A1 (en) 2006-06-15
TWI372589B (en) 2012-09-11
CN1791300A (zh) 2006-06-21
CN1791300B (zh) 2011-06-01
JP4611010B2 (ja) 2011-01-12
US7488676B2 (en) 2009-02-10

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