TWI372589B - Manufacturing method of multi-layered circuit board - Google Patents

Manufacturing method of multi-layered circuit board

Info

Publication number
TWI372589B
TWI372589B TW094143348A TW94143348A TWI372589B TW I372589 B TWI372589 B TW I372589B TW 094143348 A TW094143348 A TW 094143348A TW 94143348 A TW94143348 A TW 94143348A TW I372589 B TWI372589 B TW I372589B
Authority
TW
Taiwan
Prior art keywords
manufacturing
circuit board
layered circuit
layered
board
Prior art date
Application number
TW094143348A
Other languages
English (en)
Chinese (zh)
Other versions
TW200635469A (en
Inventor
Yasuhiko Kanaya
Akira Irie
Katsuhiro Nagasawa
Toru Yuki
Original Assignee
Hitachi Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Publication of TW200635469A publication Critical patent/TW200635469A/zh
Application granted granted Critical
Publication of TWI372589B publication Critical patent/TWI372589B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/092—Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09718—Clearance holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0242—Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW094143348A 2004-12-10 2005-12-08 Manufacturing method of multi-layered circuit board TWI372589B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004359169A JP4611010B2 (ja) 2004-12-10 2004-12-10 多層回路基板の製造方法

Publications (2)

Publication Number Publication Date
TW200635469A TW200635469A (en) 2006-10-01
TWI372589B true TWI372589B (en) 2012-09-11

Family

ID=36584293

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094143348A TWI372589B (en) 2004-12-10 2005-12-08 Manufacturing method of multi-layered circuit board

Country Status (5)

Country Link
US (1) US7488676B2 (enExample)
JP (1) JP4611010B2 (enExample)
KR (1) KR101148317B1 (enExample)
CN (1) CN1791300B (enExample)
TW (1) TWI372589B (enExample)

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CN101123846B (zh) * 2006-08-09 2010-06-23 亿光电子工业股份有限公司 印刷电路板的盲孔结构及其制造方法
JP4901602B2 (ja) 2007-06-22 2012-03-21 日立ビアメカニクス株式会社 プリント基板の製造方法及びプリント基板
US20090188710A1 (en) * 2008-01-30 2009-07-30 Cisco Technology, Inc. System and method for forming filled vias and plated through holes
CN101583250B (zh) * 2008-05-15 2011-04-13 华为技术有限公司 印刷线路板过孔加工方法及印刷线路板、通信设备
US8232115B2 (en) * 2009-09-25 2012-07-31 International Business Machines Corporation Test structure for determination of TSV depth
JP5660044B2 (ja) * 2009-10-20 2015-01-28 日本電気株式会社 配線基板設計支援装置、配線基板設計方法、及びプログラム
CN102548249B (zh) * 2010-12-13 2014-02-05 富葵精密组件(深圳)有限公司 电路板的制作方法
US8816218B2 (en) * 2012-05-29 2014-08-26 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Multilayer electronic structures with vias having different dimensions
CN103517581B (zh) * 2012-06-15 2016-08-03 深南电路有限公司 一种多层pcb板制造方法及多层pcb板
CN103796415B (zh) * 2012-10-31 2017-02-08 碁鼎科技秦皇岛有限公司 多层电路板及其制作方法
CN104227060A (zh) * 2013-06-21 2014-12-24 北大方正集团有限公司 一种钻孔方法和钻孔机
CN104470203A (zh) * 2013-09-25 2015-03-25 深南电路有限公司 Hdi电路板及其层间互连结构以及加工方法
KR101492192B1 (ko) * 2013-10-07 2015-02-10 (주)에이티씨 다층기판 및 이의 제조방법
US9341670B2 (en) 2014-05-20 2016-05-17 International Business Machines Corporation Residual material detection in backdrilled stubs
US9354270B2 (en) * 2014-06-13 2016-05-31 Oracle International Corporation Step drill test structure of layer depth sensing on printed circuit board
JP6383252B2 (ja) * 2014-10-30 2018-08-29 ルネサスエレクトロニクス株式会社 電子装置およびその製造方法
US9967984B1 (en) 2015-01-14 2018-05-08 Vlt, Inc. Power adapter packaging
US10264664B1 (en) 2015-06-04 2019-04-16 Vlt, Inc. Method of electrically interconnecting circuit assemblies
TWI578416B (zh) * 2015-09-18 2017-04-11 旭德科技股份有限公司 封裝載板及其製作方法
CN105472892A (zh) * 2015-12-30 2016-04-06 东莞生益电子有限公司 一种电路板的制作方法
WO2017149966A1 (ja) * 2016-03-04 2017-09-08 アルプス電気株式会社 電子回路モジュール及び電子回路モジュールの試験方法
US10903734B1 (en) 2016-04-05 2021-01-26 Vicor Corporation Delivering power to semiconductor loads
US11336167B1 (en) 2016-04-05 2022-05-17 Vicor Corporation Delivering power to semiconductor loads
US10785871B1 (en) 2018-12-12 2020-09-22 Vlt, Inc. Panel molded electronic assemblies with integral terminals
US10158357B1 (en) 2016-04-05 2018-12-18 Vlt, Inc. Method and apparatus for delivering power to semiconductors
US9872399B1 (en) * 2016-07-22 2018-01-16 International Business Machines Corporation Implementing backdrilling elimination utilizing anti-electroplate coating
WO2018114688A1 (en) * 2016-12-19 2018-06-28 Abb Schweiz Ag Laminated busbar for plug-in modules
WO2018221976A1 (ko) * 2017-05-31 2018-12-06 (주)피코팩 빌드업 다층 인쇄회로기판을 이용한 구강센서 제조방법 및 이로부터 제조된 인트라 오랄 센서
DE102018217349A1 (de) 2018-10-10 2020-04-16 Conti Temic Microelectronic Gmbh Leiterplatte
WO2021092463A1 (en) * 2019-11-06 2021-05-14 Ttm Technologies Inc. Systems and methods for removing undesired metal within vias from printed circuit boards
CN113727518B (zh) * 2020-05-26 2023-04-18 深圳市大族数控科技股份有限公司 印制电路预制板及背钻方法、印制电路板
CN112140229B (zh) * 2020-09-28 2021-06-18 广东鼎泰高科技术股份有限公司 一种背钻刀具及其制备方法
CN113840479B (zh) * 2021-11-29 2022-02-11 深圳市大族数控科技股份有限公司 背钻深度确定方法、背钻方法及钻孔系统
TWI808859B (zh) * 2022-02-15 2023-07-11 欣興電子股份有限公司 電路板結構

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CN101547563A (zh) * 2003-09-19 2009-09-30 通道系统集团公司 闭合反钻系统

Also Published As

Publication number Publication date
JP2006173146A (ja) 2006-06-29
KR20060065539A (ko) 2006-06-14
TW200635469A (en) 2006-10-01
JP4611010B2 (ja) 2011-01-12
CN1791300A (zh) 2006-06-21
CN1791300B (zh) 2011-06-01
US7488676B2 (en) 2009-02-10
KR101148317B1 (ko) 2012-05-21
US20060127652A1 (en) 2006-06-15

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