JP2006173146A - 多層回路基板および多層回路基板の製造方法 - Google Patents
多層回路基板および多層回路基板の製造方法 Download PDFInfo
- Publication number
- JP2006173146A JP2006173146A JP2004359169A JP2004359169A JP2006173146A JP 2006173146 A JP2006173146 A JP 2006173146A JP 2004359169 A JP2004359169 A JP 2004359169A JP 2004359169 A JP2004359169 A JP 2004359169A JP 2006173146 A JP2006173146 A JP 2006173146A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- conductor layer
- circuit board
- multilayer circuit
- detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/092—Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09718—Clearance holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0242—Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24322—Composite web or sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
【解決手段】 多層回路基板1の表面に実装される電子部品の通電端子(ピン)をめっき21された貫通穴20に挿入して導体層4aに接続する。該導体層の裏面側の導体層3cに、貫通穴20と同軸で大径の検出用穴22を有する検出部35を設ける。導体層3cと工具30との間に電圧を印加して、裏面から工具30により貫通穴20に沿って大径の穴32を形成し、該穴32の深さは、工具30が検出用穴22に電通することにより設定される。該大径の穴により、貫通穴20の不要なめっきが除去される。
【選択図】 図1
Description
表面に配置される電子部品の通電端子とめっき(21)された貫通穴(20)を介して接続される導体層(4a)の裏面側の導体層(3c)に、前記貫通穴と同軸で当該穴の外径よりも大径の検出用穴(22)を有する検出部(35)を設けると共に、該検出用穴(22)の直径より大径の工具(30)により、前記多層回路基板(1)の裏面側から、前記貫通穴(20)に沿って前記検出用穴(22)に至る穴(32)を形成し、
該穴(32)により前記通電端子と接続される導体層より裏面側の前記貫通穴(20)のめっき(21)を除去してなる、
ことを特徴とする多層回路基板にある。
前記電子部品の通電端子と接続される導体層(4a)の裏面側の導体層(3c)に、前記貫通穴(20)と同軸で当該穴の外径よりも大径の検出用穴(22)を有する検出部(35)を形成しておき、
前記電子部品の通電端子を位置決めするための接続用の貫通穴(20)を加工する工程と、
前記貫通穴の内面をめっきするめっき工程と、
前記検出用穴の直径よりも大径の工具(30)と前記検出部(35)が設けられた導体層(3c)との間に所定電圧を印加した状態で前記多層回路基板(1)の裏面側から、前記工具により前記貫通穴に沿って、前記検出用穴を検出することに基づく所定深さの大径の穴(32)を加工する追加工程と、
を備えることを特徴とする多層回路基板の製造方法にある。
前記検査用貫通穴(23)の内面をめっき(24)するめっき工程と、を備え、
前記追加工程において、前記検査用貫通穴(23)のめっき(24)を介して前記検出部(35)を有する導体層(3c)と前記工具(30)との間に前記所定電圧を印加する、
ことを特徴とする請求項2または請求項3に記載の多層回路基板の製造方法にある。
手順1:表面側に配置される電子部品の通電端子(ピン)を挿入して位置決めするための接続用の貫通穴20を加工する。また、導体層3cに接続する検査用貫通穴23を加工する。なお、検査用貫通穴23の位置は、貫通穴20に接続する導体層3c内のいずれかの位置に配置されている。
手順2:めっき処理により、貫通穴20の内面にめっき層21を、検査用貫通穴23の内面にめっき層24を、それぞれ形成する。
手順3:直径が検出用穴22の直径よりも大径の工具30とめっき層24すなわち導体層3cとの間に予め定める電圧(例えば5V)を印加した状態で、工具30により裏面側から貫通穴20に沿って加工し、工具30と導体層3cとの間の電圧が予め定める電圧(例えば2V)以下になった時、工具30が導体層3cの位置に到達(即ち接触)したと判定する。そして、例えば、導体層3cと導体層4aとの距離が近い場合にはその時点で加工を中止する。また、回路パターンの配置の関係で、例えば、検出部35が導体層3cよりも裏面側の導体層3aに配置されている場合には、この位置から更に予め定める距離だけ穴を加工する。
手順4:めっき層21が形成された貫通穴20に通電端子(ピン)を挿入して位置決めする。
手順5:通電端子とめっき層21すなわち導体層4aとをはんだにより接続する。
2,3,4,5 基板
2a,3a,3c,4a,5a 導体層
2b,3b,4b,5b 絶縁層
20 貫通穴
21 めっき層
22 検出用穴
23 検査用貫通穴
30 工具
32 大径の穴
35 検出部
Claims (4)
- 導体層と絶縁層とからなる基板を複数枚重ねて一体にした多層回路基板において、
表面に配置される電子部品の通電端子とめっきされた貫通穴を介して接続される導体層の裏面側の導体層に、前記貫通穴と同軸で当該穴の外径よりも大径の検出用穴を有する検出部を設けると共に、該検出用穴の直径より大径の工具により、前記多層回路基板の裏面側から、前記貫通穴に沿って前記検出用穴に至る穴を形成し、
該穴により前記通電端子と接続される導体層より裏面側の前記貫通穴のめっきを除去してなる、
ことを特徴とする多層回路基板。 - 導体層と絶縁層とからなる基板を複数枚重ねて一体にした多層回路基板に、該多層回路基板の表面に実装される電子部品の通電端子を挿入して所定の導体層に接続する接続穴を形成する方法であって、
前記電子部品の通電端子と接続される導体層の裏面側の導体層に、前記貫通穴と同軸で当該穴の外径よりも大径の検出用穴を有する検出部を形成しておき、
前記電子部品の通電端子を位置決めするための接続用の貫通穴を加工する工程と、
前記貫通穴の内面をめっきするめっき工程と、
前記検出用穴の直径よりも大径の工具と前記検出部が設けられた導体層との間に所定電圧を印加した状態で前記多層回路基板の裏面側から、前記工具により前記貫通穴に沿って、前記検出用穴を検出することに基づく所定深さの大径の穴を加工する追加工程と、
を備えることを特徴とする多層回路基板の製造方法。 - 前記追加工程における前記所定深さは、前記電圧が予め定める値以下になった時の前記工具の位置を基準とする深さであることを特徴とする請求項2に記載の多層回路基板の製造方法。
- 前記接続用の貫通穴とは別に、前記検出部を有する導体層に接続する位置に検査用貫通穴を加工する工程と、
前記検査用貫通穴の内面をめっきするめっき工程と、を備え、
前記追加工程において、前記検査用貫通穴のめっきを介して前記検出部を有する導体層と前記工具との間に前記所定電圧を印加する、
ことを特徴とする請求項2または請求項3に記載の多層回路基板の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004359169A JP4611010B2 (ja) | 2004-12-10 | 2004-12-10 | 多層回路基板の製造方法 |
TW094143348A TWI372589B (en) | 2004-12-10 | 2005-12-08 | Manufacturing method of multi-layered circuit board |
US11/297,358 US7488676B2 (en) | 2004-12-10 | 2005-12-09 | Manufacturing method of a multi-layered circuit board |
KR1020050120326A KR101148317B1 (ko) | 2004-12-10 | 2005-12-09 | 다층회로기판 및 다층회로기판의 제조방법 |
CN2005101301562A CN1791300B (zh) | 2004-12-10 | 2005-12-12 | 多层电路板及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004359169A JP4611010B2 (ja) | 2004-12-10 | 2004-12-10 | 多層回路基板の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006173146A true JP2006173146A (ja) | 2006-06-29 |
JP2006173146A5 JP2006173146A5 (ja) | 2007-04-12 |
JP4611010B2 JP4611010B2 (ja) | 2011-01-12 |
Family
ID=36584293
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004359169A Active JP4611010B2 (ja) | 2004-12-10 | 2004-12-10 | 多層回路基板の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7488676B2 (ja) |
JP (1) | JP4611010B2 (ja) |
KR (1) | KR101148317B1 (ja) |
CN (1) | CN1791300B (ja) |
TW (1) | TWI372589B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8151455B2 (en) | 2007-06-22 | 2012-04-10 | Hitachi Via Mechanics, Ltd. | Printed circuit board and method of manufacturing the same |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101123846B (zh) * | 2006-08-09 | 2010-06-23 | 亿光电子工业股份有限公司 | 印刷电路板的盲孔结构及其制造方法 |
US20090188710A1 (en) * | 2008-01-30 | 2009-07-30 | Cisco Technology, Inc. | System and method for forming filled vias and plated through holes |
CN101583250B (zh) * | 2008-05-15 | 2011-04-13 | 华为技术有限公司 | 印刷线路板过孔加工方法及印刷线路板、通信设备 |
US8232115B2 (en) | 2009-09-25 | 2012-07-31 | International Business Machines Corporation | Test structure for determination of TSV depth |
WO2011048763A1 (ja) * | 2009-10-20 | 2011-04-28 | 日本電気株式会社 | 配線基板設計支援装置、配線基板設計方法、プログラム、及び配線基板 |
CN102548249B (zh) * | 2010-12-13 | 2014-02-05 | 富葵精密组件(深圳)有限公司 | 电路板的制作方法 |
US8816218B2 (en) * | 2012-05-29 | 2014-08-26 | Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. | Multilayer electronic structures with vias having different dimensions |
CN103517581B (zh) * | 2012-06-15 | 2016-08-03 | 深南电路有限公司 | 一种多层pcb板制造方法及多层pcb板 |
CN103796415B (zh) * | 2012-10-31 | 2017-02-08 | 碁鼎科技秦皇岛有限公司 | 多层电路板及其制作方法 |
CN104227060A (zh) * | 2013-06-21 | 2014-12-24 | 北大方正集团有限公司 | 一种钻孔方法和钻孔机 |
CN104470203A (zh) * | 2013-09-25 | 2015-03-25 | 深南电路有限公司 | Hdi电路板及其层间互连结构以及加工方法 |
KR101492192B1 (ko) * | 2013-10-07 | 2015-02-10 | (주)에이티씨 | 다층기판 및 이의 제조방법 |
US9341670B2 (en) | 2014-05-20 | 2016-05-17 | International Business Machines Corporation | Residual material detection in backdrilled stubs |
US9354270B2 (en) * | 2014-06-13 | 2016-05-31 | Oracle International Corporation | Step drill test structure of layer depth sensing on printed circuit board |
JP6383252B2 (ja) * | 2014-10-30 | 2018-08-29 | ルネサスエレクトロニクス株式会社 | 電子装置およびその製造方法 |
US10264664B1 (en) | 2015-06-04 | 2019-04-16 | Vlt, Inc. | Method of electrically interconnecting circuit assemblies |
TWI578416B (zh) * | 2015-09-18 | 2017-04-11 | Subtron Technology Co Ltd | 封裝載板及其製作方法 |
CN105472892A (zh) * | 2015-12-30 | 2016-04-06 | 东莞生益电子有限公司 | 一种电路板的制作方法 |
JPWO2017149966A1 (ja) * | 2016-03-04 | 2018-07-19 | アルプス電気株式会社 | 電子回路モジュール及び電子回路モジュールの試験方法 |
US11336167B1 (en) | 2016-04-05 | 2022-05-17 | Vicor Corporation | Delivering power to semiconductor loads |
US10785871B1 (en) | 2018-12-12 | 2020-09-22 | Vlt, Inc. | Panel molded electronic assemblies with integral terminals |
US10903734B1 (en) | 2016-04-05 | 2021-01-26 | Vicor Corporation | Delivering power to semiconductor loads |
US10158357B1 (en) | 2016-04-05 | 2018-12-18 | Vlt, Inc. | Method and apparatus for delivering power to semiconductors |
US9872399B1 (en) * | 2016-07-22 | 2018-01-16 | International Business Machines Corporation | Implementing backdrilling elimination utilizing anti-electroplate coating |
WO2018114680A1 (en) * | 2016-12-19 | 2018-06-28 | Abb Schweiz Ag | Connection of laminated busbars |
WO2018221976A1 (ko) * | 2017-05-31 | 2018-12-06 | (주)피코팩 | 빌드업 다층 인쇄회로기판을 이용한 구강센서 제조방법 및 이로부터 제조된 인트라 오랄 센서 |
DE102018217349A1 (de) | 2018-10-10 | 2020-04-16 | Conti Temic Microelectronic Gmbh | Leiterplatte |
CN114731758A (zh) * | 2019-11-06 | 2022-07-08 | 迅达科技公司 | 用于从印刷电路板去除过孔内的不想要的金属的系统和方法 |
CN113727518B (zh) * | 2020-05-26 | 2023-04-18 | 深圳市大族数控科技股份有限公司 | 印制电路预制板及背钻方法、印制电路板 |
CN112140229B (zh) * | 2020-09-28 | 2021-06-18 | 广东鼎泰高科技术股份有限公司 | 一种背钻刀具及其制备方法 |
CN113840479B (zh) * | 2021-11-29 | 2022-02-11 | 深圳市大族数控科技股份有限公司 | 背钻深度确定方法、背钻方法及钻孔系统 |
TWI808859B (zh) * | 2022-02-15 | 2023-07-11 | 欣興電子股份有限公司 | 電路板結構 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH054105A (ja) * | 1991-06-25 | 1993-01-14 | Fujitsu Ltd | プリント基板の穴加工方法 |
JPH0715147A (ja) * | 1993-06-24 | 1995-01-17 | Nec Corp | 多層配線基板の半貫通スルーホール形成方法及びその装置 |
JPH08130379A (ja) * | 1994-10-31 | 1996-05-21 | Nec Corp | 多層配線基板の製造方法 |
JPH1022643A (ja) * | 1996-07-01 | 1998-01-23 | Nippon Avionics Co Ltd | キャビティ付きプリント配線板と、その製造方法および製造装置 |
JP2003158381A (ja) * | 2001-11-19 | 2003-05-30 | Nec Corp | 多層配線基板およびその製造方法 |
WO2005029928A2 (en) * | 2003-09-19 | 2005-03-31 | Viasystems Group, Inc. | Closed loop backdrilling system |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3034180B2 (ja) * | 1994-04-28 | 2000-04-17 | 富士通株式会社 | 半導体装置及びその製造方法及び基板 |
JP4184575B2 (ja) | 2000-05-31 | 2008-11-19 | 日立ビアメカニクス株式会社 | ワークの加工方法および工具の折損検出方法並びに加工装置 |
US6562709B1 (en) * | 2000-08-22 | 2003-05-13 | Charles W. C. Lin | Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint |
JP3527229B2 (ja) * | 2002-05-20 | 2004-05-17 | 沖電気工業株式会社 | 半導体装置、半導体装置の実装方法、及び半導体装置のリペア方法 |
JP4034612B2 (ja) | 2002-07-29 | 2008-01-16 | 日立ビアメカニクス株式会社 | 多層回路基板の止まり穴加工方法 |
-
2004
- 2004-12-10 JP JP2004359169A patent/JP4611010B2/ja active Active
-
2005
- 2005-12-08 TW TW094143348A patent/TWI372589B/zh active
- 2005-12-09 US US11/297,358 patent/US7488676B2/en active Active
- 2005-12-09 KR KR1020050120326A patent/KR101148317B1/ko active IP Right Grant
- 2005-12-12 CN CN2005101301562A patent/CN1791300B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH054105A (ja) * | 1991-06-25 | 1993-01-14 | Fujitsu Ltd | プリント基板の穴加工方法 |
JPH0715147A (ja) * | 1993-06-24 | 1995-01-17 | Nec Corp | 多層配線基板の半貫通スルーホール形成方法及びその装置 |
JPH08130379A (ja) * | 1994-10-31 | 1996-05-21 | Nec Corp | 多層配線基板の製造方法 |
JPH1022643A (ja) * | 1996-07-01 | 1998-01-23 | Nippon Avionics Co Ltd | キャビティ付きプリント配線板と、その製造方法および製造装置 |
JP2003158381A (ja) * | 2001-11-19 | 2003-05-30 | Nec Corp | 多層配線基板およびその製造方法 |
WO2005029928A2 (en) * | 2003-09-19 | 2005-03-31 | Viasystems Group, Inc. | Closed loop backdrilling system |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8151455B2 (en) | 2007-06-22 | 2012-04-10 | Hitachi Via Mechanics, Ltd. | Printed circuit board and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
TW200635469A (en) | 2006-10-01 |
JP4611010B2 (ja) | 2011-01-12 |
US20060127652A1 (en) | 2006-06-15 |
TWI372589B (en) | 2012-09-11 |
KR20060065539A (ko) | 2006-06-14 |
US7488676B2 (en) | 2009-02-10 |
KR101148317B1 (ko) | 2012-05-21 |
CN1791300A (zh) | 2006-06-21 |
CN1791300B (zh) | 2011-06-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4611010B2 (ja) | 多層回路基板の製造方法 | |
JP2006173146A5 (ja) | ||
JP6116955B2 (ja) | 多層プリント配線板のバックドリル加工方法、そのためのドリル及び基板穴明け装置 | |
JP2019525464A (ja) | 下にある凹状コンポーネント配置 | |
JP5691762B2 (ja) | プリント基板の製造方法 | |
CN110893629B (zh) | 电路板的制造方法及钻孔机 | |
JP5550977B2 (ja) | プリント基板の穴明け加工方法 | |
JP4772702B2 (ja) | プリント基板およびプリント基板ユニット並びに導電体の上がり量検出方法 | |
JP4749966B2 (ja) | プリント配線板の製造方法 | |
JP2008060208A (ja) | 多層配線基板およびそれを用いたプローブカード | |
KR101003391B1 (ko) | 인쇄회로기판의 홀 가공방법 | |
KR20180075171A (ko) | Pcb 기판의 층간을 연결하는 대각선 비아의 구조 및 pcb 기판의 층간을 연결하는 대각선 비아의 제조방법 | |
JP2008028213A (ja) | 回路基板及びその検査方法 | |
US7876571B2 (en) | Wiring board and method of manufacturing wiring board | |
US8390308B2 (en) | Testbed for testing electronic circuits and components | |
JP2003283145A (ja) | 多層配線板の位置ずれ検査方法 | |
JP2001308531A (ja) | 多層プリント配線基板 | |
JP2000323812A (ja) | 部品実装基板及びその製造方法とその検査装置 | |
JP2570174B2 (ja) | 多層プリント配線板 | |
JP2002016330A (ja) | 部品実装用基板およびその製造方法 | |
JPS6191992A (ja) | プリント配線板 | |
JP2009140993A (ja) | プリント基板 | |
JPH0661604A (ja) | プリント配線板 | |
JP2009236509A (ja) | プローブカード | |
JP2017011013A (ja) | 検査用配線基板及び検査用配線基板の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070226 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070226 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090618 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20091006 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091207 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100420 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100621 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100713 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100909 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20101005 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20101013 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131022 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4611010 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313532 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |