CN1791300B - 多层电路板及其制造方法 - Google Patents
多层电路板及其制造方法 Download PDFInfo
- Publication number
- CN1791300B CN1791300B CN2005101301562A CN200510130156A CN1791300B CN 1791300 B CN1791300 B CN 1791300B CN 2005101301562 A CN2005101301562 A CN 2005101301562A CN 200510130156 A CN200510130156 A CN 200510130156A CN 1791300 B CN1791300 B CN 1791300B
- Authority
- CN
- China
- Prior art keywords
- hole
- conductive layer
- circuit board
- multilayer circuit
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/092—Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09718—Clearance holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0242—Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24322—Composite web or sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (3)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-359169 | 2004-12-10 | ||
JP2004359169A JP4611010B2 (ja) | 2004-12-10 | 2004-12-10 | 多層回路基板の製造方法 |
JP2004359169 | 2004-12-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1791300A CN1791300A (zh) | 2006-06-21 |
CN1791300B true CN1791300B (zh) | 2011-06-01 |
Family
ID=36584293
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2005101301562A Active CN1791300B (zh) | 2004-12-10 | 2005-12-12 | 多层电路板及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7488676B2 (zh) |
JP (1) | JP4611010B2 (zh) |
KR (1) | KR101148317B1 (zh) |
CN (1) | CN1791300B (zh) |
TW (1) | TWI372589B (zh) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101123846B (zh) * | 2006-08-09 | 2010-06-23 | 亿光电子工业股份有限公司 | 印刷电路板的盲孔结构及其制造方法 |
JP4901602B2 (ja) * | 2007-06-22 | 2012-03-21 | 日立ビアメカニクス株式会社 | プリント基板の製造方法及びプリント基板 |
US20090188710A1 (en) * | 2008-01-30 | 2009-07-30 | Cisco Technology, Inc. | System and method for forming filled vias and plated through holes |
CN101583250B (zh) * | 2008-05-15 | 2011-04-13 | 华为技术有限公司 | 印刷线路板过孔加工方法及印刷线路板、通信设备 |
US8232115B2 (en) | 2009-09-25 | 2012-07-31 | International Business Machines Corporation | Test structure for determination of TSV depth |
WO2011048763A1 (ja) | 2009-10-20 | 2011-04-28 | 日本電気株式会社 | 配線基板設計支援装置、配線基板設計方法、プログラム、及び配線基板 |
CN102548249B (zh) * | 2010-12-13 | 2014-02-05 | 富葵精密组件(深圳)有限公司 | 电路板的制作方法 |
US8816218B2 (en) * | 2012-05-29 | 2014-08-26 | Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. | Multilayer electronic structures with vias having different dimensions |
CN103517581B (zh) * | 2012-06-15 | 2016-08-03 | 深南电路有限公司 | 一种多层pcb板制造方法及多层pcb板 |
CN103796415B (zh) * | 2012-10-31 | 2017-02-08 | 碁鼎科技秦皇岛有限公司 | 多层电路板及其制作方法 |
CN104227060A (zh) * | 2013-06-21 | 2014-12-24 | 北大方正集团有限公司 | 一种钻孔方法和钻孔机 |
CN104470203A (zh) * | 2013-09-25 | 2015-03-25 | 深南电路有限公司 | Hdi电路板及其层间互连结构以及加工方法 |
KR101492192B1 (ko) * | 2013-10-07 | 2015-02-10 | (주)에이티씨 | 다층기판 및 이의 제조방법 |
US9341670B2 (en) | 2014-05-20 | 2016-05-17 | International Business Machines Corporation | Residual material detection in backdrilled stubs |
US9354270B2 (en) * | 2014-06-13 | 2016-05-31 | Oracle International Corporation | Step drill test structure of layer depth sensing on printed circuit board |
JP6383252B2 (ja) * | 2014-10-30 | 2018-08-29 | ルネサスエレクトロニクス株式会社 | 電子装置およびその製造方法 |
US10264664B1 (en) | 2015-06-04 | 2019-04-16 | Vlt, Inc. | Method of electrically interconnecting circuit assemblies |
TWI578416B (zh) * | 2015-09-18 | 2017-04-11 | Subtron Technology Co Ltd | 封裝載板及其製作方法 |
CN105472892A (zh) * | 2015-12-30 | 2016-04-06 | 东莞生益电子有限公司 | 一种电路板的制作方法 |
EP3346809A4 (en) * | 2016-03-04 | 2018-11-21 | Alps Electric Co., Ltd. | Electronic circuit module and method for testing electronic circuit module |
US11336167B1 (en) | 2016-04-05 | 2022-05-17 | Vicor Corporation | Delivering power to semiconductor loads |
US10785871B1 (en) | 2018-12-12 | 2020-09-22 | Vlt, Inc. | Panel molded electronic assemblies with integral terminals |
US10158357B1 (en) | 2016-04-05 | 2018-12-18 | Vlt, Inc. | Method and apparatus for delivering power to semiconductors |
US10903734B1 (en) | 2016-04-05 | 2021-01-26 | Vicor Corporation | Delivering power to semiconductor loads |
US9872399B1 (en) * | 2016-07-22 | 2018-01-16 | International Business Machines Corporation | Implementing backdrilling elimination utilizing anti-electroplate coating |
WO2018114678A1 (en) * | 2016-12-19 | 2018-06-28 | Abb Schweiz Ag | Laminated busbar for rear cable connection and a cabinet |
WO2018221976A1 (ko) * | 2017-05-31 | 2018-12-06 | (주)피코팩 | 빌드업 다층 인쇄회로기판을 이용한 구강센서 제조방법 및 이로부터 제조된 인트라 오랄 센서 |
DE102018217349A1 (de) * | 2018-10-10 | 2020-04-16 | Conti Temic Microelectronic Gmbh | Leiterplatte |
WO2021092463A1 (en) * | 2019-11-06 | 2021-05-14 | Ttm Technologies Inc. | Systems and methods for removing undesired metal within vias from printed circuit boards |
CN113727518B (zh) * | 2020-05-26 | 2023-04-18 | 深圳市大族数控科技股份有限公司 | 印制电路预制板及背钻方法、印制电路板 |
CN112140229B (zh) * | 2020-09-28 | 2021-06-18 | 广东鼎泰高科技术股份有限公司 | 一种背钻刀具及其制备方法 |
CN113840479B (zh) * | 2021-11-29 | 2022-02-11 | 深圳市大族数控科技股份有限公司 | 背钻深度确定方法、背钻方法及钻孔系统 |
TWI808859B (zh) * | 2022-02-15 | 2023-07-11 | 欣興電子股份有限公司 | 電路板結構 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1478626A (zh) * | 2002-07-29 | 2004-03-03 | 日立比亚机械股份有限公司 | 多层电路板、测量用检测器、定位孔加工装置及其方法 |
CN1852784A (zh) * | 2003-09-19 | 2006-10-25 | 通道系统集团公司 | 闭合反钻系统 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH054105A (ja) * | 1991-06-25 | 1993-01-14 | Fujitsu Ltd | プリント基板の穴加工方法 |
JPH0715147A (ja) * | 1993-06-24 | 1995-01-17 | Nec Corp | 多層配線基板の半貫通スルーホール形成方法及びその装置 |
JP3034180B2 (ja) * | 1994-04-28 | 2000-04-17 | 富士通株式会社 | 半導体装置及びその製造方法及び基板 |
JP2609825B2 (ja) * | 1994-10-31 | 1997-05-14 | 日本電気株式会社 | 多層配線基板の製造方法 |
JPH1022643A (ja) * | 1996-07-01 | 1998-01-23 | Nippon Avionics Co Ltd | キャビティ付きプリント配線板と、その製造方法および製造装置 |
JP4184575B2 (ja) | 2000-05-31 | 2008-11-19 | 日立ビアメカニクス株式会社 | ワークの加工方法および工具の折損検出方法並びに加工装置 |
US6562709B1 (en) * | 2000-08-22 | 2003-05-13 | Charles W. C. Lin | Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint |
JP3797205B2 (ja) * | 2001-11-19 | 2006-07-12 | 日本電気株式会社 | 多層配線基板およびその製造方法 |
JP3527229B2 (ja) * | 2002-05-20 | 2004-05-17 | 沖電気工業株式会社 | 半導体装置、半導体装置の実装方法、及び半導体装置のリペア方法 |
-
2004
- 2004-12-10 JP JP2004359169A patent/JP4611010B2/ja active Active
-
2005
- 2005-12-08 TW TW094143348A patent/TWI372589B/zh active
- 2005-12-09 KR KR1020050120326A patent/KR101148317B1/ko active IP Right Grant
- 2005-12-09 US US11/297,358 patent/US7488676B2/en active Active
- 2005-12-12 CN CN2005101301562A patent/CN1791300B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1478626A (zh) * | 2002-07-29 | 2004-03-03 | 日立比亚机械股份有限公司 | 多层电路板、测量用检测器、定位孔加工装置及其方法 |
CN1852784A (zh) * | 2003-09-19 | 2006-10-25 | 通道系统集团公司 | 闭合反钻系统 |
Also Published As
Publication number | Publication date |
---|---|
KR20060065539A (ko) | 2006-06-14 |
TWI372589B (en) | 2012-09-11 |
JP2006173146A (ja) | 2006-06-29 |
CN1791300A (zh) | 2006-06-21 |
TW200635469A (en) | 2006-10-01 |
KR101148317B1 (ko) | 2012-05-21 |
JP4611010B2 (ja) | 2011-01-12 |
US20060127652A1 (en) | 2006-06-15 |
US7488676B2 (en) | 2009-02-10 |
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