KR101058917B1 - 전기 도금 장치 - Google Patents

전기 도금 장치 Download PDF

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Publication number
KR101058917B1
KR101058917B1 KR1020057016780A KR20057016780A KR101058917B1 KR 101058917 B1 KR101058917 B1 KR 101058917B1 KR 1020057016780 A KR1020057016780 A KR 1020057016780A KR 20057016780 A KR20057016780 A KR 20057016780A KR 101058917 B1 KR101058917 B1 KR 101058917B1
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KR
South Korea
Prior art keywords
plating
plating solution
substrate
workpiece
stirring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020057016780A
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English (en)
Korean (ko)
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KR20050114226A (ko
Inventor
후미오 구리야마
다카시 다케무라
노부토시 사이토
마사아키 기무라
레이 기우미
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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Publication of KR20050114226A publication Critical patent/KR20050114226A/ko
Application granted granted Critical
Publication of KR101058917B1 publication Critical patent/KR101058917B1/ko
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01251—Changing the shapes of bumps
    • H10W72/01255—Changing the shapes of bumps by using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1020057016780A 2003-03-11 2004-03-09 전기 도금 장치 Expired - Fee Related KR101058917B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2003-00065476 2003-03-11
JP2003065476 2003-03-11
JP2003208315 2003-08-21
JPJP-P-2003-00208315 2003-08-21
PCT/JP2004/003040 WO2004081261A2 (en) 2003-03-11 2004-03-09 Plating apparatus

Publications (2)

Publication Number Publication Date
KR20050114226A KR20050114226A (ko) 2005-12-05
KR101058917B1 true KR101058917B1 (ko) 2011-08-23

Family

ID=32992950

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057016780A Expired - Fee Related KR101058917B1 (ko) 2003-03-11 2004-03-09 전기 도금 장치

Country Status (7)

Country Link
US (2) US7875158B2 (https=)
EP (1) EP1602127A2 (https=)
JP (2) JP4805141B2 (https=)
KR (1) KR101058917B1 (https=)
CN (1) CN101812711B (https=)
TW (2) TWI341875B (https=)
WO (1) WO2004081261A2 (https=)

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EP1668174A2 (en) 2003-10-02 2006-06-14 Ebara Corporation Plating method and apparatus
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NL1032540C2 (nl) * 2006-09-19 2008-03-20 Meco Equip Eng Inrichting voor het elektrolytisch neerslaan van materiaal op een plaatvormig substraat.
JP4684979B2 (ja) * 2006-10-19 2011-05-18 本田技研工業株式会社 メッキ装置
JP2008121062A (ja) * 2006-11-10 2008-05-29 Ebara Corp めっき装置及びめっき方法
DE102007026635B4 (de) * 2007-06-06 2010-07-29 Atotech Deutschland Gmbh Vorrichtung zum nasschemischen Behandeln von Ware, Verwendung eines Strömungsorgans, Verfahren zum Einbauen eines Strömungsorgans in die Vorrichtung sowie Verfahren zur Herstellung einer nasschemisch behandelten Ware
DE102007026633B4 (de) * 2007-06-06 2009-04-02 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von plattenförmiger Ware
JP4942580B2 (ja) * 2007-08-20 2012-05-30 株式会社荏原製作所 アノードホルダ用通電ベルトおよびアノードホルダ
US8177944B2 (en) 2007-12-04 2012-05-15 Ebara Corporation Plating apparatus and plating method
US8784636B2 (en) * 2007-12-04 2014-07-22 Ebara Corporation Plating apparatus and plating method
JP4547016B2 (ja) 2008-04-04 2010-09-22 東京エレクトロン株式会社 半導体製造装置、半導体製造方法
JP5155755B2 (ja) * 2008-07-10 2013-03-06 株式会社荏原製作所 磁性体膜めっき装置及びめっき処理設備
EP2435373B1 (de) * 2009-05-29 2015-03-18 Holger Blum Verfahren und vorrichtung zur behandlung von ballastwasser mit acrolein
WO2011103214A1 (en) * 2010-02-16 2011-08-25 Cypress Semiconductor Corporation Integrated shielding for wafer plating
US20110284385A1 (en) * 2010-05-21 2011-11-24 Pioneer Metal Finishing Method and Apparatus For Anodizing Objects
KR101693217B1 (ko) * 2010-07-20 2017-01-05 주식회사 케이엠더블유 전기도금 장치
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JP6092653B2 (ja) * 2012-02-27 2017-03-08 株式会社荏原製作所 基板洗浄装置及び洗浄方法
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CN102660764B (zh) * 2012-05-25 2014-07-16 深圳顺络电子股份有限公司 一种镀篮内阴极
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JP5699253B2 (ja) * 2012-07-02 2015-04-08 新日鐵住金株式会社 電気めっき装置
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JP6411943B2 (ja) * 2014-05-26 2018-10-24 株式会社荏原製作所 基板電解処理装置、および該基板電解処理装置に使用されるパドル
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JP6995544B2 (ja) * 2017-09-20 2022-01-14 上村工業株式会社 表面処理装置および表面処理方法
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JP6966958B2 (ja) * 2018-03-01 2021-11-17 株式会社荏原製作所 めっき液を撹拌するために用いるパドルおよびパドルを備えるめっき装置
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KR102528900B1 (ko) * 2020-11-30 2023-05-04 주식회사 호진플라텍 도금액 순환, 도금액 교반 및 기포 제거를 동시에 수행하는 하이브리드 패들을 포함하는 기판용 도금장치
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TWI813129B (zh) * 2022-01-06 2023-08-21 日月光半導體製造股份有限公司 化學鍍槽、化學鍍系統及化學鍍方法
JP2023158895A (ja) * 2022-04-19 2023-10-31 株式会社東設 無電解めっき装置
CN115595641A (zh) * 2022-09-21 2023-01-13 通威太阳能(成都)有限公司（Cn） 太阳电池及栅线的电镀工艺
CN116288616A (zh) * 2023-04-06 2023-06-23 龙游龙辉电镀有限公司 一种单面电镀装置及其使用方法
TWI886481B (zh) * 2023-05-04 2025-06-11 日商荏原製作所股份有限公司 鍍覆裝置及鍍覆方法
CN116497302B (zh) * 2023-06-21 2023-11-24 山东华辉通信科技有限公司 一种通讯铁塔加工防锈用镀锌设备
CN119980206B (zh) * 2025-04-16 2025-08-05 天津九易金属表面处理有限公司 一种触头支座化学镀银设备

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Publication number Publication date
WO2004081261B1 (en) 2005-07-14
TW200422429A (en) 2004-11-01
JP5175871B2 (ja) 2013-04-03
CN101812711A (zh) 2010-08-25
JP4805141B2 (ja) 2011-11-02
EP1602127A2 (en) 2005-12-07
WO2004081261A3 (en) 2005-05-26
US8252167B2 (en) 2012-08-28
TWI498451B (zh) 2015-09-01
CN101812711B (zh) 2011-11-16
JP2010106369A (ja) 2010-05-13
US7875158B2 (en) 2011-01-25
JP2006519932A (ja) 2006-08-31
US20060113185A1 (en) 2006-06-01
US20110073482A1 (en) 2011-03-31
KR20050114226A (ko) 2005-12-05
TW201131012A (en) 2011-09-16
TWI341875B (en) 2011-05-11
WO2004081261A2 (en) 2004-09-23

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