CN101812711B - 镀覆装置 - Google Patents

镀覆装置 Download PDF

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Publication number
CN101812711B
CN101812711B CN2010101447137A CN201010144713A CN101812711B CN 101812711 B CN101812711 B CN 101812711B CN 2010101447137 A CN2010101447137 A CN 2010101447137A CN 201010144713 A CN201010144713 A CN 201010144713A CN 101812711 B CN101812711 B CN 101812711B
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CN
China
Prior art keywords
plating
substrate
plating solution
plated
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010101447137A
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English (en)
Chinese (zh)
Other versions
CN101812711A (zh
Inventor
栗山文夫
竹村隆
斋藤信利
木村诚章
黄海冷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of CN101812711A publication Critical patent/CN101812711A/zh
Application granted granted Critical
Publication of CN101812711B publication Critical patent/CN101812711B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01251—Changing the shapes of bumps
    • H10W72/01255—Changing the shapes of bumps by using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CN2010101447137A 2003-03-11 2004-03-09 镀覆装置 Expired - Fee Related CN101812711B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003-065476 2003-03-11
JP2003065476 2003-03-11
JP2003208315 2003-08-21
JP2003-208315 2003-08-21

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNB200480004248XA Division CN100436643C (zh) 2003-03-11 2004-03-09 镀覆装置

Publications (2)

Publication Number Publication Date
CN101812711A CN101812711A (zh) 2010-08-25
CN101812711B true CN101812711B (zh) 2011-11-16

Family

ID=32992950

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010101447137A Expired - Fee Related CN101812711B (zh) 2003-03-11 2004-03-09 镀覆装置

Country Status (7)

Country Link
US (2) US7875158B2 (https=)
EP (1) EP1602127A2 (https=)
JP (2) JP4805141B2 (https=)
KR (1) KR101058917B1 (https=)
CN (1) CN101812711B (https=)
TW (2) TWI341875B (https=)
WO (1) WO2004081261A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI682076B (zh) 2017-10-20 2020-01-11 日商Ａｌｍｅｘ Ｐｅ股份有限公司 表面處理裝置

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1668174A2 (en) 2003-10-02 2006-06-14 Ebara Corporation Plating method and apparatus
KR101146525B1 (ko) * 2005-06-30 2012-05-25 엘지디스플레이 주식회사 기판 고정 지그 및 그 제조방법
NL1032540C2 (nl) * 2006-09-19 2008-03-20 Meco Equip Eng Inrichting voor het elektrolytisch neerslaan van materiaal op een plaatvormig substraat.
JP4684979B2 (ja) * 2006-10-19 2011-05-18 本田技研工業株式会社 メッキ装置
JP2008121062A (ja) * 2006-11-10 2008-05-29 Ebara Corp めっき装置及びめっき方法
DE102007026635B4 (de) * 2007-06-06 2010-07-29 Atotech Deutschland Gmbh Vorrichtung zum nasschemischen Behandeln von Ware, Verwendung eines Strömungsorgans, Verfahren zum Einbauen eines Strömungsorgans in die Vorrichtung sowie Verfahren zur Herstellung einer nasschemisch behandelten Ware
DE102007026633B4 (de) * 2007-06-06 2009-04-02 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von plattenförmiger Ware
JP4942580B2 (ja) * 2007-08-20 2012-05-30 株式会社荏原製作所 アノードホルダ用通電ベルトおよびアノードホルダ
US8177944B2 (en) 2007-12-04 2012-05-15 Ebara Corporation Plating apparatus and plating method
US8784636B2 (en) * 2007-12-04 2014-07-22 Ebara Corporation Plating apparatus and plating method
JP4547016B2 (ja) 2008-04-04 2010-09-22 東京エレクトロン株式会社 半導体製造装置、半導体製造方法
JP5155755B2 (ja) * 2008-07-10 2013-03-06 株式会社荏原製作所 磁性体膜めっき装置及びめっき処理設備
EP2435373B1 (de) * 2009-05-29 2015-03-18 Holger Blum Verfahren und vorrichtung zur behandlung von ballastwasser mit acrolein
WO2011103214A1 (en) * 2010-02-16 2011-08-25 Cypress Semiconductor Corporation Integrated shielding for wafer plating
US20110284385A1 (en) * 2010-05-21 2011-11-24 Pioneer Metal Finishing Method and Apparatus For Anodizing Objects
KR101693217B1 (ko) * 2010-07-20 2017-01-05 주식회사 케이엠더블유 전기도금 장치
US9222194B2 (en) * 2010-08-19 2015-12-29 International Business Machines Corporation Rinsing and drying for electrochemical processing
KR101153537B1 (ko) * 2010-09-10 2012-06-11 삼성전기주식회사 인쇄회로기판 도금 장치
JP6092653B2 (ja) * 2012-02-27 2017-03-08 株式会社荏原製作所 基板洗浄装置及び洗浄方法
JP5788349B2 (ja) * 2012-03-19 2015-09-30 東京エレクトロン株式会社 めっき処理装置、めっき処理方法および記憶媒体
CN102660764B (zh) * 2012-05-25 2014-07-16 深圳顺络电子股份有限公司 一种镀篮内阴极
US8920616B2 (en) * 2012-06-18 2014-12-30 Headway Technologies, Inc. Paddle for electroplating for selectively depositing greater thickness
JP5699253B2 (ja) * 2012-07-02 2015-04-08 新日鐵住金株式会社 電気めっき装置
ES2772808T3 (es) * 2014-03-11 2020-07-08 Qualital Servizi S R L Instalación y procedimiento para el tratamiento de anodización de productos fabricados de aluminio o aleaciones del mismo
US10030313B2 (en) 2014-05-12 2018-07-24 Yamamoto-MS., Co. LTD. Plating apparatus and container bath
JP6411943B2 (ja) * 2014-05-26 2018-10-24 株式会社荏原製作所 基板電解処理装置、および該基板電解処理装置に使用されるパドル
GB2564894B (en) * 2017-07-27 2021-11-24 Semsysco Gmbh System for chemical and/or electrolytic surface treatment
JP6995544B2 (ja) * 2017-09-20 2022-01-14 上村工業株式会社 表面処理装置および表面処理方法
JP6966958B2 (ja) * 2018-03-01 2021-11-17 株式会社荏原製作所 めっき液を撹拌するために用いるパドルおよびパドルを備えるめっき装置
JP6790016B2 (ja) * 2018-04-10 2020-11-25 上村工業株式会社 表面処理装置、表面処理方法及びパドル
JP6895927B2 (ja) * 2018-05-28 2021-06-30 三菱電機株式会社 半導体装置の製造装置および半導体装置の製造方法
KR102159043B1 (ko) * 2018-07-05 2020-09-23 주식회사 테토스 웨이퍼 도금 시스템
CN112513341A (zh) * 2018-07-30 2021-03-16 雷纳技术有限责任公司 流发生器、淀积装置和用于淀积材料的方法
US11136688B1 (en) * 2018-08-08 2021-10-05 University Of Louisville Research Foundation, Inc. Use of electropolishing for uniform surface treatment of metal components with complex external geometries
CN110888305A (zh) * 2018-09-07 2020-03-17 王彦智 高阶负型光阻剥膜槽
JP7034880B2 (ja) * 2018-10-05 2022-03-14 株式会社荏原製作所 洗浄装置、これを備えためっき装置、及び洗浄方法
US10865496B2 (en) * 2018-10-30 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Plating apparatus and plating method
US12270119B2 (en) 2019-03-22 2025-04-08 Pyxis Cf Pte. Ltd. Plating apparatus and operation method thereof
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6071388A (en) * 1998-05-29 2000-06-06 International Business Machines Corporation Electroplating workpiece fixture having liquid gap spacer
CN2405647Y (zh) * 2000-01-21 2000-11-15 华东师范大学 液体搅拌装置
EP1167583A2 (en) * 2000-06-30 2002-01-02 Ebara Corporation Copper-plating liquid, plating method and plating apparatus
CN2471797Y (zh) * 2001-01-15 2002-01-16 太原风华高新技术有限公司 电镀用循环过滤搅拌装置

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53119227A (en) * 1977-03-28 1978-10-18 Sankuesuto Kk Plating method
JPS592116Y2 (ja) * 1979-09-05 1984-01-20 松下電器産業株式会社 メッキ装置
JPS59208092A (ja) * 1983-05-11 1984-11-26 Hitachi Ltd 貴金属メツキ法
JPS61270889A (ja) * 1985-05-25 1986-12-01 三菱電機株式会社 めつき装置
JPH05331679A (ja) * 1992-06-01 1993-12-14 Sumitomo Metal Ind Ltd めっき装置
JPH0754189A (ja) * 1993-08-12 1995-02-28 Matsushita Electric Ind Co Ltd 電気メッキ装置
US5421987A (en) * 1993-08-30 1995-06-06 Tzanavaras; George Precision high rate electroplating cell and method
JPH07210823A (ja) 1994-01-10 1995-08-11 Fuji Elelctrochem Co Ltd 薄膜磁気ヘッドの磁極形成方法
US5683564A (en) * 1996-10-15 1997-11-04 Reynolds Tech Fabricators Inc. Plating cell and plating method with fluid wiper
JPH10317199A (ja) * 1997-05-20 1998-12-02 Hitachi Metals Ltd めっき方法およびめっき装置
JPH11181590A (ja) * 1997-12-17 1999-07-06 Hitachi Ltd 電解めっき方法および装置
US6395152B1 (en) * 1998-07-09 2002-05-28 Acm Research, Inc. Methods and apparatus for electropolishing metal interconnections on semiconductor devices
EP1174912A4 (en) 1999-12-24 2009-11-25 Ebara Corp SEMICONDUCTOR DISC GENERATING APPARATUS AND MANUFACTURING METHOD
US6547937B1 (en) * 2000-01-03 2003-04-15 Semitool, Inc. Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece
US20020027080A1 (en) * 2000-03-17 2002-03-07 Junichiro Yoshioka Plating apparatus and method
JP2002115096A (ja) * 2000-10-10 2002-04-19 Applied Materials Inc めっき装置
JP3501747B2 (ja) * 2000-10-26 2004-03-02 秀行 小林 メッキ装置の流量調整可能なメッキ液噴出ノズルシステム
JP3340724B2 (ja) * 2000-12-01 2002-11-05 丸仲工業株式会社 メッキ装置のメッキ液噴出ノズル装置
US20030155185A1 (en) * 2001-03-08 2003-08-21 Masami Nomura Elevator
JP2002367998A (ja) * 2001-06-11 2002-12-20 Ebara Corp 半導体装置及びその製造方法
US6875333B2 (en) * 2002-02-14 2005-04-05 Electroplating Engineers Of Japan Limited Plating apparatus for wafer
US7390382B2 (en) * 2003-07-01 2008-06-24 Semitool, Inc. Reactors having multiple electrodes and/or enclosed reciprocating paddles, and associated methods

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6071388A (en) * 1998-05-29 2000-06-06 International Business Machines Corporation Electroplating workpiece fixture having liquid gap spacer
CN2405647Y (zh) * 2000-01-21 2000-11-15 华东师范大学 液体搅拌装置
EP1167583A2 (en) * 2000-06-30 2002-01-02 Ebara Corporation Copper-plating liquid, plating method and plating apparatus
CN2471797Y (zh) * 2001-01-15 2002-01-16 太原风华高新技术有限公司 电镀用循环过滤搅拌装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开平7-210823A 1995.08.11

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI682076B (zh) 2017-10-20 2020-01-11 日商Ａｌｍｅｘ Ｐｅ股份有限公司 表面處理裝置

Also Published As

Publication number Publication date
WO2004081261B1 (en) 2005-07-14
TW200422429A (en) 2004-11-01
JP5175871B2 (ja) 2013-04-03
CN101812711A (zh) 2010-08-25
JP4805141B2 (ja) 2011-11-02
EP1602127A2 (en) 2005-12-07
WO2004081261A3 (en) 2005-05-26
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