GB2564894B - System for chemical and/or electrolytic surface treatment - Google Patents
System for chemical and/or electrolytic surface treatment Download PDFInfo
- Publication number
- GB2564894B GB2564894B GB1712067.6A GB201712067A GB2564894B GB 2564894 B GB2564894 B GB 2564894B GB 201712067 A GB201712067 A GB 201712067A GB 2564894 B GB2564894 B GB 2564894B
- Authority
- GB
- United Kingdom
- Prior art keywords
- chemical
- surface treatment
- electrolytic surface
- electrolytic
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/005—Apparatus specially adapted for electrolytic conversion coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Automation & Control Theory (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1712067.6A GB2564894B (en) | 2017-07-27 | 2017-07-27 | System for chemical and/or electrolytic surface treatment |
JP2018139054A JP7229690B2 (en) | 2017-07-27 | 2018-07-25 | System for chemical and/or electrolytic surface treatment |
TW109142185A TWI751817B (en) | 2017-07-27 | 2018-07-26 | System for chemical and/or electrolytic surface treatment |
TW108147586A TWI711726B (en) | 2017-07-27 | 2018-07-26 | System for chemical and/or electrolytic surface treatment |
TW107125886A TWI678437B (en) | 2017-07-27 | 2018-07-26 | System for chemical and/or electrolytic surface treatment |
CN201810847212.1A CN109306476A (en) | 2017-07-27 | 2018-07-27 | For chemistry and/or the system of electrolytic surface processing |
JP2023021450A JP7551801B2 (en) | 2017-07-27 | 2023-02-15 | System for chemical and/or electrolytic surface treatment - Patents.com |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1712067.6A GB2564894B (en) | 2017-07-27 | 2017-07-27 | System for chemical and/or electrolytic surface treatment |
Publications (3)
Publication Number | Publication Date |
---|---|
GB201712067D0 GB201712067D0 (en) | 2017-09-13 |
GB2564894A GB2564894A (en) | 2019-01-30 |
GB2564894B true GB2564894B (en) | 2021-11-24 |
Family
ID=59778981
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1712067.6A Active GB2564894B (en) | 2017-07-27 | 2017-07-27 | System for chemical and/or electrolytic surface treatment |
Country Status (4)
Country | Link |
---|---|
JP (2) | JP7229690B2 (en) |
CN (1) | CN109306476A (en) |
GB (1) | GB2564894B (en) |
TW (3) | TWI751817B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3828316B1 (en) * | 2019-11-26 | 2023-09-13 | Semsysco GmbH | Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate |
EP4286560A1 (en) * | 2022-05-31 | 2023-12-06 | Semsysco GmbH | Module kit for a chemical and/or electrolytic surface treatment of a substrate |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6299753B1 (en) * | 1999-09-01 | 2001-10-09 | Applied Materials, Inc. | Double pressure vessel chemical dispenser unit |
JP2002115096A (en) * | 2000-10-10 | 2002-04-19 | Applied Materials Inc | Plating apparatus |
US7875158B2 (en) * | 2003-03-11 | 2011-01-25 | Ebara Corporation | Plating apparatus |
JP4553632B2 (en) * | 2004-05-21 | 2010-09-29 | 株式会社荏原製作所 | Substrate plating method and substrate plating apparatus |
US20060191784A1 (en) * | 2005-02-28 | 2006-08-31 | Hitachi Global Storage Technologies | Methods and systems for electroplating wafers |
TWI624567B (en) * | 2012-12-11 | 2018-05-21 | 諾發系統有限公司 | Electrofill vacuum plating cell |
CN205171008U (en) * | 2015-09-30 | 2016-04-20 | 东莞市威力固电路板设备有限公司 | Plating bath liquid level control system |
-
2017
- 2017-07-27 GB GB1712067.6A patent/GB2564894B/en active Active
-
2018
- 2018-07-25 JP JP2018139054A patent/JP7229690B2/en active Active
- 2018-07-26 TW TW109142185A patent/TWI751817B/en active
- 2018-07-26 TW TW108147586A patent/TWI711726B/en active
- 2018-07-26 TW TW107125886A patent/TWI678437B/en active
- 2018-07-27 CN CN201810847212.1A patent/CN109306476A/en active Pending
-
2023
- 2023-02-15 JP JP2023021450A patent/JP7551801B2/en active Active
Non-Patent Citations (1)
Title |
---|
None * |
Also Published As
Publication number | Publication date |
---|---|
CN109306476A (en) | 2019-02-05 |
TW202120749A (en) | 2021-06-01 |
TWI678437B (en) | 2019-12-01 |
GB2564894A (en) | 2019-01-30 |
JP2023062067A (en) | 2023-05-02 |
TW201910562A (en) | 2019-03-16 |
TW202014559A (en) | 2020-04-16 |
TWI751817B (en) | 2022-01-01 |
JP2019052370A (en) | 2019-04-04 |
JP7229690B2 (en) | 2023-02-28 |
TWI711726B (en) | 2020-12-01 |
GB201712067D0 (en) | 2017-09-13 |
JP7551801B2 (en) | 2024-09-17 |
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