TWI800356B - Distribution system for chemical and/or electrolytic surface treatment - Google Patents

Distribution system for chemical and/or electrolytic surface treatment Download PDF

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Publication number
TWI800356B
TWI800356B TW111115385A TW111115385A TWI800356B TW I800356 B TWI800356 B TW I800356B TW 111115385 A TW111115385 A TW 111115385A TW 111115385 A TW111115385 A TW 111115385A TW I800356 B TWI800356 B TW I800356B
Authority
TW
Taiwan
Prior art keywords
chemical
surface treatment
distribution system
electrolytic surface
electrolytic
Prior art date
Application number
TW111115385A
Other languages
Chinese (zh)
Other versions
TW202230507A (en
Inventor
赫伯特 奧茲林格
Original Assignee
奧地利商勝思科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 奧地利商勝思科技有限公司 filed Critical 奧地利商勝思科技有限公司
Publication of TW202230507A publication Critical patent/TW202230507A/en
Application granted granted Critical
Publication of TWI800356B publication Critical patent/TWI800356B/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/005—Apparatus specially adapted for electrolytic conversion coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
TW111115385A 2017-07-27 2018-07-26 Distribution system for chemical and/or electrolytic surface treatment TWI800356B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB1712064.3 2017-07-27
GB1712064.3A GB2564893B (en) 2017-07-27 2017-07-27 Distribution system for chemical and/or electrolytic surface treatment

Publications (2)

Publication Number Publication Date
TW202230507A TW202230507A (en) 2022-08-01
TWI800356B true TWI800356B (en) 2023-04-21

Family

ID=59778879

Family Applications (2)

Application Number Title Priority Date Filing Date
TW111115385A TWI800356B (en) 2017-07-27 2018-07-26 Distribution system for chemical and/or electrolytic surface treatment
TW107125883A TWI759514B (en) 2017-07-27 2018-07-26 Distribution system for chemical and/or electrolytic surface treatment

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW107125883A TWI759514B (en) 2017-07-27 2018-07-26 Distribution system for chemical and/or electrolytic surface treatment

Country Status (4)

Country Link
JP (2) JP6539390B2 (en)
CN (1) CN109306474A (en)
GB (1) GB2564893B (en)
TW (2) TWI800356B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3825445A1 (en) * 2019-11-22 2021-05-26 Semsysco GmbH Distribution body for a process fluid for chemical and/or electrolytic surface treatment of a substrate
EP3828316B1 (en) * 2019-11-26 2023-09-13 Semsysco GmbH Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate
EP4286560A1 (en) * 2022-05-31 2023-12-06 Semsysco GmbH Module kit for a chemical and/or electrolytic surface treatment of a substrate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005097732A (en) * 2003-08-21 2005-04-14 Ebara Corp Plating apparatus

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208092A (en) * 1983-05-11 1984-11-26 Hitachi Ltd Plating method of noble metal
JPS6393897A (en) * 1986-10-03 1988-04-25 C Uyemura & Co Ltd Plating liquid injection type plating device
US5833816A (en) * 1994-05-11 1998-11-10 Siemens S.A. Apparatus for treating printed circuit boards
JP4560181B2 (en) * 2000-06-30 2010-10-13 アイシン高丘株式会社 Method and apparatus for manufacturing fuel cell separator
WO2002079548A1 (en) 2001-03-28 2002-10-10 Fujitsu Limited Electrolytic plating tank
JP4434948B2 (en) * 2002-07-18 2010-03-17 株式会社荏原製作所 Plating apparatus and plating method
DE10255884B4 (en) * 2002-11-29 2006-05-11 Atotech Deutschland Gmbh nozzle assembly
CN101369533B (en) * 2003-03-11 2010-06-02 株式会社荏原制作所 Plating apparatus
JP2006111976A (en) * 2006-01-19 2006-04-27 Ebara Udylite Kk Acid copper plating method and acid copper plating device
KR100906662B1 (en) * 2007-09-14 2009-07-07 강원대학교산학협력단 System for thrust magnetic bearing
US8366884B2 (en) * 2008-04-30 2013-02-05 Alcatel Lucent Plating apparatus with direct electrolyte distribution system
US8043434B2 (en) * 2008-10-23 2011-10-25 Lam Research Corporation Method and apparatus for removing photoresist
EP2746433B1 (en) * 2012-12-20 2016-07-20 ATOTECH Deutschland GmbH Device for vertical galvanic metal, preferably copper, deposition on a substrate and a container suitable for receiving such a device
CH710741A2 (en) 2015-01-30 2016-08-15 Acrom S A Ecological procedure for continuous chrome plating of bars and relative equipment.
CN104862767B (en) * 2015-05-29 2017-05-10 东莞市开美电路板设备有限公司 Copper plating tank

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005097732A (en) * 2003-08-21 2005-04-14 Ebara Corp Plating apparatus

Also Published As

Publication number Publication date
JP2019049046A (en) 2019-03-28
TW202230507A (en) 2022-08-01
JP7161445B2 (en) 2022-10-26
JP2019167628A (en) 2019-10-03
GB201712064D0 (en) 2017-09-13
CN109306474A (en) 2019-02-05
GB2564893B (en) 2020-12-16
TW201911408A (en) 2019-03-16
TWI759514B (en) 2022-04-01
GB2564893A (en) 2019-01-30
JP6539390B2 (en) 2019-07-03

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