JPS6393897A - Plating liquid injection type plating device - Google Patents

Plating liquid injection type plating device

Info

Publication number
JPS6393897A
JPS6393897A JP23682586A JP23682586A JPS6393897A JP S6393897 A JPS6393897 A JP S6393897A JP 23682586 A JP23682586 A JP 23682586A JP 23682586 A JP23682586 A JP 23682586A JP S6393897 A JPS6393897 A JP S6393897A
Authority
JP
Japan
Prior art keywords
plating
plating solution
plating liquid
cell
tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23682586A
Other languages
Japanese (ja)
Other versions
JPH0459400B2 (en
Inventor
Atsuhiko Sato
敦彦 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Original Assignee
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uemera Kogyo Co Ltd, C Uyemura and Co Ltd filed Critical Uemera Kogyo Co Ltd
Priority to JP23682586A priority Critical patent/JPS6393897A/en
Publication of JPS6393897A publication Critical patent/JPS6393897A/en
Publication of JPH0459400B2 publication Critical patent/JPH0459400B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE:To prevent bubbling in a plating cell at the start of an operation, by forming an overflow tank which recovers a plating liquid to the outside of a plating cell provided internally with nozzles for injecting the plating liquid to block-shaped works. CONSTITUTION:The plural block-shaped works Q held by jigs 21 connected to a negative electrode are disposed in the plating cell 1 in which the plating liquid is stored. The plating liquid is ejected from the plural plating liquid ejection nozzles 11 to the above-mentioned works Q. Anodes 22 are further disposed to face the works Q and the plating is executed. The overflow tank 5 is provided on the outside of the above-mentioned plating cell 1 to recover the plating liquid overflowing from the cell 1. The recovered plating liquid is injected from the nozzles 11 through pipes 8, 10 by a plating liquid return mechanism having a pump 7. The cell 1 acts as a storage tank for storing the plating liquid while the pump 7 is held stopped. The bubbling in the cell 11 is thus prevented at the time of starting the injection operation and the working efficiency is improved.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は複数のブロック状ワーク(8!Eね塊状の被処
理物)を1個のワーク群として処理するためのめっき処
理装置に関し、特に複数のめっき液噴射ノズルからめっ
き液をワークに吹き付けながら電気めっき処理を行うよ
うにしためっき液噴射式めっき処理装置に関する。
Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a plating processing apparatus for processing a plurality of block-shaped workpieces (8!E block-shaped workpieces) as one workpiece group, and particularly The present invention relates to a plating solution injection type plating processing apparatus that performs electroplating while spraying plating solution onto a workpiece from a plurality of plating solution spray nozzles.

(従来の技術) この種の処理装置の一例は、本件出願人による特願昭5
8−31478 (特開昭59−157300号)に記
載されている。その装置ではめっき処理槽内に吊り下げ
た1枚の板状ワークの両側に複数のめっき液噴射ノズル
を配置し、それらの噴射ノズルからめっき液をワークに
向けて噴射しながらめっきを行うようになっている。
(Prior art) An example of this type of processing device is
No. 8-31478 (Japanese Unexamined Patent Publication No. 157300/1983). In this equipment, multiple plating solution injection nozzles are arranged on both sides of a single plate-shaped workpiece suspended in a plating treatment tank, and plating is performed while spraying the plating solution from these injection nozzles toward the workpiece. It has become.

又従来の噴射式処理装置では、いずれも、めっき液はめ
っき処理槽の下側に設けた別の槽(貯槽)からポンプに
よりノズルに供給され、めっき処理槽内へ噴射されため
っき液は上記貯槽へ流下するようになっている。なおめ
っき処理槽とは別に貯槽を設けた構造の一例は、本件出
願人による特願昭58−40190号(特開昭59−1
66697号)に記載されている。
In addition, in all conventional injection processing equipment, the plating solution is supplied to the nozzle by a pump from another tank (storage tank) provided below the plating processing tank, and the plating solution injected into the plating processing tank is as described above. It is designed to flow down to the storage tank. An example of a structure in which a storage tank is provided separately from the plating treatment tank is disclosed in Japanese Patent Application No. 58-40190 (Japanese Unexamined Patent Publication No. 59-198) filed by the present applicant.
No. 66697).

そして本件出願人は、従来、板状ワークのめっき処理だ
けに使用されていためっき液噴射式処理装置をブロック
状ワーク(例えば車両用ディスクブレーキのキャリパ等
の部品)のめっき処理に利用しようとした。
The applicant attempted to use the plating liquid injection processing equipment, which had conventionally been used only for plating plate-shaped workpieces, for plating block-shaped workpieces (for example, parts such as calipers of vehicle disc brakes). .

(発明が解決しようとする問題点) ところが従来の装置を車両用ディスクブレーキ部品の処
理にそのままで流用すると、次のような問題が生じるこ
とが判明した。
(Problems to be Solved by the Invention) However, it has been found that if the conventional apparatus is used as is for processing disc brake parts for vehicles, the following problems occur.

すなわち上記部品を処理する場合、処理時間の短縮や処
理品質の向上を図るために、発泡性の高いめっき液を使
用する必要がある。
That is, when processing the above-mentioned parts, it is necessary to use a plating solution with high foaming properties in order to shorten processing time and improve processing quality.

ところが従来構造では、作業が終了して装置を停止させ
ると、めっき処理槽内のめっき液は下方の貯槽へ流下す
るので、作業開始前にはめっき処理槽は空である。その
ために作業に先立って貯槽内のめっき液をポンプにより
ノズルからめっき処理槽へ供給する必要があるが、空の
処理槽へノズルから発泡性の高いめっき液を噴出させる
と、処理槽全体が泡立ち、その泡を消すまでめっき作業
を開始できないという問題が生じる。
However, in the conventional structure, when the work is completed and the apparatus is stopped, the plating solution in the plating tank flows down to the storage tank below, so the plating tank is empty before the work starts. For this purpose, it is necessary to supply the plating solution in the storage tank from the nozzle to the plating processing tank using a pump prior to the work, but when the highly foaming plating solution is jetted from the nozzle into the empty processing tank, the entire processing tank becomes foamy. However, a problem arises in that plating cannot be started until the bubbles disappear.

(問題点を解決するための手段) 上記問題を解決するために、本発明は、めっき液を溜め
るめっき処理槽の内部に、複数のブロック状ワークに対
してめっき液を噴射する複数のめっき液噴射ノズルを設
け、上記処理槽の外側に、処理槽から溢れためっき液を
回収するためのオーバーフロー槽を形成し、ポンプを有
するめっき液戻し機構によりオーバーフロー槽とめっき
液噴射ノズルとを連結し、めっき処理槽により、ポンプ
停止時にめっき液を溜めるための貯槽を形成したことを
特徴としている。
(Means for Solving the Problems) In order to solve the above problems, the present invention provides a method for spraying a plurality of plating solutions onto a plurality of block-shaped workpieces into a plating treatment tank that stores plating solutions. An injection nozzle is provided, an overflow tank is formed outside the processing tank for collecting the plating solution overflowing from the processing tank, and the overflow tank and the plating solution injection nozzle are connected by a plating solution return mechanism having a pump, The plating treatment tank is characterized by forming a storage tank for storing the plating solution when the pump is stopped.

(作用) 上記構造によると、めっき処理槽が貯槽を兼ねているの
で、作業が終了してポンプを停止させても、めっき液は
処理槽に溜ったままであり、処理槽が空になることはな
い。従って次の作業開始時にノズルからめっき液を噴射
しても、めっき液はめっき液内へ噴射され、処理槽内が
泡立つことはない。
(Function) According to the above structure, the plating tank also serves as a storage tank, so even when the work is finished and the pump is stopped, the plating solution remains in the processing tank, and the processing tank never becomes empty. do not have. Therefore, even if the plating solution is injected from the nozzle at the start of the next operation, the plating solution will be injected into the plating solution, and the inside of the processing tank will not bubble.

(実施例) 第1図は実施例の装置の垂直断面略図、第2図は第1図
の■−■断面略図である。これらの図において、めっき
処理槽1は底壁2と周壁3とを有しており、基礎4上に
設置されている。周壁3の上部の外側にはめっき液回収
用の容器又は回収溝5(オーバーフロー槽)が形成され
ている。回収溝5の底部には戻し配管6の入口が接続し
ている。
(Example) FIG. 1 is a schematic vertical cross-sectional view of an apparatus according to an example, and FIG. 2 is a schematic cross-sectional view taken along the line ■-■ in FIG. In these figures, a plating tank 1 has a bottom wall 2 and a peripheral wall 3, and is installed on a foundation 4. A plating solution recovery container or recovery groove 5 (overflow tank) is formed on the outside of the upper part of the peripheral wall 3. An inlet of a return pipe 6 is connected to the bottom of the recovery groove 5 .

配管6は途中にポンプ7を備え、出口がめつき処理槽1
内部の1対のバイブ8に接続している。
The pipe 6 is equipped with a pump 7 in the middle, and the outlet is connected to the plating treatment tank 1.
It is connected to a pair of internal vibrators 8.

バイブ8はめっき処理槽1の底部を左右方向(第1図で
左右方向)に間隔を隔てて水平に延びている。第2図の
如く、各バイブ8の前後方向(第2図で左右方向)に間
隔を隔てた複数箇所からは、ライザーバイブ10が上方
へ延びている。
The vibrator 8 extends horizontally at the bottom of the plating tank 1 at intervals in the left-right direction (left-right direction in FIG. 1). As shown in FIG. 2, riser vibes 10 extend upward from a plurality of locations spaced apart in the front-rear direction (left-right direction in FIG. 2) of each vibe 8.

第1図の如く、各バイブ10の上下に間隔を隔てた複数
箇所には、めっき液噴射ノズル11が後述するワーク設
置領域12に向けて設けである。個々のノズル11はそ
の噴射角度を前後左右いずれの方向にも調整できるよう
に構成されており、具体的には、例えば第3図のように
構成されている。
As shown in FIG. 1, plating solution spray nozzles 11 are provided at a plurality of vertically spaced locations on each vibrator 10 toward a workpiece installation area 12, which will be described later. Each nozzle 11 is configured so that its spray angle can be adjusted in any direction, front, back, left, or right, and specifically, it is configured as shown in FIG. 3, for example.

第2図の■−■断面拡大部分図である第3図において、
ノズル11は筒状のボルト状部材15と、ナツト状部材
16、ノズル部材17とを備えている。ボルト状部材1
5は基端の雄ねじ部がバイブ10の管壁のねじ孔に固定
されている。ナツト状部材16はボルト状部材15の先
端のねじ部に固定されている。ノズル部材17は基端部
外周に形成した球面がボルト状部材15の先端部とナツ
ト状部材16の内周に形成した球面座に回動自在の状態
で固定されている。
In Fig. 3, which is an enlarged partial view of the ■-■ cross section of Fig. 2,
The nozzle 11 includes a cylindrical bolt-like member 15, a nut-like member 16, and a nozzle member 17. Bolt-shaped member 1
5 has a male threaded portion at the proximal end fixed to a threaded hole in the pipe wall of the vibrator 10. The nut-shaped member 16 is fixed to a threaded portion at the tip of the bolt-shaped member 15. A spherical surface formed on the outer circumference of the base end of the nozzle member 17 is rotatably fixed to a spherical seat formed on the distal end of the bolt-like member 15 and the inner circumference of the nut-like member 16.

第1図において、上記ワーク設置領域12は上下方向の
高さHと左右方向の幅Wと前後方向の長さしく第2図)
とを有しており、左右のバイブ10群の間に形成されて
いる。このワーク設置領域12には複数のワークQ(実
施例では車両用ディスクブレーク部品)が上下方向(又
は左右方向あるいは上下左右両方向)に隙間20を隔て
て配置される。ワークQは例えば枠状の治具21に保持
されており、負電極に接続している。
In Fig. 1, the workpiece installation area 12 has a vertical height H, a horizontal width W, and a longitudinal length (Fig. 2).
It is formed between the left and right vibrators 10 groups. In this workpiece installation area 12, a plurality of works Q (vehicle disc break parts in the embodiment) are arranged with gaps 20 in between in the vertical direction (or in the horizontal direction or in both the vertical and horizontal directions). The workpiece Q is held in a frame-shaped jig 21, for example, and is connected to a negative electrode.

前述の多数のノズル11の内、一部(複数)のノズル1
1は、その噴射方向が、第1図に破線Mで示す如く、ワ
ーク間の隙間20に向けて設定されている。又その他の
複数のノズル11は、その噴射方向が、実線Nで示す如
く、ワークQに向けて設定されている。更に隙間20に
向けられた左右のノズル11は、その方向が互いにずら
されており、両側からのめっき液流が互いに衝突しない
ようになっている。
Among the large number of nozzles 11 described above, some (plural) nozzles 1
1, the injection direction is set toward the gap 20 between the workpieces, as shown by the broken line M in FIG. Further, the other plurality of nozzles 11 have their jetting directions directed toward the workpiece Q, as shown by the solid line N. Further, the directions of the left and right nozzles 11 facing the gap 20 are shifted from each other so that the plating liquid flows from both sides do not collide with each other.

左右のパイプ10群に対してワーク設置領域12と反対
側の位置にはアノード22が配置されている。アノード
22はワーク設置領域12の真正面に配置されており、
より具体的は、アノード22の中央部がワーク設置領域
12の中央部に対して概ね左右方向に並ぶように配置さ
れている。左右両側のアノード22は、それぞれ、上下
高さ及び前後長さがワーク設置領域12の前記高さH及
び長さLよりも小さく、各アノード22の有効表面積は
ワークQの表面積よりもかなり小さく (例えば約半分
に)設定されている。
An anode 22 is arranged at a position opposite to the workpiece installation area 12 with respect to the left and right pipes 10 groups. The anode 22 is placed directly in front of the workpiece installation area 12,
More specifically, the center part of the anode 22 is arranged so as to be lined up in the left-right direction with respect to the center part of the workpiece installation area 12. The anodes 22 on both the left and right sides have vertical heights and longitudinal lengths smaller than the height H and length L of the workpiece installation area 12, and the effective surface area of each anode 22 is considerably smaller than the surface area of the workpiece Q. For example, it is set to about half).

次に実施例の装置の作用を説明する。Next, the operation of the device of the embodiment will be explained.

めっき処理作業中はポンプ7が作動し、ポンプ7から吐
出されためっき液がバイブ8.10を通ってノズル11
から噴出する。この噴出しためっき液は、一部が矢印N
方向に流れてワークQに衝突し、ワークQの周囲のめっ
き液を攪拌する。その他のめっき液はワーク間の隙間2
0やワークQの周囲を通過し、パイプ10.10間の隙
間を通ってアノード22まで流れ、アノード22の周囲
のめっき液を攪拌する。このようにしてめっき処理槽1
内全体のめっき液が充分に攪拌されるので、金属濃度の
高いめっき液が常にワークQの表面へ供給される。従っ
て高精度のめっき層が短時間で形成される。
During the plating process, the pump 7 operates, and the plating solution discharged from the pump 7 passes through the vibrator 8.10 and enters the nozzle 11.
erupts from. A part of this spouted plating solution is indicated by the arrow N.
The plating solution flows in this direction and collides with the workpiece Q, stirring the plating solution around the workpiece Q. For other plating solutions, the gap between the workpieces is 2.
0 and the workpiece Q, flows through the gap between the pipes 10 and 10 to the anode 22, and agitates the plating solution around the anode 22. In this way, plating treatment tank 1
Since the entire plating solution is sufficiently stirred, the plating solution with high metal concentration is always supplied to the surface of the workpiece Q. Therefore, a highly accurate plating layer can be formed in a short time.

ワークQの仕様が変更され、ワークQの寸法形状や治具
21に装着されるワークQの数等が変わった場合、第3
図のノズル部材17の方向を変え、上記噴射状態を維持
する。又、ナツト状部材16を一時的に外すことにより
、ノズル部材17をノズル形状(孔形状)の異なる別の
ノズル部材に付は換えることもできる。
If the specifications of the workpiece Q are changed, such as the dimensions and shape of the workpiece Q or the number of workpieces Q attached to the jig 21, the third
The direction of the nozzle member 17 shown in the figure is changed to maintain the above jetting state. Further, by temporarily removing the nut-shaped member 16, the nozzle member 17 can be replaced with another nozzle member having a different nozzle shape (hole shape).

上記処理作業において、仮にワーク設置領域12よりも
広い範囲にアノードを設置すると、ワークQの縁部(例
えば第1図の縁部23)の電流密度が他の部分よりも高
くなり、そのために縁部のめっき厚さが大きくなる。こ
れに対し、図示の構造では、前述の如く、小形のアノー
ド22を使用しているので、縁部に電流が集中すること
を防止し、ワークQ全体のめっき厚さを均一化できる。
In the above processing operation, if the anode is installed in a wider area than the workpiece installation area 12, the current density at the edge of the workpiece Q (for example, the edge 23 in FIG. 1) will be higher than other parts, and therefore the edge The thickness of the plating increases. On the other hand, in the illustrated structure, as described above, since the small anode 22 is used, concentration of current at the edges can be prevented and the plating thickness of the entire workpiece Q can be made uniform.

上述の如くノズル11からめっき液が噴射されるのにと
もなって、めっき処理槽1の上端からはめっき液が溢れ
、回収溝5に流入する。このめっき液は回収溝5から配
管6へ流入し、ポンプ7により再びめっき処理槽1内へ
噴射される。
As the plating solution is sprayed from the nozzle 11 as described above, the plating solution overflows from the upper end of the plating tank 1 and flows into the recovery groove 5. This plating solution flows into the pipe 6 from the recovery groove 5 and is again injected into the plating tank 1 by the pump 7.

上記動作において、回収溝5へ流入するめっき液は、前
述の如く、矢印M方向の噴流により攪拌された金属濃度
の高いめっき液であり、そのめっき液が、大形の貯槽に
戻されることなく、配管6等の短い通路だけを介してノ
ズル11から噴出する。従ってノズル11から噴出する
めっき液の金属濃度も高く、この点においても、高精度
のめっき層が短時間で形成される。
In the above operation, the plating solution flowing into the recovery groove 5 is a plating solution with high metal concentration that has been stirred by the jet flow in the direction of arrow M, and the plating solution is not returned to the large storage tank. , is ejected from the nozzle 11 only through a short passage such as the piping 6. Therefore, the metal concentration of the plating solution ejected from the nozzle 11 is high, and in this respect as well, a highly accurate plating layer can be formed in a short time.

作業が終了してポンプ7を停止させると、ノズル11か
らの噴射は停止するが、めっき処理槽1からめっき液が
流出することはなく、めっき液はめっき処理槽1内に溜
ったままの状態となる。そのために次の作業開始時にポ
ンプ7を始動した場合、空気中にめっき液が噴射される
ことはなく、めっき液はノズル11からめっき液内へ噴
射される。従って、めっき液は発泡性が高いにもかかわ
らず、噴射開始時にめっき処理槽1内が泡立つことはな
い。
When the work is completed and the pump 7 is stopped, the injection from the nozzle 11 is stopped, but the plating solution does not flow out from the plating tank 1, and the plating solution remains in the plating tank 1. becomes. Therefore, when the pump 7 is started at the start of the next work, the plating solution is not injected into the air, but is injected from the nozzle 11 into the plating solution. Therefore, even though the plating solution has a high foaming property, the inside of the plating treatment tank 1 does not foam at the start of injection.

なお、図示されていないが、めっき処理システムでは、
めっき処理槽1やその他の処理槽が前後あるいは左右方
向に多数並べてあり、ワークQは治具21に装着された
状態で、搬送ロボットによりそれらの処理槽に順々に漬
けられるようになっている。
Although not shown, in the plating system,
A large number of plating tanks 1 and other processing tanks are lined up in the front and back or left and right directions, and the workpieces Q, mounted on a jig 21, are immersed in these processing tanks one after another by a transfer robot. .

(発明の効果) 以上説明したように本発明では、従来の噴流式処理装置
と異なり、装置停止時にもめっき液をめっき処理槽1に
溜めておくことができるので、作業開始時にノズル11
からのめっき液噴流によりめっき処理槽1内が泡立つこ
とを防止できる。
(Effects of the Invention) As explained above, in the present invention, unlike the conventional jet treatment apparatus, the plating solution can be stored in the plating treatment tank 1 even when the apparatus is stopped.
It is possible to prevent the inside of the plating treatment tank 1 from bubbling due to the plating solution jet from the plating solution.

【図面の簡単な説明】[Brief explanation of the drawing]

Claims (1)

【特許請求の範囲】[Claims] めっき液を溜めるめっき処理槽の内部に、複数のブロッ
ク状ワークに対してめっき液を噴射する複数のめっき液
噴射ノズルを設け、上記処理槽の外側に、処理槽から溢
れためっき液を回収するためのオーバーフロー槽を形成
し、ポンプを有するめっき液戻し機構によりオーバーフ
ロー槽とめっき液噴射ノズルとを連結し、めっき処理槽
により、ポンプ停止時にめっき液を溜めるための貯槽を
形成したことを特徴とするめっき液噴射式めっき処理装
置。
A plurality of plating solution injection nozzles that spray plating solution onto a plurality of block-shaped workpieces are provided inside a plating processing tank that stores plating solution, and the plating solution overflowing from the processing tank is collected outside the processing tank. The overflow tank is connected to the plating solution injection nozzle by a plating solution return mechanism having a pump, and the plating processing tank forms a storage tank for storing the plating solution when the pump is stopped. Plating liquid injection type plating processing equipment.
JP23682586A 1986-10-03 1986-10-03 Plating liquid injection type plating device Granted JPS6393897A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23682586A JPS6393897A (en) 1986-10-03 1986-10-03 Plating liquid injection type plating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23682586A JPS6393897A (en) 1986-10-03 1986-10-03 Plating liquid injection type plating device

Publications (2)

Publication Number Publication Date
JPS6393897A true JPS6393897A (en) 1988-04-25
JPH0459400B2 JPH0459400B2 (en) 1992-09-22

Family

ID=17006339

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23682586A Granted JPS6393897A (en) 1986-10-03 1986-10-03 Plating liquid injection type plating device

Country Status (1)

Country Link
JP (1) JPS6393897A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019049046A (en) * 2017-07-27 2019-03-28 セムシスコ ゲーエムベーハーSemsysco GmbH Distribution system for chemical and/or electrolytic surface treatment
JP2019056174A (en) * 2017-07-27 2019-04-11 セムシスコ ゲーエムベーハーSemsysco GmbH Distribution system for at least either of chemical and electrolytic surface treatment

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52111844A (en) * 1976-03-17 1977-09-19 Toyo Giken Kougiyou Kk Method of circulating liquid in surface treating means
JPS6026693A (en) * 1983-07-25 1985-02-09 C Uyemura & Co Ltd High speed electrolyzing device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52111844A (en) * 1976-03-17 1977-09-19 Toyo Giken Kougiyou Kk Method of circulating liquid in surface treating means
JPS6026693A (en) * 1983-07-25 1985-02-09 C Uyemura & Co Ltd High speed electrolyzing device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019049046A (en) * 2017-07-27 2019-03-28 セムシスコ ゲーエムベーハーSemsysco GmbH Distribution system for chemical and/or electrolytic surface treatment
JP2019056174A (en) * 2017-07-27 2019-04-11 セムシスコ ゲーエムベーハーSemsysco GmbH Distribution system for at least either of chemical and electrolytic surface treatment
US11105014B2 (en) 2017-07-27 2021-08-31 Semsysco Gmbh Distribution system for chemical and/or electrolytic surface treatment

Also Published As

Publication number Publication date
JPH0459400B2 (en) 1992-09-22

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