KR101003404B1 - 제조 시스템 및 발광장치의 제조방법 - Google Patents
제조 시스템 및 발광장치의 제조방법 Download PDFInfo
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- KR101003404B1 KR101003404B1 KR1020090067282A KR20090067282A KR101003404B1 KR 101003404 B1 KR101003404 B1 KR 101003404B1 KR 1020090067282 A KR1020090067282 A KR 1020090067282A KR 20090067282 A KR20090067282 A KR 20090067282A KR 101003404 B1 KR101003404 B1 KR 101003404B1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
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- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
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- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (18)
- 기판에 대향하여 배치된 제1 및 제2 증착원으로부터 제1 및 제2 증착재료를 증착시켜 상기 기판 위에 막형성을 하는 막형성장치를 갖는 제조 시스템으로서,상기 기판이 배치되는 막형성실을 구비하고, 상기 막형성실은,상기 제1 및 제2 증착원과,상기 제1 및 제2 증착원을 이동시키는 수단을 구비하고,상기 증착원은 지그재그로 이동하고,상기 제1 증착재료는 제1 유기 화합물을 포함하고, 상기 제2 증착재료는 제2 유기 화합물을 포함하며,상기 제1 및 제2 유기 화합물이 서로 혼합되도록, 상기 제1 및 제2 유기 화합물의 증착 방향은 상기 기판의 위치에서 교차하도록 경사지게 설정된 것을 특징으로 하는 제조 시스템.
- 막형성장치를 갖는 제조 시스템으로서,로드실과,상기 로드실에 연결된 반송실과,상기 반송실에 연결된 막형성실을 구비하고,상기 막형성실은,제1 및 제2 증착원과,상기 제1 및 제2 증착원을 이동시키는 수단을 구비하고,상기 제1 및 제2 증착원은 지그재그로 이동하고,상기 제1 증착원의 제1 증착재료는 제1 유기 화합물을 포함하고, 상기 제2 증착원의 제2 증착재료는 제2 유기 화합물을 포함하며,상기 제1 및 제2 유기 화합물이 서로 혼합되도록, 상기 제1 및 제2 유기 화합물의 증착 방향은 기판의 위치에서 교차하도록 경사지게 설정된 것을 특징으로 하는 제조 시스템.
- 제 1 항 또는 제 2 항에 있어서,상기 제1 및 제2 증착원 중 하나와 상기 기판과의 사이의 간격이 30cm 이하인 것을 특징으로 하는 제조 시스템.
- 제 1 항 또는 제 2 항에 있어서,상기 막형성실은 상기 막형성실을 진공으로 하는 진공 펌프에 연결되어 있는 것을 특징으로 하는 제조 시스템.
- 제 1 항 또는 제 2 항에 있어서,상기 제1 및 제2 증착원은 X방향 및 Y방향 중 적어도 하나의 방향으로 이동하는 것을 특징으로 하는 제조 시스템.
- 삭제
- 제 1 항 또는 제 2 항에 있어서,상기 증착원을 이동시키는 수단은, 증착원 홀더인 것을 특징으로 하는 제조 시스템.
- 기판에 대해 제1 및 제2 증착원을 지그재그로 이동시키면서, 상기 제1 증착원으로부터 제1 유기 화합물로 이루어진 제1 증착재료 및 상기 제2 증착원으로부터 제2 유기 화합물로 이루어진 제2 증착재료를 증착해서, 막형성실 내의 상기 기판 위에 상기 제1 및 제2 유기 화합물로 이루어진 층을 적층하는 단계를 포함하며,상기 제1 및 제2 유기 화합물이 서로 혼합되도록, 상기 제1 및 제2 유기 화합물의 증착 방향은 상기 기판의 위치에서 교차하도록 경사지게 설정된 것을 특징으로 하는 발광장치의 제조방법.
- 기판에 대해 제1 및 제2 증착원을 X방향 및 Y방향으로 경사지게 또는 이차원 평면의 아크 형상으로 이동시키면서, 제1 증착원으로부터 제1 유기 화합물로 이루어진 제1 증착재료 및 제2 증착원으로부터 제2 유기 화합물로 이루어진 제2 증착재료를 증착해서, 막형성실 내의 상기 기판 위에 상기 제1 및 제2 유기 화합물로 이루어진 층을 적층하는 단계를 포함하며,상기 제1 및 제2 유기 화합물이 서로 혼합되도록, 상기 제1 및 제2 유기 화합물의 증착 방향은 상기 기판의 위치에서 교차하도록 경사지게 설정된 것을 포함한 것을 특징으로 하는 발광장치의 제조방법.
- 삭제
- 제 8 항 또는 제 9항에 있어서,상기 제1 및 제2 증착원은 일정한 가속도로 이동하는 것을 특징으로 하는 발광장치의 제조방법.
- 제 8 항 또는 제 9 항에 있어서,상기 제1 및 제2 증착원은 상기 기판의 에지 부분 근처에서 감속하거나 가속하여 이동하는 것을 특징으로 하는 발광장치의 제조방법.
- 제 7 항에 있어서,상기 제1 및 제2 증착원은 상기 증착원 홀더의 길이방향에 수직인 방향으로 직선 이동하는 것을 특징으로 하는 제조 시스템.
- 제 7 항에 있어서,상기 기판은 영구자석과 금속으로 이루어진 마스크와의 사이에 고정되어 있는 것을 특징으로 하는 제조 시스템.
- 제 7 항에 있어서,상기 증착원 홀더의 길이방향의 길이가 상기 기판의 표면측의 길이보다 긴 것을 특징으로 하는 제조 시스템.
- 제 8 항 또는 제 9 항에 있어서,상기 제1 및 제2 증착재료를 증착하기 이전에, 재료 메이커에서 상기 제1 및 제2 증착재료 중 하나를 정제하는 단계;제1 용기에, 상기 제1 및 제2 증착재료 중 하나를 저장하는 단계;상기 재료 메이커에서 제2 용기에, 상기 제1 및 제2 증착재료 중 하나를 저장하는 상기 제1 용기를 밀봉하는 단계;상기 제2 용기를 발광장치 메이커로 이송하는 단계;상기 발광장치 메이커에서 제조 시스템내로 상기 제2 용기를 도입시키고, 상기 제2 용기로부터 상기 제1 용기를 취출하는 단계; 및상기 제조 시스템 내의 상기 제1 및 제2 증착재료 중 하나를 증착시키기 위하여 상기 제1 용기를 가열하는 단계를 더 포함한 것을 특징으로 하는 발광장치의 제조방법.
- 제 1 항 또는 제 2 항에 있어서,상기 제1 및 제2 증착재료는 저항 가열에 의해 증착되는 것을 특징으로 하는 제조 시스템.
- 제 8 항 또는 제 9 항에 있어서,상기 제1 및 제2 증착재료는 저항 가열에 의해 증착되는 것을 특징으로 하는 발광장치의 제조방법.
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JP2002047508 | 2002-02-25 | ||
JPJP-P-2002-047508 | 2002-02-25 |
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KR10-2003-0010424A Division KR20030070534A (ko) | 2002-02-25 | 2003-02-19 | 제조 시스템 및 발광장치의 제조방법 |
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KR1020090067282A KR101003404B1 (ko) | 2002-02-25 | 2009-07-23 | 제조 시스템 및 발광장치의 제조방법 |
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US (2) | US20030162314A1 (ko) |
EP (2) | EP2444518B1 (ko) |
KR (2) | KR20030070534A (ko) |
CN (1) | CN100354452C (ko) |
SG (1) | SG113448A1 (ko) |
TW (1) | TWI284487B (ko) |
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-
2003
- 2003-02-14 SG SG200300603A patent/SG113448A1/en unknown
- 2003-02-19 KR KR10-2003-0010424A patent/KR20030070534A/ko active Search and Examination
- 2003-02-19 EP EP12150311.4A patent/EP2444518B1/en not_active Expired - Fee Related
- 2003-02-19 EP EP03003757A patent/EP1338673B1/en not_active Expired - Lifetime
- 2003-02-24 TW TW092103806A patent/TWI284487B/zh not_active IP Right Cessation
- 2003-02-24 US US10/370,577 patent/US20030162314A1/en not_active Abandoned
- 2003-02-25 CN CNB031063462A patent/CN100354452C/zh not_active Expired - Fee Related
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2008
- 2008-11-18 US US12/272,820 patent/US9551063B2/en not_active Expired - Fee Related
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2009
- 2009-07-23 KR KR1020090067282A patent/KR101003404B1/ko active IP Right Grant
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US9551063B2 (en) | 2017-01-24 |
CN100354452C (zh) | 2007-12-12 |
TW200303700A (en) | 2003-09-01 |
EP1338673A1 (en) | 2003-08-27 |
EP1338673B1 (en) | 2012-05-02 |
CN1441080A (zh) | 2003-09-10 |
KR20090093914A (ko) | 2009-09-02 |
US20090074952A1 (en) | 2009-03-19 |
EP2444518A1 (en) | 2012-04-25 |
EP2444518B1 (en) | 2018-05-02 |
US20030162314A1 (en) | 2003-08-28 |
SG113448A1 (en) | 2005-08-29 |
TWI284487B (en) | 2007-07-21 |
KR20030070534A (ko) | 2003-08-30 |
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