KR100993086B1 - 전자 부품의 수지 밀봉 성형 방법 - Google Patents

전자 부품의 수지 밀봉 성형 방법 Download PDF

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Publication number
KR100993086B1
KR100993086B1 KR1020087014966A KR20087014966A KR100993086B1 KR 100993086 B1 KR100993086 B1 KR 100993086B1 KR 1020087014966 A KR1020087014966 A KR 1020087014966A KR 20087014966 A KR20087014966 A KR 20087014966A KR 100993086 B1 KR100993086 B1 KR 100993086B1
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KR
South Korea
Prior art keywords
cavity
resin
mold
cavities
substrate
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KR1020087014966A
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English (en)
Korean (ko)
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KR20080096749A (ko
Inventor
신지 타카세
요헤이 오니시
Original Assignee
토와 가부시기가이샤
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Publication of KR20080096749A publication Critical patent/KR20080096749A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/56—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
    • B29C45/561—Injection-compression moulding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H10W74/017—Auxiliary layers for moulds, e.g. release layers or layers preventing residue
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/004—Shaping under special conditions
    • B29C2791/006—Using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
KR1020087014966A 2006-05-17 2007-04-13 전자 부품의 수지 밀봉 성형 방법 Active KR100993086B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006138022A JP4836661B2 (ja) 2006-05-17 2006-05-17 電子部品の樹脂封止成形方法及び樹脂封止成形用金型
JPJP-P-2006-00138022 2006-05-17

Publications (2)

Publication Number Publication Date
KR20080096749A KR20080096749A (ko) 2008-11-03
KR100993086B1 true KR100993086B1 (ko) 2010-11-08

Family

ID=38693712

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087014966A Active KR100993086B1 (ko) 2006-05-17 2007-04-13 전자 부품의 수지 밀봉 성형 방법

Country Status (5)

Country Link
US (1) US20090291532A1 (https=)
JP (1) JP4836661B2 (https=)
KR (1) KR100993086B1 (https=)
TW (1) TW200802639A (https=)
WO (1) WO2007132611A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101219631B1 (ko) * 2012-06-07 2013-01-21 (주)에스엘케이 멀티 반도체 패키지 가압장치
KR20190094973A (ko) * 2018-02-06 2019-08-14 이호연 수지 이송 성형장치

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101015585B1 (ko) 2008-06-26 2011-02-17 세크론 주식회사 전자 부품 몰딩 장치
JP4954171B2 (ja) * 2008-09-30 2012-06-13 Ｔｏｗａ株式会社 電子部品の圧縮樹脂封止成形方法及び装置
JP4954172B2 (ja) * 2008-09-30 2012-06-13 Ｔｏｗａ株式会社 電子部品の圧縮樹脂封止成形方法
KR101254860B1 (ko) 2008-09-30 2013-04-15 토와 가부시기가이샤 전자 부품의 압축 수지 밀봉 성형 방법 및 그를 위한 장치
JP5312897B2 (ja) 2008-10-20 2013-10-09 Ｔｏｗａ株式会社 圧縮成形装置
TWI416674B (zh) * 2008-11-05 2013-11-21 日月光半導體製造股份有限公司 封膠模具與封膠方法
JP5682033B2 (ja) * 2011-03-14 2015-03-11 アピックヤマダ株式会社 樹脂封止装置
KR101850979B1 (ko) 2011-06-03 2018-04-20 서울반도체 주식회사 발광소자의 봉지재 성형장치 및 방법
US8616067B2 (en) * 2011-11-30 2013-12-31 General Electric Company Pressure sensor assembly
US9310836B2 (en) * 2013-05-02 2016-04-12 Amazon Technologies, Inc. Resin-encapsulated portable media device
JP6115505B2 (ja) * 2013-06-21 2017-04-19 株式会社デンソー 電子装置
JP5934156B2 (ja) * 2013-08-20 2016-06-15 Ｔｏｗａ株式会社 基板の搬送供給方法及び基板の搬送供給装置
JP5786918B2 (ja) * 2013-10-23 2015-09-30 第一精工株式会社 樹脂封止金型およびこれを用いた樹脂封止装置、樹脂封止方法
JP6152037B2 (ja) * 2013-10-24 2017-06-21 川崎重工業株式会社 繊維強化プラスチックの成形方法
FR3027835B1 (fr) * 2014-10-31 2017-09-01 Plastic Omnium Cie Moule pour la fabrication de piece en matiere plastique comportant un systeme d'etancheite optimise
NL2013978B1 (en) * 2014-12-15 2016-10-11 Besi Netherlands Bv Device and method for controlled moulding and degating of a carrier with electronic components and moulded product.
JP6560498B2 (ja) 2015-01-27 2019-08-14 Ｔｏｗａ株式会社 樹脂封止方法及び樹脂成形品の製造方法
US9947561B2 (en) * 2016-03-07 2018-04-17 Asm Technology Singapore Pte Ltd Semiconductor encapsulation system comprising a vacuum pump and a reservoir pump
US10103478B1 (en) * 2017-06-23 2018-10-16 Amazon Technologies, Inc. Water resistant connectors with conductive elements
JP6482616B2 (ja) * 2017-08-21 2019-03-13 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品製造方法
JP7134926B2 (ja) * 2019-07-10 2022-09-12 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
CN114402431A (zh) * 2019-09-12 2022-04-26 株式会社村田制作所 半导体装置及其制造方法
CN217405408U (zh) * 2021-03-22 2022-09-09 意法半导体(格勒诺布尔2)公司 电子器件和电子系统

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JP2524955B2 (ja) * 1993-04-22 1996-08-14 トーワ株式会社 電子部品の樹脂封止成形方法及び装置
JP2706914B2 (ja) * 1995-12-13 1998-01-28 トーワ株式会社 電子部品の樹脂封止成形方法及び金型
JPH11168114A (ja) * 1997-12-03 1999-06-22 Matsushita Electron Corp 半導体チップ用の樹脂封止装置
JP3207837B2 (ja) * 1998-07-10 2001-09-10 アピックヤマダ株式会社 半導体装置の製造方法および樹脂封止装置
EP0971401B1 (en) * 1998-07-10 2010-06-09 Apic Yamada Corporation Method of manufacturing semiconductor devices and a resin molding machine therefor
JP3149409B2 (ja) * 1999-06-28 2001-03-26 株式会社日立製作所 半導体装置の製造方法
JP4416218B2 (ja) * 1999-09-14 2010-02-17 アピックヤマダ株式会社 樹脂封止方法及び樹脂封止装置
JP4336502B2 (ja) * 2003-01-30 2009-09-30 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び装置
JP2005161695A (ja) * 2003-12-03 2005-06-23 Towa Corp 樹脂封止装置及び樹脂封止方法
JP4373237B2 (ja) * 2004-02-13 2009-11-25 Ｔｏｗａ株式会社 半導体チップの樹脂封止成形方法および樹脂封止成形用金型
JP5004410B2 (ja) * 2004-04-26 2012-08-22 Ｔｏｗａ株式会社 光素子の樹脂封止成形方法および樹脂封止成形装置
JP2007109831A (ja) * 2005-10-13 2007-04-26 Towa Corp 電子部品の樹脂封止成形方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101219631B1 (ko) * 2012-06-07 2013-01-21 (주)에스엘케이 멀티 반도체 패키지 가압장치
KR20190094973A (ko) * 2018-02-06 2019-08-14 이호연 수지 이송 성형장치
KR102036534B1 (ko) 2018-02-06 2019-10-29 재이물산(주) 수지 이송 성형장치

Also Published As

Publication number Publication date
JP4836661B2 (ja) 2011-12-14
TW200802639A (en) 2008-01-01
JP2007307766A (ja) 2007-11-29
KR20080096749A (ko) 2008-11-03
TWI350571B (https=) 2011-10-11
US20090291532A1 (en) 2009-11-26
WO2007132611A1 (ja) 2007-11-22

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