Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
  • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
  • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
  • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
  • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
  • B29C43/32—Component parts, details or accessories; Auxiliary operations
  • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
  • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
  • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
  • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
  • B29C45/17—Component parts, details or accessories; Auxiliary operations
  • B29C45/40—Removing or ejecting moulded articles
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
  • B29C45/17—Component parts, details or accessories; Auxiliary operations
  • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
  • B29C45/56—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
  • B29C45/561—Injection-compression moulding
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/01—Manufacture or treatment
  • H10W72/0198—Manufacture or treatment batch processes
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/01—Manufacture or treatment
  • H10W74/016—Manufacture or treatment using moulds
  • H10W74/017—Auxiliary layers for moulds, e.g. release layers or layers preventing residue
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
  • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
  • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
  • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
  • B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C2791/00—Shaping characteristics in general
  • B29C2791/004—Shaping under special conditions
  • B29C2791/006—Using vacuum
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
  • B29C45/17—Component parts, details or accessories; Auxiliary operations
  • B29C45/26—Moulds
  • B29C45/34—Moulds having venting means
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
  • B29L2031/00—Other particular articles
  • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
  • B29L2031/3406—Components, e.g. resistors
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings

Definitions

• the present invention relates to a method for resin-seal molding of an electronic component, which seals a plurality of electronic components mounted on a substrate with resin by compression molding.
• a compression-molding mold assembly having a two-type structure consisting of an upper mold and a lower mold is used.
• a strip-like lead frame is used as the substrate (for example, page 3-5 of Japanese Patent Application Laid-Open No. 2004-230707, FIG. 5, and FIG. 6).
• a predetermined amount of a resin material is supplied in a cavity formed in a lower mold. Later, with the semiconductor chip mounted on the substrate directed downward, the substrate is set in the recess formed in the lower mold. In this state, the upper and lower molds are closed. Also, resin material is supplied into the cavity. Thereafter, the resin material is melted by heating. As a result, the space in the cavity is filled with the molten resin.
• the above-described resin sealing and forming apparatus includes a sliding member attached to the lower mold, and a mold clamping mechanism which vertically moves the sliding member to close and open the upper mold and the lower mold. And clamping means for moving a sliding member provided separately from the clamping mechanism upward. At the same time as the sliding member moves upward, the resin material supplied to the upper surface of the sliding member Melt) also rises. Thereby, the molten resin is supplied into the cavity. Within the cavity, multiple semiconductor chips are included in the molten resin. As a result, the resin material in the cavity is sealed by the resin.
• the inventors of the present application efficiently resinize a plurality of semiconductor chips on two substrates in one resin sealing process using one mold assembly (upper mold and lower mold). We examined whether it could be sealed and formed by As a result, it was necessary to be able to realize that by changing the structure of the conventional resin seal molding apparatus.
• an apparatus provided with a mold assembly capable of resin sealing by compression molding independently and substantially simultaneously between two sheets of substrates was developed.
• a mold assembly upper mold and lower mold
• a predetermined amount of resin material is first supplied to each of the two cavities formed in the lower mold.
• the substrate is set in the recess of the upper mold.
• the upper and lower molds are closed with the chip mounting surfaces of the two substrates directed downward.
• the resin material melts by heating in each of the two cavities.
• a molten resin is formed within each of the two cavities.
• Patent Document 1 Japanese Patent Application Laid-Open No. 2004-230707 (pages 3-5, FIG. 5, and FIG. 6) Disclosure of the Invention
• the lower mold may be used. Clamping means are required to move the two provided sliding members upward and downward.
• the clamp means includes drive sources such as a motor and a cylinder. Also, two clamping means corresponding to two sliding members are required. Therefore, upper type and A large space is required for the clamping mechanism and the drive source to move the lower mold upward and downward. As a result, the entire structure of the resin sealing and forming apparatus is enlarged.
• clamp means is used until the pressure of the molten resin reaches an appropriate predetermined value. It becomes necessary to control the two sliding members independently. Therefore, a long time is consumed in the resin sealing process. As a result, if it is difficult to sufficiently improve the productivity of the resin sealing process, problems occur.
• the present invention has been made in view of the above problems, and an object thereof is to compression-mold a plurality of electronic components mounted on two substrates using one mold assembly. It is an object of the present invention to provide a resin seal molding method capable of miniaturizing a resin sealing molding device and evenly distributing a predetermined amount of a resin material in two cavities. Means to solve the problem
• a mold and release film are prepared.
• a plurality of substrates on which a plurality of electronic components are mounted are attached to the upper mold.
• the mold release film is adhered to a plurality of cavities by the intermediate mold and the lower mold.
• the upper mold, the intermediate mold and the lower mold are closed with the plurality of cavities coated on the release film.
• liquid resin or molten resin is injected into the plurality of cavities, or the force by which the molten resin is generated in the plurality of cavities.
• a plurality of electronic components are simultaneously immersed in the liquid resin or the molten resin so that the liquid resin or the molten resin is evenly distributed within the plurality of cavities through the communication passage connecting the plurality of cavities.
• the resin seal molding apparatus when compression molding of a plurality of electronic components mounted on two substrates using one mold assembly, the resin seal molding apparatus can be miniaturized.
• a predetermined amount of resin material can be evenly distributed in the two cavities.
• the cavity may include a lower cavity surface as its bottom surface and a cavity side adjacent to the cavity surface, and the cavity side and the lower cavity surface may be separated. According to this, cleaning of the member which constitutes a cavity becomes easy.
• the plurality of substrates are attached to the upper mold in a state where the plurality of substrates are adjacent to each other. According to this, the communication passage can be shortened.
• the gap between the upper mold and the intermediate mold may be closed by a seal member for blocking the outside air.
• the resin sealing method may further comprise the step of evacuating the space in the cavity after the aforementioned closing step. According to this, it is possible to suppress the formation of voids in the molten resin.
• the resin seal molding apparatus when compression molding a plurality of electronic components mounted on two substrates using one mold assembly, the resin seal molding apparatus can be miniaturized. In addition, it is possible to evenly distribute a predetermined amount of resin within the two cavities.
• FIG. 1 is a plan view of a substrate on which an electronic component to be seal-molded using a mold assembly is mounted.
• FIG. 2 Another example of a plan view of a substrate on which an electronic component to be seal-molded using a mold assembly is mounted.
• FIG. 3 This is still another example of a plan view of a substrate on which an electronic component to be seal-molded using a mold assembly is mounted.
• FIG. 4 is a cross-sectional view of a mold assembly for resin-seal molding of an electronic component mounted on the substrate shown in FIGS. 1 to 3, and a diagram showing the mold-opened state thereof.
• FIG. 5 is a cross-sectional view of a mold assembly for resin-seal molding of an electronic component mounted on the substrate shown in FIGS. 1 to 3, to which the substrate and the resin material are supplied.
• FIG. 5 is a cross-sectional view of a mold assembly for resin-seal molding of an electronic component mounted on the substrate shown in FIGS. 1 to 3, to which the substrate and the resin material are supplied.
• FIG. 6 is a perspective view of a lower mold and an intermediate mold.
• FIG. 7 A sectional view of the mold assembly shown in FIG. 4, in which the substrate shown in FIG. FIG. 6 is a view showing a state of being clamped.
• FIG. 8 A sectional view of a mold assembly, showing a substrate clamped by another example of the mold assembly.
• FIGS. 1 to 6 a resin seal molding method of an electronic component according to an embodiment of the present invention will be described with reference to FIGS. 1 to 6.
• FIGS. 1 to 6 In the drawings used in the following description, for simplicity of the description, detailed portions are schematically drawn by omitting or exaggerating.
• a matrix type substrate 1 is used in the resin seal molding method of the electronic component of the present embodiment.
• the matrix type substrate 1 may have any shape such as a circular shape or a polygonal shape. In the present embodiment, the substrate 1 has a square shape.
• a plurality of chips 2 which are an example of the plurality of electronic components of the present invention are mounted on one main surface of the substrate 1.
• the pre-seal substrate 3 is drawn in the upper part of the figure
• the sealed substrate 10 is drawn in the lower part of the figure.
• the substrate 1 has a sealing and molding portion 6, a substrate outer peripheral portion 7, and a non-mounting surface 8.
• Seal molding The part 6 is a part where the chip 2 on one main surface is sealed with the resin material 4 (melt resin 5).
• the substrate outer peripheral portion 7 is a portion which is an outer peripheral portion of the seal molded portion 6 on one main surface and does not have the resin material 4.
• the non-mounting surface 8 is the other main surface facing the one main surface on which the chip 2 is mounted.
• a sealed substrate 10 (product) having the cured resin 9 constituting the seal-molded portion 6 is formed (the lower part of the figure) reference).
• the two substrates 1 are attached to predetermined positions of the mold assembly 50 with their relatively long end faces in contact with (adjacent to) each other. According to this structure, the two substrates can be compression molded simultaneously. In addition, a cured resin 11 for connecting the substrates 1 is molded between the sealing molded portions 6 on the two substrates 1.
• the resin sealing and forming method of electronic parts of the present invention can be applied not only to the resin sealing and forming of a plurality of electronic parts on two substrates 1 as shown in FIG.
• the present invention can be applied to resin seal molding of a plurality of electronic components on a plurality of substrates 1.
• the method for resin seal molding of an electronic component of the present invention may be applied to resin seal molding for three substrates 1 shown in FIG.
• the three substrates 1 may be mounted on the upper mold in a state in which mutually adjacent relatively long end faces abut (adjacent) each other.
• the sealing molded portions 6 of the two substrates 1 adjacent to each other are connected by the curing resin 11 as in the case of the substrate 1 shown in FIG.
• the method for resin-seal molding of the electronic component of the present invention may be applied to resin-seal molding of a plurality of electronic components on two substrates 1 as shown in FIG. .
• eight sealing portions 6 may be formed.
• the plurality of electronic components on the plurality of (in this case, two) substrates 1 can be resin-sealed by compression molding almost simultaneously.
• the relatively long end faces of the two substrates 1 adjacent to each other are connected by the curing resin 11 in a state where the forces are in contact with each other (adjacent).
• the resin sealing and molding apparatus of the present embodiment compression molding of a plurality of electronic components on a plurality of substrates 1 can be carried out almost simultaneously without using complicated clamping means as in the prior art.
• the resin can be sealed in the cured resin 11.
• the mold assembly 50 of the resin mold for resin sealing of the present embodiment will be described later.
• the matrix type substrate a wire bonding substrate, a flip chip substrate, or a wafer level package such as a wafer substrate may be employed.
• a material of the substrate any metal lead frame or plastic (ceramic, glass, or other material) called a PC (Printed Circuit) boat is used.
• the resin material 4 tablet-like resin, liquid resin, granular resin, powdered resin, sheet-like resin, or fine particles smaller in diameter than granules and larger than powders are used. The situation is adopted.
• the mold assembly of the present embodiment is for resin-sealing a plurality of electronic components on two substrates 1 shown in FIGS. 1 to 3 almost simultaneously by compression molding.
• the mold assembly 50 includes three members consisting of an upper mold 12, a lower mold 13 disposed to face the upper mold 12, and an intermediate mold 14 disposed between the upper mold 12 and the lower mold 13. It has a type (12 ⁇ 13 ⁇ 14) structure. Further, in the mold assembly 50, a release film 15 is used.
• a plurality of electronic components on the two pre-sealed substrates 3 shown in FIG. 1 are resin-sealed by compression molding. Thereby, two sealed substrates 10 are formed.
• the mold assembly 50 of the present embodiment differs from the conventional mold assembly in that it has a three-type (12 ⁇ 13 ⁇ 14) structure which is not the same as the conventional two-type structure, and the release film 15 is used. ing. According to this, even when forming the enlarged and thinned seal-formed portion 6, the seal-formed portion 6 can be efficiently removed from the mold assembly 50.
• the upper mold 12 is provided with a substrate fixing mechanism 17.
• the chips 2 of the two pre-sealed substrates 3 are directed downward, and the relatively long end faces of the two substrates 1 are in contact with each other (adjacent).
• the two pre-sealed substrates 3 can be fixed to the upper mold 12 by sandwiching and suctioning on the substrate mounting surface 16 of the two upper molds 12.
• the substrate fixing mechanism 17 includes a substrate suction fixing portion 18 for suctioning the substrate 1 (the substrate 3 before sealing and the sealed substrate 10), and a substrate holding fixing portion 19 for holding the substrate 1. Have. This configuration is adopted to efficiently mount the substrate 1 on the substrate mounting surface 16 in response to the recent increase in size and thickness of the substrate 1.
• the substrate suction fixing portion 18 has a substrate air permeable member 20 and a vacuum drawing mechanism (not shown). In order to adsorb the non-mounting surface 8 of the substrate 1, the substrate air-permeable member 20 is made of a material having air permeability and heat resistance such as metal or ceramic.
• the vacuuming mechanism is provided on the upper surface opposite to the lower surface (substrate mounting surface 16) of the air-permeable member 20, and air, moisture, water, water, water, etc. from the passage communicating with the air-permeable member 20. Forcedly aspirate gases and other substances. According to this, the two matrix type substrates 1 are adsorbed to the substrate air-permeable member 20 by the action of the vacuum pulling mechanism. In addition, the evacuating mechanism communicates with the air-permeable member 20 described above at substantially the same time as the two sealed substrates 10 are released from the substrate clamping and fixing portion 19, and the two sealing devices are sealed. It may also be used to blow air towards the non-mounted surface 8 of the clamped substrate 10! /.
• the substrate clamping and fixing portion 19 is provided with chuck claws 21 (ten points in this case) provided around the substrate suction and fixing portion 18 in order to clamp the substrate outer peripheral portion 7 of the two substrates 1.
• the chuck claws 21 may also be provided at a position between the two substrates 1.
• the chucking claws 21 generally extend substantially horizontally without coming into contact with the substrate mounting surface 16. Also, when the substrate 1 (3 ⁇ 10) is attached to the substrate fixing mechanism 17 or removed from the substrate fixing mechanism 17, as shown in FIG. 5, the chuck claws 21 extend in the horizontal direction. It changes from the closed state (closed state) to the state (opened state) in which the tip is turned toward the upper surface side of the intermediate mold 14.
• the resin sealing and forming apparatus can perform both the adsorption of the substrate suction and fixing portion 18 and the sandwiching of the substrate clamping and fixing portion 19. Therefore, various substrates 1 can be reliably mounted on the substrate mounting surface 16 of the upper mold 12. More specifically, the two substrates 1 are prevented from being shifted downward and in the horizontal direction.
• the intermediate mold 14 has a mold assembly surface 22 facing the upper mold 12 and a mold assembly surface 24 facing the lower mold 13. Further, the intermediate mold 14 has an upper accommodation portion 23 having an opening in the mold assembly surface 22 on the upper mold side, and a lower accommodation portion 25 having an opening in the mold assembly surface 24 on the lower mold side.
• the upper accommodation portion 23 and the lower accommodation portion 25 are in communication with each other, and constitute a penetration extending upward and downward.
• the chuck claws 21 do not contact the intermediate mold 14. Housed in At this time, the cavity 26 of the lower mold 13 penetrates the lower accommodation portion 25 and reaches the upper accommodation portion 23.
• the mold release film 15 has the lower mold assembly side 24 of the intermediate mold 14 and the upper surface of the lower mold 13. In between, with tension applied.
• the lower mold 13 includes a cavity 26 having a shape corresponding to the sealing molded portion 6 (curing resin 9) of the two substrates 1 as shown in FIG. In FIG. 6, upper mold 12 is not depicted. Further, by clamping the intermediate mold 14 and the lower mold 13, as shown in FIG. 6, the release film 15 is coated on the communication passage 27 that allows the cavities 26 to communicate with each other. Further, the mold release film 15 is also provided to the chuck claw accommodating portion 28 provided on the upper mold 12 so that the chuck claws 21 can be accommodated when the upper mold 12, the intermediate mold 14 and the lower mold 13 are clamped. It is covered. Also, this cavity 26 has a shape corresponding to the two sealing portions 6 shown in FIG. More specifically, the lower mold cavity surface 29 of the lower mold 13 has a shape corresponding to the upper surface of the sealing molding portion 6.
• the cavity 26 has a cavity surface 32 in addition to the lower cavity surface 29.
• the cavity surface 32 is provided with a cavity side surface 30 surrounding the outer periphery of the lower cavity surface 29 and a communicating road surface 31 (in this case, two places) forming communication passages 27 for communicating the cavities 26 with each other.
• the lower mold 13 holds the release film 15 in cooperation with the intermediate mold 14 and has a film fixing mechanism 33 for adsorbing the release film 15 to the cavity 26, a cavity surface 32 (a cavity side surface 30 and a communicating road surface 31) and a cavity member 34 defining the same.
• the cavity member 34 has an integral structure, and is used when the thicknesses of the two substrates 1 are substantially the same.
• a cavity member 34 having a separation structure is composed of a cavity member 34 a corresponding to one of the two substrates 1 and a cavity member 34 b corresponding to the other of the two substrates 1.
• the separation structure is composed of a cavity member 34 a corresponding to one of the two substrates 1 and a cavity member 34 b corresponding to the other of the two substrates 1.
• the film fixing mechanism 33 includes a film suction fixing portion 35 for suctioning the release film 15 and a film holding fixing portion 36 for holding the release film 15.
• the film suction fixing portion 35 includes a film air-permeable member 37 and a vacuum drawing mechanism (not shown).
• the film air-permeable member 37 is made of a material having air permeability and heat resistance such as metal or ceramic so that the mold release film 15 can be adsorbed to the lower cavity surface 29.
• the evacuating mechanism includes a lower surface opposite to the lower mold surface 29 which is the upper surface of the air-permeable member 37, a communication passage communicating with the air-permeable member 37, air, moisture, and gases through piping and valves. Are discharged to the outside by forced suction.
• the lower cavity surface 29 and the film air-permeable member 37 are provided to correspond to each of the two substrates 1, the vacuum drawing mechanism has a single mechanical force. .
• the film clamping and fixing portion 36 is provided with a cavity member 34.
• the cavity member 34 is provided so as to surround the film suction fixing portion 35 around the film suction fixing portion 35 in plan view.
• the film clamping and fixing portion 36 includes a clamping member 38 for clamping the release film 15, a plurality of mounting rods 39 attached to the lower surface of the clamping member 38 so as to extend in the vertical direction, and the clamping member 38.
• an elastic member 40 also serving as a spring or the like for elastically supporting the mounting rod 39. Also, as shown in FIG. 4, when the mold assembly 50 is opened, the elastic member 40 is restored (stretched so that the upper surface of the holding member 38 is positioned above the lower mold 13). ) State.
• the cavity member 34 is fitted around the suction fixing portion 35 of the film fixing mechanism 33, as can be seen from FIG.
• the cross-sectional shape of the cavity member 34 is an L-shaped vertical portion and It consists of a horizontal part.
• the cavity member 34 may have an integral structure.
• the cavity member 34 may have a structure that can be separated by having cavity members 34a and 34b as shown in FIG.
• the vertical portion of the cavity member 34 is provided with a cavity side surface 30 and a substrate contact portion 41 for pressing the substrate outer peripheral portion 7 of the two substrates 1.
• two communication passages 27 for resin adjustment are provided at the top of the cavity side 30.
• a communication passage 27 is provided between the two cavities 26.
• Each of the two communication passages 27 allows the two cavities 26 to communicate with each other. Therefore, the molten resin 5 is evenly distributed to the two cavities 26.
• a chuck claw accommodating portion 28 is provided on the vertical portion of the cavity member 34. The chuck claw accommodating portion 28 accommodates the tip end portion of the chuck claw 21 so that the chuck claw 21 and the substrate contact portion 41 do not contact when the mold assembly 50 is clamped.
• the cavity member 34 includes the chuck claw housing portion 28, the substrate contact portion 41 excluding the chuck claw housing portion 28, the communicating road surface 31, and the communicating road surface. It has a cavity side 30 with the exception of 31.
• the cavity member 34 is separated into the cavity member 34a of one side and the cavity member 34b of the other side, one cavity member 34a and the other side of the cavity member 34b respectively.
• a force chuck claw housing portion 28, a substrate contact portion 41 excluding the chuck claw housing portion 28, a communicating road surface 31, and a cavity side surface 30 excluding the communication path surface 31 are provided.
• the lower die 13 has a mounting member 42 on which the L-shaped horizontal portion of the cavity member 34 is mounted, a mounting member 43 mounted on the mounting member 42, and the periphery of the mounting member 43. And an elastic member 44 such as a surrounding spring.
• the cavity side surface 30 of the cavity member 34 is above the respective lower mold cavity surfaces 29 corresponding to the two substrates 2 and below the upper surface of the holding member 38. Positioned on the side. At this time, the elastic member 44 is in a restored (stretched) state.
• the mold assembly 50 is in the mold clamped state.
• the cavity member 34 abuts on the upper surface of the lower mold 13 and the elastic member 44 is most contracted.
• the release film 15 is coated on each of the two lower mold cavities 29, the intermediate mold shown in FIGS. 5 and 6 is obtained from the mold open state of the mold assembly 50 shown in FIG.
• the lower mold 13 changes to the clamped state.
• the release film 15 is held by the film holding and fixing portion 36.
• the mold release film 15 is forced to the lower mold cavity surface 29 and forcedly sucked by the film suction fixing portion 35.
• the release film 15 is coated in a tensioned state on the entire surface of the cavity 26, that is, on the lower cavity surface 29, the cavity side 30, and the communicating road surface 31.
• FIG. 5 shows the cavity 26 in which the release film 15 in a tensioned state is in close contact with the mold surface.
• This state is a state immediately before the resin material 4 (in this case, granular resin) is supplied to the cavity 26.
• the communication path 27 for connecting the cavities 26 is provided in the resin seal molding apparatus of the present embodiment.
• the resin material 4 is not equally supplied to the two cavities 26 when the mold assembly 50 is opened, but as shown in FIG. When the mold assembly 50 is closed, it is evenly distributed to the two cavities 26 through the common passage 27. This action can occur not only when using the substrate 1 shown in FIG. 1 but also when using the substrate 1 shown in FIGS. 2 and 3.
• the two sealed substrates 10 shown in FIG. 1 are formed almost simultaneously by compression molding.
• the melted resin 5 may be produced by heating solid resin in the cavity 26.
• the melted resin 5 produced in a force pot or the like may be injected into the cavity 26.
• liquid resin may be externally injected into the cavity 26.
• the cured resin 11 in the communication passage may be cut inside or outside of the mold assembly 50 until the Singulation process is performed. . Thereby, one sealed substrate is completed.
• the Singui release device The cured resin 11 in the communication passage may be cut.
• upper seal member 45 that abuts mold assembly surface 22 on the upper mold side of intermediate mold 14, and the lower surface of intermediate mold 14, respectively.
• a lower seal member 46 is provided to abut against the mold assembly surface 24 on the mold side. The upper seal member 45 and the lower seal member 46 are used to maintain the degree of vacuum of the space in the mold assembly 50 of the present embodiment when a vacuum drawing mechanism (not shown) is used.
• only upper seal member 45 is used in force mold 12 in which upper seal member 45 and lower seal member 46 are attached to upper die 12 and lower die 13, respectively.
• the structure will be adopted.
• the upper seal member 45 and the lower seal member 46 are attached to the upper seal fixing portion 47 and the lower seal fixing portion 48 provided on the outer side than the substrate fixing mechanism 17 and the film fixing mechanism 33, respectively.
• a material having excellent elasticity, heat resistance, and durability such as a hollow seal or an O-ring, is employed.
• the upper seal member 45 is crushed when the upper mold member surface 22 of the middle die 14 abuts on the upper seal member 45. Thereafter, with the water, gas, etc. being in a space shielded from external air by upper mold 12, intermediate mold 14 and lower mold 13, air in the space is forced through piping and valves. It is discharged by mechanical suction.
• the plurality of electronic components on the two substrates 1 can be compression molded almost simultaneously, without generating a void and the like.
• the resin can be sealed.
• the mold release film 15 abuts on the mold assembly surface 24 on the lower mold side of the intermediate mold 14. This state Then, the intermediate mold 14 moves downward. As a result, in a state where the release film 15 is nipped by the mold assembly surface 24 on the lower die side and the upper surface of the nipping member 38, the intermediate die 14 moves downward. At this time, the mounting rod 39 of the holding and fixing portion 36 also moves downward. As a result, the elastic member 40 is in a contracted state.
• the substrate contact portion 41 in the L-shaped vertical portion of the cavity member 34 is accommodated in the upper accommodation portion 23 and the lower accommodation portion 25 of the middle mold 14.
• the release film 15 in the substrate contact portion 41 protrudes above the upper surface of the intermediate mold 14. Further, the release film 15 is held by the intermediate mold 14 and the holding member 38. Furthermore, the entire mold assembly 50 is heated to melt the resin material 4. Therefore, the release film 15 adheres to the cavity 26 in the substrate contact portion 41.
• the release film 15 is forced to be attracted toward the lower cavity surface 29 and continued.
• the mold release film 15 follows the shape of the entire surface of the cavity 26 including the lower cavity surface 29 and the cavity surface 32 (cavity side 30 and communicating road surface 31).
• the states shown in FIGS. 5 and 6 are formed. In this state, the two cavities 26 are formed so as to correspond to the sealing portions 6 of the two substrates 1 described above, respectively.
• a preparation step for supplying the resin material 4 to the cavity 26 is performed.
• the tip of the chuck claw 21 does not come in contact with the two substrates 1. It is pivoted away from the mounting surface 16.
• the resin material 4 is supplied to the cavity 26.
• the resin material 4 is changed to the molten resin 5.
• the molten resin 5 is equally distributed to the two cavities 26 through the communication passage 27. Therefore, the amount of the resinous material 4 may be slightly different when supplied to the two cavities 26.
• a preparation step for moving the intermediate mold 14 and the lower mold 13 toward the upper mold 12 is performed.
• the substrate outer peripheral portions 7 of the two pre-sealed substrates 3 are chuck claws. It is pinched by 21.
• the two pre-sealed substrates 3 are securely fixed to the upper mold 12 by the substrate fixing mechanism 17.
• the whole of the mold assembly 50 is heated to a temperature necessary for melting the resin material 4. Therefore, it has been changed to molten resin 5 at Cavity 26.
• the release film 15 is coated with the cavity 26 and adheres to the cavity 26 along the shape of the entire surface of the cavity 26 which does not generate a film wrinkle due to the weight of the molten resin 5. .
• the intermediate mold 14 and the lower mold 13 move toward the upper upper mold 12 in the upward direction.
• the mold assembly 50 is in the intermediate mold clamping state.
• the mold assembly surface 22 on the upper mold side of the intermediate mold 14 is in contact with the upper seal member 45 formed on the mold surface of the upper mold 12. Therefore, the upper seal member 45 is in a collapsed state.
• a space shielded from the outside air is formed in the mold assembly 50.
• air or the like is forcibly discharged to the outside by suction through the passage communicating with the vacuum mechanism. This is called a vacuuming step.
• the resin material 4 supplied into the cavity 26 has been changed to the molten resin 5 before stopping the vacuuming even if it has not been changed to the molten resin 5 in the above-described intermediate mold clamping state.
• the vacuuming step of the present embodiment is performed in the above-described intermediate mold clamping state, It is executed intermittently while repeatedly repeating the intermediate clamping state and the full clamping state, or from the intermediate clamping state to the full clamping state without stopping the movement of the mold assembly 50. It may be carried out continuously, with the mold assembly 50 moving at a clamping speed (the moving speed of the mold assembly 50) slower than the speed up to that time.
• the mold surface of the upper mold 12 and the mold set on the upper mold side of the intermediate mold 14 are assembled.
• Product surface 22 contacts.
• the substrate contact portion 41 in the cavity 26 contacts the substrate outer peripheral portions 7 of the two pre-seal substrates 3 almost simultaneously while the release film 15 is sandwiched therebetween.
• the electronic component (chip 2) is immersed in the molten resin 5 in the cavity 26.
• the chuck claws 21 are housed in the upper housing portion 23 of the intermediate mold 14 and the chuck claw housing portions 28 of the cavity member 34 while holding the substrate outer peripheral portion 7 of the two pre-sealed substrates 3. There is.
• the substrate outer peripheral portion 7 of the two substrates 1 is clamped by the substrate contact portion 41 and the upper mold 12. Therefore, even if compression molding is performed in the mold assembly 50, the molten resin 5 is prevented from leaking onto the two substrates 1 of the substrate outer peripheral portion 7.
• the upper seal member 45 in a state in which the mold assembly surface 22 on the upper mold side of the intermediate mold 14 is in contact with the mold surface of the upper mold 12 is completely crushed,
• the mold surface of the upper mold 12 and the mold assembly surface 22 on the upper mold side may be separated as long as the space in the mold assembly 50 is in a state in which external air is shut off.
• the timing to stop the vacuum drawing process may be performed at any timing as long as it is a time until the intermediate clamping force is completely clamped. However, it is desirable that the vacuuming process be continued until the resin sealing is completed and stopped after the resin sealing is completed.
• the cavity member 34 has two sheets. It may have a separate structure consisting of two cavity members 34a and 34b corresponding to each of the substrates 1.
• the timing when the cavity member 34 a contacts the substrate 1 and the timing when the cavity member 34 b contacts the substrate 1 are different due to the difference in thickness between the two substrates 1.
• the cavity members 34a and 34b can move to different positions depending on the thickness of the two substrates 1 respectively. That Therefore, both the substrate contact portion 41 of the cavity member 34a and the substrate contact portion 41 of the cavity member 34b can press the substrate outer peripheral portion 7 of the two substrates 1 firmly.
• the substrates 1 are communicated with each other so that the molten resin 5 is equally distributed to the two cavities 26.
• a communication passage 27 is provided. Even if the lower mold 13 has a structure in which the vertical position of the lower cavity surface 29 can be changed instead of the communication passage 27, the molten resin 5 has two cavities 26. Distributed evenly. Also, measurement equipment (not shown) such as a pressure sensor may be provided in the mold assembly 50 so that the mold clamping pressure can be monitored.
• a sealing / molding portion including two chips 2 is included. That is, the cured resin 9 is formed. As a result, two sealed substrates 10 (product) are completed. At this time, although both the substrate fixing mechanism 17 and the film fixing mechanism 33 continue suctioning by the vacuum drawing mechanism, the suction by one or both of them may be stopped. .
• the intermediate mold 14 and the lower mold 13 are opened. That is, only the lower mold 13 (lower mold cavity surface 29) moves downward from the state shown in FIG. As a result, a space is formed between the release film 15 coated on the cured resin 9 of each of the two substrates 1 and each of the two lower cavity surfaces 29. Almost simultaneously with this, air is blown out from each of the two lower mold cavities 29 by the action of the vacuum drawing mechanism connected to the suction fixing portion 35 of the film fixing mechanism 33. Thus, the air from each of the two lower cavity surfaces 29 It is sprayed on each of the sealing and forming portions 6 (9) of the two sealed substrates 10 via the release film 15.
• the middle mold 14 and the lower mold 13 are further pulled away from the upper mold 12. At this time, the two sealed substrates 10 are mounted on the substrate mounting surface 16 of the upper mold 12. In addition, the intermediate mold 14 and the lower mold 13 integrally move downward.
• the chuck claws 21 have their top ends substantially the same as the state of the mold assembly 50 shown in FIG. Mold 12 Turns away from substrate mounting surface 16 to open. As a result, the two sealed substrates 10 are removed almost simultaneously from the substrate mounting surface 16 of the upper mold 12.
• a series of compression molding is performed so that two pre-sealed substrates 3 change to two sealed substrates 10 substantially simultaneously. While the oil seal molding process has been described, this series of resin sealing steps may be performed on continuous and intermittent modes of V, offset!,.
• the resin material 4 including the high density resin material 4 is included.
• the releasability of the mold assembly 50 and the mold assembly 50 is significantly improved.
• a vacuuming mechanism since a vacuuming mechanism is used, it is possible to prevent voids (air bubbles) from remaining in the resin material 4.
• compression molding since compression molding is used, many thin chips 2 mounted on a matrix type substrate 1 can be sealed with resin almost simultaneously.

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• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
• Casting Or Compression Moulding Of Plastics Or The Like (AREA)
• Moulds For Moulding Plastics Or The Like (AREA)

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• 2006
  • 2006-05-17 JP JP2006138022A patent/JP4836661B2/ja active Active
• 2007
  • 2007-04-13 KR KR1020087014966A patent/KR100993086B1/ko active Active
  • 2007-04-13 WO PCT/JP2007/058150 patent/WO2007132611A1/ja not_active Ceased
  • 2007-04-13 US US12/096,568 patent/US20090291532A1/en not_active Abandoned
  • 2007-04-18 TW TW096113605A patent/TW200802639A/zh unknown

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