TW200802639A - Method of resin encapsulation molding for electronic part - Google Patents

Method of resin encapsulation molding for electronic part

Info

Publication number
TW200802639A
TW200802639A TW096113605A TW96113605A TW200802639A TW 200802639 A TW200802639 A TW 200802639A TW 096113605 A TW096113605 A TW 096113605A TW 96113605 A TW96113605 A TW 96113605A TW 200802639 A TW200802639 A TW 200802639A
Authority
TW
Taiwan
Prior art keywords
cavities
face
molten resin
encapsulation molding
resin encapsulation
Prior art date
Application number
TW096113605A
Other languages
English (en)
Other versions
TWI350571B (zh
Inventor
Shinji Takase
Yohei Onishi
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of TW200802639A publication Critical patent/TW200802639A/zh
Application granted granted Critical
Publication of TWI350571B publication Critical patent/TWI350571B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/56—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
    • B29C45/561—Injection-compression moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/004—Shaping under special conditions
    • B29C2791/006—Using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
TW096113605A 2006-05-17 2007-04-18 Method of resin encapsulation molding for electronic part TW200802639A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006138022A JP4836661B2 (ja) 2006-05-17 2006-05-17 電子部品の樹脂封止成形方法及び樹脂封止成形用金型

Publications (2)

Publication Number Publication Date
TW200802639A true TW200802639A (en) 2008-01-01
TWI350571B TWI350571B (zh) 2011-10-11

Family

ID=38693712

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096113605A TW200802639A (en) 2006-05-17 2007-04-18 Method of resin encapsulation molding for electronic part

Country Status (5)

Country Link
US (1) US20090291532A1 (zh)
JP (1) JP4836661B2 (zh)
KR (1) KR100993086B1 (zh)
TW (1) TW200802639A (zh)
WO (1) WO2007132611A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI416674B (zh) * 2008-11-05 2013-11-21 Advanced Semiconductor Eng 封膠模具與封膠方法
CN112208054A (zh) * 2019-07-10 2021-01-12 Ｔｏｗａ株式会社 树脂成型装置及树脂成型品的制造方法

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101015585B1 (ko) 2008-06-26 2011-02-17 세크론 주식회사 전자 부품 몰딩 장치
JP4954172B2 (ja) * 2008-09-30 2012-06-13 Ｔｏｗａ株式会社 電子部品の圧縮樹脂封止成形方法
JP4954171B2 (ja) * 2008-09-30 2012-06-13 Ｔｏｗａ株式会社 電子部品の圧縮樹脂封止成形方法及び装置
CN102171801B (zh) * 2008-09-30 2013-10-16 东和株式会社 电子元器件的压缩树脂密封成形方法及采用该方法的装置
JP5312897B2 (ja) 2008-10-20 2013-10-09 Ｔｏｗａ株式会社 圧縮成形装置
JP5682033B2 (ja) * 2011-03-14 2015-03-11 アピックヤマダ株式会社 樹脂封止装置
KR101850979B1 (ko) * 2011-06-03 2018-04-20 서울반도체 주식회사 발광소자의 봉지재 성형장치 및 방법
US8616067B2 (en) * 2011-11-30 2013-12-31 General Electric Company Pressure sensor assembly
KR101219631B1 (ko) * 2012-06-07 2013-01-21 (주)에스엘케이 멀티 반도체 패키지 가압장치
US9310836B2 (en) * 2013-05-02 2016-04-12 Amazon Technologies, Inc. Resin-encapsulated portable media device
JP6115505B2 (ja) * 2013-06-21 2017-04-19 株式会社デンソー 電子装置
JP5934156B2 (ja) * 2013-08-20 2016-06-15 Ｔｏｗａ株式会社 基板の搬送供給方法及び基板の搬送供給装置
JP5786918B2 (ja) * 2013-10-23 2015-09-30 第一精工株式会社 樹脂封止金型およびこれを用いた樹脂封止装置、樹脂封止方法
JP6152037B2 (ja) * 2013-10-24 2017-06-21 川崎重工業株式会社 繊維強化プラスチックの成形方法
FR3027835B1 (fr) * 2014-10-31 2017-09-01 Plastic Omnium Cie Moule pour la fabrication de piece en matiere plastique comportant un systeme d'etancheite optimise
NL2013978B1 (en) * 2014-12-15 2016-10-11 Besi Netherlands Bv Device and method for controlled moulding and degating of a carrier with electronic components and moulded product.
JP6560498B2 (ja) 2015-01-27 2019-08-14 Ｔｏｗａ株式会社 樹脂封止方法及び樹脂成形品の製造方法
US9947561B2 (en) * 2016-03-07 2018-04-17 Asm Technology Singapore Pte Ltd Semiconductor encapsulation system comprising a vacuum pump and a reservoir pump
US10103478B1 (en) * 2017-06-23 2018-10-16 Amazon Technologies, Inc. Water resistant connectors with conductive elements
JP6482616B2 (ja) * 2017-08-21 2019-03-13 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品製造方法
KR102036534B1 (ko) * 2018-02-06 2019-10-29 재이물산(주) 수지 이송 성형장치
WO2021049138A1 (ja) * 2019-09-12 2021-03-18 株式会社村田製作所 半導体装置およびその製造方法

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JP2524955B2 (ja) * 1993-04-22 1996-08-14 トーワ株式会社 電子部品の樹脂封止成形方法及び装置
JP2706914B2 (ja) * 1995-12-13 1998-01-28 トーワ株式会社 電子部品の樹脂封止成形方法及び金型
JPH11168114A (ja) * 1997-12-03 1999-06-22 Matsushita Electron Corp 半導体チップ用の樹脂封止装置
JP3207837B2 (ja) * 1998-07-10 2001-09-10 アピックヤマダ株式会社 半導体装置の製造方法および樹脂封止装置
TW421833B (en) * 1998-07-10 2001-02-11 Apic Yamada Corp Method of manufacturing semiconductor devices and resin molding machine
JP3149409B2 (ja) * 1999-06-28 2001-03-26 株式会社日立製作所 半導体装置の製造方法
JP4416218B2 (ja) * 1999-09-14 2010-02-17 アピックヤマダ株式会社 樹脂封止方法及び樹脂封止装置
JP4336502B2 (ja) * 2003-01-30 2009-09-30 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び装置
JP2005161695A (ja) * 2003-12-03 2005-06-23 Towa Corp 樹脂封止装置及び樹脂封止方法
JP4373237B2 (ja) * 2004-02-13 2009-11-25 Ｔｏｗａ株式会社 半導体チップの樹脂封止成形方法および樹脂封止成形用金型
JP5004410B2 (ja) * 2004-04-26 2012-08-22 Ｔｏｗａ株式会社 光素子の樹脂封止成形方法および樹脂封止成形装置
JP2007109831A (ja) * 2005-10-13 2007-04-26 Towa Corp 電子部品の樹脂封止成形方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI416674B (zh) * 2008-11-05 2013-11-21 Advanced Semiconductor Eng 封膠模具與封膠方法
CN112208054A (zh) * 2019-07-10 2021-01-12 Ｔｏｗａ株式会社 树脂成型装置及树脂成型品的制造方法
CN112208054B (zh) * 2019-07-10 2022-10-25 Ｔｏｗａ株式会社 树脂成型装置及树脂成型品的制造方法

Also Published As

Publication number Publication date
KR100993086B1 (ko) 2010-11-08
US20090291532A1 (en) 2009-11-26
KR20080096749A (ko) 2008-11-03
JP2007307766A (ja) 2007-11-29
JP4836661B2 (ja) 2011-12-14
WO2007132611A1 (ja) 2007-11-22
TWI350571B (zh) 2011-10-11

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