KR100886768B1 - 솔더, 이의 제조 방법 및 이를 이용한 솔더링 방법 - Google Patents

솔더, 이의 제조 방법 및 이를 이용한 솔더링 방법 Download PDF

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Publication number
KR100886768B1
KR100886768B1 KR1020077007046A KR20077007046A KR100886768B1 KR 100886768 B1 KR100886768 B1 KR 100886768B1 KR 1020077007046 A KR1020077007046 A KR 1020077007046A KR 20077007046 A KR20077007046 A KR 20077007046A KR 100886768 B1 KR100886768 B1 KR 100886768B1
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KR
South Korea
Prior art keywords
copper
lead
solder
weight
tin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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KR1020077007046A
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English (en)
Korean (ko)
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KR20070049229A (ko
Inventor
카이화 츄
빈센트 유에 세른 코
Original Assignee
퀀텀 케미컬 테크놀로지즈(싱가포르) 피티이. 리미티드
싱가포르 아사히 케미칼 앤드 솔더 인더스트리스 피티이 리미티드
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Application filed by 퀀텀 케미컬 테크놀로지즈(싱가포르) 피티이. 리미티드, 싱가포르 아사히 케미칼 앤드 솔더 인더스트리스 피티이 리미티드 filed Critical 퀀텀 케미컬 테크놀로지즈(싱가포르) 피티이. 리미티드
Publication of KR20070049229A publication Critical patent/KR20070049229A/ko
Application granted granted Critical
Publication of KR100886768B1 publication Critical patent/KR100886768B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Silicates, Zeolites, And Molecular Sieves (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Glass Compositions (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Powder Metallurgy (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Silicon Compounds (AREA)
  • Fats And Perfumes (AREA)
  • Detergent Compositions (AREA)
KR1020077007046A 2004-10-27 2005-08-26 솔더, 이의 제조 방법 및 이를 이용한 솔더링 방법 Expired - Lifetime KR100886768B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0423860A GB2406101C (en) 2004-10-27 2004-10-27 Improvements in ro relating to solders
GB0423860.6 2004-10-27
PCT/GB2005/003338 WO2006045995A1 (en) 2004-10-27 2005-08-26 Improvements in or relating to solders

Publications (2)

Publication Number Publication Date
KR20070049229A KR20070049229A (ko) 2007-05-10
KR100886768B1 true KR100886768B1 (ko) 2009-03-04

Family

ID=33515637

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077007046A Expired - Lifetime KR100886768B1 (ko) 2004-10-27 2005-08-26 솔더, 이의 제조 방법 및 이를 이용한 솔더링 방법

Country Status (17)

Country Link
US (2) US20060088439A1 (https=)
EP (1) EP1815034B1 (https=)
JP (1) JP4048288B2 (https=)
KR (1) KR100886768B1 (https=)
CN (1) CN100497693C (https=)
AT (1) ATE417941T1 (https=)
AU (1) AU2005298466B2 (https=)
BR (1) BRPI0517384B1 (https=)
DE (1) DE602005011848D1 (https=)
DK (1) DK1815034T3 (https=)
GB (1) GB2406101C (https=)
IL (1) IL180932A (https=)
MX (1) MX2007003369A (https=)
MY (1) MY136213A (https=)
NO (1) NO333370B1 (https=)
RU (1) RU2356975C2 (https=)
WO (1) WO2006045995A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8308053B2 (en) 2005-08-31 2012-11-13 Micron Technology, Inc. Microfeature workpieces having alloyed conductive structures, and associated methods
US7629249B2 (en) 2006-08-28 2009-12-08 Micron Technology, Inc. Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods
CN103008903A (zh) * 2007-08-14 2013-04-03 株式会社爱科草英 无铅焊料组合物及使用它的印刷电路板与电子器件
WO2009022758A1 (en) * 2007-08-14 2009-02-19 Ecojoin Pb-free solder compositions and pcb and electronic device using the same
WO2009028147A1 (ja) * 2007-08-24 2009-03-05 Kabushiki Kaisha Toshiba 接合用組成物
CN101554684A (zh) * 2009-05-19 2009-10-14 广州瀚源电子科技有限公司 一种无铅焊料的减渣方法
RU2441736C1 (ru) * 2010-11-24 2012-02-10 Открытое акционерное общество "Всероссийский институт легких сплавов" (ОАО "ВИЛС") Припой для пайки алюминия и его сплавов
JP6008101B2 (ja) * 2012-08-11 2016-10-19 千住金属工業株式会社 電力用はんだ
EP3138658B1 (en) 2014-04-30 2020-11-04 Nihon Superior Co., Ltd. Lead-free solder alloy
RU2584357C1 (ru) * 2014-11-26 2016-05-20 Открытое акционерное общество "Композит" (ОАО "Композит") Припой для пайки алюминия и его сплавов
BE1025771B1 (nl) * 2017-12-14 2019-07-08 Metallo Belgium Verbeterde koperproductiewerkwijze

Citations (2)

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KR20010043636A (ko) * 1999-03-16 2001-05-25 이즈하라 요조 무연 땜납
KR20030003030A (ko) * 2001-06-28 2003-01-09 센주긴조쿠고교 가부시키가이샤 납없는 땜납합금

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FR2612035B1 (fr) * 1987-03-03 1989-05-26 Loire Electronique Machine de soudage a l'etain avec pare-vague automatique, pour cartes a circuit imprime
TW251249B (https=) * 1993-04-30 1995-07-11 At & T Corp
JP3107483B2 (ja) * 1993-07-13 2000-11-06 日本アルミット株式会社 無ないし低含鉛半田合金
US5410184A (en) * 1993-10-04 1995-04-25 Motorola Microelectronic package comprising tin-copper solder bump interconnections, and method for forming same
US5520752A (en) * 1994-06-20 1996-05-28 The United States Of America As Represented By The Secretary Of The Army Composite solders
JPH0970687A (ja) * 1995-07-04 1997-03-18 Toyota Central Res & Dev Lab Inc 無鉛はんだ合金
WO1997009455A1 (en) 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
JP3874031B2 (ja) 1995-11-29 2007-01-31 内橋エステック株式会社 無鉛はんだ合金
KR980006783A (ko) 1996-05-13 1998-03-30 이. 힐러 윌리엄 저가의 위상 고정 모터 제어 방법 및 구조
JPH1071488A (ja) * 1996-08-29 1998-03-17 Mitsui Mining & Smelting Co Ltd 錫−銀系半田合金
KR19980068127A (ko) * 1997-02-15 1998-10-15 김광호 납땜용 무연 합금
JPH10314980A (ja) 1997-05-14 1998-12-02 Sony Corp はんだ材料
JP3719624B2 (ja) * 1997-06-07 2005-11-24 内橋エステック株式会社 電子部品実装用はんだ及び電子部品の実装方法
JPH11221694A (ja) 1998-02-06 1999-08-17 Hitachi Ltd 鉛フリーはんだを用いた実装構造体およびそれを用いた実装方法
CN1168571C (zh) * 1998-03-26 2004-09-29 斯比瑞尔社股份有限公司 无铅软钎焊料合金
JP2000141078A (ja) 1998-09-08 2000-05-23 Nippon Sheet Glass Co Ltd 無鉛ハンダ
JP2000153388A (ja) * 1998-09-14 2000-06-06 Murata Mfg Co Ltd はんだ付け物品
WO2000018536A1 (en) 1998-09-30 2000-04-06 Matsushita Electric Industrial Co., Ltd. Soldering material and electric/electronic device using the same
JP3753168B2 (ja) 1999-08-20 2006-03-08 千住金属工業株式会社 微小チップ部品接合用ソルダペースト
JP2001071173A (ja) * 1999-09-06 2001-03-21 Ishikawa Kinzoku Kk 無鉛はんだ
JP2002248596A (ja) * 2001-02-27 2002-09-03 Toshiba Tungaloy Co Ltd 耐酸化性に優れる鉛レス半田ボール
JP2002373824A (ja) * 2001-04-11 2002-12-26 Miura Gokin Kogyosho:Kk 金属化プラスチックフィルムコンデンサの外部電極用無鉛合金
SG139507A1 (en) * 2001-07-09 2008-02-29 Quantum Chem Tech Singapore Improvements in or relating to solders
TW504427B (en) * 2001-09-25 2002-10-01 Honeywell Int Inc Composition, methods and devices for high temperature lead-free solder
KR100366131B1 (ko) * 2001-11-21 2002-12-31 이재옥 드로스 발생이 적은 저융점 무연땜납
RU2219030C1 (ru) * 2002-05-27 2003-12-20 Открытое акционерное общество "ГАЗ" Припой для низкотемпературной пайки
US7282175B2 (en) * 2003-04-17 2007-10-16 Senju Metal Industry Co., Ltd. Lead-free solder
GB2431412B (en) * 2005-10-24 2009-10-07 Alpha Fry Ltd Lead-free solder alloy

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Publication number Priority date Publication date Assignee Title
KR20010043636A (ko) * 1999-03-16 2001-05-25 이즈하라 요조 무연 땜납
KR20030003030A (ko) * 2001-06-28 2003-01-09 센주긴조쿠고교 가부시키가이샤 납없는 땜납합금

Also Published As

Publication number Publication date
JP4048288B2 (ja) 2008-02-20
EP1815034B1 (en) 2008-12-17
AU2005298466A1 (en) 2006-05-04
US7472817B2 (en) 2009-01-06
NO333370B1 (no) 2013-05-13
HK1105668A1 (en) 2008-02-22
JP2006123001A (ja) 2006-05-18
DK1815034T3 (da) 2009-04-06
GB2406101A8 (en) 2005-11-07
GB0423860D0 (en) 2004-12-01
ATE417941T1 (de) 2009-01-15
US20070125834A1 (en) 2007-06-07
NO20072097L (no) 2007-06-06
GB2406101C (en) 2007-09-11
KR20070049229A (ko) 2007-05-10
IL180932A (en) 2013-03-24
CN101080505A (zh) 2007-11-28
US20060088439A1 (en) 2006-04-27
IL180932A0 (en) 2007-07-04
MX2007003369A (es) 2008-03-05
GB2406101A (en) 2005-03-23
RU2007116722A (ru) 2008-12-10
WO2006045995A8 (en) 2007-04-12
RU2356975C2 (ru) 2009-05-27
GB2406101B (en) 2006-08-02
CN100497693C (zh) 2009-06-10
MY136213A (en) 2008-08-29
BRPI0517384B1 (pt) 2017-06-27
DE602005011848D1 (de) 2009-01-29
EP1815034A1 (en) 2007-08-08
BRPI0517384A (pt) 2008-10-07
WO2006045995A1 (en) 2006-05-04
AU2005298466B2 (en) 2008-11-20

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