KR20070049229A - 솔더, 이의 제조 방법 및 이를 이용한 솔더링 방법 - Google Patents
솔더, 이의 제조 방법 및 이를 이용한 솔더링 방법 Download PDFInfo
- Publication number
- KR20070049229A KR20070049229A KR1020077007046A KR20077007046A KR20070049229A KR 20070049229 A KR20070049229 A KR 20070049229A KR 1020077007046 A KR1020077007046 A KR 1020077007046A KR 20077007046 A KR20077007046 A KR 20077007046A KR 20070049229 A KR20070049229 A KR 20070049229A
- Authority
- KR
- South Korea
- Prior art keywords
- copper
- solder
- tin
- alloys
- lead
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 98
- 230000006872 improvement Effects 0.000 title description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 62
- 239000010949 copper Substances 0.000 claims abstract description 62
- 229910052802 copper Inorganic materials 0.000 claims abstract description 60
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 58
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 35
- 239000010703 silicon Substances 0.000 claims abstract description 35
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052732 germanium Inorganic materials 0.000 claims abstract description 18
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 18
- 239000011574 phosphorus Substances 0.000 claims abstract description 18
- 239000000203 mixture Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 45
- 229910052718 tin Inorganic materials 0.000 claims description 35
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 28
- 238000005476 soldering Methods 0.000 claims description 12
- 239000011135 tin Substances 0.000 claims description 2
- 239000000956 alloy Substances 0.000 description 54
- 229910045601 alloy Inorganic materials 0.000 description 53
- 229910001128 Sn alloy Inorganic materials 0.000 description 19
- 230000032683 aging Effects 0.000 description 18
- 229910000881 Cu alloy Inorganic materials 0.000 description 12
- 229910000978 Pb alloy Inorganic materials 0.000 description 10
- 229910000676 Si alloy Inorganic materials 0.000 description 7
- 230000000704 physical effect Effects 0.000 description 7
- 238000009736 wetting Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 241000208152 Geranium Species 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical group [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Landscapes
- Mechanical Engineering (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
- Silicates, Zeolites, And Molecular Sieves (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Glass Compositions (AREA)
- Fats And Perfumes (AREA)
- Powder Metallurgy (AREA)
- Detergent Compositions (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Silicon Compounds (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (32)
- 약 96.8% 내지 약 99.3% 주석;약 0.2% 내지 약 3.0% 구리;및약 0.02% 내지 약 0.12% 규소를 포함하는 실질적인 무연 솔더.
- 제1항에 있어서, 약 0.005% 내지 약 0.01%의 인을 더 포함하는 실질적인 무연 솔더.
- 제2항에 있어서, 약 0.01% 인을 포함하는 실질적인 무연 솔더.
- 전 항중 어느 한 항에 있어서, 약 0.005% 내지 약 0.01%의 게르마늄을 더 포함하는 실질적인 무연 솔더.
- 제4항에 있어서, 약 0.01%의 게르마늄을 포함하는 실질적인 무연 솔더.
- 전 항중 어느 한 항에 있어서, 약 0.7% 내지 약 3.0%의 구리를 포함하는 실질적인 무연 솔더.
- 전 항중 어느 한 항에 있어서,약 0.7% 구리;및약 0.02% 규소를 포함하는 실질적인 무연 솔더.
- 전 항중 어느 한 항에 있어서, 약 0.7% 구리를 포함하는 실질적인 무연 솔더
- 제1항 내지 제6항 중 어느 한 항에 있어서, 약 2.0%의 구리를 포함하는 실질적인 무연 솔더.
- 제1항 내지 제6항 중 어느 한 항에 있어서, 약 3.0%의 구리를 포함하는 실질적인 무연 솔더.
- 상기 솔더내의 주석 비율은 약 96.8% 내지 약 99.3%;상기 솔더내의 구리 비율은 약 0.2% 내지 약 3.0%;및상기 솔더내의 규소의 비율은 약 0.02% 내지 약 0.12%이 되도록, 주석, 구리 및 규소를 혼합하는 단계를 포함하는 실질적인 무연 솔더의 제조 방법.
- 제11항에 있어서, 상기 솔더 혼합물에 약 0.005% 내지 약 0.01%의 인을 첨가하는 단계를 더 포함하는 실질적인 무연 솔더의 제조 방법.
- 제12항에 있어서, 상기 솔더 혼합물에 약 0.01%의 인을 첨가하는 단계를 포 함하는 실질적인 무연 솔더의 제조 방법.
- 제11항 내지 제13항 중 어느 한 항에 있어서, 상기 솔더 혼합물에 약 0.005% 내지 약 0.01%의 게르마늄을 첨가하는 단계를 더 포함하는 실질적인 무연 솔더의 제조 방법.
- 제14항에 있어서, 상기 솔더 혼합물에 약 0.01%의 게르마늄을 첨가하는 단계를 포함하는 실질적인 무연 솔더의 제조 방법.
- 제11항 내지 제15항 중 어느 한 항에 있어서, 약 0.7% 내지 약 3.0%의 구리를 첨가하는 단계를 포함하는 실질적인 무연 솔더의 제조 방법.
- 제11항 내지 제16항 중 어느 한 항에 있어서, 상기 솔더 혼합물에 약 0.7%의 구리 및 약 0.02%의 규소를 첨가하는 단계를 포함하는 실질적인 무연 솔더의 제조 방법.
- 제11항 내지 제17항 중 어느 한 항에 있어서, 약 0.7%의 구리를 첨가하는 단계를 포함하는 실질적인 무연 솔더의 제조 방법.
- 제11항 내지 제16항 중 어느 한 항에 있어서, 약 2.0%의 구리를 첨가하는 단 계를 포함하는 실질적인 무연 솔더의 제조 방법.
- 제11항 내지 제16항 중 어느 한 항에 있어서, 약 3.0%의 구리를 첨가하는 단계를 포함하는 실질적인 무연 솔더의 제조 방법.
- 실질적인 무연 솔더를 이용하는 단계를 포함하고, 상기 무연 솔더는:약 96.8% 내지 약 99.3% 주석;약 0.2% 내지 약 3.0% 구리;및약 0.02% 내지 약 0.12% 규소를 포함하는 솔더링 방법.
- 제21항에 있어서, 약 0.005% 내지 약 0.01% 인을 갖는 솔더를 이용하는 단계를 포함하는 솔더링 방법.
- 제22항에 있어서, 약 0.01%의 인을 갖는 솔더를 이용하는 단계를 포함하는 솔더링 방법.
- 제21항 내지 제23항 중 어느 한 항에 있어서, 약 0.005% 내지 약 0.01%의 게르마늄을 갖는 솔더를 이용하는 단계를 포함하는 솔더링 방법.
- 제24항에 있어서, 약 0.01%의 게르마늄을 갖는 솔더를 이용하는 단계를 포함 하는 솔더링 방법.
- 제21항 내지 제25항 중 어느 한 항에 있어서, 약 0.7% 내지 약 3.0% 의 구리를 첨가하는 단계를 포함하는 솔더링 방법.
- 제21항 내지 제26항 중 어느 한 항에 있어서, 약 0.7%의 구리 및 약 0.02%의 규소를 갖는 솔더를 이용하는 단계를 포함하는 솔더링 방법.
- 제21항 내지 제27항 중 어느 한 항에 있어서,약 0.7%의 구리를 첨가하는 단계를 포함하는 솔더링 방법.
- 제21항 내지 제26항 중 어느 한 항에 있어서, 약 2.0%의 구리를 첨가하는 단계를 포함하는 솔더링 방법.
- 제21항 내지 제26항 중 어느 한 항에 있어서, 약 3.0%의 구리를 첨가하는 단계를 포함하는 솔더링 방법.
- 실질적으로, 첨부도면을 참조하여, 이전에 상술된 솔더.
- 실질적으로, 첨부도면을 참조하여, 이전에 상술된 방법.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0423860A GB2406101C (en) | 2004-10-27 | 2004-10-27 | Improvements in ro relating to solders |
GB0423860.6 | 2004-10-27 | ||
PCT/GB2005/003338 WO2006045995A1 (en) | 2004-10-27 | 2005-08-26 | Improvements in or relating to solders |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070049229A true KR20070049229A (ko) | 2007-05-10 |
KR100886768B1 KR100886768B1 (ko) | 2009-03-04 |
Family
ID=33515637
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020077007046A KR100886768B1 (ko) | 2004-10-27 | 2005-08-26 | 솔더, 이의 제조 방법 및 이를 이용한 솔더링 방법 |
Country Status (18)
Country | Link |
---|---|
US (2) | US20060088439A1 (ko) |
EP (1) | EP1815034B1 (ko) |
JP (1) | JP4048288B2 (ko) |
KR (1) | KR100886768B1 (ko) |
CN (1) | CN100497693C (ko) |
AT (1) | ATE417941T1 (ko) |
AU (1) | AU2005298466B2 (ko) |
BR (1) | BRPI0517384B1 (ko) |
DE (1) | DE602005011848D1 (ko) |
DK (1) | DK1815034T3 (ko) |
GB (1) | GB2406101C (ko) |
HK (1) | HK1105668A1 (ko) |
IL (1) | IL180932A (ko) |
MX (1) | MX2007003369A (ko) |
MY (1) | MY136213A (ko) |
NO (1) | NO333370B1 (ko) |
RU (1) | RU2356975C2 (ko) |
WO (1) | WO2006045995A1 (ko) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8308053B2 (en) | 2005-08-31 | 2012-11-13 | Micron Technology, Inc. | Microfeature workpieces having alloyed conductive structures, and associated methods |
US7629249B2 (en) | 2006-08-28 | 2009-12-08 | Micron Technology, Inc. | Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods |
CN103008903A (zh) * | 2007-08-14 | 2013-04-03 | 株式会社爱科草英 | 无铅焊料组合物及使用它的印刷电路板与电子器件 |
WO2009022758A1 (en) * | 2007-08-14 | 2009-02-19 | Ecojoin | Pb-free solder compositions and pcb and electronic device using the same |
EP2179815A4 (en) * | 2007-08-24 | 2010-09-08 | Toshiba Kk | BINDING COMPOSITION |
CN101554684A (zh) * | 2009-05-19 | 2009-10-14 | 广州瀚源电子科技有限公司 | 一种无铅焊料的减渣方法 |
JP6008101B2 (ja) * | 2012-08-11 | 2016-10-19 | 千住金属工業株式会社 | 電力用はんだ |
JP5872114B1 (ja) * | 2014-04-30 | 2016-03-01 | 株式会社日本スペリア社 | 鉛フリーはんだ合金 |
RU2584357C1 (ru) * | 2014-11-26 | 2016-05-20 | Открытое акционерное общество "Композит" (ОАО "Композит") | Припой для пайки алюминия и его сплавов |
BE1025771B1 (nl) * | 2017-12-14 | 2019-07-08 | Metallo Belgium | Verbeterde koperproductiewerkwijze |
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TW251249B (ko) * | 1993-04-30 | 1995-07-11 | At & T Corp | |
JP3107483B2 (ja) * | 1993-07-13 | 2000-11-06 | 日本アルミット株式会社 | 無ないし低含鉛半田合金 |
US5410184A (en) * | 1993-10-04 | 1995-04-25 | Motorola | Microelectronic package comprising tin-copper solder bump interconnections, and method for forming same |
US5520752A (en) * | 1994-06-20 | 1996-05-28 | The United States Of America As Represented By The Secretary Of The Army | Composite solders |
JPH0970687A (ja) * | 1995-07-04 | 1997-03-18 | Toyota Central Res & Dev Lab Inc | 無鉛はんだ合金 |
WO1997009455A1 (en) | 1995-09-01 | 1997-03-13 | Sarnoff Corporation | Soldering composition |
JP3874031B2 (ja) | 1995-11-29 | 2007-01-31 | 内橋エステック株式会社 | 無鉛はんだ合金 |
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JPH10314980A (ja) | 1997-05-14 | 1998-12-02 | Sony Corp | はんだ材料 |
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JPH11221694A (ja) | 1998-02-06 | 1999-08-17 | Hitachi Ltd | 鉛フリーはんだを用いた実装構造体およびそれを用いた実装方法 |
JP2000141078A (ja) | 1998-09-08 | 2000-05-23 | Nippon Sheet Glass Co Ltd | 無鉛ハンダ |
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TW592872B (en) * | 2001-06-28 | 2004-06-21 | Senju Metal Industry Co | Lead-free solder alloy |
SG139507A1 (en) * | 2001-07-09 | 2008-02-29 | Quantum Chem Tech Singapore | Improvements in or relating to solders |
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-
2004
- 2004-10-27 GB GB0423860A patent/GB2406101C/en not_active Expired - Lifetime
-
2005
- 2005-01-28 US US11/046,417 patent/US20060088439A1/en not_active Abandoned
- 2005-02-25 JP JP2005050173A patent/JP4048288B2/ja active Active
- 2005-08-26 EP EP05775216A patent/EP1815034B1/en active Active
- 2005-08-26 CN CNB2005800365688A patent/CN100497693C/zh active Active
- 2005-08-26 DE DE602005011848T patent/DE602005011848D1/de active Active
- 2005-08-26 AU AU2005298466A patent/AU2005298466B2/en active Active
- 2005-08-26 AT AT05775216T patent/ATE417941T1/de not_active IP Right Cessation
- 2005-08-26 RU RU2007116722/02A patent/RU2356975C2/ru not_active IP Right Cessation
- 2005-08-26 WO PCT/GB2005/003338 patent/WO2006045995A1/en active Application Filing
- 2005-08-26 DK DK05775216T patent/DK1815034T3/da active
- 2005-08-26 KR KR1020077007046A patent/KR100886768B1/ko active IP Right Grant
- 2005-08-26 BR BRPI0517384-1A patent/BRPI0517384B1/pt active IP Right Grant
- 2005-08-26 MX MX2007003369A patent/MX2007003369A/es active IP Right Grant
- 2005-10-27 MY MYPI20055070A patent/MY136213A/en unknown
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2007
- 2007-01-24 IL IL180932A patent/IL180932A/en active IP Right Grant
- 2007-02-12 US US11/674,075 patent/US7472817B2/en active Active
- 2007-04-23 NO NO20072097A patent/NO333370B1/no not_active IP Right Cessation
- 2007-10-09 HK HK07110911.8A patent/HK1105668A1/xx unknown
Also Published As
Publication number | Publication date |
---|---|
WO2006045995A8 (en) | 2007-04-12 |
KR100886768B1 (ko) | 2009-03-04 |
GB2406101A (en) | 2005-03-23 |
CN101080505A (zh) | 2007-11-28 |
EP1815034B1 (en) | 2008-12-17 |
BRPI0517384A (pt) | 2008-10-07 |
MX2007003369A (es) | 2008-03-05 |
GB2406101A8 (en) | 2005-11-07 |
NO333370B1 (no) | 2013-05-13 |
GB2406101B (en) | 2006-08-02 |
AU2005298466A1 (en) | 2006-05-04 |
NO20072097L (no) | 2007-06-06 |
ATE417941T1 (de) | 2009-01-15 |
CN100497693C (zh) | 2009-06-10 |
GB0423860D0 (en) | 2004-12-01 |
JP4048288B2 (ja) | 2008-02-20 |
AU2005298466B2 (en) | 2008-11-20 |
HK1105668A1 (en) | 2008-02-22 |
RU2356975C2 (ru) | 2009-05-27 |
BRPI0517384B1 (pt) | 2017-06-27 |
IL180932A (en) | 2013-03-24 |
MY136213A (en) | 2008-08-29 |
IL180932A0 (en) | 2007-07-04 |
JP2006123001A (ja) | 2006-05-18 |
GB2406101C (en) | 2007-09-11 |
US7472817B2 (en) | 2009-01-06 |
EP1815034A1 (en) | 2007-08-08 |
RU2007116722A (ru) | 2008-12-10 |
DK1815034T3 (da) | 2009-04-06 |
DE602005011848D1 (de) | 2009-01-29 |
US20070125834A1 (en) | 2007-06-07 |
WO2006045995A1 (en) | 2006-05-04 |
US20060088439A1 (en) | 2006-04-27 |
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