NO20072097L - Forbedringer i eller relatert til loddinger - Google Patents

Forbedringer i eller relatert til loddinger

Info

Publication number
NO20072097L
NO20072097L NO20072097A NO20072097A NO20072097L NO 20072097 L NO20072097 L NO 20072097L NO 20072097 A NO20072097 A NO 20072097A NO 20072097 A NO20072097 A NO 20072097A NO 20072097 L NO20072097 L NO 20072097L
Authority
NO
Norway
Prior art keywords
approx
brazing
optionally
germanium
phosphorus
Prior art date
Application number
NO20072097A
Other languages
English (en)
Other versions
NO333370B1 (no
Inventor
Kaihwa Chew
Vincent Yue Sern Kho
Original Assignee
Quantum Chem Tech Singapore
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Quantum Chem Tech Singapore filed Critical Quantum Chem Tech Singapore
Publication of NO20072097L publication Critical patent/NO20072097L/no
Publication of NO333370B1 publication Critical patent/NO333370B1/no

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Silicates, Zeolites, And Molecular Sieves (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Silicon Compounds (AREA)
  • Powder Metallurgy (AREA)
  • Glass Compositions (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Fats And Perfumes (AREA)
  • Detergent Compositions (AREA)

Abstract

Et blyfritt loddemiddel, omfattende fra ca. 96,8 % til ca. 99,3 % tinn, fra ca. 0,2 % til ca. 3,0 % kobber, fra ca. 0,02 % til ca. 0,12 % silisium, eventuelt fra ca. 0,005 % til ca. 0,01 % fosfor, og eventuelt fra ca. 0,005 % til ca. 0,01 % germanium.
NO20072097A 2004-10-27 2007-04-23 Forbedringer i eller relatert til loddinger NO333370B1 (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0423860A GB2406101C (en) 2004-10-27 2004-10-27 Improvements in ro relating to solders
PCT/GB2005/003338 WO2006045995A1 (en) 2004-10-27 2005-08-26 Improvements in or relating to solders

Publications (2)

Publication Number Publication Date
NO20072097L true NO20072097L (no) 2007-06-06
NO333370B1 NO333370B1 (no) 2013-05-13

Family

ID=33515637

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20072097A NO333370B1 (no) 2004-10-27 2007-04-23 Forbedringer i eller relatert til loddinger

Country Status (18)

Country Link
US (2) US20060088439A1 (no)
EP (1) EP1815034B1 (no)
JP (1) JP4048288B2 (no)
KR (1) KR100886768B1 (no)
CN (1) CN100497693C (no)
AT (1) ATE417941T1 (no)
AU (1) AU2005298466B2 (no)
BR (1) BRPI0517384B1 (no)
DE (1) DE602005011848D1 (no)
DK (1) DK1815034T3 (no)
GB (1) GB2406101C (no)
HK (1) HK1105668A1 (no)
IL (1) IL180932A (no)
MX (1) MX2007003369A (no)
MY (1) MY136213A (no)
NO (1) NO333370B1 (no)
RU (1) RU2356975C2 (no)
WO (1) WO2006045995A1 (no)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8308053B2 (en) 2005-08-31 2012-11-13 Micron Technology, Inc. Microfeature workpieces having alloyed conductive structures, and associated methods
US7629249B2 (en) 2006-08-28 2009-12-08 Micron Technology, Inc. Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods
CN103008903A (zh) * 2007-08-14 2013-04-03 株式会社爱科草英 无铅焊料组合物及使用它的印刷电路板与电子器件
WO2009022758A1 (en) * 2007-08-14 2009-02-19 Ecojoin Pb-free solder compositions and pcb and electronic device using the same
EP2179815A4 (en) * 2007-08-24 2010-09-08 Toshiba Kk BINDING COMPOSITION
CN101554684A (zh) * 2009-05-19 2009-10-14 广州瀚源电子科技有限公司 一种无铅焊料的减渣方法
JP6008101B2 (ja) * 2012-08-11 2016-10-19 千住金属工業株式会社 電力用はんだ
KR20160147996A (ko) 2014-04-30 2016-12-23 가부시키가이샤 니혼슈페리어샤 무연솔더합금
RU2584357C1 (ru) * 2014-11-26 2016-05-20 Открытое акционерное общество "Композит" (ОАО "Композит") Припой для пайки алюминия и его сплавов
BE1025771B1 (nl) * 2017-12-14 2019-07-08 Metallo Belgium Verbeterde koperproductiewerkwijze

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2612035B1 (fr) * 1987-03-03 1989-05-26 Loire Electronique Machine de soudage a l'etain avec pare-vague automatique, pour cartes a circuit imprime
TW251249B (no) * 1993-04-30 1995-07-11 At & T Corp
JP3107483B2 (ja) * 1993-07-13 2000-11-06 日本アルミット株式会社 無ないし低含鉛半田合金
US5410184A (en) * 1993-10-04 1995-04-25 Motorola Microelectronic package comprising tin-copper solder bump interconnections, and method for forming same
US5520752A (en) * 1994-06-20 1996-05-28 The United States Of America As Represented By The Secretary Of The Army Composite solders
JPH0970687A (ja) * 1995-07-04 1997-03-18 Toyota Central Res & Dev Lab Inc 無鉛はんだ合金
WO1997009455A1 (en) 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
JP3874031B2 (ja) 1995-11-29 2007-01-31 内橋エステック株式会社 無鉛はんだ合金
KR980006783A (ko) 1996-05-13 1998-03-30 이. 힐러 윌리엄 저가의 위상 고정 모터 제어 방법 및 구조
JPH1071488A (ja) * 1996-08-29 1998-03-17 Mitsui Mining & Smelting Co Ltd 錫−銀系半田合金
KR19980068127A (ko) * 1997-02-15 1998-10-15 김광호 납땜용 무연 합금
JPH10314980A (ja) 1997-05-14 1998-12-02 Sony Corp はんだ材料
JP3719624B2 (ja) * 1997-06-07 2005-11-24 内橋エステック株式会社 電子部品実装用はんだ及び電子部品の実装方法
JPH11221694A (ja) 1998-02-06 1999-08-17 Hitachi Ltd 鉛フリーはんだを用いた実装構造体およびそれを用いた実装方法
JP2000141078A (ja) 1998-09-08 2000-05-23 Nippon Sheet Glass Co Ltd 無鉛ハンダ
JP2000153388A (ja) * 1998-09-14 2000-06-06 Murata Mfg Co Ltd はんだ付け物品
WO2000018536A1 (fr) 1998-09-30 2000-04-06 Matsushita Electric Industrial Co., Ltd. Materiau de brasage et dispositif electrique/electronique utilisant celui-ci
JP2000326088A (ja) * 1999-03-16 2000-11-28 Nippon Sheet Glass Co Ltd 無鉛ハンダ
JP3753168B2 (ja) 1999-08-20 2006-03-08 千住金属工業株式会社 微小チップ部品接合用ソルダペースト
JP2001071173A (ja) * 1999-09-06 2001-03-21 Ishikawa Kinzoku Kk 無鉛はんだ
JP2002248596A (ja) * 2001-02-27 2002-09-03 Toshiba Tungaloy Co Ltd 耐酸化性に優れる鉛レス半田ボール
JP2002373824A (ja) * 2001-04-11 2002-12-26 Miura Gokin Kogyosho:Kk 金属化プラスチックフィルムコンデンサの外部電極用無鉛合金
US20030021718A1 (en) * 2001-06-28 2003-01-30 Osamu Munekata Lead-free solder alloy
SG139507A1 (en) * 2001-07-09 2008-02-29 Quantum Chem Tech Singapore Improvements in or relating to solders
KR100366131B1 (ko) * 2001-11-21 2002-12-31 이재옥 드로스 발생이 적은 저융점 무연땜납
US7282175B2 (en) * 2003-04-17 2007-10-16 Senju Metal Industry Co., Ltd. Lead-free solder
GB2431412B (en) * 2005-10-24 2009-10-07 Alpha Fry Ltd Lead-free solder alloy

Also Published As

Publication number Publication date
GB2406101C (en) 2007-09-11
GB2406101B (en) 2006-08-02
US20070125834A1 (en) 2007-06-07
HK1105668A1 (en) 2008-02-22
AU2005298466B2 (en) 2008-11-20
JP4048288B2 (ja) 2008-02-20
US7472817B2 (en) 2009-01-06
CN100497693C (zh) 2009-06-10
GB2406101A (en) 2005-03-23
KR20070049229A (ko) 2007-05-10
RU2007116722A (ru) 2008-12-10
AU2005298466A1 (en) 2006-05-04
DK1815034T3 (da) 2009-04-06
CN101080505A (zh) 2007-11-28
RU2356975C2 (ru) 2009-05-27
IL180932A0 (en) 2007-07-04
WO2006045995A1 (en) 2006-05-04
GB0423860D0 (en) 2004-12-01
DE602005011848D1 (de) 2009-01-29
NO333370B1 (no) 2013-05-13
MX2007003369A (es) 2008-03-05
ATE417941T1 (de) 2009-01-15
GB2406101A8 (en) 2005-11-07
IL180932A (en) 2013-03-24
EP1815034A1 (en) 2007-08-08
JP2006123001A (ja) 2006-05-18
EP1815034B1 (en) 2008-12-17
BRPI0517384A (pt) 2008-10-07
WO2006045995A8 (en) 2007-04-12
BRPI0517384B1 (pt) 2017-06-27
US20060088439A1 (en) 2006-04-27
MY136213A (en) 2008-08-29
KR100886768B1 (ko) 2009-03-04

Similar Documents

Publication Publication Date Title
NO20072097L (no) Forbedringer i eller relatert til loddinger
EP1825011A4 (en) LEAD-FREE SOLDERING ALLOY
EP1889684A4 (en) LEAD FREE BRAZING ALLOY
PL1841561T3 (pl) Stop lutowniczy
GB2433944B (en) Solder alloy
AU2003209129A8 (en) Lead-free tin-silver-copper alloy solder composition
DE602005020940D1 (de) Au-sn-legierungspulver für lötpaste
DK1784367T3 (da) Blyfrie og cadmiumfrie ledende tykfilmpastaer
DK1864132T3 (da) Fra amnion stammende cellesammensætninger, fremgangsmåder til fremstilling deraf og anvendelser deraf
EP1824638A4 (en) LEAD-FREE LOT ALLOY
EP1930117A4 (en) LOW TEMPERATURE WELDING PASTE WITHOUT LEAD
DK1774566T3 (da) Sammensætninger til afgivelse af kviksölv og fremgangsmåde til fremstilling deraf
EP1772225A4 (en) LEAD-FREE SOLDERING ALLOY
WO2007027428A3 (en) Technique for increasing the compliance of tin-indium solders
ZA200308375B (en) Non-Biochemical method to heap leach copper concentrates.
HK1096628A1 (en) Pb-free solder alloy compositions comprising essentially tin (sn), silver (ag), copper (cu), and phosphorus (p)
DK1820380T3 (da) Loddepasta-skabelon og fremgangsmåde til fremstilling af heraf
TW200722397A (en) Glass substrate for semiconductor devices, and chip scale package using the same
GB2431412B (en) Lead-free solder alloy
HK1082372A2 (en) Pb-free solder alloy compositions comprising essentially tin(sn), silver (ag), copper(cu), and phos phorus(p)
EP1980355A4 (en) LEAD FREE BRAZING ALLOY
WO2007045191A3 (en) Lead-free solder alloy
NO20054557D0 (no) Kobberlegering
RU2007142301A (ru) Металломатричный композит
TW200711778A (en) Solder alloy, and electronic substrate making use of the solder alloy and process for producing the same

Legal Events

Date Code Title Description
CREP Change of representative

Representative=s name: PROTECTOR INTELLECTUAL PROPERTY CONSULTANTS AS, PO

MM1K Lapsed by not paying the annual fees