PL1841561T3 - Stop lutowniczy - Google Patents
Stop lutowniczyInfo
- Publication number
- PL1841561T3 PL1841561T3 PL05811506T PL05811506T PL1841561T3 PL 1841561 T3 PL1841561 T3 PL 1841561T3 PL 05811506 T PL05811506 T PL 05811506T PL 05811506 T PL05811506 T PL 05811506T PL 1841561 T3 PL1841561 T3 PL 1841561T3
- Authority
- PL
- Poland
- Prior art keywords
- solder alloy
- solder
- alloy
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/06—Making non-ferrous alloys with the use of special agents for refining or deoxidising
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0426383A GB2421030B (en) | 2004-12-01 | 2004-12-01 | Solder alloy |
US71091505P | 2005-08-24 | 2005-08-24 | |
PCT/GB2005/004609 WO2006059115A1 (en) | 2004-12-01 | 2005-12-01 | Solder alloy |
EP05811506.4A EP1841561B1 (en) | 2004-12-01 | 2005-12-01 | Solder alloy |
Publications (1)
Publication Number | Publication Date |
---|---|
PL1841561T3 true PL1841561T3 (pl) | 2016-01-29 |
Family
ID=34043880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL05811506T PL1841561T3 (pl) | 2004-12-01 | 2005-12-01 | Stop lutowniczy |
Country Status (11)
Country | Link |
---|---|
US (2) | US9221131B2 (pl) |
EP (1) | EP1841561B1 (pl) |
JP (1) | JP5147409B2 (pl) |
KR (1) | KR101345677B1 (pl) |
CN (1) | CN101132881B (pl) |
BR (1) | BRPI0518780B1 (pl) |
CA (1) | CA2589259C (pl) |
GB (1) | GB2421030B (pl) |
MX (1) | MX2007006353A (pl) |
PL (1) | PL1841561T3 (pl) |
WO (1) | WO2006059115A1 (pl) |
Families Citing this family (82)
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CZ297596B6 (cs) * | 2005-10-19 | 2007-01-10 | JenĂk@Jan | Bezolovnatá pájka |
US8143722B2 (en) * | 2006-10-05 | 2012-03-27 | Flipchip International, Llc | Wafer-level interconnect for high mechanical reliability applications |
CN100439027C (zh) * | 2007-01-18 | 2008-12-03 | 广州有色金属研究院 | 适用于铜铝异种金属软钎焊的无铅焊料合金 |
US8502086B2 (en) * | 2007-05-17 | 2013-08-06 | Fujikura Ltd. | Laminated wiring board and method for manufacturing the same |
CN103008903A (zh) * | 2007-08-14 | 2013-04-03 | 株式会社爱科草英 | 无铅焊料组合物及使用它的印刷电路板与电子器件 |
CN101848787B (zh) * | 2007-08-14 | 2013-10-23 | 株式会社爱科草英 | 无铅焊料组合物及使用它的印刷电路板与电子器件 |
US20110091351A1 (en) * | 2007-08-24 | 2011-04-21 | Than Trong Long | Bonding composition |
US7847399B2 (en) * | 2007-12-07 | 2010-12-07 | Texas Instruments Incorporated | Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles |
CN101952081B (zh) * | 2008-02-22 | 2016-01-13 | 日本斯倍利亚社股份有限公司 | 含有Ni的无铅焊料的Ni浓度调节方法 |
WO2009131178A1 (ja) * | 2008-04-23 | 2009-10-29 | 千住金属工業株式会社 | 引け巣が抑制された鉛フリーはんだ合金 |
KR101184234B1 (ko) * | 2008-04-23 | 2012-09-19 | 센주긴조쿠고교 가부시키가이샤 | 납프리 땜납 |
JP5379402B2 (ja) * | 2008-05-12 | 2013-12-25 | 株式会社弘輝 | 鉛フリーSn−Ag系半田合金及び半田合金粉末 |
JP5362719B2 (ja) * | 2008-06-23 | 2013-12-11 | パナソニック株式会社 | 接合構造および電子部品の製造方法 |
US8013444B2 (en) * | 2008-12-24 | 2011-09-06 | Intel Corporation | Solder joints with enhanced electromigration resistance |
KR100968173B1 (ko) * | 2009-12-23 | 2010-07-07 | 코리아 오토글라스 주식회사 | 자동차 유리 솔더링용 무연 솔더 조성물 |
CN101780608B (zh) * | 2010-04-12 | 2011-09-21 | 天津市恒固科技有限公司 | 一种含Si和Ge的SnAgCu系无铅焊料 |
CN101927410B (zh) * | 2010-09-16 | 2012-10-17 | 上海交通大学 | Sn-Ag-Zn-Bi-Cr无铅焊料 |
CN101920406B (zh) * | 2010-09-16 | 2012-05-09 | 上海交通大学 | Sn-Ag-Zn-Cr共晶无铅焊料 |
CN102172805B (zh) * | 2011-01-18 | 2013-01-02 | 哈尔滨理工大学 | 一种电子封装用低成本抗老化钎料及其制备方法 |
CN102085604A (zh) * | 2011-03-04 | 2011-06-08 | 上海交通大学 | Sn-Ag-Cu-Bi-Cr低银无铅焊料 |
WO2012127642A1 (ja) * | 2011-03-23 | 2012-09-27 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
KR101275302B1 (ko) | 2011-08-11 | 2013-06-17 | 엠케이전자 주식회사 | 주석계 솔더볼 및 이를 포함하는 반도체 패키지 |
KR101283580B1 (ko) * | 2011-12-14 | 2013-07-05 | 엠케이전자 주식회사 | 주석계 솔더 볼 및 이를 포함하는 반도체 패키지 |
CN102554504B (zh) * | 2011-12-28 | 2013-11-06 | 常熟市华银焊料有限公司 | 含镨、锆和镓的自钎性银钎料 |
CN102581516A (zh) * | 2012-03-27 | 2012-07-18 | 郑州机械研究所 | 一种超塑性铜磷焊条及其制备方法 |
JP5238088B1 (ja) * | 2012-06-29 | 2013-07-17 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
WO2014002304A1 (ja) * | 2012-06-29 | 2014-01-03 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
WO2014013632A1 (ja) | 2012-07-19 | 2014-01-23 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
KR101438897B1 (ko) * | 2012-08-13 | 2014-09-17 | 현대자동차주식회사 | 유리용 무연솔더 조성물 |
MY179941A (en) | 2012-10-09 | 2020-11-19 | Alpha Metals | Lead-free and antimony-free tin solder reliable at high temperatures |
CN102848100B (zh) * | 2012-10-10 | 2015-03-25 | 南京航空航天大学 | 含Nd、Ga的低银Sn-Ag-Cu无铅钎料 |
CN102896438B (zh) * | 2012-10-22 | 2014-10-08 | 王志祥 | 一种铜锌钎料及其制备方法 |
US20140284794A1 (en) * | 2012-11-07 | 2014-09-25 | Mk Electron Co., Ltd. | Tin-based solder ball and semiconductor package including the same |
CN103008919B (zh) * | 2012-12-13 | 2015-05-27 | 郴州金箭焊料有限公司 | 一种低银无卤无铅焊锡膏 |
CN102974953B (zh) * | 2012-12-17 | 2015-03-11 | 南京航空航天大学 | 含Fe和Nd的Sn-Cu-Co无铅钎料 |
CN103042315B (zh) * | 2013-01-22 | 2015-05-27 | 马莒生 | 耐热耐湿低熔点无铅焊料合金 |
JPWO2014142153A1 (ja) * | 2013-03-13 | 2017-02-16 | 株式会社日本スペリア社 | はんだ接合物及びはんだ接合方法 |
ES2706479T3 (es) | 2013-03-19 | 2019-03-29 | Nippon A&L Inc | Copolímero de látex para adhesivo y composición adhesiva |
CN103212919A (zh) * | 2013-03-22 | 2013-07-24 | 宁波市鄞州品达电器焊料有限公司 | 一种改进的无铅焊锡丝及其助焊剂 |
US10180035B2 (en) | 2013-04-01 | 2019-01-15 | Schlumberger Technology Corporation | Soldered components for downhole use |
US9320152B2 (en) | 2013-05-29 | 2016-04-19 | Nippon Steel & Sumikin Materials Co., Ltd. | Solder ball and electronic member |
CN103381526B (zh) * | 2013-06-22 | 2016-02-03 | 宁波市鄞州品达电器焊料有限公司 | 一种新型焊料 |
JP5730354B2 (ja) * | 2013-07-17 | 2015-06-10 | ハリマ化成株式会社 | はんだ組成物、ソルダペーストおよび電子回路基板 |
CN103480978A (zh) * | 2013-09-29 | 2014-01-01 | 宁波市鄞州恒迅电子材料有限公司 | 环保无铅防电极溶出焊锡丝 |
JP2016537206A (ja) * | 2013-10-31 | 2016-12-01 | アルファ・メタルズ・インコーポレイテッドAlpha Metals, Inc. | 鉛フリーかつ銀フリーのはんだ合金 |
WO2015105089A1 (ja) * | 2014-01-07 | 2015-07-16 | 株式会社村田製作所 | 補修方法および補修材 |
JP5872114B1 (ja) * | 2014-04-30 | 2016-03-01 | 株式会社日本スペリア社 | 鉛フリーはんだ合金 |
WO2015198496A1 (ja) | 2014-06-24 | 2015-12-30 | ハリマ化成株式会社 | はんだ合金、はんだ組成物、ソルダペーストおよび電子回路基板 |
CN106660153A (zh) * | 2014-07-21 | 2017-05-10 | 阿尔法装配解决方案公司 | 用于焊接的低温高可靠性锡合金 |
CN104400248A (zh) * | 2014-10-24 | 2015-03-11 | 云南锡业锡材有限公司 | 一种光伏用锡合金焊料、制备方法及用途 |
JP6648468B2 (ja) * | 2014-10-29 | 2020-02-14 | Tdk株式会社 | Pbフリーはんだ及び電子部品内蔵モジュール |
JP5723056B1 (ja) * | 2014-12-15 | 2015-05-27 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
CN104439751A (zh) * | 2014-12-24 | 2015-03-25 | 深圳市亿铖达工业有限公司 | 新型低熔点无铅焊料 |
CN104942474B (zh) * | 2015-07-06 | 2017-04-05 | 江苏科技大学 | 一种含锡、硅、锌和镨的无镉银钎料及其制备方法 |
CN105057910A (zh) * | 2015-07-29 | 2015-11-18 | 瑞声光电科技(常州)有限公司 | Sn-Zn系无铅钎料及其制备方法 |
JP6011709B1 (ja) * | 2015-11-30 | 2016-10-19 | 千住金属工業株式会社 | はんだ合金 |
KR101865727B1 (ko) * | 2016-03-22 | 2018-06-08 | 현대자동차 주식회사 | 무연 솔더 조성물 |
JP6755546B2 (ja) * | 2016-08-09 | 2020-09-16 | 株式会社日本スペリア社 | 接合方法 |
CN106181111A (zh) * | 2016-08-16 | 2016-12-07 | 镇江市锶达合金材料有限公司 | 一种高性能铜铝复合焊料 |
JP6365653B2 (ja) * | 2016-08-19 | 2018-08-01 | 千住金属工業株式会社 | はんだ合金、はんだ継手およびはんだ付け方法 |
GB2557439B (en) * | 2016-10-24 | 2021-06-30 | Jaguar Land Rover Ltd | Apparatus and method relating to electrochemical migration |
KR101941866B1 (ko) * | 2016-12-19 | 2019-01-25 | 에이에치코리아 주식회사 | 전자부품용 솔더 크림 |
CN106956091A (zh) * | 2017-05-02 | 2017-07-18 | 泰州朗瑞新能源科技有限公司 | 一种焊接材料及其制备方法 |
KR102247498B1 (ko) * | 2017-07-07 | 2021-05-03 | 덕산하이메탈(주) | 솔더 합금, 솔더볼 및 그 제조방법 |
JP6292342B1 (ja) * | 2017-09-20 | 2018-03-14 | 千住金属工業株式会社 | Cu管及び/又はFe管接合用はんだ合金、プリフォームはんだ、やに入りはんだおよびはんだ継手 |
CN108080810A (zh) * | 2017-12-13 | 2018-05-29 | 柳州智臻智能机械有限公司 | 一种电子封装用焊料合金及其制备方法 |
CN112518167A (zh) * | 2018-04-04 | 2021-03-19 | 史国民 | 耐腐蚀低温焊接材料 |
CN111936264A (zh) * | 2018-04-13 | 2020-11-13 | 千住金属工业株式会社 | 焊膏 |
JP6439893B1 (ja) * | 2018-05-25 | 2018-12-19 | 千住金属工業株式会社 | ハンダボール、ハンダ継手および接合方法 |
CN108941971B (zh) * | 2018-08-16 | 2020-12-18 | 广东省科学院中乌焊接研究所 | 一种免清洗水性锡膏及其制备方法 |
CN108994479B (zh) * | 2018-08-24 | 2020-08-07 | 温州市星峰新材料有限公司 | 一种耐腐蚀高强度的焊接材料及其制造方法 |
KR102187085B1 (ko) * | 2019-01-24 | 2020-12-04 | 주식회사 경동엠텍 | 고온 및 진동환경에 적합한 무연솔더 합금 조성물 및 그 제조방법 |
JP6649595B1 (ja) * | 2019-05-27 | 2020-02-19 | 千住金属工業株式会社 | はんだ合金、はんだ粉末、はんだペースト、およびこれらを用いたはんだ継手 |
JP6721851B1 (ja) * | 2019-06-28 | 2020-07-15 | 千住金属工業株式会社 | はんだ合金、鋳造物、形成物およびはんだ継手 |
JP6700568B1 (ja) * | 2019-08-09 | 2020-05-27 | 千住金属工業株式会社 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ball Grid Arrayおよびはんだ継手 |
JP6912742B1 (ja) * | 2020-02-14 | 2021-08-04 | 千住金属工業株式会社 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手 |
CN111702280B (zh) * | 2020-05-13 | 2021-09-24 | 中国科学院金属研究所 | Ti2AlNb基合金同材或异材钎焊专用中温Ti基钎料及其制备方法和钎焊工艺 |
JP6889387B1 (ja) * | 2020-06-23 | 2021-06-18 | 千住金属工業株式会社 | はんだ合金、ソルダペースト、はんだボール、ソルダプリフォーム、はんだ継手、車載電子回路、ecu電子回路、車載電子回路装置、及びecu電子回路装置 |
CN113182726A (zh) * | 2021-04-07 | 2021-07-30 | 河南鸿昌电子有限公司 | 一种焊接半导体所用的焊锡和焊锡的使用方法 |
CN114871628A (zh) * | 2022-05-31 | 2022-08-09 | 杭州华光焊接新材料股份有限公司 | 一种低银高强度无铅锡基钎料及其制备方法 |
CN115365699A (zh) * | 2022-09-19 | 2022-11-22 | 云南锡业锡材有限公司 | 一种焊点无微裂纹Sn-Ag-Cu系无铅焊料合金及制备方法 |
CN115815872B (zh) * | 2023-01-09 | 2023-06-27 | 广州汉源新材料股份有限公司 | 一种无铅无锑强化焊料合金及其制备方法 |
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JP2003051729A (ja) * | 2001-08-06 | 2003-02-21 | Tdk Corp | 積層型フィルタアレイ |
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JP4144415B2 (ja) * | 2003-01-07 | 2008-09-03 | 千住金属工業株式会社 | 鉛フリーはんだ |
US7282175B2 (en) * | 2003-04-17 | 2007-10-16 | Senju Metal Industry Co., Ltd. | Lead-free solder |
DE10319888A1 (de) * | 2003-04-25 | 2004-11-25 | Siemens Ag | Lotmaterial auf SnAgCu-Basis |
-
2004
- 2004-12-01 GB GB0426383A patent/GB2421030B/en not_active Ceased
-
2005
- 2005-12-01 JP JP2007543916A patent/JP5147409B2/ja active Active
- 2005-12-01 EP EP05811506.4A patent/EP1841561B1/en active Active
- 2005-12-01 MX MX2007006353A patent/MX2007006353A/es active IP Right Grant
- 2005-12-01 KR KR1020077015074A patent/KR101345677B1/ko active IP Right Grant
- 2005-12-01 WO PCT/GB2005/004609 patent/WO2006059115A1/en active Application Filing
- 2005-12-01 CN CN200580045736XA patent/CN101132881B/zh active Active
- 2005-12-01 BR BRPI0518780-0A patent/BRPI0518780B1/pt active IP Right Grant
- 2005-12-01 PL PL05811506T patent/PL1841561T3/pl unknown
- 2005-12-01 US US11/720,578 patent/US9221131B2/en active Active
- 2005-12-01 CA CA2589259A patent/CA2589259C/en active Active
-
2015
- 2015-12-22 US US14/977,853 patent/US20160107267A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
BRPI0518780B1 (pt) | 2012-12-11 |
US20080292492A1 (en) | 2008-11-27 |
JP2008521619A (ja) | 2008-06-26 |
CN101132881A (zh) | 2008-02-27 |
MX2007006353A (es) | 2008-01-22 |
KR101345677B1 (ko) | 2013-12-30 |
GB0426383D0 (en) | 2005-01-05 |
WO2006059115A1 (en) | 2006-06-08 |
CN101132881B (zh) | 2011-02-09 |
JP5147409B2 (ja) | 2013-02-20 |
CA2589259C (en) | 2014-11-18 |
KR20070118588A (ko) | 2007-12-17 |
US9221131B2 (en) | 2015-12-29 |
GB2421030A (en) | 2006-06-14 |
GB2421030B (en) | 2008-03-19 |
EP1841561A1 (en) | 2007-10-10 |
US20160107267A1 (en) | 2016-04-21 |
EP1841561B1 (en) | 2015-08-12 |
BRPI0518780A2 (pt) | 2008-12-09 |
CA2589259A1 (en) | 2006-06-08 |
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