TW200722397A - Glass substrate for semiconductor devices, and chip scale package using the same - Google Patents

Glass substrate for semiconductor devices, and chip scale package using the same

Info

Publication number
TW200722397A
TW200722397A TW095113033A TW95113033A TW200722397A TW 200722397 A TW200722397 A TW 200722397A TW 095113033 A TW095113033 A TW 095113033A TW 95113033 A TW95113033 A TW 95113033A TW 200722397 A TW200722397 A TW 200722397A
Authority
TW
Taiwan
Prior art keywords
glass substrate
chip scale
scale package
same
semiconductor devices
Prior art date
Application number
TW095113033A
Other languages
Chinese (zh)
Other versions
TWI428305B (en
Inventor
Masahiro Kobayashi
Shinkichi Miwa
Original Assignee
Nippon Electric Glass Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Glass Co filed Critical Nippon Electric Glass Co
Publication of TW200722397A publication Critical patent/TW200722397A/en
Application granted granted Critical
Publication of TWI428305B publication Critical patent/TWI428305B/en

Links

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Glass Compositions (AREA)

Abstract

The glass substrate for a semiconductor device is used for the semiconductor device on the front surface of which wiring is arranged comprising a metal film. The content of a halogen element is equal to or less than 0.1% by mass% conversion. In the chip scale package, a semiconductor device is arranged between two glass substrates. The content of the halogen element of at least one glass substrate is equal to or less than 0.1% by mass% conversion.
TW95113033A 2005-05-10 2006-04-12 A semiconductor substrate for a semiconductor element, and a print size thereof TWI428305B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005136962 2005-05-10
JP2006072485A JP5348598B2 (en) 2005-05-10 2006-03-16 Glass substrate for semiconductor device and chip scale package using the same

Publications (2)

Publication Number Publication Date
TW200722397A true TW200722397A (en) 2007-06-16
TWI428305B TWI428305B (en) 2014-03-01

Family

ID=37641628

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95113033A TWI428305B (en) 2005-05-10 2006-04-12 A semiconductor substrate for a semiconductor element, and a print size thereof

Country Status (2)

Country Link
JP (1) JP5348598B2 (en)
TW (1) TWI428305B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10011519B2 (en) 2013-08-09 2018-07-03 Nippon Electric Glass Co., Ltd. Bismuth-based glass composition, powder material, and powder material paste
TWI644881B (en) * 2013-09-12 2018-12-21 日商日本電氣硝子股份有限公司 Carrier and manufacturing method of semiconductor assembly package

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7666511B2 (en) * 2007-05-18 2010-02-23 Corning Incorporated Down-drawable, chemically strengthened glass for cover plate
KR101446971B1 (en) * 2009-03-19 2014-10-06 니폰 덴키 가라스 가부시키가이샤 Alkali-free glass
CN102844858A (en) * 2010-04-20 2012-12-26 旭硝子株式会社 Glass substrate for forming semiconductor device via
JP5732758B2 (en) * 2010-07-13 2015-06-10 旭硝子株式会社 Cover glass for solid-state imaging device
US11951713B2 (en) 2020-12-10 2024-04-09 Corning Incorporated Glass with unique fracture behavior for vehicle windshield

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0818845B2 (en) * 1987-11-11 1996-02-28 日本板硝子株式会社 Glass substrate for electronic equipment
JP2000001330A (en) * 1998-04-14 2000-01-07 Hoya Corp Circuit board material
JP3796202B2 (en) * 2002-07-05 2006-07-12 三洋電機株式会社 Manufacturing method of semiconductor integrated device
JP2004091244A (en) * 2002-08-30 2004-03-25 Nippon Electric Glass Co Ltd Alkali-free glass substrate and method for manufacturing the same
JP4401066B2 (en) * 2002-11-19 2010-01-20 三洋電機株式会社 Semiconductor integrated device and manufacturing method thereof
JP4378769B2 (en) * 2003-09-18 2009-12-09 日本電気硝子株式会社 Glass substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10011519B2 (en) 2013-08-09 2018-07-03 Nippon Electric Glass Co., Ltd. Bismuth-based glass composition, powder material, and powder material paste
TWI644881B (en) * 2013-09-12 2018-12-21 日商日本電氣硝子股份有限公司 Carrier and manufacturing method of semiconductor assembly package

Also Published As

Publication number Publication date
TWI428305B (en) 2014-03-01
JP2006344927A (en) 2006-12-21
JP5348598B2 (en) 2013-11-20

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