TW200722397A - Glass substrate for semiconductor devices, and chip scale package using the same - Google Patents
Glass substrate for semiconductor devices, and chip scale package using the sameInfo
- Publication number
- TW200722397A TW200722397A TW095113033A TW95113033A TW200722397A TW 200722397 A TW200722397 A TW 200722397A TW 095113033 A TW095113033 A TW 095113033A TW 95113033 A TW95113033 A TW 95113033A TW 200722397 A TW200722397 A TW 200722397A
- Authority
- TW
- Taiwan
- Prior art keywords
- glass substrate
- chip scale
- scale package
- same
- semiconductor devices
- Prior art date
Links
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Glass Compositions (AREA)
Abstract
The glass substrate for a semiconductor device is used for the semiconductor device on the front surface of which wiring is arranged comprising a metal film. The content of a halogen element is equal to or less than 0.1% by mass% conversion. In the chip scale package, a semiconductor device is arranged between two glass substrates. The content of the halogen element of at least one glass substrate is equal to or less than 0.1% by mass% conversion.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005136962 | 2005-05-10 | ||
JP2006072485A JP5348598B2 (en) | 2005-05-10 | 2006-03-16 | Glass substrate for semiconductor device and chip scale package using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200722397A true TW200722397A (en) | 2007-06-16 |
TWI428305B TWI428305B (en) | 2014-03-01 |
Family
ID=37641628
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95113033A TWI428305B (en) | 2005-05-10 | 2006-04-12 | A semiconductor substrate for a semiconductor element, and a print size thereof |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5348598B2 (en) |
TW (1) | TWI428305B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10011519B2 (en) | 2013-08-09 | 2018-07-03 | Nippon Electric Glass Co., Ltd. | Bismuth-based glass composition, powder material, and powder material paste |
TWI644881B (en) * | 2013-09-12 | 2018-12-21 | 日商日本電氣硝子股份有限公司 | Carrier and manufacturing method of semiconductor assembly package |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7666511B2 (en) * | 2007-05-18 | 2010-02-23 | Corning Incorporated | Down-drawable, chemically strengthened glass for cover plate |
KR101446971B1 (en) * | 2009-03-19 | 2014-10-06 | 니폰 덴키 가라스 가부시키가이샤 | Alkali-free glass |
CN102844858A (en) * | 2010-04-20 | 2012-12-26 | 旭硝子株式会社 | Glass substrate for forming semiconductor device via |
JP5732758B2 (en) * | 2010-07-13 | 2015-06-10 | 旭硝子株式会社 | Cover glass for solid-state imaging device |
US11951713B2 (en) | 2020-12-10 | 2024-04-09 | Corning Incorporated | Glass with unique fracture behavior for vehicle windshield |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0818845B2 (en) * | 1987-11-11 | 1996-02-28 | 日本板硝子株式会社 | Glass substrate for electronic equipment |
JP2000001330A (en) * | 1998-04-14 | 2000-01-07 | Hoya Corp | Circuit board material |
JP3796202B2 (en) * | 2002-07-05 | 2006-07-12 | 三洋電機株式会社 | Manufacturing method of semiconductor integrated device |
JP2004091244A (en) * | 2002-08-30 | 2004-03-25 | Nippon Electric Glass Co Ltd | Alkali-free glass substrate and method for manufacturing the same |
JP4401066B2 (en) * | 2002-11-19 | 2010-01-20 | 三洋電機株式会社 | Semiconductor integrated device and manufacturing method thereof |
JP4378769B2 (en) * | 2003-09-18 | 2009-12-09 | 日本電気硝子株式会社 | Glass substrate |
-
2006
- 2006-03-16 JP JP2006072485A patent/JP5348598B2/en active Active
- 2006-04-12 TW TW95113033A patent/TWI428305B/en active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10011519B2 (en) | 2013-08-09 | 2018-07-03 | Nippon Electric Glass Co., Ltd. | Bismuth-based glass composition, powder material, and powder material paste |
TWI644881B (en) * | 2013-09-12 | 2018-12-21 | 日商日本電氣硝子股份有限公司 | Carrier and manufacturing method of semiconductor assembly package |
Also Published As
Publication number | Publication date |
---|---|
TWI428305B (en) | 2014-03-01 |
JP2006344927A (en) | 2006-12-21 |
JP5348598B2 (en) | 2013-11-20 |
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