CN100497693C - 焊料的或者与焊料有关的改进 - Google Patents

焊料的或者与焊料有关的改进 Download PDF

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Publication number
CN100497693C
CN100497693C CNB2005800365688A CN200580036568A CN100497693C CN 100497693 C CN100497693 C CN 100497693C CN B2005800365688 A CNB2005800365688 A CN B2005800365688A CN 200580036568 A CN200580036568 A CN 200580036568A CN 100497693 C CN100497693 C CN 100497693C
Authority
CN
China
Prior art keywords
copper
solder
tin
alloys
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB2005800365688A
Other languages
English (en)
Chinese (zh)
Other versions
CN101080505A (zh
Inventor
周家华
许喻胜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Quantum Chemical Technologies Singapore Pte Ltd
Singapore Asahi Chemical and Solder Industries Pte Ltd
Original Assignee
Quantum Chemical Technologies Singapore Pte Ltd
Singapore Asahi Chemical and Solder Industries Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Quantum Chemical Technologies Singapore Pte Ltd, Singapore Asahi Chemical and Solder Industries Pte Ltd filed Critical Quantum Chemical Technologies Singapore Pte Ltd
Publication of CN101080505A publication Critical patent/CN101080505A/zh
Application granted granted Critical
Publication of CN100497693C publication Critical patent/CN100497693C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Silicates, Zeolites, And Molecular Sieves (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Glass Compositions (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Powder Metallurgy (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Silicon Compounds (AREA)
  • Fats And Perfumes (AREA)
  • Detergent Compositions (AREA)
CNB2005800365688A 2004-10-27 2005-08-26 焊料的或者与焊料有关的改进 Expired - Lifetime CN100497693C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0423860A GB2406101C (en) 2004-10-27 2004-10-27 Improvements in ro relating to solders
GB0423860.6 2004-10-27

Publications (2)

Publication Number Publication Date
CN101080505A CN101080505A (zh) 2007-11-28
CN100497693C true CN100497693C (zh) 2009-06-10

Family

ID=33515637

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005800365688A Expired - Lifetime CN100497693C (zh) 2004-10-27 2005-08-26 焊料的或者与焊料有关的改进

Country Status (17)

Country Link
US (2) US20060088439A1 (https=)
EP (1) EP1815034B1 (https=)
JP (1) JP4048288B2 (https=)
KR (1) KR100886768B1 (https=)
CN (1) CN100497693C (https=)
AT (1) ATE417941T1 (https=)
AU (1) AU2005298466B2 (https=)
BR (1) BRPI0517384B1 (https=)
DE (1) DE602005011848D1 (https=)
DK (1) DK1815034T3 (https=)
GB (1) GB2406101C (https=)
IL (1) IL180932A (https=)
MX (1) MX2007003369A (https=)
MY (1) MY136213A (https=)
NO (1) NO333370B1 (https=)
RU (1) RU2356975C2 (https=)
WO (1) WO2006045995A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8308053B2 (en) 2005-08-31 2012-11-13 Micron Technology, Inc. Microfeature workpieces having alloyed conductive structures, and associated methods
US7629249B2 (en) 2006-08-28 2009-12-08 Micron Technology, Inc. Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods
CN103008903A (zh) * 2007-08-14 2013-04-03 株式会社爱科草英 无铅焊料组合物及使用它的印刷电路板与电子器件
WO2009022758A1 (en) * 2007-08-14 2009-02-19 Ecojoin Pb-free solder compositions and pcb and electronic device using the same
WO2009028147A1 (ja) * 2007-08-24 2009-03-05 Kabushiki Kaisha Toshiba 接合用組成物
CN101554684A (zh) * 2009-05-19 2009-10-14 广州瀚源电子科技有限公司 一种无铅焊料的减渣方法
RU2441736C1 (ru) * 2010-11-24 2012-02-10 Открытое акционерное общество "Всероссийский институт легких сплавов" (ОАО "ВИЛС") Припой для пайки алюминия и его сплавов
JP6008101B2 (ja) * 2012-08-11 2016-10-19 千住金属工業株式会社 電力用はんだ
EP3138658B1 (en) 2014-04-30 2020-11-04 Nihon Superior Co., Ltd. Lead-free solder alloy
RU2584357C1 (ru) * 2014-11-26 2016-05-20 Открытое акционерное общество "Композит" (ОАО "Композит") Припой для пайки алюминия и его сплавов
BE1025771B1 (nl) * 2017-12-14 2019-07-08 Metallo Belgium Verbeterde koperproductiewerkwijze

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1262638A (zh) * 1998-03-26 2000-08-09 斯比瑞尔社股份有限公司 无铅软钎焊料合金
WO2003026828A2 (en) * 2001-09-25 2003-04-03 Honeywell International Inc. Improved compositions, methods and devices for high temperature lead-free solder

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FR2612035B1 (fr) * 1987-03-03 1989-05-26 Loire Electronique Machine de soudage a l'etain avec pare-vague automatique, pour cartes a circuit imprime
TW251249B (https=) * 1993-04-30 1995-07-11 At & T Corp
JP3107483B2 (ja) * 1993-07-13 2000-11-06 日本アルミット株式会社 無ないし低含鉛半田合金
US5410184A (en) * 1993-10-04 1995-04-25 Motorola Microelectronic package comprising tin-copper solder bump interconnections, and method for forming same
US5520752A (en) * 1994-06-20 1996-05-28 The United States Of America As Represented By The Secretary Of The Army Composite solders
JPH0970687A (ja) * 1995-07-04 1997-03-18 Toyota Central Res & Dev Lab Inc 無鉛はんだ合金
WO1997009455A1 (en) 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
JP3874031B2 (ja) 1995-11-29 2007-01-31 内橋エステック株式会社 無鉛はんだ合金
KR980006783A (ko) 1996-05-13 1998-03-30 이. 힐러 윌리엄 저가의 위상 고정 모터 제어 방법 및 구조
JPH1071488A (ja) * 1996-08-29 1998-03-17 Mitsui Mining & Smelting Co Ltd 錫−銀系半田合金
KR19980068127A (ko) * 1997-02-15 1998-10-15 김광호 납땜용 무연 합금
JPH10314980A (ja) 1997-05-14 1998-12-02 Sony Corp はんだ材料
JP3719624B2 (ja) * 1997-06-07 2005-11-24 内橋エステック株式会社 電子部品実装用はんだ及び電子部品の実装方法
JPH11221694A (ja) 1998-02-06 1999-08-17 Hitachi Ltd 鉛フリーはんだを用いた実装構造体およびそれを用いた実装方法
JP2000141078A (ja) 1998-09-08 2000-05-23 Nippon Sheet Glass Co Ltd 無鉛ハンダ
JP2000153388A (ja) * 1998-09-14 2000-06-06 Murata Mfg Co Ltd はんだ付け物品
WO2000018536A1 (en) 1998-09-30 2000-04-06 Matsushita Electric Industrial Co., Ltd. Soldering material and electric/electronic device using the same
JP2000326088A (ja) * 1999-03-16 2000-11-28 Nippon Sheet Glass Co Ltd 無鉛ハンダ
JP3753168B2 (ja) 1999-08-20 2006-03-08 千住金属工業株式会社 微小チップ部品接合用ソルダペースト
JP2001071173A (ja) * 1999-09-06 2001-03-21 Ishikawa Kinzoku Kk 無鉛はんだ
JP2002248596A (ja) * 2001-02-27 2002-09-03 Toshiba Tungaloy Co Ltd 耐酸化性に優れる鉛レス半田ボール
JP2002373824A (ja) * 2001-04-11 2002-12-26 Miura Gokin Kogyosho:Kk 金属化プラスチックフィルムコンデンサの外部電極用無鉛合金
US20030021718A1 (en) * 2001-06-28 2003-01-30 Osamu Munekata Lead-free solder alloy
SG139507A1 (en) * 2001-07-09 2008-02-29 Quantum Chem Tech Singapore Improvements in or relating to solders
KR100366131B1 (ko) * 2001-11-21 2002-12-31 이재옥 드로스 발생이 적은 저융점 무연땜납
RU2219030C1 (ru) * 2002-05-27 2003-12-20 Открытое акционерное общество "ГАЗ" Припой для низкотемпературной пайки
US7282175B2 (en) * 2003-04-17 2007-10-16 Senju Metal Industry Co., Ltd. Lead-free solder
GB2431412B (en) * 2005-10-24 2009-10-07 Alpha Fry Ltd Lead-free solder alloy

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1262638A (zh) * 1998-03-26 2000-08-09 斯比瑞尔社股份有限公司 无铅软钎焊料合金
WO2003026828A2 (en) * 2001-09-25 2003-04-03 Honeywell International Inc. Improved compositions, methods and devices for high temperature lead-free solder

Also Published As

Publication number Publication date
JP4048288B2 (ja) 2008-02-20
EP1815034B1 (en) 2008-12-17
AU2005298466A1 (en) 2006-05-04
US7472817B2 (en) 2009-01-06
NO333370B1 (no) 2013-05-13
HK1105668A1 (en) 2008-02-22
JP2006123001A (ja) 2006-05-18
DK1815034T3 (da) 2009-04-06
GB2406101A8 (en) 2005-11-07
GB0423860D0 (en) 2004-12-01
ATE417941T1 (de) 2009-01-15
US20070125834A1 (en) 2007-06-07
NO20072097L (no) 2007-06-06
GB2406101C (en) 2007-09-11
KR20070049229A (ko) 2007-05-10
IL180932A (en) 2013-03-24
CN101080505A (zh) 2007-11-28
US20060088439A1 (en) 2006-04-27
IL180932A0 (en) 2007-07-04
MX2007003369A (es) 2008-03-05
GB2406101A (en) 2005-03-23
RU2007116722A (ru) 2008-12-10
WO2006045995A8 (en) 2007-04-12
RU2356975C2 (ru) 2009-05-27
GB2406101B (en) 2006-08-02
MY136213A (en) 2008-08-29
BRPI0517384B1 (pt) 2017-06-27
KR100886768B1 (ko) 2009-03-04
DE602005011848D1 (de) 2009-01-29
EP1815034A1 (en) 2007-08-08
BRPI0517384A (pt) 2008-10-07
WO2006045995A1 (en) 2006-05-04
AU2005298466B2 (en) 2008-11-20

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SE01 Entry into force of request for substantive examination
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GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20090610

CX01 Expiry of patent term