KR100776466B1 - 플렉서블 프린트 배선 기판 및 플렉서블 프린트 배선기판의 제조방법 및 반도체 장치 - Google Patents

플렉서블 프린트 배선 기판 및 플렉서블 프린트 배선기판의 제조방법 및 반도체 장치 Download PDF

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KR100776466B1
KR100776466B1 KR1020060025363A KR20060025363A KR100776466B1 KR 100776466 B1 KR100776466 B1 KR 100776466B1 KR 1020060025363 A KR1020060025363 A KR 1020060025363A KR 20060025363 A KR20060025363 A KR 20060025363A KR 100776466 B1 KR100776466 B1 KR 100776466B1
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South Korea
Prior art keywords
wiring pattern
cover layer
flexible printed
layer film
film
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KR1020060025363A
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English (en)
Korean (ko)
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KR20060102281A (ko
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켄 사카타
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미쓰이 긴조꾸 고교 가부시키가이샤
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Publication of KR20060102281A publication Critical patent/KR20060102281A/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/143—Digital devices
    • H01L2924/1433—Application-specific integrated circuit [ASIC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020060025363A 2005-03-22 2006-03-20 플렉서블 프린트 배선 기판 및 플렉서블 프린트 배선기판의 제조방법 및 반도체 장치 KR100776466B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00081581 2005-03-22
JP2005081581A JP4628154B2 (ja) 2005-03-22 2005-03-22 フレキシブルプリント配線基板、および半導体装置

Publications (2)

Publication Number Publication Date
KR20060102281A KR20060102281A (ko) 2006-09-27
KR100776466B1 true KR100776466B1 (ko) 2007-11-16

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060025363A KR100776466B1 (ko) 2005-03-22 2006-03-20 플렉서블 프린트 배선 기판 및 플렉서블 프린트 배선기판의 제조방법 및 반도체 장치

Country Status (5)

Country Link
US (1) US20060214282A1 (zh)
JP (1) JP4628154B2 (zh)
KR (1) KR100776466B1 (zh)
CN (1) CN1838860A (zh)
TW (1) TWI347158B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3983786B2 (ja) * 2005-11-15 2007-09-26 シャープ株式会社 プリント配線基板
US8013254B2 (en) * 2008-02-15 2011-09-06 Gigalane Co. Ltd. Printed circuit board
WO2013011873A1 (ja) * 2011-07-20 2013-01-24 株式会社カネカ 新規な導電層一体型ｆｐｃ
JP6375015B1 (ja) * 2017-04-25 2018-08-15 住友化学株式会社 有機電子デバイスの製造方法
JP6375016B1 (ja) 2017-04-26 2018-08-15 住友化学株式会社 電極付き基板、積層基板及び有機デバイスの製造方法
KR102622861B1 (ko) 2018-06-22 2024-01-10 삼성디스플레이 주식회사 연성 기판 및 이를 포함하는 표시 장치
CN112105155B (zh) * 2020-08-20 2022-01-11 瑞声新能源发展(常州)有限公司科教城分公司 一种片式fpc及其制作方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000331730A (ja) 1999-05-20 2000-11-30 Canon Inc スタッキングコネクタ実装構造
JP2003282650A (ja) 2002-03-27 2003-10-03 Mitsui Mining & Smelting Co Ltd 電子部品実装用フィルムキャリアテープ、その製造方法、その製造装置およびその方法に用いられる保護テープ

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02191392A (ja) * 1989-01-19 1990-07-27 Hitachi Chem Co Ltd フレキシブル配線板の製造方法及び装置
JP2678327B2 (ja) * 1991-02-15 1997-11-17 住友金属鉱山株式会社 フレキシブル配線基板およびその製造方法
JPH10261849A (ja) * 1997-03-19 1998-09-29 Fujitsu Ltd フレキシブルプリント基板および接続プリント基板構造
JPH1145913A (ja) * 1997-05-26 1999-02-16 Seiko Epson Corp フィルムキャリアおよび半導体装置
US6320135B1 (en) * 1999-02-03 2001-11-20 Casio Computer Co., Ltd. Flexible wiring substrate and its manufacturing method
JP2000332369A (ja) * 1999-05-25 2000-11-30 Mitsui Mining & Smelting Co Ltd プリント回路板及びその製造方法
EP1085788A3 (en) * 1999-09-14 2003-01-02 Seiko Epson Corporation Composite flexible wiring board, method of manufacturing the same, electro-optical device, and electronic equipment
US6496026B1 (en) * 2000-02-25 2002-12-17 Microconnect, Inc. Method of manufacturing and testing an electronic device using a contact device having fingers and a mechanical ground
JP3694286B2 (ja) * 2002-10-08 2005-09-14 日東電工株式会社 Ｔａｂ用テープキャリア
JP3638276B2 (ja) * 2002-12-24 2005-04-13 三井金属鉱業株式会社 電子部品実装用フィルムキャリアテープ
JP3895697B2 (ja) * 2003-03-03 2007-03-22 日東電工株式会社 フレキシブル配線回路基板
US7012017B2 (en) * 2004-01-29 2006-03-14 3M Innovative Properties Company Partially etched dielectric film with conductive features

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000331730A (ja) 1999-05-20 2000-11-30 Canon Inc スタッキングコネクタ実装構造
JP2003282650A (ja) 2002-03-27 2003-10-03 Mitsui Mining & Smelting Co Ltd 電子部品実装用フィルムキャリアテープ、その製造方法、その製造装置およびその方法に用いられる保護テープ

Also Published As

Publication number Publication date
JP4628154B2 (ja) 2011-02-09
TW200640317A (en) 2006-11-16
US20060214282A1 (en) 2006-09-28
JP2006269495A (ja) 2006-10-05
TWI347158B (en) 2011-08-11
CN1838860A (zh) 2006-09-27
KR20060102281A (ko) 2006-09-27

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