TWI347158B - Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor device - Google Patents

Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor device

Info

Publication number
TWI347158B
TWI347158B TW095109424A TW95109424A TWI347158B TW I347158 B TWI347158 B TW I347158B TW 095109424 A TW095109424 A TW 095109424A TW 95109424 A TW95109424 A TW 95109424A TW I347158 B TWI347158 B TW I347158B
Authority
TW
Taiwan
Prior art keywords
wiring board
printed wiring
flexible printed
semiconductor device
fabricating
Prior art date
Application number
TW095109424A
Other languages
English (en)
Other versions
TW200640317A (en
Inventor
Ken Sakata
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200640317A publication Critical patent/TW200640317A/zh
Application granted granted Critical
Publication of TWI347158B publication Critical patent/TWI347158B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/143—Digital devices
    • H01L2924/1433—Application-specific integrated circuit [ASIC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW095109424A 2005-03-22 2006-03-20 Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor device TWI347158B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005081581A JP4628154B2 (ja) 2005-03-22 2005-03-22 フレキシブルプリント配線基板、および半導体装置

Publications (2)

Publication Number Publication Date
TW200640317A TW200640317A (en) 2006-11-16
TWI347158B true TWI347158B (en) 2011-08-11

Family

ID=37016070

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095109424A TWI347158B (en) 2005-03-22 2006-03-20 Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor device

Country Status (5)

Country Link
US (1) US20060214282A1 (zh)
JP (1) JP4628154B2 (zh)
KR (1) KR100776466B1 (zh)
CN (1) CN1838860A (zh)
TW (1) TWI347158B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3983786B2 (ja) * 2005-11-15 2007-09-26 シャープ株式会社 プリント配線基板
JP5424417B2 (ja) * 2008-02-15 2014-02-26 ギガレーン・カンパニー・リミテッド 印刷回路基板
JP6343449B2 (ja) * 2011-07-20 2018-06-13 株式会社カネカ 新規な導電層一体型ｆｐｃ
JP6375015B1 (ja) * 2017-04-25 2018-08-15 住友化学株式会社 有機電子デバイスの製造方法
JP6375016B1 (ja) 2017-04-26 2018-08-15 住友化学株式会社 電極付き基板、積層基板及び有機デバイスの製造方法
KR102622861B1 (ko) 2018-06-22 2024-01-10 삼성디스플레이 주식회사 연성 기판 및 이를 포함하는 표시 장치
CN112105155B (zh) * 2020-08-20 2022-01-11 瑞声新能源发展(常州)有限公司科教城分公司 一种片式fpc及其制作方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02191392A (ja) * 1989-01-19 1990-07-27 Hitachi Chem Co Ltd フレキシブル配線板の製造方法及び装置
US5288950A (en) * 1991-02-15 1994-02-22 Sumitomo Metal Mining Company Limited Flexible wiring board and method of preparing the same
JPH10261849A (ja) * 1997-03-19 1998-09-29 Fujitsu Ltd フレキシブルプリント基板および接続プリント基板構造
JPH1145913A (ja) * 1997-05-26 1999-02-16 Seiko Epson Corp フィルムキャリアおよび半導体装置
US6320135B1 (en) * 1999-02-03 2001-11-20 Casio Computer Co., Ltd. Flexible wiring substrate and its manufacturing method
JP2000332369A (ja) * 1999-05-25 2000-11-30 Mitsui Mining & Smelting Co Ltd プリント回路板及びその製造方法
JP2000331730A (ja) 1999-05-20 2000-11-30 Canon Inc スタッキングコネクタ実装構造
EP1085788A3 (en) * 1999-09-14 2003-01-02 Seiko Epson Corporation Composite flexible wiring board, method of manufacturing the same, electro-optical device, and electronic equipment
US6496026B1 (en) * 2000-02-25 2002-12-17 Microconnect, Inc. Method of manufacturing and testing an electronic device using a contact device having fingers and a mechanical ground
JP3775329B2 (ja) 2002-03-27 2006-05-17 三井金属鉱業株式会社 電子部品実装用フィルムキャリアテープの製造方法、その製造装置およびその方法に用いられる保護テープ
JP3694286B2 (ja) * 2002-10-08 2005-09-14 日東電工株式会社 Ｔａｂ用テープキャリア
JP3638276B2 (ja) * 2002-12-24 2005-04-13 三井金属鉱業株式会社 電子部品実装用フィルムキャリアテープ
JP3895697B2 (ja) * 2003-03-03 2007-03-22 日東電工株式会社 フレキシブル配線回路基板
US7012017B2 (en) * 2004-01-29 2006-03-14 3M Innovative Properties Company Partially etched dielectric film with conductive features

Also Published As

Publication number Publication date
JP2006269495A (ja) 2006-10-05
KR100776466B1 (ko) 2007-11-16
JP4628154B2 (ja) 2011-02-09
CN1838860A (zh) 2006-09-27
US20060214282A1 (en) 2006-09-28
KR20060102281A (ko) 2006-09-27
TW200640317A (en) 2006-11-16

Similar Documents

Publication Publication Date Title
TWI315553B (en) Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor device
GB2437465B (en) Multilayer wiring board, method for manufacturing such multilayer wiring board, and semiconductor device, and electronic device using multilayer wiring board
TWI371997B (en) Printed wiring board and method for manufacturing the same
EP1850648A4 (en) Multilayer printed circuit board for a semiconductor device and manufacturing method therefor
TWI351013B (en) Light-emitting device, circuit for driving the same, and electronic apparatus
TWI350584B (en) Wiring board and semiconductor apparatus
EP1928218A4 (en) FLEXIBLE PRINTED BOARD AND METHOD FOR MANUFACTURING THE SAME
EP2068605A4 (en) CIRCUIT BOARD
HK1123886A1 (en) Printed wiring board with built-in semiconductor element, and process for producing the same
EP1921675A4 (en) PRINTED CIRCUIT BOARD AND SEMICONDUCTOR MODULE USING THE SAME, MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD
HK1135556A1 (en) Printed wiring board and method for manufacturing the same
GB2418808B (en) Electronic device
EP2071907A4 (en) FLEXORIGID PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE FLEXORIGID PRINTED CIRCUIT BOARD
EP1909324A4 (en) THERMAL DISSIPATION WIRING BOARD, ITS MANUFACTURING METHOD AND ELECTRICAL DEVICE EMPLOYING THE SAME
EP1945013A4 (en) MULTILAYER PRINTED CIRCUIT WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
EP1854342A4 (en) FLEXIBLE ELECTRONIC DEVICE
EP1793599A4 (en) ELECTRONIC EQUIPMENT
EP1821183A4 (en) ELECTRONIC EQUIPMENT
EP1887845A4 (en) CIRCUIT BOARD
EP1739525A4 (en) ELECTRONIC EQUIPMENT
TWI318409B (en) Memory controller, integrated circuit memory device, electronic system, memory integrated circuit and memory device
EP1863326A4 (en) CIRCUIT BOARD
EP2046103A4 (en) FLEXIBLE PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE MOUNTED WITH THE SAME, AND FLEXIBLE PRINTED CIRCUIT PLATE FOLDING METHOD
EP2053462A4 (en) ELECTRONIC CIRCUIT ARRANGEMENT AND METHOD FOR THE PRODUCTION THEREOF
EP2020023A4 (en) METHOD FOR PRODUCING C4 COMPOUNDS ON IC CHIPS AND COMPONENTS PRODUCED THEREFOR

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees