KR100675466B1 - 수지봉지 성형장치 - Google Patents

수지봉지 성형장치 Download PDF

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Publication number
KR100675466B1
KR100675466B1 KR20040084461A KR20040084461A KR100675466B1 KR 100675466 B1 KR100675466 B1 KR 100675466B1 KR 20040084461 A KR20040084461 A KR 20040084461A KR 20040084461 A KR20040084461 A KR 20040084461A KR 100675466 B1 KR100675466 B1 KR 100675466B1
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KR
South Korea
Prior art keywords
unit
resin
molded article
molding apparatus
press
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KR20040084461A
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English (en)
Korean (ko)
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KR20050041890A (ko
Inventor
켄지 오가타
유이치 타나카
Original Assignee
다이-이치 세이코 가부시키가이샤
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Application filed by 다이-이치 세이코 가부시키가이샤 filed Critical 다이-이치 세이코 가부시키가이샤
Publication of KR20050041890A publication Critical patent/KR20050041890A/ko
Application granted granted Critical
Publication of KR100675466B1 publication Critical patent/KR100675466B1/ko

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KR20040084461A 2003-10-30 2004-10-21 수지봉지 성형장치 KR100675466B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003370707A JP3609824B1 (ja) 2003-10-30 2003-10-30 樹脂封止成形装置
JPJP-P-2003-00370707 2003-10-30

Publications (2)

Publication Number Publication Date
KR20050041890A KR20050041890A (ko) 2005-05-04
KR100675466B1 true KR100675466B1 (ko) 2007-01-26

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ID=34101303

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20040084461A KR100675466B1 (ko) 2003-10-30 2004-10-21 수지봉지 성형장치

Country Status (5)

Country Link
JP (1) JP3609824B1 (zh)
KR (1) KR100675466B1 (zh)
CN (1) CN100366414C (zh)
HK (1) HK1074816A1 (zh)
TW (1) TWI251885B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3926379B1 (ja) * 2006-10-25 2007-06-06 株式会社エヌ．エフ．テイ 樹脂モールド装置
CN102785326A (zh) * 2011-05-19 2012-11-21 深圳市安托山特种机电有限公司 一种新型封装材料注射机
JP5387646B2 (ja) * 2011-10-07 2014-01-15 第一精工株式会社 樹脂封止装置
JP5866398B2 (ja) * 2013-05-15 2016-02-17 東芝機械株式会社 成形システム及び成形品の製造方法
JP6218549B2 (ja) * 2013-10-17 2017-10-25 Ｔｏｗａ株式会社 半導体封止型への半導体基板供給方法及び半導体基板供給装置
JP7335647B2 (ja) * 2018-08-10 2023-08-30 アピックヤマダ株式会社 ワーク搬送装置及び樹脂モールド装置
JP7068094B2 (ja) * 2018-08-10 2022-05-16 アピックヤマダ株式会社 ワーク搬送装置、樹脂搬送装置及び樹脂モールド方法
JP7203414B2 (ja) * 2018-12-27 2023-01-13 アピックヤマダ株式会社 樹脂供給取出装置、ワーク搬送装置及び樹脂モールド装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06830A (ja) * 1992-06-22 1994-01-11 Toshiba Corp モールドシステム
TW257745B (zh) * 1993-07-22 1995-09-21 Towa Kk
TW410194B (en) * 1996-08-20 2000-11-01 Apic Yamada Kk Resin molding machine
TW509615B (en) * 2000-04-21 2002-11-11 Apic Yamada Corp Resin molding machine and resin tablet feeding machine
JP4327986B2 (ja) * 2000-04-21 2009-09-09 アピックヤマダ株式会社 樹脂封止装置

Also Published As

Publication number Publication date
JP2005136193A (ja) 2005-05-26
CN1611339A (zh) 2005-05-04
CN100366414C (zh) 2008-02-06
TW200529335A (en) 2005-09-01
HK1074816A1 (en) 2005-11-25
JP3609824B1 (ja) 2005-01-12
TWI251885B (en) 2006-03-21
KR20050041890A (ko) 2005-05-04

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