TW200529335A - Resin sealing molding apparatus - Google Patents

Abstract

To provide a low-cost, small-size resin sealing molding apparatus that can easily carry out multi-sort small quantity production as well as variable quantity production. For achieving this object, an inloader unit 800 and an unloader unit 900 are radially disposed in a manner so as to form a right angle with an axis 702 of rotation of a loader unit 700 as the center, and integrated with each other. The inloader unit 800 and the unloader unit 900 are supported so as to be integrally rotatable with the axis 702 of rotation of the loader unit 700 as the center.

Description

200529335 IX. Description of the invention: [Minghu Jinxuanbei] Field of the invention The present invention relates to an electronic part, especially a chip semiconductor 5 device (hereinafter referred to as a semiconductor wafer) and a beautiful board on which the semiconductor device is mounted. Resin sealing molding device that seals and molds together with a resin material. L Er Zhi Zhi Shou U U BACKGROUND OF THE INVENTION In recent years, 10 electronic devices such as computers, mobile phones, digital cameras, and home appliances can be seen. In order to make the difference with competitive products more significant, there are more specialized electronic components. The tendency. In addition, as the development period of new products has been shortened, lowered in price, and increased in functionality, the need for replacement has increased. Therefore, the life of electronic equipment has gradually been shortened. Therefore, the production of electronic parts requires many varieties and small amounts, and the output can be changed. 15 In recent years, in response to the miniaturization, diversification, and price reduction of electronic devices, high-density packaging, high performance, and low cost of electronic components used in these electronic devices have been required. Therefore, a package group (FB GA, FLGA, SON, QFN, etc.) has been developed in which so-called cSP (ChipSize Parage) and resin-sealed semiconductor devices have been reduced in size, thickness, and multi-terminals. These packaging groups are manufactured using the MAP method (MatrixAn ^

Packagmg meth〇d), this method is to arrange a plurality of f semiconductor 7L pieces on one side of a substrate and electrically connect them, and then refining and sealing, cutting and separating along the outer periphery of each packet, thereby obtaining Single packet. According to this method, for example, 1,000 semiconductor wafers 200529335 can be mounted on one substrate, and 1000 semiconductor wafers can be resin-sealed by a single resin sealing molding. However, in the operation of electrically connecting semiconductor wafers mounted on a high-density substrate, if the conventional wire bonding method is used, the time required for the 5-wire bonding process of a single substrate is too long, and only one hour can be produced. Film situation. Therefore, there is a problem that the standby time of the resin-sealed molding apparatus is increased because several substrates are sealed with resin. In response to these problems, in order to produce a large variety of products in small quantities and to change the production capacity, the latest resin sealing molding equipment includes mold units that can increase or decrease the minimum number of constituent units as shown in Fig. 14 (see Patent Document 1). That is, the resin-sealed molding apparatus includes a resin-sealed lead frame supply unit i on which electronic components are mounted, a lead-frame alignment unit 2 that arranges the resin-sealed lead frame in a predetermined direction, a resin sheet supply unit 3, and resin sheets in a row. Removable resin sheet removal unit 4, mold unit 5 for sealing electronic parts into 15 shapes with resin, transfer of lead frames and resin sheets to loading unit 6 of the mold unit 5 above, for taking out and forming Unloading sheet of resin-sealed lead frame it 7, mold cleaning unit 8, transfer unit for transferring resin-sealed lead frame 9, removal unit for removing the mouth of resin-sealed lead frame 1 2. The picking unit n for engaging the resin-sealed lead-frames that have been removed from the washing mouth, and the resin-sealed lead-frames that are engaged are respectively housed in each! The lead frame accommodating unit 12 in the body, the control unit 13 for continuously and automatically controlling the operations of the above units, and the like. In addition, as shown in Fig. 15 (see Patent Document 2), a resin sealing and molding apparatus capable of producing a large variety and a small number of mold units can be used. 200529335 That is, the aforementioned resin seal forming device has a material filling portion 22 for filling the lead frame before molding, a lead frame preheating portion 23 for heating the lead frame 21 supplied in advance from the material filling portion 22, and the lead before molding. The in-line formation portion 24 of the frame, the resin sheet supply mechanism 26, 5 for supplying the resin sheet 25, and the resin sheet formation portion 27 in which the resin sheet 25 supplied from the above-mentioned supply mechanism 26 are aligned, are mounted on the above-mentioned The resin sealing and molding portion 28 (the mold for resin sealing and molding) of the electronic components of the lead frame 21 before molding is sealed with a resin material, and the pre-molding lead frame 21 and the resin sheet 25 are transferred to the two rows (24, 27). The material of the predetermined position of the resin-sealed-molded part 28 is provided to a feeding mechanism 29 (loader), and a molded product storage part for storing a molded product (sealed-completed lead frame 30) formed by the resin-sealed molded part 28. 31. The unnecessary resin molded body 32 (unnecessary hardened material) cut and removed in the product connected to the above-mentioned molded article is removed and the unnecessary resin molded body cutting and removing portion 33 (gate cut portion) is formed. 30 and the unnecessary resin molded body 15 32 are transferred to the unnecessary resin molded body cutting and removing portion 33, and the molded product transfer mechanism 34 (unloader) that transfers the molded product 3G to the molded product storage portion% A cleaning mechanism 35 for cleaning the mold surface of the above-mentioned mold, and a control mechanism for automatically controlling each of these departments and institutions. Patent Document 1 Patent No. 2932136 No. 20 Patent Document 2 JP-A No. 9-314612, and in the resin molding apparatus of Patent Document 1, the lead frame and the resin sheet are moved to the load sheet I of the mold sheet 70 and used. The unloading units that take out the ν wire frame that has been sealed with the resin after molding are individually driven structures. In addition, the transfer unit and the pick-up unit are installed separately from the loading unit and the unloading unit in 200529335, and are driven separately. Therefore, each unit needs an independent structure and driving device. In addition, it takes time and time to adjust each other when changing the variety of each unit. In addition, the aforementioned resin sealing device has a problem that it is difficult to miniaturize the entire device because the mold unit has a structure capable of being detachably mounted in response to mass production. In addition, the resin sealing and molding apparatus of Patent Document 2 has a problem in that since the material supply mechanism (loader) and the molded product transfer mechanism (unloader) are separately driven structures, an expensive driving mechanism, Driving device. In addition, since the lead frame, the material supply mechanism, and the 10-shaped product transfer mechanism are disposed on the front surface of the resin-sealed molding device before molding, the entire device is lengthened and cannot be miniaturized. [Meichi ^^ j Summary of the Invention In view of the above-mentioned problems, the present invention aims to provide a resin-sealed molding device that can be easily produced with a large variety of products, can be produced at a variable output, and has a low cost and a small size. In order to achieve the aforementioned object, the resin sealing and molding apparatus of the present invention includes a pressurizing unit, a molded article supply unit for supplying a molded product, a resin material supply unit for supplying a resin material, and a molded product for the pressing unit 2 The loading unit of 〇, the unloading unit for taking out the resin-sealed completed molded product from the pressurizing unit, the molded product storage unit for storing the resin-sealed completed molded product, and disposing the aforementioned loading unit and unloading unit in a radial shape The rotation axis center is used as a center to be integrated with each other at an angle of 90 degrees, and is supported to be integrally rotated around the rotation axis center. 200529335

And driving device, the tree can be manufactured at low cost. According to the present invention, the shaft center is a central unit, and a high-priced driving mechanism, a driving device, and a grease sealing molding device are provided. 5 Since the insertion unit and the unloading unit are integrated around the center of the rotating shaft, a small resin sealing molding device with a smaller footprint than the conventional example can be obtained. According to one embodiment of the present invention, it is also possible to arrange the molded article unit, the pressurizing unit, and the molded article storage unit in order of 90 degrees with the rotation axis as the center. According to this embodiment ', each unit is arranged at an interval of 90 degrees in the same order as the loading unit and the unloading unit. Therefore, it is possible to obtain a resin sealing and molding apparatus which can simultaneously perform operations with different units and has excellent operation efficiency. In another embodiment, the loaded product is used to transfer the molded product from the molded product supply unit 15 to the pressurized unit, and the unloaded unit is used to convey the molded product from the pressurized unit to the molded product storage unit. . According to this embodiment, the conveyance of the formed article from the formed article supply unit to the pressurizing unit is performed only by the loading unit, and the resin sealing completion from the pressurizing unit to the formed article storage unit is performed only by the unloading unit. . 20 Therefore, it is not necessary to provide a separate conveying mechanism, and a simple, low-cost, and compact resin seal molding device can be obtained. In still another embodiment, the rotational axis is used as the center, and the formed article supplying unit, the pressing unit, and the removing unit for separating the resin-sealed formed article from unnecessary resin may be arranged at intervals of 90 degrees. In addition, centering on the rotation axis 200529335, the formed article supply unit, the pressurizing unit, the removal unit for separating the resin-sealed formed article from unnecessary resin, and the formed article storage unit may be arranged at intervals of 90 degrees. . In this embodiment, the units are sequentially arranged at 90-degree intervals in the same manner as the loading unit and the unloading unit. Therefore, it is possible to obtain a resin sealing molding apparatus which can perform operations simultaneously in different units together with the operation for separating unnecessary resins, and the operation efficiency is good. Another new embodiment is to transfer the molded product from the molded product supply unit to the pressurized unit by the loading unit, and transfer the molded product from the 10-pressurization unit to the removal unit by the unloading unit. Yes. The loading unit is used to transfer the molded product from the molded product supply unit to the pressurization unit, and the unloading unit is used to seal the resin from the pressurization unit to the removal unit and the removal unit to the molded product storage unit to complete the transfer of the molded product. Yes. According to this embodiment, only the loading unit is used to transfer the molded product from the supply unit to the pressurizing unit, and only the loading unit is used to carry out the removal from the pressurizing unit to the removal of the early element and / or the removal of the early element to the molded product. The resin sealing of the storage unit completes the conveyance of the molded product. Therefore, it is not necessary to provide a separate conveying mechanism, and a resin sealing and molding apparatus that is simple, inexpensive, and small in size changeover operation can be obtained. In another embodiment, the mold unit may be disposed adjacent to the pressurizing unit. According to this embodiment, it is possible to obtain a low-cost and small resin sealing molding apparatus having a mold cleaning unit. An additional embodiment is to provide resin for supplying a resin material between any one of the unit for forming the article supply unit, the pressurizing order 200529335 yuan, the removal unit and the article storage unit, and the rotation axis of the loading unit and the unloading unit 7L. Material can also be transferred to the unit's resin material. With this embodiment, since the transfer position of the resin material can be set at the desired position as required, a resin sealing molding device with a large degree of freedom in design can be obtained. Embodiment 3 Best Mode for Implementing the Invention The first embodiment of the present invention, as shown in Figs. 1 to 13, is a case where a semiconductor device resin sealing molding apparatus 100 is applied. As shown in FIGS. 1 and 2, the semiconductor device resin sealing and molding apparatus 100 is provided with a substrate supply unit 101, a resin sheet supply unit 2⑻ (FIG. 2), a pressing unit 300, a mold cleaning unit 400, and a removal unit. A unit 500, a molded article storage unit 600, and a loading unit 700. 15 In addition, a substrate supply unit, a pressurizing unit 300, a removal unit 500, and a molded product storage unit 600 are arranged in the clockwise direction around the rotation axis 702 of the loading unit 700 shown in FIG. 4 as a center. Then, the resin sheet supply unit 200 is disposed below the loading unit 700, and a resin sheet transfer unit 200 of a resin sheet supply unit 200 is arranged between the pressurizing unit and the loading unit 700, and the shuttle 20 is 202. Further, the mold cleaning unit 400 is disposed adjacent to the pressurizing unit 300. As shown in Fig. 1 and Fig. 2, the 'substrate supply unit' is composed of a g-body elevator 102, a substrate transport mechanism 103, and a preheater 104. That is, the cassette lifter 102 houses the input of most of the molded articles 11 200529335 resin-sealed front substrate 105! When the substrate transport mechanism 103 removes the resin-sealed front substrate from the input cassette 106, the substrate Up a slice. Then, the resin-sealed substrate 105 in the input box 106 is held by the chuck 107 of the substrate conveying mechanism 103, and it is pulled out to the preheater jo # 5 and positioned. The preheater 104 is composed of a pneumatic cylinder or the like, and can move up and down. When the resin-sealed front substrate 105 is delivered to a loading unit 800, which will be described later, it rises. In addition, the substrate supply unit 101 is not limited to the method of supplying the substrate 105 before the resin sealing from the input box 106 as shown in this embodiment, and may also be a belt conveyor or the like from the steps before the resin sealing step and the like. Automatic supply. 10 In addition, each component of the substrate supply unit can be appropriately changed in width or length according to the type of substrate. If the preheater 104 is not provided, it may be provided only as a guide or the like for drawing out the substrate 105 before the resin is sealed from the input cassette 106. As shown in FIGS. 1 and 2, the resin sheet supply unit 2000 loads a plurality of resin sheets 203 as a sealing resin material from a feeder 15 201 to a resin sheet transfer shuttle 202 to load the resin sheets. 203 is handed over to the loading unit 800 which will be described later. The resin sheet transfer shuttle 202 can reciprocate in a resin sheet transfer position 204 (FIG. 1) of the loading unit 800 in a direction perpendicular to the paper surface. In addition, the resin sheet transfer shuttle 202 may be appropriately modified in accordance with the 20 pitch of the crucible 3006 of the mold 3101 described below and the outer shape of the resin sheet 203. The supply mechanism of the resin sheet 203 is not limited to a feeder, and various methods such as a g-body method and an air-feed method may be used. As shown in FIGS. 1 and 2, the pressurizing unit 300 is composed of a lower mold 3001 and an upper tool 302. In particular, as shown in FIG. 2, the lower mold 300mm 12 200529335 is mounted on the movable flat hall 303, and the upper mold 3002 is mounted on the upper fixed platform 304. The movable platform 303 and the upper fixed platform 304 are supported by four roots 305. Therefore, the movable platform 303 slides up and down along the tie bar 305 by a well-known mold opening and closing mechanism. In addition, a plurality of crucibles 306 are provided in the lower mold 305 for the resin sheet 203 to be introduced. A plunger (not shown) for pressing the resin sheet is housed in the crucible 306 by a well-known transfer mechanism. In addition, the lower mold 301, the upper mold 302, and the plunger can be appropriately replaced according to the types of the substrate 105 and the resin sheet 203. Spring 10 As shown in FIG. 1, the mold cleaning unit 400 moves out of the resin-sealed substrate 9101 and unnecessary resin 902 (FIG. 10) after the unloading unit 900 彳 < lower mold 301, which will be described later, enters Open the mold between the upper mold 302 and the lower mold 301. Then, brush the surface of the upper mold 3002 and the lower mold 3001 with a brush 401, and then vacuum clean the mold surface. In addition, the aforementioned cleaning operation can also be performed while blowing air toward the die surface. As shown in FIG. 1, the removal unit 500 is a resin sealing completed substrate 001 and an unnecessary resin 902 separated from the unloading unit 900 described later. A waste box 501 is provided below the removal unit 500, and unnecessary resin 902 can be discarded. In addition, the removal unit 500 can complete the sealing of the substrate 901 and the unnecessary resin 902 by resins having various shapes by replacing 20 components of each component. In addition, the removal unit 500 may not be provided, and the resin may be automatically sealed in the mold to separate the substrate from unnecessary resin. At this time, since the removal unit 500 is not needed, a substrate correction unit such as a substrate sealed by resin sealing 901 to correct the curvature of the substrate 901 may be provided, and the removal unit 500 is taken as 13 200529335. As shown in Figure 1, the finished product storage unit 600 receives the resin-sealed substrate 901 from the unloading unit 900, and the person who stores it can install the output box 6 that stacks and stores the resin-sealed substrate 901. 〇1. In addition, the 5-output box 601 is not limited to the case where the resin-sealed substrate 901 is stacked and stored as in this embodiment, and a box of a type in which the resin-sealed substrate is slid from the side of the box to be stored can also be used. The storage method of the molded product is not limited to the method of storing it in the output box, and a transport mechanism such as a belt conveyor may be used to automatically transport the molded product 10 storage unit outside the resin-sealed molding apparatus. As shown in FIG. 1 to FIG. 6, the loading unit 700 includes a turning unit 701, a loading unit 800, and an unloading unit 900. Especially the loading unit

Heart and swirling state is supported by 15 support. As shown in FIG. 4, the rotating portion 701 is composed of a base plate 703, an upper plate 704 moving shaft 705, and a unit base plate 718. The base plate 703 is mounted on a semiconductor device resin sealing molding device

The moving pulley 713 is mounted on the upper disk fixed at the lower part of the above-mentioned / 10 ', and the rotating disk' 'is installed on the moving pulley 713. This confirms that the servo 714 of the bracket 714 14 200529335 the rotating shaft 716 of the motor 715. 10 15 20 up to 715 The rotation force rotates the rotating disk 711 through the moving pulley 713, the moving roller ▼ 712, the broken pulley 710, and the rotating shaft 705, so that the loading as early as π700 rotates around the rotating shaft 7G2. In addition, in the lower part of the rotating disk 711 > t — 疋 mi, the pillar 717 is used as the intermediary security unit chassis 718. Moreover, the disk is placed; ^, Zaowu 800 and the unloading unit 900 are 90 ° to each other. The angles "are respectively installed above and below the aforementioned unit chassis 718. As shown in Figure 3 and Figure 5, the loading unit _ is the one that transfers the resin-sealed substrate 105 and resin sheet 203 to the lower mold 301. The basin system is composed of the loading unit Xie and the sliding unit 8G5. . In addition, the aforementioned sliding unit is capable of reciprocating in a direction perpendicular to the rotation center. A connection block 803 is mounted on one side of the resin sheet holder 802 for storing the resin sheet 203 of the carry-in unit 801, and a sliding platform is fixed on the other side. A protruding pin bow is installed on the upper part of the resin sheet holder 8G2. The protruding pin 866 can be guided by a guide mechanism as shown in the figure, and can be moved up and down with the front end inserted from the upper part of the resin sheet insertion hole 813. In addition, a pin hole 868 communicating with the resin sheet insertion hole 813 is provided below the connecting block 803 mounted on the side of the resin sheet holder 802, and the stopper pin 862 is guided by a guide mechanism (not shown) and inserted at the front end thereof. The state of the pin hole 868 can be protruded or embedded in the resin sheet insertion hole 813 from the resin sheet insertion hole 813. A connecting block 805 is attached to the slide shaft 804, which is fixed to the opposite side of one side of the resin sheet holder 802. A pair of rod bodies 807 are mounted on the sliding shaft 804 with the bushing 806 as an intermediate. This rod

On the side of 807, a pin 809 is mounted on the upper part of the chuck 808 'for holding the substrate 105 before resin sealing. In addition, the aforementioned connection block 803 and the connection 15 200529335 block 805 form a convex portion 810 that can be slid into the connection block 859 and the connection block 86 described below. The sliding unit 850 is disposed on the unit chassis 718 and can reciprocate in a direction perpendicular to the rotation axis 702. The aforementioned loading unit 801 is detachably disposed at the front end of the sliding unit 850. This sliding unit 850 is composed of a chassis 851 and a slider 852. A block 853 is erected above the unit chassis 718, and a linear slide rail 854 is installed on the block 853 (Figure 3). The slide rail 852 is fixed to the rod body 855 mounted on the chassis 851, and is guided by the linear slide 854. 10, the chuck switch actuators 858, 858, connecting block 859, and connecting block 860 are fixed below the chassis 851. A resin chip pushing cylinder 861 is fixed on the chassis 851. Further, stopper pins 811 are attached to the connection block 859 and the connection block 860, respectively. A resin sheet stopper cylinder 864 is fixed on the side of the connecting block 860 with a bracket as a medium. In addition, a guide groove 865 is formed on the opposite side of the link block 859 and the link block 860. Then, the aforementioned groove 865 can be slidably fitted with the connecting block 803 and the convex portion 810 of the connecting block 805 of the carrying unit 801. When the loading unit 700 is in the state shown in Fig. 1, the carrying unit 801 is slidably disengaged in the X direction by the sliding unit 850, and is positioned by the stop pin $ η, and is fixed by the guide plunger 858. In addition, the carry-in unit 801 can be easily and appropriately replaced according to the type of the substrate 20 105 and the resin sheet 203. In addition, when the loading unit 801 is connected to the sliding unit 850, the pin 809 mounted on the upper portion of the lever body 807 of the loading unit 801 is to be engaged with the chuck pawl opening actuation 1§ 856. Further, a top contact pin 866 is connected to the resin sheet top abutting cylinder 861, and a resin sheet stopper cylinder 864 is connected to a stopper pin 862. When the chuck jaw switch 16 200529335 is actuated by the actuator 856, the chuck jaw 808 is opened and closed, and the substrate 105 before the resin sealing can be maintained. Further, when the resin sheet 203 is inserted from the lower side of the resin sheet holder 802, the resin sheet hits the stopper cylinder 864 to push against the stopper pin 862 without causing the resin sheet 203 to fall. The resin sheet abutting cylinder 861 abuts the resin sheet 203 from above 5 so that the resin sheet 203 can be surely put into the crucible 306 of the lower mold 301. A ball screw 870 parallel to the slide rail 852 is mounted on the block 869 mounted on the rod 855. One end of the aforementioned ball screw 870 is connected to a holding block 872 mounted on the unit chassis 718 by a nut 871. This nut 871 is mounted on the nut holder 873. The nut holder 873 is rotatably mounted on the holding block 872 through a bearing 874. An actuating pulley 875 'is attached to the nut holder 873, and is connected to the actuating pulley 877 via an actuating belt 876. This actuating pulley 877 is mounted on a rotating shaft 721 of a motor 720 fixed to a bracket 719 standing above the unit chassis 718. 15 Therefore, the rotation power of the motor 720 can rotate the nut 871 through the confirming pulley 877, the confirming belt 876, the confirming pulley 875, and the nut holder 873 to convert this rotational movement into a linear reciprocating motion, so that The sliding unit 85 is reciprocated. In addition, when the loading unit 700 is rotated, the slide unit 85 is moved (retreated) in the direction of the rotation 20 axis 702. As shown in FIGS. 3 to 5, the unloading unit 900 is a substrate 901 that has been sealed with resin and unnecessary resin 902 (picture 10) is removed from the lower mold 3101 and then transferred to Remove unit 500. And it is the one that transfers the sealed substrate 001 separated by the removal unit 500 to the molded product storage 17 200529335 output box 601 of the unit 600, and discards unnecessary resin in the waste box 501. The unloading unit 900 has almost the same structure as the loading unit, and includes an unloading early element 903 and a sliding unit 950. The aforementioned sliding unit 950 can reciprocate in a direction where the phase 5 intersects perpendicularly to the rotation axis 702. The carrying-out unit 903 has a T-shaped / moon moving block 906 fixed on the circuit board 905 on which the suction pad 904 for vacuum suction of unnecessary resin 902 is mounted. A slide shaft 907 is fixed to a side surface of the circuit board 905. A disk body 908 is mounted on the slide shaft 907 on the side opposite to the side where the circuit board 905 is fixed. A pair of rods 910 are attached to the slide shaft 907 via a bush 909 (Fig. 3). A collet claw 911 of a base plate 901 sealed with a resin seal is mounted on the side of the rod body 910, and a pin 912 is mounted on the rod body 91. The sliding unit 950 is installed below the unit chassis 718 and can reciprocate in a direction perpendicular to the relative rotation axis 702. The front end of the sliding unit 950 is provided with a removable unit 903. This slide unit 950 is composed of a chassis 951, a slide rail 952, and a movable plate 953. A block 954 is erected above the unit chassis 718, and a linear slider 955 is mounted on the block 954 (Fig. 3). The slide rail 952 is fixed to a rod body 956 mounted on the chassis 951, and is guided by a linear slider 955. A block is erected on the chassis 951, and a linear slider 958 is mounted on the block 957. A movable plate upper and lower cylinder 959 is mounted on the upper surface of the chassis 951. Further, a guide block 96, a guide block 961, an actuator 962 for a lost-head claw switch, and a stopper pin 963 are mounted below the movable plate 953. On the movable plate 953, the female skirt has a plate 964 ′, and the plate 964 is connected to the piston 965 on the movable plate 18 200529335 lower cylinder 959 through the plate 964. Further, a guide plunger 966 is fixed to the upper portion of the movable disk 953. In addition, a rail 967 is fixed on the side of the guide block 960 and is guided by the linear slide rail 958, so that the movable plate 953 can move up and down. The slide block 906 of the carrying-out unit 903 can be slidably fitted to the groove portion 969 formed in the guide block 5 960, the guide block 961, and the movable plate 953 in a T-shaped cross section, and fixed by the guide piston 966. When the loading unit 700 is rotated 90 degrees clockwise from the state shown in FIG. 1, the unloading unit 903 slides in the X direction by the sliding unit 950 and is positioned by the stop pin 963, and is fixed by the guide piston 966. And 10 15 20

The carrying-out unit 903 can be easily and appropriately replaced according to the type of the substrate and the resin sheet. When the carrying-out unit 903 is connected to the movable plate 953, a pin 912 mounted on the upper part of the rod body 91 of the carrying-out unit 903 is fitted into the chuck pawl switch bow actuator 962. And when the chuck claw switch actuator 962 is actuated, the chuck claw% is opened and closed, and the resin-sealed substrate 901 can be maintained. Further, the movable plate 953 can be moved up and down by actuating the upper and lower cylinders 959 of the movable plate. Therefore, when the resin is sealed and formed, the ejector pin is held from the lower mold (not shown in the figure).

= For the resin-sealed substrate, suck unnecessary resin 902 to remove it from the lower mold 301. Take —: this ::: two by: cap connected to the unit chassis-retainer cap __, wheel: 76 two: == even: 19 200529335 Move the pulley 978. The moving pulley 978 is fixed to a rotating shaft of a motor 723 fixed to a bracket 722 standing below the unit chassis 718. Therefore, the rotation power of the motor 723 can be determined by moving the pulley 978, the belt 977, the pulley 976, and the nut holder to rotate the nut to convert the 5 rotation motion into a linear reciprocating motion to cause sliding. The unit 950 moves back and forth. In addition, when the loading unit 700 is rotated, the slide unit 95 is moved (retreated) in the direction of the rotation shaft 702. Next, the operation of the semiconductor device resin sealing and molding apparatus 100 configured as described above will be described. 10 3. Take the rotation position of the loading unit shown in Figure 6 as the origin position (absolute coordinate 0 degrees), and take the clockwise direction as the positive direction for explanation. First, as shown in FIG. 7, the input from the S-body lifter 102 placed on the substrate supply unit 101 is held by the chuck 107 of the substrate transport mechanism 103 to hold the substrate before the resin is sealed. After 105, it is pulled out onto the preheater 15 104 'and positioned. When the substrate 105 before the resin sealing is just pulled out from the aforementioned input craftsman, the lifter 102 is raised to a height of one substrate, and the substrate 105 is pulled out before the next resin sealing. At this time, the resin sheet holder of the loading sheet 7L 8000 and the loading unit 801 is moved to the resin sheet transfer position, so that the resin sheet on which the resin sheet supply unit 203 is mounted is moved 2 to the shuttle 2. 2 Raise directly below the resin sheet holder. Then, a pusher (not shown) is pressed against the resin sheet 203 'mounted on the resin sheet transfer shuttle 202, and it is mixed in from the opening below the resin sheet holder 28. When inserting the resin sheet 203 into the resin sheet holder 802, the resin sheet stopper cylinder 864 is actuated to abut against the stop pin 862, so that the resin sheet 203 does not fall from the resin sheet holding 20 200529335 pieces 802 (No. Figure 5). Next, as shown in Fig. 8, the loading unit 700 is rotated 90 degrees in the counterclockwise direction (absolute coordinate_90 degrees). After that, the sliding unit 850 of the loading unit is advanced, and the carrying unit 80H stands 5 just above the preheater. Then, after the preheater 104 on which the substrate 105 before the resin sealing is mounted is raised, the chuck jaw switch actuator 856 is actuated, and the chuck jaws of the carrying unit 801 hold the substrate before the resin sealing. 105. Next, the preheater 104 is lowered, the sliding unit 850 is moved backward, and as shown in FIG. 9, the loading unit 700 is rotated by 100% in the clockwise direction (absolutely 10 pairs of coordinates 0 °). Then, the sliding unit 85 of the loading unit 800 is advanced, and the carrying-in unit 801 is inserted between the opened upper mold 302 and the lower mold 301, and stands by at a predetermined position on the lower mold 301. Next, after the lower mold 301 is raised slightly, the head-losing claw _ of the carrying unit 801 is opened, and the substrate 105 before the resin sealing is placed on the lower mold 301. Further, the stopper pin 862 is pulled in from the resin sheet holder 802 to abut against the resin sheet 866, and the resin sheet 203 is put into the crucible 306 of the lower mold 301. When the substrate 1 () 5 before the resin sealing is placed in the lower mold, and the resin sheet 203 is put into the crucible 306, the lower mold 301 is slightly lowered, and the slide unit 850 of the loading unit 800 is retracted. At this time, the resin sheet holder 802 of the carry-in unit 20 801 is located at the resin sheet transfer position 204 to perform the aforementioned resin sheet transfer operation. After that, the lower mold 301 is raised and the mold is closed. The upper mold 302 and the lower mold 301 sandwich the substrate 105 before the resin is sealed to form a cavity. The plunger (not shown) is pushed up, and the resin sheet 203 is pushed. Heated and dazzled to fill the cavity with 21 200529335 resin. After the resin filled in the cavity is hardened, the lower mold 301 is lowered, and the upper mold 302 and the lower mold 301 are opened. At this time, the upper pin (not shown) of the upper mold 302 is pressed to push the resin-sealed substrate 901 and the unnecessary resin 5 902 to the lower mold 301. Further, the lower mold 301 and the upper mold

When the 302 is turned on, as shown in FIG. 10, the loading unit 700 is rotated 90 degrees counterclockwise (absolute coordinate _90 degrees). Then, the sliding unit 950 of the unloading unit 900 is advanced into the opened mold 302 and the lower mold 301, and the unloading unit 903 is positioned at a predetermined position H 10 on the lower mold 301. Next, the upper pin (not shown) of the mold 301 is pushed down, and the substrate 901 and the unnecessary resin 902 formed of the resin sealing element are ejected from the lower mold 301, and the unloading unit 903 is lowered at the same time. Then, the resin-to-be-sealed substrate 901 is held by the chuck pawl 911, and unnecessary resin 902 is sucked by the suction pad 904. Then, the unloading unit 903 is raised to maintain the resin-sealed substrate 15 901 and the unnecessary resin 902, and the sliding unit 950 is moved backward. At the same time as the sliding unit 95 of the unloading unit 900 is retracted, the mold cleaning unit side brushes the upper mold * 302 and the lower mold, and then vacuums them to start cleaning. In addition, while the unloading unit _ performs the aforementioned operation, the loading unit 20 yuan is followed by the sliding unit, and the receiving operation of the substrate 105 before the resin sealing is performed. · Unloading unit_Removing the resin-sealed substrate 901 and unnecessary resin 902 from the lower mold 301, when —Yita loading Zaowu 800 receives the substrate 105 before resin sealing, as shown in Figure 11 at- What Leyuan does not do, rotate the loading unit 700 90 degrees clockwise (absolute coordinate 0 degrees) in the clockwise 22 200529335 clock direction. Then, the slide unit 950 of the unloading unit 9⑽ is advanced to transfer the resin-sealed substrate 901 and the unnecessary resin to the removal unit ·. Then, after the resin-sealed substrate 901 and the unnecessary resin 902 carrying unit 903 are lowered by 5, the chuck claw 911 is opened, and the suction of the suction pad 904 is released, and the resin-sealed substrate is released. 901 and unnecessary resin 902 were placed on the removal of Shanfan 500. Next, the unloading unit 903 is raised, and the sliding unit% 0 is moved backward. In addition, when the mold cleaning is completed, the sliding unit φ 10 moving unit 850 of the loading unit is immediately advanced, and the substrate 105 and the resin sheet 203 before the resin sealing are supplied to the lower mold 301 as described above, and the sliding After the unit 85 has moved backward, the pressurizing unit 300 performs a resin sealing operation in the same manner as described above. If the unloading unit 900 is not used to carry the resin-sealed substrate 90 from the removal unit 500 to the finished product collection, the inner unit 600, the sliding unit 15 is moved back to 950, and it is the seventh The state shown in the figure repeats the aforementioned actions. Although the sliding unit 950 of the unloading unit 900 is retracted, the removing unit 500 separates the resin-sealed substrate 901 from the unnecessary resin 902, and discards the unnecessary resin 902 to the waste box 501. Then, when the removal unit 500 200 finishes the separation operation, as shown in FIG. 12, the sliding unit 950 of the unloading unit 900 is moved forward again, and the unloading unit 903 is lowered. Then, close the clamp head claw 911 to hold the resin-sealed substrate 901 by holding it. Next, the carry-out list 70 903 is raised, and the slide unit 950 is moved backward. After the resin-sealed base 23 200529335 plate 901 is taken out from the removal unit 500 by the unloading unit 900, as shown in FIG. 13, the loading unit 700 is rotated 90 degrees in the clockwise direction (absolute coordinate 90 degrees). Then, the slide unit 950 of the unloading unit 900 is advanced, and the unloading unit 903 is positioned above the output cassette 601 mounted on the molded product storage unit 600. Next, the chuck pawl 911 is opened, and the resin-sealed substrate 901 is stored in the output cassette 601, and the slide unit 95 is moved backward. Next, as shown in Fig. 7, the loading unit 700 is rotated 90 degrees in the counterclockwise direction (absolute coordinate 0 degree). Thereafter, the same operations as described above are repeated. In the aforementioned first embodiment, the resin sheet transfer shuttle 200 of the resin sheet supply unit 200 is arranged between the pressurizing unit 300 and the loading unit 700, and the resin sheet transfer position 204 is provided. Therefore, in the first embodiment, the loading unit 800 stores the resin sheet 203 in the resin sheet holder 802, and then rotates by -90 degrees (absolute coordinates-90 degrees). Next, after the aforementioned loading unit 800 receives the substrate 105 before the resin sealing from the preheater 104, it rotates by +90 degrees to assume an absolute coordinate of 0 degrees. Then, the resin sheet 203 and the substrate 105 before the resin sealing are supplied to the lower mold 301 of the pressurizing unit 30015. As another example, § 'Another application example of the first embodiment is that after the aforementioned loading unit 800 receives the substrate 105 before the resin sealing from the preheater 104, the angle is +90 degrees. Further, the resin sheet 203 is received from the resin sheet transfer shuttle 202 at an absolute coordinate of 0 °, and then the resin sheet 203 and the substrate 20 105 before the resin sealing are supplied to the mold 301 under the pressurizing unit 300. With this use case, since the resin sheet 203 is received before the molding material is supplied to the pressurizing unit 300, the dust adhered to the resin sheet 203 is not scattered on the moving path. More preferably, since the foregoing use example is only You can change the action program, so it is easier to change. 24 200529335 The second step is to change the position of the resin sheet transfer shuttle 202, and the resin sheet transfer position 204 is arranged between the substrate supply unit mi and the loading unit 700. According to this embodiment, a resin sheet transfer position 204 is arranged between the substrate supply unit 101 and the loading unit 705. Therefore, while the unloading unit 900 enters between the upper mold 302 and the lower mold 301, and the resin sealing is completed to complete the substrate 901, the loading unit 800 can simultaneously perform the receiving operation of the substrate 105 before the resin sealing and from the aforementioned The resin sheet transfer shuttle 200 receives a receiving operation of the resin sheet 203. As a result, there is an advantage that the operating efficiency of the device can be improved and the cycle time of the entire device can be shortened. In addition, the resin sheet transfer shuttle 202 is not necessarily provided at the same position as the resin sheet supply unit 2000, and may be provided at a position remote from the resin sheet supply unit 200. More specifically, the rotary shafts of any one of the substrate supply unit 101, the pressurizing unit 300, the removal unit 500, and the molded article storage unit 600, and the 15 loading unit 800 and the unloading unit 900 may be used. A resin material delivery position 204 is arranged between the hearts 702. The resin-sealing device of the present invention is also suitable for resin-sealing other ® electronic parts. [Brief description of the drawings] Fig. 1 is a plan cross-sectional view showing an embodiment of the semiconductor resin sealing and molding apparatus of the present invention. Fig. 2 is a side view of the semiconductor device resin sealing molding apparatus shown in Fig. 1; Figure 3 is a detailed plan sectional view of the loading unit. 25 200529335 Figure 4 is a sectional view of part A-A of the loading unit shown in Figure 3, which shows the state in which the unloading unit is advanced. Fig. 5 is a sectional view of part B-B of the loading unit shown in Fig. 3, which shows a state in which the loading unit is advanced. 5 FIG. 6 is a process explanatory diagram of the semiconductor device resin sealing molding apparatus of this embodiment, and shows a state where each unit is located at the origin position. Fig. 7 is a process explanatory diagram of the semiconductor device resin sealing and molding apparatus of this embodiment. Fig. 8 is an explanatory diagram of the manufacturing process of the semiconductor device resin sealing and molding apparatus 10 of this embodiment. Fig. 9 is a process explanatory diagram of the semiconductor device resin sealing and molding apparatus of this embodiment. Fig. 10 is an explanatory diagram of a manufacturing process of the semiconductor device resin sealing molding apparatus of this embodiment. 15 FIG. 11 is a process explanatory diagram of the semiconductor device resin sealing and molding apparatus of this embodiment. Fig. 12 is a process explanatory diagram of the semiconductor device resin sealing molding apparatus of this embodiment. Fig. 13 is an explanatory diagram of a manufacturing process of the semiconductor device resin sealing and molding apparatus 20 of this embodiment. Fig. 14 is a plan view of a resin sealing and molding apparatus of Patent Document 1 showing a conventional example. Fig. 15 is a plan view of a resin sealing and molding apparatus of Patent Document 2 showing a conventional example. 26 200529335 [Description of main component symbols] 1. Lead frame supply unit before resin sealing 2. Lead frame arrangement unit 3 ... Resin sheet supply unit 4 ... Resin sheet unloading unit 5 ... Mold unit 6 ... Loading Unit 7 ... Unloading unit 8 ... Mold cleaning unit 9 ... Transfer unit 10 ... Removal unit 11 ... Picking unit 12 ... Lead frame receiving unit 13 ... Control unit 21 .... Lead frame 22 before forming ... Material loading section 23. Preheating section 24. Alignment section 25 ... Resin sheet 26 .. Resin sheet supply mechanism 27. Alignment section 28 .. Resin seal molding section 29 .. Material supply mechanism 30. Sealed lead frame 31. Molded article storage section 32. Resin molded body 33. Unwanted resin molded body cutting and removing section 34. Molded product transfer mechanism 35. .Cleaning mechanism 36..Control mechanism 100..Semiconductor device resin sealing molding device 101..Substrate supply unit 102..Box elevator 103..Substrate transfer mechanism 104..Preheater 105 ... Resin Substrate 106 before sealing ... Input box 107 ... Chuck 108 ... Frame 200 ... Resin sheet supply unit 201 ... Feeder 202 ... Resin sheet handling shuttle

27 200529335 203 ... Resin sheet 204 ... Resin sheet transfer position 300 ... Pressure unit 301 ... Lower mold 302 ... Upper mold 303 ... Movable platform 304 ... Upper fixed platform 305 ... Rod 306 .. Crucible. 400 .. Mold cleaning unit 401 .. Brush 500 ... Removal unit 501 .. Waste box 600 ... Formed article storage unit 601 .. Output box 700 ... Loading unit 701 .. .Rotating part 702... Rotating shaft center 703... Chassis 704..... Top plate 705... Rotating shaft 707... Pillar 708... Bearing holder 709... Bearing 710 .. .Positioning pulley 711 .. Rotating disk 712 ... Positioning belt 713 ... Positioning pulley 714 ... Bracket 715..Servo motor 716..Rotating shaft 717 ... Pillar 718 ... Unit chassis 719 ... Bracket 720... Motor 721... Rotating shaft 722... Bracket 723... Motor 724... Rotating shaft 800... Loading unit 801 ... carrying unit 802... Resin sheet holder 803 .. link block 804 .. slide shaft 805 .. link block 806 ... bushing 807 .. rod body 808 .. collet claw

28 200529335 809 ··· pin 810.... Convex part 811... Stop pin 813... Resin sheet insertion hole 850... Slide unit 851... Chassis 852... Slide 853... Block Body 854 .. Linear slide 855. Rod 856 .. Chuck claw switch actuator 858 .. Guide plunger 859 .. Linking block 860 .. Linking block 861 ... Resin sheet against cylinder 862 ... Stopper pin 863... Bracket 864... Resin sheet against the cylinder 865... Groove 866... Against the pin 868... Pin hole 869... Block 870... Ball Screw 871 .. Nut 872 .. Holding block 873 .. Nut holder 874 ... Bearing 875 .. Move the pulley 876 .. Move the belt 877 .. Move the pulley 900 ... Unload unit 901 .. Resin sealing completed substrate 902 .. Unwanted resin 903 ... Take-out unit 904 .. Suction 塾 905 ... Circuit board 906 .. Slide block 907 .. Slide shaft 908 .. Disk body 909 ... Bushing 910 ... Rod body 911 ... Collet claw 912 ... Pin 950 ... Slide unit 951 ... Chassis 952 ... Slide 953 ... Movable plate 954 ... Block 29 200529335 955 ... linear slider 966 ... indicating plunger 956 ... rod 967 ... steering path 957 ... block 968 ... linear slider 958 ... linear slider 969 ... Groove part 959 ... Movable plate upper and lower cylinder 970 ... Bracket 960 ... Guide block 971 ... Ball screw 961 ... Guide block 973 ... Holding block 962 ... Chuck claw switch With the actuator 976 ... the pulley 963 ... the stop pin 977 ... the belt 964 ... the plate 978 ... the pulley 965 ... the piston

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Claims (1)

200529335 10. Scope of patent application: 1. A resin sealing molding device that includes a pressurizing unit; a molded product supply unit that supplies the molded product; 5 a resin material supply unit that supplies the resin material; The “input unit” refers to the person who supplies the molded product to the pressurizing unit; the unloading unit, which takes out the resin-sealed completed molded product from the pressurizing unit; and the molded product storage unit, which stores the resin-sealed completed molded product, and The loading unit and the unloading unit are arranged in a radial shape, and are integrated with each other at an angle of 90 degrees around the center of the rotation axis 10, and are supported to rotate integrally around the rotation axis. For example, the resin sealing and molding device according to the first item of the patent scope, wherein the to-be-molded unit, the pressurizing unit, and the molded product storage unit are arranged at 90 degrees in sequence with the rotation axis as the center. 3. The resin sealing molding device according to item 1 of the scope of the patent application, wherein the loading unit performs the transfer of the molded product from the molded product supply unit to the pressurization unit, and the unloading unit performs the pressurization unit to the molded product. The resin sealing of the storage unit completes the conveyance of the molded product. 4. If the resin seal forming device of the second item of the patent application, the aforementioned loading unit and unloading unit are arranged in a radial shape, and the rotation axis is used as the center to form a 90-degree angle with each other to integrate and support It can rotate integrally around the above-mentioned rotating shaft center, transfer the molded product from the molded product supply unit to the pressurized unit by the loading unit, and perform the unloading unit from the pressurized unit to the molded product. Resin sealing of the storage unit is completed. 31 200529335 Transportation. 5. If the resin sealing and forming device of the first item of the scope of the patent application, the center of the rotation axis is used to supply the formed product to the unit, the pressurizing unit, and the unit for turning the tree month into the formed product and unnecessary. Resin-separated units are arranged sequentially at 905 degrees. 6. The resin sealing molding device according to item 5 of the patent application scope, wherein the molded product supply unit, the pressurizing unit, and the resin sealing unit are used to separate the molded product from unnecessary resin and remove the unnecessary resin. The unit and the molded article storage unit are arranged at 90-degree intervals in order. 10 7 · As stated in the patent claim 5, the resin sealing molding device, wherein the loading unit is used to transfer the molded product from the molded product supply unit to the pressurization unit, and the unloading unit is used to perform the removal from the pressurization unit to the removal. The resin sealing of the unit completes the conveyance of the molded product. 8. The resin sealing molding device according to item 6 of the patent application range, wherein the loaded product is moved from the molded product supply unit to the pressurized unit with a 15-load unit, and the unloaded unit is used to move from the pressurized unit to The resin sealing of the removal unit and the removal unit to the storage unit of the molded product completes the transportation of the molded product. For example, the resin sealing device in any one of the items 1 to 8 of the scope of application for a patent includes a device in which a molded product unit and a resin material supply unit are arranged to form a 90-degree angle with each other around a rotation axis. 10. If the resin of any one of the items in the scope of the patent application is sealed, the resin is sealed into an open garment, in which the mold cleaning unit is arranged adjacent to the pressurizing unit. U • The resin sealed in any one of items 1 to 8 of the patent scope of the Shenshen is a 32 200529335-shaped device, which is in any one of a molded article supply unit, a pressing unit, a removal unit, and a molded article storage unit. A resin material transfer position of a resin material supply unit for supplying a resin material is provided between the rotation axis of the unit and the loading unit and the unloading unit. 33