JP2904124B2 - Mold cleaning device and mold cleaning method - Google Patents
Mold cleaning device and mold cleaning methodInfo
- Publication number
- JP2904124B2 JP2904124B2 JP8153613A JP15361396A JP2904124B2 JP 2904124 B2 JP2904124 B2 JP 2904124B2 JP 8153613 A JP8153613 A JP 8153613A JP 15361396 A JP15361396 A JP 15361396A JP 2904124 B2 JP2904124 B2 JP 2904124B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin molded
- cleaning
- molded article
- molded product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004140 cleaning Methods 0.000 title claims description 196
- 238000000034 method Methods 0.000 title claims description 19
- 239000011347 resin Substances 0.000 claims description 208
- 229920005989 resin Polymers 0.000 claims description 208
- 238000000465 moulding Methods 0.000 claims description 31
- 238000012546 transfer Methods 0.000 claims description 14
- 238000003780 insertion Methods 0.000 claims description 8
- 230000037431 insertion Effects 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims 1
- 239000011342 resin composition Substances 0.000 claims 1
- 238000003860 storage Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0003—Discharging moulded articles from the mould
- B29C37/0007—Discharging moulded articles from the mould using means operable from outside the mould for moving between mould parts, e.g. robots
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3406—Components, e.g. resistors
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
【0001】[0001]
【発明の属する技術分野】本発明は、金型クリーニング
装置及び金型クリーニング方法に関するものであり、更
に詳しくは、半導体樹脂封止装置に使用される金型の金
型クリーニング装置及び金型クリーニング方法に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold cleaning apparatus and a mold cleaning method, and more particularly, to a mold cleaning apparatus and a mold cleaning method for a mold used in a semiconductor resin sealing apparatus. It is about.
【0002】[0002]
【従来の技術】従来から、樹脂成形ボビンの金型のクリ
ーニングは、例えば、特開昭63−62331号公報に
示される様に、クリーニングユニットを専用の前後進機
構に取付けられ、該クリーニングユニットに取りつけら
れたブラシを金型の上型部及び下型部の樹脂成形面の表
面に一定の加重が加わる様に押圧加重を加え、かつ振動
させて当該金型内を移動させながらクリーニングを行っ
ていた。2. Description of the Related Art Conventionally, for cleaning a mold of a resin molding bobbin, for example, as shown in Japanese Patent Application Laid-Open No. 63-63331, a cleaning unit is attached to a dedicated forward / backward moving mechanism, The cleaning is performed while applying a pressing load to the attached brush so that a constant load is applied to the surface of the resin molding surface of the upper mold portion and the lower mold portion of the mold, and moving the inside of the mold by vibrating. Was.
【0003】係る従来の金型クリーニング装置では、ク
リーニングユニットのブラシを振動させながら前進及び
後進させる前後進機構を専用に設ける必要があり、従っ
て、機構そのものが複雑となり、又装置全体が大型にな
るので保守性も悪く、コストが増加すると言う問題が有
った。In such a conventional mold cleaning apparatus, it is necessary to provide a forward / backward mechanism for moving the brush of the cleaning unit forward and backward while oscillating the brush. Therefore, the mechanism itself becomes complicated and the entire apparatus becomes large. Therefore, maintainability is poor, and the cost increases.
【0004】[0004]
【発明が解決しようとする課題】本発明の目的は、上記
した従来技術の欠点を改良し、簡単な構成により、装置
の小型化が実現出来ると同時に、保守性が向上し、生産
コストを低減出来る金型クリーニング装置及びその金型
クリーニング方法を提供するものである。SUMMARY OF THE INVENTION It is an object of the present invention to improve the above-mentioned disadvantages of the prior art, to realize a compact device with a simple structure, to improve maintainability and to reduce production costs. An object of the present invention is to provide a mold cleaning apparatus and a mold cleaning method for the mold.
【0005】[0005]
【課題を解決するための手段】本発明は上記した目的を
達成するため、基本的には以下に記載されたような技術
構成を採用するものである。 即ち、本発明の第1の態
様としては、上型部及び下型部からなる金型と、当該上
型部及び下型部が開放状態にある金型内部に挿入され、
当該金型部内部から樹脂成形品を取り上げて、該金型外
部に搬出する樹脂成形品搬送手段と、当該樹脂成形品搬
送手段と係合し、当該樹脂成形品搬送手段が該樹脂成形
品を搬出する搬出操作時に該金型の上型部及び下型部の
少なくとも一方の金型部の樹脂成形面と接触して当該樹
脂成形面を清掃するクリーニング手段とが設けられてい
る金型クリーニング装置に於て、該クリーニング手段
は、当該樹脂成形品搬送手段が、該開放された当該金型
内部に挿入される挿入操作時には、該上型部及び下型部
の金型部の樹脂成形面には接触せず、当該樹脂成形品搬
送手段が該金型部内より、該樹脂成形品を搬出する搬出
操作時に該金型の上型部及び下型部の少なくとも一方の
金型部の樹脂成形面と接触する様に、当該クリーニング
手段の存在位置を変位させる機構を有しており、且つ、
当該クリーニング手段は、該樹脂成形品搬送手段に於け
る、該金型部に対向する先端部に、着脱自在の係合機構
を介して取付けられている事を特徴とする金型クリーニ
ング装置であり、又本発明に於ける第2の態様として
は、上型部及び下型部からなる金型により所定の樹脂成
形品を成形した後、樹脂成形品搬送手段により当該樹脂
成形品を該金型より取り出して当該金型外部に搬出する
に際して、当該樹脂成形品搬送手段を、開放された上型
部及び下型部の間に挿入するに際して、クリーニング手
段を該樹脂成形品搬送手段に係合せしめた状態で、該樹
脂成形品搬送手段を、開放された上型部及び下型部の間
に挿入させ、次いで当該搬送手段が所定の樹脂成形品を
取り上げて、該金型外部に搬出するに際して、該クリー
ニング手段を該樹脂成形品搬送手段に係合せしめた状態
で、該樹脂成形品搬送手段を当該金型外部に移動せしな
がら同時に当該クリーニング手段を駆動させて、当該金
型の開放された上型部及び下型部の樹脂成形面を清掃す
る事を特徴とする金型クリーニング方法に於て、当該ク
リーニング手段を、当該樹脂成形品搬送手段が該金型部
内に挿入される直前に、該樹脂成形品搬送手段に於け
る、当該樹脂成形品搬送手段 の該金型部に対向する先端
部に係合せしめると共に、該樹脂成形品搬送手段が、該
金型部内より該樹脂成形品を搬出した後、該クリーニン
グ手段を当該樹脂成形品搬送手段の該先端部から分離さ
せる事を特徴とする金型クリーニング方法である。The present invention basically employs the following technical configuration in order to achieve the above object. That is, as a first aspect of the present invention, a mold comprising an upper mold portion and a lower mold portion, and the upper mold portion and the lower mold portion are inserted into a mold in an open state,
The resin molded product is taken out from the inside of the mold portion, and the resin molded product conveying means for carrying out the mold is engaged with the resin molded product conveying means. A mold cleaning device provided with cleaning means for cleaning the resin molding surface by contacting the resin molding surface of at least one of the upper mold portion and the lower mold portion of the mold during an unloading operation. The cleaning means
Means that the resin molded article conveying means is the opened mold
During the insertion operation to be inserted inside, the upper mold part and the lower mold part
Without contacting the resin molding surface of the mold part of
Unloading in which the feeding means unloads the resin molded product from within the mold section
During operation, at least one of the upper mold part and the lower mold part of the mold
Make the cleaning so that it contacts the resin molding surface of the mold.
A mechanism for displacing the position of the means, and
The cleaning means is provided in the resin molded article conveying means.
A detachable engagement mechanism at a tip portion facing the mold portion.
Mold cleaner characterized by being mounted via
Device according to the second aspect of the present invention.
Is a predetermined resin mold with a mold consisting of an upper mold part and a lower mold part.
After molding the molded product, the resin
Take out the molded product from the mold and carry it out of the mold
At this time, the resin molded product conveying means is
Cleaning hand when inserting it between the
While the step is engaged with the resin molded article conveying means, the tree
Move the fat molding product transfer means between the opened upper mold part and lower mold part.
And then the conveying means inserts the specified resin molded product.
When picked up and taken out of the mold,
State in which the lining means is engaged with the resin molded article conveying means.
Do not move the resin molded product conveying means outside the mold.
At the same time, the cleaning means is driven to
Clean the resin molding surfaces of the opened upper mold part and lower mold part.
In the mold cleaning method,
Leaning means, the resin molded article conveying means, the mold part
Immediately before being inserted into the
The tip of the resin molded article conveying means facing the mold section
And the resin molded article conveying means is
After unloading the resin molded product from the mold, the cleaning
Is separated from the leading end of the resin molded article conveying means.
This is a mold cleaning method characterized by performing the following.
【0006】[0006]
【発明の実施の形態】本発明にかかる金型クリーニング
装置は、従来の金型クリーニング装置が、樹脂成形品を
形成しようとする基材を金型内部に搬入したり、完成し
た樹脂成形品を搬出する為の樹脂成形品搬送手段と、該
金型を構成する上型部及び下型部の内面を清掃するクリ
ーニング手段とが別々に準備されているのに対し、本発
明に係る金型クリーニング装置に於いては、当該クリー
ニング手段を必要に応じて樹脂成形品搬送手段と係合合
体させ、当該樹脂成形品搬送手段の駆動手段を該クリー
ニング手段の駆動手段としても兼用する様にしたもので
有って、金型に於ける開放状態にある上型部及び下型部
との間に、樹脂成形品を形成しようとする基材を金型内
部に搬入する場合には、該樹脂成形品搬送手段が単独で
若しくは該クリーニング手段と一体化された状態で当該
上型部及び下型部との間に挿入されるが、完成した樹脂
成形品を該開放された上型部及び下型部間から取り出す
操作を行う場合には、先ず、該樹脂成形品搬送手段が該
金型に向かって進行する方向にある当該樹脂成形品搬送
手段の先端部に、クリーニング手段を取付け、その状態
で該樹脂成形品搬送手段が、該金型の開放された上型部
及び下型部の中間部に挿入され、そこで、該樹脂成形品
搬送手段が、完成された樹脂成形品を取上げ、該金型外
部に搬出する為に、当該樹脂成形品搬送手段が金型内部
に挿入された方向と逆の方向に移動する際には、当該樹
脂成形品搬送手段と一体に係合されたクリーニング手段
は、該搬出される樹脂成形品搬送手段の移動と共に逆向
きに該金型の開放された上型部及び下型部の間を移動す
るが、その間に、該クリーニング手段に内蔵されている
ブラシ手段の位置調整装置を作動させて、ブラシ或いは
吸引手段を、該金型の上型部及び下型部に於ける樹脂成
形面に接触させ、さらに該クリーニング手段に内蔵され
ているブラシ振動手段を作動させ、当該ブラシを振動さ
せるか、及び/又は吸引手段を駆動させて、該上型部及
び下型部の樹脂成形面の清掃を行う様に構成されたもの
である。BEST MODE FOR CARRYING OUT THE INVENTION A mold cleaning apparatus according to the present invention is a conventional mold cleaning apparatus in which a substrate on which a resin molded article is to be formed is loaded into the mold or a completed resin molded article is removed. While a resin molded product conveying means for carrying out and a cleaning means for cleaning the inner surfaces of the upper mold part and the lower mold part constituting the mold are separately prepared, the mold cleaning according to the present invention is provided. In the apparatus, the cleaning means is engaged with the resin molded article conveying means as necessary, and the driving means of the resin molded article conveying means is also used as the driving means of the cleaning means. When a base material on which a resin molded product is to be formed is carried into the mold between the upper mold portion and the lower mold portion in an open state in the mold, the resin molded product The transfer means is used alone or To remove the completed resin molded product from between the opened upper mold part and lower mold part while being inserted between the upper mold part and the lower mold part in a state integrated with the First, a cleaning means is attached to the tip of the resin molded article conveying means in the direction in which the resin molded article conveying means advances toward the mold, and in this state, the resin molded article conveying means is It is inserted into the middle of the opened upper mold part and lower mold part of the mold, where the resin molded article conveying means picks up the completed resin molded article and carries it out of the mold. When the resin molded article transporting means moves in a direction opposite to the direction in which the resin molded article is inserted into the mold, the cleaning means integrally engaged with the resin molded article transporting means moves the resin molded article to be unloaded. The upper mold portion of the mold opened in the opposite direction with the movement of the conveying means, and While moving between the mold parts, the brush or suction means is operated at the upper mold part and the lower mold part of the mold by activating the position adjusting device of the brush means incorporated in the cleaning means. The upper and lower mold parts by vibrating the brush and / or driving the suction means by operating the brush vibration means incorporated in the cleaning means. It is configured to clean the resin molding surface.
【0007】[0007]
【実施例】以下に、本発明に係る金型クリーニング装置
及び金型クリーニング方法の具体例を図面を参照しなが
ら詳細に説明する。尚、以下の具体例は、特にリードフ
レームに搭載された半導体集積回路素子(IC)を樹脂
封止後、金型を自動的にクリーニングする機構を備えた
金型クリーニング装置に付いて説明するが、本発明は、
係る半導体集積回路素子を樹脂封止するものに特定され
るものではなく、樹脂成形品を製造する全ての工程で適
用しえるものである事を付言しておく。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific examples of a mold cleaning apparatus and a mold cleaning method according to the present invention will be described in detail with reference to the drawings. The following specific example will be described with reference to a mold cleaning apparatus having a mechanism for automatically cleaning a mold after sealing a semiconductor integrated circuit element (IC) mounted on a lead frame with a resin. The present invention
It is to be noted that the semiconductor integrated circuit element is not limited to a resin-sealed element, but can be applied to all steps of manufacturing a resin molded product.
【0008】即ち、図1は、本発明に係る金型クリーニ
ング装置の1具体例の構造と作動の概略を示す斜視図で
あり、図中、上型部9及び下型部10からなる金型11
と、当該上型部9及び下型部10が開放状態にある金型
11の内部に挿入され、当該金型部11内部から樹脂成
形品12を取り上げて、該金型11外部に搬出する樹脂
成形品搬送手段5と、当該樹脂成形品搬送手段5と係合
し、当該樹脂成形品搬送手段5が該樹脂成形品12を搬
出する搬出操作時に該金型11の上型部9及び下型部1
0の少なくとも一方の金型部の樹脂成形面S1及び/又
はS2と接触して当該樹脂成形面S1及び/又はS2を
清掃するクリーニング手段6とが設けられている金型ク
リーニング装置30が示されている。FIG. 1 is a perspective view schematically showing the structure and operation of a specific example of a mold cleaning device according to the present invention. In FIG. 1, a mold comprising an upper mold portion 9 and a lower mold portion 10 is shown. 11
The upper mold part 9 and the lower mold part 10 are inserted into the mold 11 in an open state, and the resin molded product 12 is picked up from the mold part 11 and carried out to the outside of the mold 11. The upper part 9 and the lower part of the mold 11 are engaged during the unloading operation in which the molded article transporting means 5 engages with the resin molded article transporting means 5 and unloads the resin molded article 12. Part 1
0 shows a mold cleaning device 30 provided with cleaning means 6 for contacting the resin molding surface S1 and / or S2 of at least one mold part and cleaning the resin molding surface S1 and / or S2. ing.
【0009】尚、該樹脂成形品搬送手段5は、適宜の支
持手段1によって、摺動自在に所定の位置に保持されて
いる。該金型11の上型部9及び下型部10は、それぞ
れ個別にステージ31及び32に固定されており、当該
ステージ31及び32は、図示されていない公知の駆動
手段によって、上下動出来る様に構成され、当該上型部
9及び下型部10を分離して当該金型11内に開放部を
形成したり、当該上型部9及び下型部10の樹脂形成面
S1及びS2を互いに加圧密着せしめる様に構成されて
いる。The resin molded article conveying means 5 is slidably held at a predetermined position by an appropriate supporting means 1. The upper mold part 9 and the lower mold part 10 of the mold 11 are individually fixed to stages 31 and 32, respectively. The stages 31 and 32 can be moved up and down by known driving means (not shown). The upper mold part 9 and the lower mold part 10 are separated to form an open part in the mold 11 or the resin forming surfaces S1 and S2 of the upper mold part 9 and the lower mold part 10 are mutually It is configured so as to be pressed and adhered.
【0010】一方、本発明に係る該樹脂成形品搬送手段
5は、樹脂成形品を形成する基材12’、例えば、半導
体素子を搭載したリードフレーム等を所定の位置で把持
し、該金型内部でそれを分離させたり、或いは、該金型
内部で形成された樹脂成形品12を取上げて所定の位置
で当該樹脂成形品12を分離させる事の出来る収納搬送
ハンド手段13を有すると共に、当該収納搬送ハンド手
段13の駆動及び、該収納搬送ハンド手段13を含む樹
脂成形品搬送手段5の該金型11方向への移動及びその
反対方向への移動は、図示されていない適宜の駆動手段
により駆動されるものである。On the other hand, the resin molded product conveying means 5 according to the present invention holds a base material 12 'forming a resin molded product, for example, a lead frame on which a semiconductor element is mounted, at a predetermined position, and In addition to having a storage / transport hand means 13 capable of separating the resin molded product 12 formed inside the mold or picking up the resin molded product 12 formed inside the mold and separating the resin molded product 12 at a predetermined position, The driving of the storing and conveying hand means 13 and the movement of the resin molded article conveying means 5 including the storing and conveying hand means 13 in the direction of the mold 11 and the movement in the opposite direction are performed by appropriate driving means (not shown). It is driven.
【0011】即ち、本発明に係る金型クリーニング装置
30に於いては、当該樹脂成形品搬送手段5にブラシ或
いは吸引手段を含むクリーニング手段6が予め固定して
設けられているものであり、従って、該クリーニング手
段6は、それ自身、移動の為の駆動手段を有するもので
はなく、当該樹脂成形品搬送手段5の駆動手段を兼用す
る形を採っている。That is, in the mold cleaning apparatus 30 according to the present invention, the cleaning means 6 including a brush or a suction means is fixedly provided in advance in the resin molded article conveying means 5. The cleaning means 6 does not itself have a driving means for movement, but adopts a form which also serves as a driving means for the resin molded article conveying means 5.
【0012】具体的には、該クリーニング手段6は、当
該樹脂成形品搬送手段5が、該開放された当該金型11
内部に挿入される挿入操作時には、該上型部9及び下型
部10の金型部の樹脂成形面S1及びS2のいずれにも
接触せず、当該樹脂成形品搬送手段5が該金型部11内
より、該樹脂成形品12を搬出する搬出操作時に該金型
11の上型部9及び下型部10の少なくとも一方、好ま
しくは双方の金型部の樹脂成形面S1及びS2と接触す
る様にして、該上型部9及び下型部10の樹脂成形面S
1及びS2を清掃しながら、前記した樹脂成形品搬送手
段5の該金型内部への挿入方向とは逆方向に引き出され
る様に構成したものである。More specifically, the cleaning means 6 includes a means for transferring the resin molded article 5 to the opened mold 11.
At the time of the insertion operation to be inserted into the inside, neither the resin molding surfaces S1 and S2 of the mold portions of the upper mold portion 9 and the lower mold portion 10 come into contact with each other, and the resin molded product conveying means 5 does not During the unloading operation for unloading the resin molded product 12 from the inside of the mold 11, the mold 11 comes into contact with at least one of the upper mold portion 9 and the lower mold portion 10, preferably with the resin molding surfaces S1 and S2 of both mold portions. Thus, the resin molding surface S of the upper mold part 9 and the lower mold part 10
While cleaning 1 and S2, the resin molded article conveying means 5 is pulled out in the direction opposite to the direction of insertion into the mold.
【0013】従って、本発明に於いては、当該クリーニ
ング手段6に、該樹脂成形品搬送手段5が、搬出操作を
実行する時点に於いてのみ、該金型11の上型部9及び
下型部10の少なくとも一方、好ましくは双方と接触す
る様に、その存在位置が変位しうる、クリーニング手段
の位置調整機構を有している事が望ましい。係るクリー
ニング手段の位置調整機構の構成は特に限定されるもの
ではなく、当該ブラシ或いは吸引手段等が、該金型11
の上型部9及び下型部10の少なくとも一方、好ましく
は双方と接触若しくは離反する様な方向に移動可能に構
成されたものであれば如何なるものでも使用でき、例え
ば、カム機構、スプリング機構、螺子機構等を電気的、
流体的、磁力的等のエネルギー手段を使用して構成され
たものが使用可能である。Therefore, in the present invention, the upper mold portion 9 and the lower mold portion of the mold 11 are provided to the cleaning means 6 only when the resin molded article conveying means 5 executes the unloading operation. It is desirable to have a position adjusting mechanism of the cleaning means, the position of which can be displaced so as to be in contact with at least one, preferably both, of the parts 10. The configuration of the position adjusting mechanism of the cleaning means is not particularly limited, and the brush or the suction means may be provided in the mold 11.
Any type can be used as long as it is configured to be movable in such a direction as to contact or separate from at least one of the upper mold portion 9 and the lower mold portion 10, preferably both. For example, a cam mechanism, a spring mechanism, Screw mechanism etc.
Those configured using energy means such as fluid or magnetic can be used.
【0014】又、本発明に於ける当該ブラシの振動機
構、或いは、ブラシ操作により、該上型部9及び下型部
10の樹脂形成面から分離された樹脂片、樹脂粒等を吸
引する吸引機構等も特にその構成が限定されるものでは
なく、従来公知の構造を採用する事が出来る。係る本発
明の具体例に於いては、当該樹脂成形品搬送手段5の先
端部に該クリーニング手段6が固定して設けられている
ので、当該クリーニング手段6を移動させる為の駆動手
段は全く必要としないので、金型クリーニング装置全体
の構成が極めて簡易化され、生産コストの大幅な低減に
寄与する。In addition, a suction mechanism for sucking resin pieces, resin particles, and the like separated from the resin forming surfaces of the upper mold section 9 and the lower mold section 10 by the vibration mechanism of the brush or the brush operation in the present invention. The structure of the mechanism is not particularly limited, and a conventionally known structure can be adopted. In the specific example of the present invention, since the cleaning means 6 is fixedly provided at the tip of the resin molded article conveying means 5, no driving means for moving the cleaning means 6 is required. Therefore, the configuration of the entire mold cleaning apparatus is extremely simplified, which contributes to a significant reduction in production cost.
【0015】尚、上記本発明に於ける具体例では、該樹
脂成形品搬送手段5の先端部に固定して係合されている
該クリーニング手段6を円滑に移動させる為に、該クリ
ーニング手段6の移動方向に沿った両側に、該クリーニ
ング手段6を摺動指示する適宜の溝部手段或いはレール
手段等を配置する事が望ましい。つまり、本発明に係る
上記第1の具体例における金型クリーニング方法として
は、上型部9及び下型部10からなる金型11により所
定の樹脂成形品12を成形した後、樹脂成形品搬送手段
5により当該樹脂成形品12を該金型11より取り出し
て当該金型11外部に搬出するに際して、当該樹脂成形
品搬送手段5を、開放された上型部9及び下型部10の
間に挿入するに際して、クリーニング手段6を該樹脂成
形品搬送手段5に係合せしめた状態で、該樹脂成形品搬
送手段5を、開放された上型部9及び下型部10の間に
挿入させ、次いで当該搬送手段5が所定の樹脂成形品1
2を取り上げて、該金型11外部に搬出するに際して、
該クリーニング手段6を樹脂成形品搬送手段5に係合せ
しめた状態で、当該金型11外部に移動させながら、同
時に当該クリーニング手段6を駆動させて、当該金型1
1の開放された上型部9及び下型部10の樹脂成形面S
1及びS2を清掃する金型クリーニング方法である。In the embodiment of the present invention, in order to smoothly move the cleaning means 6 fixedly engaged with the tip end of the resin molded article conveying means 5, the cleaning means 6 is used. It is desirable to dispose appropriate groove means or rail means for instructing the cleaning means 6 to slide on both sides along the direction of movement. In other words, as the mold cleaning method in the first specific example according to the present invention, a predetermined resin molded article 12 is molded by a mold 11 including an upper mold section 9 and a lower mold section 10, and then the resin molded article is conveyed. When the resin molded product 12 is taken out of the mold 11 by the means 5 and carried out of the mold 11, the resin molded product transfer means 5 is moved between the opened upper mold portion 9 and lower mold portion 10. At the time of insertion, in a state where the cleaning means 6 is engaged with the resin molded article conveying means 5, the resin molded article conveying means 5 is inserted between the opened upper mold part 9 and lower mold part 10, Next, the transfer means 5 is used for the predetermined resin molded product 1.
When picking up 2 and carrying it out of the mold 11,
In a state where the cleaning means 6 is engaged with the resin molded article conveying means 5, the cleaning means 6 is simultaneously driven while being moved to the outside of the mold 11, and the mold 1 is moved.
1. The resin molding surface S of the open upper mold part 9 and lower mold part 10
This is a mold cleaning method for cleaning 1 and S2.
【0016】次に、本発明に係る金型クリーニング装置
の第2の具体例に付いて図2を参照しながら説明する
と、図2は、本発明に係る第2の具体例に関する金型ク
リーニング装置の構成の概略を説明する斜視図であり、
図中、当該クリーニング手段6は、該樹脂成形品搬送手
段5に於ける、該金型部11に対向する先端部33に、
着脱自在の係合機構を介して取付けられているものであ
る。Next, a second embodiment of the mold cleaning apparatus according to the present invention will be described with reference to FIG. 2. FIG. 2 shows a mold cleaning apparatus according to the second embodiment of the present invention. FIG. 2 is a perspective view illustrating the outline of the configuration of FIG.
In the figure, the cleaning means 6 is provided at a tip 33 opposed to the mold section 11 in the resin molded article conveying means 5.
It is attached via a detachable engagement mechanism.
【0017】より具体的には、当該クリーニング手段6
は、当該樹脂成形品搬送手段5が該金型部11内に挿入
される挿入操作開始時の直前に、当該樹脂成形品搬送手
段5の該先端部33に係合される様に構成されると共
に、当該クリーニング手段6は、当該樹脂成形品搬送手
段5が該金型部11内より、該樹脂成形品12を搬出
し、該搬出操作終了後、当該樹脂成形品搬送手段5の該
先端部33との係合が解舒される様に構成されているも
のである。More specifically, the cleaning means 6
Is configured to be engaged with the distal end portion 33 of the resin molded product transfer means 5 immediately before the start of the insertion operation in which the resin molded product transfer means 5 is inserted into the mold portion 11. At the same time, the cleaning means 6 is configured such that the resin molded article transporting means 5 unloads the resin molded article 12 from the inside of the mold portion 11 and, after the unloading operation is completed, the tip end of the resin molded article transport means 5 33 is configured to be unwound.
【0018】より具体的には、図2に示す様に、収納搬
送ハンド手段13を含む樹脂成形品搬送手段5の該金型
11と対向する先端部33に、クリーニング手段6を、
適宜の着脱自在機構を利用して、当該クリーニング処理
が必要な工程に於いてのみ、該クリーニング手段6を該
樹脂成形品搬送手段5に係合固定して、上記した第1の
具体例に於けると同様のクリーニング操作を行うもので
ある。More specifically, as shown in FIG. 2, the cleaning means 6 is attached to the tip 33 of the resin molded article transporting means 5 including the storage transporting hand means 13 facing the mold 11.
The cleaning means 6 is engaged and fixed to the resin molded article conveying means 5 only in a step requiring the cleaning process by using an appropriate detachable mechanism. In this case, the same cleaning operation is performed.
【0019】本発明に於いては、当該クリーニング手段
6は、該樹脂成形品搬送手段5の移動方向Aと交差する
方向、例えば、該樹脂成形品搬送手段5の移動方向A
が、水平方向であれば、該クリーニング手段6の移動方
向は、垂直方向Kである事が望ましい。即ち、本発明に
於いては、図2に示す様に、当該クリーニング手段6
は、当該樹脂成形品搬送手段5が該金型部11内に挿入
される挿入操作開始時の直前に、当該樹脂成形品搬送手
段5の該先端部33に係合される様に構成されるもので
あり、従って、該樹脂成形品搬送手段5が、当該クリー
ニング操作以外の動作を実行する場合、例えば、上記し
た様に、樹脂成形品を製造する基材12’を該金型11
の内部に搬送する様な場合には、当該クリーニング手段
6は、該樹脂成形品搬送手段5の移動を妨害しない様
に、当該樹脂成形品搬送手段5の移動方向軌跡Aから退
避した位置に配置されている必要があり、又該クリーニ
ング操作を実行する際には、該樹脂成形品搬送手段5と
該クリーニング手段6とを一体に係合させる必要から、
当該クリーニング手段6を該樹脂成形品搬送手段5の移
動方向軌跡内に配置される事が必要となる。In the present invention, the cleaning means 6 is provided in a direction intersecting the moving direction A of the resin molded article conveying means 5, for example, the moving direction A of the resin molded article conveying means 5.
If the direction is horizontal, it is desirable that the moving direction of the cleaning means 6 is the vertical direction K. That is, in the present invention, as shown in FIG.
Is configured to be engaged with the distal end portion 33 of the resin molded product transfer means 5 immediately before the start of the insertion operation in which the resin molded product transfer means 5 is inserted into the mold portion 11. Therefore, when the resin molded product conveying means 5 performs an operation other than the cleaning operation, for example, as described above, the base material 12 ′ for manufacturing the resin molded product is transferred to the mold 11.
In such a case, the cleaning means 6 is disposed at a position retracted from the moving direction trajectory A of the resin molded article conveying means 5 so as not to hinder the movement of the resin molded article conveying means 5. When performing the cleaning operation, it is necessary to integrally engage the resin molded article transporting means 5 and the cleaning means 6.
It is necessary that the cleaning means 6 be arranged within the trajectory of the resin molded article conveying means 5 in the moving direction.
【0020】その為、一例としては、ブラシ手段6aと
6b及びブラシ手段6aと6bを振動させたり、上下動
させる機能及び吸引機構を含むクリーニングユニット6
cとから構成されたクリーニング手段6を適宜の搭載台
3上に搭載し、当該搭載台を、シリンダー8等の上下動
可能な上下動機構により適当なストロークを以て、上
昇、下降させる様にするものである。Therefore, as an example, a cleaning unit 6 including a function of vibrating or moving the brush means 6a and 6b and the brush means 6a and 6b up and down and a suction mechanism is provided.
(c) is mounted on an appropriate mounting table 3, and the mounting table is raised and lowered with an appropriate stroke by a vertically movable mechanism such as a cylinder 8 which can move up and down. It is.
【0021】又本発明に係る具体例に於いては、当該ク
リーニング手段6を上下動させる為の上下動機構、つま
りクリーニング手段位置調整手段は、シリンダーに限る
ものではなく、適宜の上下動機構、例えば、電動モータ
を含む電気的エネルギー、流体エネルギー等を使用し
た、ギア機構、カム機構、螺子機構を主体とするもの等
が利用出来る。In the embodiment according to the present invention, the vertical movement mechanism for moving the cleaning means 6 up and down, that is, the cleaning means position adjusting means is not limited to the cylinder, but an appropriate vertical movement mechanism. For example, a gear mechanism, a cam mechanism, a screw mechanism, or the like using electric energy, fluid energy, or the like including an electric motor can be used.
【0022】該クリーニング手段6の上下動機構として
は、図2に示す様な、該クリーニング手段6を載置する
様な台を上下動させるものであってもよいが、図3に示
す様な、当該クリーニング手段6の該クリーニングユニ
ット6cの両端部に、上下動しうる溝部或いはレール部
36を有する支持部材35、35’を設け、該支持部材
35、35’を適宜の上下動機構によって、同時に上下
動させる様にしても良い。The vertical movement mechanism of the cleaning means 6 may be a mechanism for vertically moving a table on which the cleaning means 6 is mounted as shown in FIG. At both ends of the cleaning unit 6c of the cleaning means 6, supporting members 35 and 35 'having a vertically movable groove or rail portion 36 are provided, and the supporting members 35 and 35' are moved by an appropriate vertical moving mechanism. You may make it move up and down simultaneously.
【0023】係る場合には、当該クリーニングユニット
6cの両側端部に、当該溝部或いはレール部36に嵌合
する適宜の突起部或いは凹み溝部37、37’が設けら
れている事が望ましい。又、係る溝部或いはレール部3
6を有する支持部材35、35’を用いて、当該クリー
ニング手段6を該金型11の開口された上型部9及び下
型部10内に挿入する場合には、当該開口された上型部
9及び下型部10の両側にも該支持部材35、35’の
軸線を延長した軸線を持つ支持部材38、38’を設
け、且つ該支持部材38、38’に該支持部材35、3
5’に設けられた当該溝部或いはレール部36とその中
心軸線が一致する溝部或いはレール部39を形成するも
のである。In such a case, it is desirable to provide appropriate protrusions or concave grooves 37, 37 'to be fitted to the grooves or the rails 36 at both end portions of the cleaning unit 6c. Also, the groove or the rail 3
When the cleaning means 6 is inserted into the opened upper mold part 9 and the lower mold part 10 of the mold 11 using the supporting members 35 and 35 ′ having the 9 and the lower mold part 10 are provided on both sides thereof with support members 38, 38 'having an axis extending from the support members 35, 35', and the support members 38, 38 'are provided with the support members 35, 3'.
The groove or the rail portion 39 provided on the 5 'is formed so that its central axis coincides with the groove or the rail portion 36.
【0024】係る構成を採用する事により、該支持部材
35、35’によって、その両端部が支持されたクリー
ニングユニット6cは、該樹脂成形品搬送手段5の前進
操作されると同時に、該支持部材38、38’に設けら
れた当該溝部或いはレール部39に継続的に支持され
て、開口された上型部9及び下型部10内に挿入され
る。By adopting such a structure, the cleaning unit 6c, whose both ends are supported by the support members 35 and 35 ', is moved forward by the resin molded article conveying means 5, and at the same time the support member 35 It is continuously supported by the grooves or the rails 39 provided in 38, 38 ′ and inserted into the opened upper mold part 9 and lower mold part 10.
【0025】尚、上記具体例に於いては、該クリーニン
グ手段6を支持している該支持部材35、35’が、下
降して、当該クリーニング手段6を該樹脂成形品搬送手
段5の移動軌跡から離脱する場合に、当該クリーニング
手段6が該支持部材35、35’の開放された溝部又は
レール部36から滑り落ちない様に、適宜のストッパー
手段40が設けられている事が望ましい。In the above specific example, the support members 35 and 35 'supporting the cleaning means 6 are lowered, and the cleaning means 6 is moved along the locus of movement of the resin molded article conveying means 5. It is desirable that an appropriate stopper means 40 be provided so that the cleaning means 6 does not slide down from the open groove portions or the rail portions 36 of the support members 35, 35 'when detaching from the support member 35, 35'.
【0026】次に、本発明に係る第2の具体例に於い
て、該樹脂成形品搬送手段5と該クリーニング手段6と
を着脱自在に係合させる手段は、特に特定されるもので
はないが、例えば、電気的或いは磁気手段により自在に
接合、離反を実行出来る機構であれば何れの構成のもの
でも使用出来る。図4は、本発明に係る上記具体例に於
いて使用しうる極めて構成が簡易化された係合機構の例
を示している。Next, in the second specific example according to the present invention, the means for detachably engaging the resin molded article conveying means 5 with the cleaning means 6 is not particularly specified, For example, any structure can be used as long as it is a mechanism that can freely perform joining and separation by electric or magnetic means. FIG. 4 shows an example of an extremely simplified configuration of the engagement mechanism that can be used in the above-described specific example according to the present invention.
【0027】即ち、図4に於いては、該樹脂成形品搬送
手段5の先端面33には、鉤状の突起41が固定して設
けられており、又該クリーニング手段6の当該樹脂成形
品搬送手段5の先端部33の対向する部分42には、該
鉤状の突起41が設けられている位置と対向する位置
に、該突起41を嵌合しえる該鉤状の突起41と略同一
の形状を有する孔部43が設けられており、当該クリー
ニング手段6が、当該樹脂成形品搬送手段5の移動方向
Aに対して直角に、上方から下降して来るか、或いは下
方から上昇してきた場合に、当該クリーニング手段6に
設けられた上記孔部43が、該樹脂成形品搬送手段5に
設けられた該突起部41と嵌合しえる様に構成されたも
のである。That is, in FIG. 4, a hook-shaped projection 41 is fixedly provided on the tip end surface 33 of the resin molded product conveying means 5, and the resin molded product of the cleaning means 6 is provided. The opposite portion 42 of the distal end portion 33 of the transporting means 5 has substantially the same hook-shaped projection 41 as the hook-shaped projection 41 that can fit the projection 41 at a position facing the position where the hook-shaped projection 41 is provided. The cleaning means 6 is lowered from above or rises from below at right angles to the moving direction A of the resin molded article conveying means 5. In this case, the hole 43 provided in the cleaning means 6 can be fitted to the projection 41 provided in the resin molded article conveying means 5.
【0028】従って、本具体例に於いては、当該クリー
ニング手段6の上下動によってのみ、樹脂成形品搬送手
段5とクリーニング手段6とは容易に係合され、かつ該
樹脂成形品搬送手段5の水平方向の移動によって、該ク
リーニング手段6も同時に移動せしめられる。本具体例
に於いては、当該クリーニングユニット6c及びブラシ
手段6a、6bからなるクリーニング手段6は、収納搬
送ハンド手段13を含む樹脂成形品搬送手段5に着脱自
在に取付けられており、該金型11をクリーニングする
際には、樹脂封止操作が完了して、該金型11の上型部
9及び下型部10が開放された後、該クリーニング手段
6を該樹脂成形品搬送手段5の先端部33に取付け、該
樹脂成形品搬送手段5が、当該金型11の上型部9及び
下型部10内に進入して該下型部10上にある完成され
た樹脂成形品を含むリードフレームを掴み、後退時に於
いて、該クリーニング手段6のブラシ手段6aは、該金
型11の上型部9に於ける樹脂成形面S1と、又ブラシ
手段6bは、該金型11の下型部10に於ける樹脂成形
面S2とそれぞれ押圧接触して、且つ適度の振動を付与
しながら退出するので、その際、当該金型11の上型部
9及び下型部10の樹脂成形面に付着した樹脂かすを払
い落とし、更には、吸引手段によって、該払い落とされ
た樹脂かすを吸引して除去清掃するものである。Accordingly, in this embodiment, the resin molded product conveying means 5 and the cleaning means 6 are easily engaged only by the vertical movement of the cleaning means 6, and the resin molded product conveying means 5 Due to the horizontal movement, the cleaning means 6 is also moved at the same time. In this specific example, the cleaning unit 6 composed of the cleaning unit 6c and the brush units 6a and 6b is detachably attached to the resin molded product transfer unit 5 including the storage transfer hand unit 13, and the mold is provided. When cleaning the resin molding 11, after the resin sealing operation is completed and the upper mold part 9 and the lower mold part 10 of the mold 11 are opened, the cleaning means 6 is moved to the resin molded article conveying means 5. Attached to the tip 33, the resin molded product conveying means 5 includes a completed resin molded product that enters the upper mold portion 9 and the lower mold portion 10 of the mold 11 and is on the lower mold portion 10. When the lead frame is gripped and retracted, the brush means 6a of the cleaning means 6 is in contact with the resin molding surface S1 in the upper mold portion 9 of the mold 11, and the brush means 6b is located under the mold 11 under the mold 11. With the resin molding surface S2 in the mold part 10 Each of them comes out of contact with each other and with appropriate vibration, and at that time, the resin residue adhered to the resin molding surfaces of the upper mold 9 and the lower mold 10 of the mold 11 is wiped off, Further, the blown-off resin residue is sucked and removed and cleaned by a suction means.
【0029】その結果、従来と同様の金型11のクリー
ニング効果が、低コストで達成される事が判った。つま
り、本発明の金型クリーニング装置を採用する事によ
り、従来から専用に設けていたクリーニングユニットを
含むクリーニング手段6の前進及び後退の為の駆動手段
を省略する事が可能となり、その代わりに、簡単な構成
を有するクリーニング手段6の上下動用の駆動手段とク
リーニング手段6の搭載用、或いは支持用の手段を設け
るだけであるので、機構が簡単となり、装置前提が小型
化、軽量化され、保守性も向上する事になる。As a result, it has been found that the same cleaning effect of the mold 11 as that of the related art can be achieved at low cost. That is, by adopting the mold cleaning device of the present invention, it is possible to omit the driving means for moving forward and backward the cleaning means 6 including the cleaning unit which has conventionally been provided exclusively, and instead, Since only a driving means for vertically moving the cleaning means 6 having a simple structure and a means for mounting or supporting the cleaning means 6 are provided, the mechanism is simplified, and the apparatus is reduced in size and weight, and maintenance is performed. The property will also be improved.
【0030】次に、上記した本発明に係る第2の具体例
に於ける金型クリーニング装置及び金型クリーニング方
法の操作手順を図5〜図9及び図10を参照しながら説
明する。即ち、図5〜図9に示す具体例としては、樹脂
成形品搬送手段5の先端部33にクリーニング手段6が
着脱自在に取付けられる機構を有し、又該クリーニング
手段6は、クリーニング手段搭載台3に搭載され、且つ
該搭載台3は、クリーニング手段位置調整手段の一具体
例であるシリンダ8により上昇及び下降する様に構成さ
れている。Next, the operation procedure of the mold cleaning apparatus and the mold cleaning method according to the second embodiment of the present invention will be described with reference to FIGS. That is, as a specific example shown in FIGS. 5 to 9, there is provided a mechanism in which the cleaning means 6 is detachably attached to the distal end portion 33 of the resin molded article conveying means 5. 3, and the mounting table 3 is configured to move up and down by a cylinder 8 which is a specific example of a cleaning unit position adjusting unit.
【0031】そこで、図10を参照すると、収納搬送ハ
ンド手段13を含む樹脂成形品搬送手段5が適宜の移動
駆動手段(図示せず)によって、基準位置P1から第1
の位置P2に向け矢印Bの様に移動され、次いで供給カ
セット22の向けて矢印Cの様に前進移動し、当該供給
カセット22から樹脂封止処理を行うべき半導体回路素
子を搭載したリードフレームを、該収納搬送ハンド手段
13を操作して基材12’として1個若しくは複数個取
り出した後、矢印D、Eに示す様に、樹脂成形品搬送手
段5は、最初の基準位置P1に戻る。Therefore, referring to FIG. 10, the resin molded article conveying means 5 including the storing and conveying hand means 13 is moved from the reference position P1 to the first position by an appropriate moving drive means (not shown).
Is moved as indicated by an arrow B toward the position P2, and then moved forward as indicated by an arrow C toward the supply cassette 22, and a lead frame on which a semiconductor circuit element to be subjected to resin sealing processing is mounted from the supply cassette 22 is removed. After operating the storage / transport hand means 13 to take out one or a plurality of base materials 12 ', the resin molded article transport means 5 returns to the initial reference position P1 as shown by arrows D and E.
【0032】その後、金型11の上型部9及び下型部1
0を上下に動かして、金型11を開放した後、該樹脂成
形品搬送手段5を基準位置P1から矢印Fに沿って前進
移動させ、当該収納搬送ハンド手段13が把持している
該リードフレームを該下型部10の樹脂成形面S2上に
載置し、その後該樹脂成形品搬送手段5は、矢印Gに沿
って戻り、最初の基準位置P1に待機する。Thereafter, the upper mold 9 and the lower mold 1 of the mold 11 are formed.
After the mold 11 is opened by moving the vertical direction 0, the resin molded article transfer means 5 is moved forward along the arrow F from the reference position P1, and the lead frame held by the storage and transfer hand means 13 is held. Is placed on the resin molding surface S2 of the lower mold part 10, and thereafter, the resin molded product conveying means 5 returns along the arrow G and waits at the first reference position P1.
【0033】その間、該金型11は、閉じられ、所定の
樹脂が、当該金型11内に注入され、金型11の上型部
9及び下型部10を型締めされ、半導体回路素子が樹脂
封止され樹脂成形品12が完成する。 その後、該金型
11の上型部9及び下型部10を上下に動かして、再び
該金型11を開放する。係る状態を図5に示す。Meanwhile, the mold 11 is closed, a predetermined resin is injected into the mold 11, the upper mold 9 and the lower mold 10 of the mold 11 are clamped, and the semiconductor circuit element is mounted. The resin molding is completed by resin sealing. Thereafter, the upper die 9 and the lower die 10 of the mold 11 are moved up and down, and the mold 11 is opened again. FIG. 5 shows such a state.
【0034】つまり、この状態では、該クリーニング手
段搭載台3に搭載された該クリーニング手段6は、該金
型11の下型部10よりも下方の位置に配置せしめられ
ている。樹脂成形後、該金型11の上型部9及び下型部
10の型開きが完了すると、図6に示す様に、シリンダ
8が矢印Qの方向に上昇するので、該クリーニング手段
6が、該樹脂成形品搬送手段5の移動方向軸線A迄上昇
せしめられる。That is, in this state, the cleaning means 6 mounted on the cleaning means mounting table 3 is disposed below the lower mold portion 10 of the mold 11. After the resin is molded, when the mold opening of the upper mold part 9 and the lower mold part 10 of the mold 11 is completed, as shown in FIG. 6, the cylinder 8 moves up in the direction of the arrow Q. The resin molded article conveying means 5 is moved up to the moving direction axis A.
【0035】その際、上記した様に、該樹脂成形品搬送
手段5の先端部33と該クリーニング手段6とが係合し
一体的に移動可能な状態となる。その後、当該シリンダ
8は、下降して、元の位置に於いて待機する事になる。
次いで、図10に示す様に、該クリーニング手段6を一
体化した樹脂成形品搬送手段5を矢印Hに沿って、再び
前進移動させ、該金型11の上型部9及び下型部10内
部にまで進入挿入し、当該収納搬送ハンド手段13によ
って、該樹脂成形品12を取上げ、矢印Iの方向に該樹
脂成形品搬送手段5が逆方向に該基準位置P1に向けて
移動を開始する。At this time, as described above, the distal end portion 33 of the resin molded article conveying means 5 and the cleaning means 6 are engaged with each other, and are in a state of being integrally movable. Thereafter, the cylinder 8 descends and stands by at the original position.
Next, as shown in FIG. 10, the resin molded article conveying means 5 having the cleaning means 6 integrated therein is moved forward again along the arrow H, and the inside of the upper mold part 9 and the lower mold part 10 of the mold 11 is moved. Then, the resin molded product 12 is picked up by the storage / transport hand means 13, and the resin molded article transport means 5 starts moving in the direction of the arrow I in the opposite direction toward the reference position P1.
【0036】その際、クリーニング手段6に設けられた
クリーニングユニット6c内に内蔵された、ブラシ手段
6a及び6bを互いに反対の方向に移動させるブラシ位
置調整機構(図示せず)が、図7に示す様に矢印Rの方
向に沿って互いに反対の方向に変位して、該ブラシ手段
6a及び6bのブラシ構成面が、該金型11の上型部9
及び下型部10の樹脂形成面S1及びS2に所定の圧力
で接触する様になし、且つ当該ブラシ手段6a及び6b
をクリーニングユニット6c内に内蔵されたブラシ振動
手段(図示せず)により振動させると同時に、当該クリ
ーニングユニット6c内に内蔵された吸引手段(図示せ
ず)を駆動させて、当該上型部9及び下型部10の樹脂
形成面S1及びS2を矢印Iの方向に掃引しながら該上
型部9及び下型部10の樹脂形成面S1及びS2に付着
した残留樹脂を除去すると同時に吸引廃棄する事にな
る。At this time, a brush position adjusting mechanism (not shown) for moving the brush means 6a and 6b in directions opposite to each other, which is built in the cleaning unit 6c provided in the cleaning means 6, is shown in FIG. As described above, the brush means 6a and 6b are displaced in the directions opposite to each other along the direction of arrow R, and
And the resin forming surfaces S1 and S2 of the lower mold portion 10 are brought into contact with a predetermined pressure, and the brush means 6a and 6b
Is vibrated by a brush vibrating means (not shown) built in the cleaning unit 6c, and at the same time, a suction means (not shown) built in the cleaning unit 6c is driven to drive the upper die 9 and While the resin forming surfaces S1 and S2 of the lower mold portion 10 are swept in the direction of arrow I, the residual resin adhered to the resin forming surfaces S1 and S2 of the upper mold portion 9 and the lower mold portion 10 are removed and simultaneously suction-discarded. become.
【0037】その後、当該樹脂成形品搬送手段5が、前
記した基準位置P1迄戻り、該クリーニング手段6がク
リーニングユニット搭載台3の真上の搭載位置に戻りそ
の位置で停止する。図8は、かかる状態を示している。
これまでの工程に於いて、当該クリーニング手段6のブ
ラシ手段6a及び6bは、該樹脂成形品搬送手段5が上
記した矢印Iの方向へ移動している間中、前記したクリ
ーニング動作を継続しているので、金型11に付着した
樹脂かすが除去され、金型11のクリーニングが効果的
に且つ短時間に実行される事になる。Thereafter, the resin molded article conveying means 5 returns to the above-described reference position P1, and the cleaning means 6 returns to the mounting position immediately above the cleaning unit mounting base 3 and stops there. FIG. 8 shows such a state.
In the steps so far, the brush means 6a and 6b of the cleaning means 6 continue the above-described cleaning operation while the resin molded article conveying means 5 is moving in the direction of the arrow I described above. Therefore, the resin residue adhering to the mold 11 is removed, and the cleaning of the mold 11 is performed effectively and in a short time.
【0038】次いで、該クリーニング手段搭載台を支持
するシリンダ8が矢印Q方向に上昇して、当該クリーニ
ング手段搭載台3が該クリーニング手段6に当接して該
クリーニング手段6を押し上げる事によって、当該クリ
ーニング手段6を該クリーニング手段搭載台3に移設さ
せる事により、該クリーニング手段6と該樹脂成形品搬
送手段5との係合関係を解舒する。 係る状態を図9に
示す。Next, the cylinder 8 supporting the cleaning means mounting table is raised in the direction of arrow Q, and the cleaning means mounting table 3 is brought into contact with the cleaning means 6 to push up the cleaning means 6 to thereby perform the cleaning. By moving the means 6 to the cleaning means mounting table 3, the engagement relationship between the cleaning means 6 and the resin molded article conveying means 5 is unwound. FIG. 9 shows such a state.
【0039】その後、シリンダ8が矢印Q方向と反対の
方向に下降して該クリーニング手段6を図5に示す元の
配置位置に戻される。その間、クリーニング手段6の振
動手段及び吸引手段を停止させると同時に、当該クリー
ニング手段6の互いに離反する方向に延展されていたブ
ラシ手段6a及び6bをブラシ位置調整機構を作動させ
て互いに接近する方向に移動させる事によって、ブラシ
手段6a及び6bを該クリーニングユニット6cとを互
いに密接させて次の操作に備える。Thereafter, the cylinder 8 is lowered in the direction opposite to the arrow Q direction, and the cleaning means 6 is returned to the original arrangement position shown in FIG. In the meantime, the vibration means and the suction means of the cleaning means 6 are stopped, and at the same time, the brush means 6a and 6b of the cleaning means 6 extending in the direction away from each other are operated in the direction approaching each other by operating the brush position adjusting mechanism. By moving the brush units 6a and 6b, the cleaning units 6c are brought into close contact with each other to prepare for the next operation.
【0040】次いで、該樹脂成形品搬送手段5は、矢印
Jの方向に第2の位置P3に向け移動され、次いで収納
カセット23の向けて矢印Kの様に前進移動し、当該収
納カセット23に、該樹脂成形品搬送手段5の収納搬送
ハンド手段13に保持されている完成された樹脂成形
品、つまり、樹脂封止部を有するリードフレーム12を
搬送して、収納カセット23収納した後、矢印L、Mに
示す様な経路を経て、樹脂成形品搬送手段5は、最初の
基準位置P1に戻る。Next, the resin molded article conveying means 5 is moved toward the second position P3 in the direction of the arrow J, and then moves forward as indicated by the arrow K toward the storage cassette 23. After the completed resin molded product held by the storage and transport hand means 13 of the resin molded product transport means 5, that is, the lead frame 12 having the resin sealing portion, is transported and stored in the storage cassette 23, The resin molded article conveying means 5 returns to the initial reference position P1 via the paths shown by L and M.
【0041】かかる一連の操作は、該供給カセット22
が空になるまで継続され、該供給カセット22が空にな
ると、樹脂封止をすべきリードフレーム12’を収納し
た別の供給カセット22が供給されて同様の操作が継続
される。尚、本発明に於ける第1の具体例の動作に関し
ては、予め該クリーニング手段6が、該樹脂成形品搬送
手段5の先端部に取りつけられている為、クリーニング
手段の搭載台3、及び当該クリーニング手段の搭載台3
を上下に上昇、下降させるシリンダー手段8が省略され
ている点を除けば、上記した具体例と略同一であるの
で、詳細な説明は省略する。This series of operations is performed by the supply cassette 22
Is continued until the supply cassette 22 becomes empty, and when the supply cassette 22 becomes empty, another supply cassette 22 containing the lead frame 12 'to be sealed with resin is supplied, and the same operation is continued. In the operation of the first specific example of the present invention, since the cleaning means 6 is attached to the tip of the resin molded article transport means 5 in advance, the mounting table 3 of the cleaning means, and Mounting stand 3 for cleaning means
Except that the cylinder means 8 for raising and lowering the vertical direction is omitted, the detailed description is omitted because it is almost the same as the above-described specific example.
【0042】本発明に於ける金型クリーニング装置に於
いては、該クリーニング手段6を該樹脂成形品搬送手段
5の移動方向Aと交差する方向に変位させるクリーニン
グ手段位置調整手段8を有しているものである。本発明
にかかる第2の具体例の金型クリーニング方法は、上記
した様に、上型部及び下型部からなる金型により所定の
樹脂成形品を成形した後、樹脂成形品搬送手段により当
該樹脂成形品を該金型より取り出して当該金型外部に搬
出するに際して、当該樹脂成形品搬送手段を、開放され
た上型部及び下型部の間に挿入するに際して、クリーニ
ング手段を当該樹脂成形品搬送手段が該金型部内に挿入
される直前に、該樹脂成形品搬送手段の該金型部に対向
する先端部に係合せしめた後、該樹脂成形品搬送手段
を、開放された上型部及び下型部の間に挿入させ、次い
で当該搬送手段が所定の樹脂成形品を取り上げて、該金
型外部に搬出するに際して、該クリーニング手段を該樹
脂成形品搬送手段に係合せしめた状態で、該樹脂成形品
搬送手段を当該金型外部に移動せしながら同時に当該ク
リーニング手段を駆動させて、当該金型の開放された上
型部及び下型部の樹脂成形面を清掃する様になし、次い
で該樹脂成形品搬送手段が、該金型部内より該樹脂成形
品を搬出した後、該クリーニング手段を当該樹脂成形品
搬送手段の該先端部から分離させる様にする金型クリー
ニング方法である。The mold cleaning apparatus according to the present invention has a cleaning means position adjusting means 8 for displacing the cleaning means 6 in a direction intersecting the moving direction A of the resin molded article conveying means 5. Is what it is. As described above, the mold cleaning method of the second specific example according to the present invention includes forming a predetermined resin molded product by a mold including an upper mold portion and a lower mold portion, and then performing the molding by a resin molded product conveying unit. When taking out the resin molded product from the mold and carrying it out of the mold, when inserting the resin molded product conveying means between the opened upper mold part and lower mold part, the cleaning means is used for the resin molding. Immediately before the article conveying means is inserted into the mold section, after engaging the tip end of the resin molded article conveying means facing the mold section, the resin molded article conveying means is opened. The cleaning means was engaged with the resin molded article conveying means when the conveying means picked up a predetermined resin molded article and carried it out of the mold. In this state, apply the resin molded article conveying means At the same time, the cleaning means is driven while being moved to the outside of the mold to clean the resin molding surfaces of the opened upper and lower mold parts of the mold, and then the resin molded article conveying means is moved. And a mold cleaning method in which the cleaning means is separated from the tip of the resin molded article conveying means after the resin molded article is carried out from the mold part.
【0043】[0043]
【発明の効果】本発明に係る樹脂成形品搬送手段及び金
型クリーニング方法は、樹脂成形品搬送手段5の前進後
退用駆動機構をクリーニング手段6の前進後退用駆動機
構と兼用する事が可能であるので、従来の方法の様に、
当該クリーニング手段6の為の専用の駆動機構を別に設
ける必要がなく、従って、クリーニング手段6の為の専
用の駆動機構を省略する事が出来るので、その分の空間
を省く事が可能となり、機構も簡単となるので、装置の
小型化、軽量化、保守性の向上等の効果を奏することが
出来る。According to the present invention, the resin-molded article conveying means and the mold cleaning method can use the forward / backward driving mechanism of the resin-molded article conveying means 5 as well as the forward / backward driving mechanism of the cleaning means 6. So, like the traditional method,
It is not necessary to separately provide a dedicated drive mechanism for the cleaning means 6 and, therefore, a dedicated drive mechanism for the cleaning means 6 can be omitted. Therefore, it is possible to achieve effects such as miniaturization, weight reduction, and improvement of maintainability of the apparatus.
【図1】図1は、本発明に係る金型クリーニング装置の
第1の具体例に於ける構成の概略と作動を説明する斜視
図である。FIG. 1 is a perspective view illustrating the outline and operation of a first specific example of a mold cleaning device according to the present invention.
【図2】図2は、本発明に係る金型クリーニング装置の
第2の具体例に於ける構成の概略と作動を説明する斜視
図である。FIG. 2 is a perspective view illustrating the outline and operation of a second specific example of the mold cleaning device according to the present invention.
【図3】図3は、本発明に係る金型クリーニング装置の
第2の具体例に於いて使用される樹脂成形品搬送手段と
クリーニング手段との着脱自在な係合手段の一具体例を
説明する平面図である。FIG. 3 illustrates a specific example of a detachable engaging means between a resin molded article conveying means and a cleaning means used in a second specific example of the mold cleaning apparatus according to the present invention. FIG.
【図4】図4は、本発明に係る金型クリーニング装置の
第2の具体例に於いて使用されるクリーニング手段支持
手段の構成例を説明する斜視図である。FIG. 4 is a perspective view illustrating a configuration example of a cleaning means supporting means used in a second specific example of the mold cleaning device according to the present invention.
【図5】図5は、本発明に係る第2の具体例に於ける動
作を説明する断面図である。FIG. 5 is a cross-sectional view illustrating an operation in a second specific example according to the present invention.
【図6】図6は、本発明に係る第2の具体例に於ける動
作を説明する断面図である。FIG. 6 is a cross-sectional view illustrating an operation in a second specific example according to the present invention.
【図7】図7は、本発明に係る第2の具体例に於ける動
作を説明する断面図である。FIG. 7 is a cross-sectional view illustrating an operation in a second specific example according to the present invention.
【図8】図8は、本発明に係る第2の具体例に於ける動
作を説明する断面図である。FIG. 8 is a cross-sectional view illustrating an operation in a second specific example according to the present invention.
【図9】図9は、本発明に係る第2の具体例に於ける動
作を説明する断面図である。FIG. 9 is a cross-sectional view illustrating an operation in a second specific example according to the present invention.
【図10】図10は、本発明に係る第2の具体例に於け
る動作を説明する斜視図である。FIG. 10 is a perspective view illustrating an operation in a second specific example according to the present invention.
1…樹脂成形品搬送手段の支持部材 3…クリーニング手段搭載台 5…樹脂成形品搬送手段 6…クリーニング手段 6a、6b…ブラシ手段 6c…クリーニングユニット手段 8…クリーニング手段位置調整手段、シリンダ 9…金型の上型部 10…金型の下型部 11…金型 12…樹脂成形品 12’…樹脂封止を必要とする基材 13…収納搬送ハンド手段 30…金型クリーニング装置 31、32…金型取付け用ステージ部 33…樹脂成形品搬送手段の先端部 35、35’…クリーニングユニット支持部材 36、36’…溝部、レール部 37、37’…突起部或いは凹み溝部 38、38’…支持部材 39…溝部或いはレール部 40…ストッパー手段 41…鉤状突起部 42…クリーニング手段の樹脂成形品搬送手段対向面部 43…鉤状開口部 DESCRIPTION OF SYMBOLS 1 ... Support member of resin molded article conveyance means 3 ... Cleaning means mounting base 5 ... Resin molded article conveyance means 6 ... Cleaning means 6a, 6b ... Brush means 6c ... Cleaning unit means 8 ... Cleaning means position adjusting means, cylinder 9 ... Gold Upper mold part of mold 10 ... Lower mold part of mold 11 ... Mold 12 ... Resin molded product 12 '... Substrate requiring resin sealing 13 ... Storage / transport hand means 30 ... Mold cleaning device 31, 32 ... Mold mounting stage 33: tip of resin molded product conveying means 35, 35 ': cleaning unit support member 36, 36': groove, rail 37, 37 ': projection or recess groove 38, 38': support Member 39: Groove or rail 40: Stopper 41: Hook-shaped projection 42: Opposite surface of resin-molded article conveying means of cleaning means 43: Hook-shaped open Part
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6,DB名) B29C 33/44 - 33/46 B29C 33/72 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 6 , DB name) B29C 33/44-33/46 B29C 33/72
Claims (8)
上型部及び下型部が開放状態にある金型内部に挿入さ
れ、当該金型部内部から樹脂成形品を取り上げて、該金
型外部に搬出する樹脂成形品搬送手段と、当該樹脂成形
品搬送手段と係合し、当該樹脂成形品搬送手段が該樹脂
成形品を搬出する搬出操作時に該金型の上型部及び下型
部の少なくとも一方の金型部の樹脂成形面と接触して当
該樹脂成形面を清掃するクリーニング手段とが設けられ
ている金型クリーニング装置に於て、該クリーニング手
段は、当該樹脂成形品搬送手段が、該開放された当該金
型内部に挿入される挿入操作時には、該上型部及び下型
部の金型部の樹脂成形面には接触せず、当該樹脂成形品
搬送手段が該金型部内より、該樹脂成形品を搬出する搬
出操作時に該金型の上型部及び下型部の少なくとも一方
の金型部の樹脂成形面と接触する様に、当該クリーニン
グ手段の存在位置を変位させる機構を有しており、且
つ、当該クリーニング手段は、該樹脂成形品搬送手段に
於ける、該金型部に対向する先端部に、着脱自在の係合
機構を介して取付けられている事を特徴とする金型クリ
ーニング装置。1. A mold comprising an upper mold part and a lower mold part, and a resin molded product which is inserted into a mold in which the upper mold part and the lower mold part are in an open state, and picks up a resin molded product from the inside of the mold part. A resin molded product conveying means for carrying out the outside of the mold, and the upper mold portion of the mold engaged with the resin molded product carrying means when the resin molded product carrying means carries out the resin molded product. and at a least one of the contact with the resin molding face of the mold part a mold cleaning apparatus and a cleaning means is provided for cleaning the resin molding face of the lower mold portion, the cleaning hands
The step is a step in which the resin molded article conveying means is provided with the opened metal.
During the insertion operation to be inserted into the mold, the upper mold part and the lower mold
Contact with the resin molding surface of the mold part
A carrying means for carrying out the resin molded product from inside the mold portion.
At least one of the upper mold part and the lower mold part of the mold during the dispensing operation
The cleaning so that it contacts the resin molding surface of the mold
A mechanism for displacing the position of the
In addition, the cleaning means is provided in the resin molded article conveying means.
Detachable engagement with the tip portion facing the mold portion.
A mold cleaning device characterized by being mounted via a mechanism .
調整手段、ブラシ手段振動手段及び吸引手段の少なくと
も一つを含んでいる事を特徴とする請求項1に記載の金
型クリーニング装置。2. The cleaning device according to claim 1, wherein said cleaning device is located at a brush device position.
At least adjusting means, brush means, vibrating means and suction means
The mold cleaning device according to claim 1, further comprising one of them.
品搬送手段が該金型部内に挿入される挿入操作開始時の
直前に、当該樹脂成形品搬送手段の該先端部に係合され
る様に構成されている事を特徴とする請求項1又は2記
載の金型クリーニング装置。Wherein said cleaning means, the resin molding
At the start of the insertion operation in which the article conveying means is inserted into the mold part.
Immediately before, it is engaged with the tip of the resin molded article conveying means.
The mold cleaning device according to claim 1, wherein the mold cleaning device is configured to perform the following .
品搬送手段が該金型部内より、該樹脂成形品を搬出し、
該搬出操作終了後、当該樹脂成形品搬送手段の該先端部
との係合が解舒される様に構成されている事を特徴とす
る請求項1または2記載の金型クリーニング装置。4. The cleaning device according to claim 1, wherein
The article conveying means unloads the resin molded article from inside the mold section,
After the end of the unloading operation, the leading end of the resin molded article conveying means
Is configured to be released from engagement with the
The mold cleaning device according to claim 1 or 2, wherein
搬送手段の移動方向と交差する方向に移動可能に構成さ
れている事を特徴とする請求項1乃至4の何れかに記載
の金型クリーニング装置。 5. The resin molded product according to claim 1, wherein
It is configured to be movable in a direction that intersects the
The mold cleaning device according to any one of claims 1 to 4, wherein
ング手段を該樹脂成形品搬送手段の移動方向と交差する
方向に変位させるクリーニング手段位置調整手段を有し
ている事を特徴とする請求項5記載の金型クリーニング
装置。6. The cleaning device according to claim 1 , wherein the mold cleaning device comprises:
Intersecting with the moving direction of the resin molded article conveying means
Cleaning means displaced in the direction
The mold cleaning device according to claim 5, wherein
半導体素子を樹脂で封止する半導体樹脂封止装置に使用
されるものである事を特徴とする請求項1乃至6の何れ
かに記載の金型クリーニング装置。7. The mold is mounted on a lead frame.
Used for semiconductor resin sealing equipment that seals semiconductor elements with resin
7. The method according to claim 1, wherein
A mold cleaning apparatus according to any one of the above.
定の樹脂成形品を成形した後、樹脂成形品搬送手段によ
り当該樹脂成形品を該金型より取り出して当該金型外部
に搬出するに際して、当該樹脂成形品搬送手段を、開放
された上型部及び下型部の間に挿入するに際して、クリ
ーニング手段を該樹脂成形品搬送手段に係合せしめた状
態で、該樹脂成形品搬送手段を、開放された上型部及び
下型部の間に挿入させ、次いで当該搬送手段が所定の樹
脂成形品を取り上げて、該金型外部に搬出するに際し
て、該クリーニング手段を該樹脂成形品搬送手段に係合
せしめた状態で、該樹脂成形品搬送手段を当該金型外部
に移動せしながら同時に当該クリーニング手段を駆動さ
せて、当該金型の開放された上型部及び下型部の樹脂成
形面を清掃する事を特徴とする金型クリーニング方法に
於て、当該クリーニング手段を、当該樹脂成形品搬送手
段が該金型部内に挿入される直前に、該樹脂成形品搬送
手段に於ける、当該樹脂成形品搬送手段の該金型部に対
向する先端部に係合せしめると共に、該樹脂成形品搬送
手段が、該金型部内より該樹脂成形品を搬出した後、該
クリーニング手段を当該樹脂成形品搬送手段の該先端部
から分離させる事を特徴とする金型クリーニング方法。 8. A mold comprising an upper mold part and a lower mold part.
After molding a fixed resin molded product, the resin molded product
Remove the resin molded product from the mold and
Open the resin molded product transfer means
When inserting between the upper mold part and the lower mold part
The cleaning means is engaged with the resin molded article conveying means.
In this state, the resin molded article conveying means, the open upper mold portion and
Insert between the lower mold parts, and then
When picking up the oil molded product and carrying it out of the mold,
And engage the cleaning means with the resin molded article conveying means.
In the squeezed state, move the resin molded product transfer means outside the mold.
And at the same time drive the cleaning means.
Then, the resin composition of the open upper mold part and lower mold part of the mold is
Mold cleaning method characterized by cleaning the mold surface
In this case, the cleaning means is connected to the resin molded article transporter.
Immediately before the step is inserted into the mold part, the resin molded article is conveyed.
Means for transferring the resin molded article to the mold portion.
And the resin molded article is conveyed.
Means for carrying out the resin molded product from within the mold portion,
The cleaning means is provided at the tip of the resin molded article conveying means.
A mold cleaning method characterized by separating from a mold.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8153613A JP2904124B2 (en) | 1996-06-14 | 1996-06-14 | Mold cleaning device and mold cleaning method |
KR1019970024781A KR100266526B1 (en) | 1996-06-14 | 1997-06-14 | Mold-cleaning apparatus and mold-cleaning method |
NL1006326A NL1006326C2 (en) | 1996-06-14 | 1997-06-16 | Apparatus and method for cleaning a mold. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8153613A JP2904124B2 (en) | 1996-06-14 | 1996-06-14 | Mold cleaning device and mold cleaning method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH10631A JPH10631A (en) | 1998-01-06 |
JP2904124B2 true JP2904124B2 (en) | 1999-06-14 |
Family
ID=15566322
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8153613A Expired - Fee Related JP2904124B2 (en) | 1996-06-14 | 1996-06-14 | Mold cleaning device and mold cleaning method |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2904124B2 (en) |
KR (1) | KR100266526B1 (en) |
NL (1) | NL1006326C2 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100764803B1 (en) | 2006-10-12 | 2007-10-08 | 세크론 주식회사 | Mold cleaner for semiconductor device |
KR100945895B1 (en) | 2008-05-21 | 2010-03-05 | 주식회사 피에스엠 | In line die cleaning apparatus and method for semiconductor molding equipments |
KR101854007B1 (en) * | 2014-09-11 | 2018-05-03 | 세메스 주식회사 | Apparatus for molding a semiconductor device |
CN109940845A (en) * | 2017-12-21 | 2019-06-28 | 重庆科美模具有限公司 | Injection mold protective device |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61148016A (en) * | 1984-12-24 | 1986-07-05 | Hitachi Ltd | Molding system |
DE3515255A1 (en) * | 1985-04-27 | 1986-10-30 | Hartmann, Josef, 7987 Weingarten | Device for removing and transferring further an injection moulded part in an injection moulding machine |
JPH084097B2 (en) * | 1986-09-03 | 1996-01-17 | 日本電気株式会社 | Semiconductor resin sealing device |
DE3837257A1 (en) * | 1988-11-03 | 1990-05-10 | Krupp Gmbh | DEVICE FOR CLEANING A MOLDING TOOL OF PLASTIC PROCESSING MACHINES |
WO1991008095A2 (en) * | 1989-11-24 | 1991-06-13 | Asm Fico Tooling B.V. | Single-strip moulding apparatus |
JP3502106B2 (en) * | 1991-01-14 | 2004-03-02 | 松下電器産業株式会社 | Mold press equipment |
JPH0919950A (en) * | 1995-07-06 | 1997-01-21 | Mitsubishi Materials Corp | Injection molding apparatus |
-
1996
- 1996-06-14 JP JP8153613A patent/JP2904124B2/en not_active Expired - Fee Related
-
1997
- 1997-06-14 KR KR1019970024781A patent/KR100266526B1/en not_active IP Right Cessation
- 1997-06-16 NL NL1006326A patent/NL1006326C2/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR980005917A (en) | 1998-03-30 |
NL1006326A1 (en) | 1997-12-17 |
JPH10631A (en) | 1998-01-06 |
KR100266526B1 (en) | 2000-09-15 |
NL1006326C2 (en) | 1998-05-18 |
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