HK1074816A1 - Resin sealing molding apparatus - Google Patents

Resin sealing molding apparatus

Info

Publication number
HK1074816A1
HK1074816A1 HK05107137A HK05107137A HK1074816A1 HK 1074816 A1 HK1074816 A1 HK 1074816A1 HK 05107137 A HK05107137 A HK 05107137A HK 05107137 A HK05107137 A HK 05107137A HK 1074816 A1 HK1074816 A1 HK 1074816A1
Authority
HK
Hong Kong
Prior art keywords
molding apparatus
resin sealing
sealing molding
resin
sealing
Prior art date
Application number
HK05107137A
Other languages
English (en)
Inventor
Kenji Ogata
Yuichi Tanaka
Original Assignee
Dai Ichi Seiko Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Ichi Seiko Co Ltd filed Critical Dai Ichi Seiko Co Ltd
Publication of HK1074816A1 publication Critical patent/HK1074816A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1753—Cleaning or purging, e.g. of the injection unit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1769—Handling of moulded articles or runners, e.g. sorting, stacking, grinding of runners
HK05107137A 2003-10-30 2005-08-17 Resin sealing molding apparatus HK1074816A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003370707A JP3609824B1 (ja) 2003-10-30 2003-10-30 樹脂封止成形装置

Publications (1)

Publication Number Publication Date
HK1074816A1 true HK1074816A1 (en) 2005-11-25

Family

ID=34101303

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05107137A HK1074816A1 (en) 2003-10-30 2005-08-17 Resin sealing molding apparatus

Country Status (5)

Country Link
JP (1) JP3609824B1 (xx)
KR (1) KR100675466B1 (xx)
CN (1) CN100366414C (xx)
HK (1) HK1074816A1 (xx)
TW (1) TWI251885B (xx)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3926379B1 (ja) * 2006-10-25 2007-06-06 株式会社エヌ．エフ．テイ 樹脂モールド装置
CN102785326A (zh) * 2011-05-19 2012-11-21 深圳市安托山特种机电有限公司 一种新型封装材料注射机
JP5387646B2 (ja) * 2011-10-07 2014-01-15 第一精工株式会社 樹脂封止装置
JP5866398B2 (ja) * 2013-05-15 2016-02-17 東芝機械株式会社 成形システム及び成形品の製造方法
JP6218549B2 (ja) * 2013-10-17 2017-10-25 Ｔｏｗａ株式会社 半導体封止型への半導体基板供給方法及び半導体基板供給装置
JP7335647B2 (ja) * 2018-08-10 2023-08-30 アピックヤマダ株式会社 ワーク搬送装置及び樹脂モールド装置
JP7068094B2 (ja) * 2018-08-10 2022-05-16 アピックヤマダ株式会社 ワーク搬送装置、樹脂搬送装置及び樹脂モールド方法
JP7203414B2 (ja) * 2018-12-27 2023-01-13 アピックヤマダ株式会社 樹脂供給取出装置、ワーク搬送装置及び樹脂モールド装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06830A (ja) * 1992-06-22 1994-01-11 Toshiba Corp モールドシステム
TW257745B (xx) * 1993-07-22 1995-09-21 Towa Kk
TW410194B (en) * 1996-08-20 2000-11-01 Apic Yamada Kk Resin molding machine
TW509615B (en) * 2000-04-21 2002-11-11 Apic Yamada Corp Resin molding machine and resin tablet feeding machine
JP4327986B2 (ja) * 2000-04-21 2009-09-09 アピックヤマダ株式会社 樹脂封止装置

Also Published As

Publication number Publication date
KR100675466B1 (ko) 2007-01-26
JP2005136193A (ja) 2005-05-26
CN1611339A (zh) 2005-05-04
CN100366414C (zh) 2008-02-06
TW200529335A (en) 2005-09-01
JP3609824B1 (ja) 2005-01-12
TWI251885B (en) 2006-03-21
KR20050041890A (ko) 2005-05-04

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20201027