KR100527897B1 - 매스 리플로우에 의해 장착되는 이미지 센서 - Google Patents

매스 리플로우에 의해 장착되는 이미지 센서 Download PDF

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Publication number
KR100527897B1
KR100527897B1 KR10-2001-7004632A KR20017004632A KR100527897B1 KR 100527897 B1 KR100527897 B1 KR 100527897B1 KR 20017004632 A KR20017004632 A KR 20017004632A KR 100527897 B1 KR100527897 B1 KR 100527897B1
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KR
South Korea
Prior art keywords
image sensor
package
imaging system
cfa
color
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR10-2001-7004632A
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English (en)
Korean (ko)
Other versions
KR20010080129A (ko
Inventor
셍웁타가불에스.
아싸디아자르
앨리앨런비.
선달로버트씨.
Original Assignee
인텔 코오퍼레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 인텔 코오퍼레이션 filed Critical 인텔 코오퍼레이션
Publication of KR20010080129A publication Critical patent/KR20010080129A/ko
Application granted granted Critical
Publication of KR100527897B1 publication Critical patent/KR100527897B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR10-2001-7004632A 1998-10-13 1999-10-11 매스 리플로우에 의해 장착되는 이미지 센서 Expired - Fee Related KR100527897B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/172,734 US6753922B1 (en) 1998-10-13 1998-10-13 Image sensor mounted by mass reflow
US09/172,734 1998-10-13

Publications (2)

Publication Number Publication Date
KR20010080129A KR20010080129A (ko) 2001-08-22
KR100527897B1 true KR100527897B1 (ko) 2005-11-15

Family

ID=22628985

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2001-7004632A Expired - Fee Related KR100527897B1 (ko) 1998-10-13 1999-10-11 매스 리플로우에 의해 장착되는 이미지 센서

Country Status (9)

Country Link
US (5) US6753922B1 (https=)
EP (1) EP1121799B1 (https=)
JP (1) JP5201770B2 (https=)
KR (1) KR100527897B1 (https=)
AU (1) AU1444900A (https=)
DE (1) DE69933040T2 (https=)
MY (1) MY118657A (https=)
TW (1) TW454411B (https=)
WO (1) WO2000022814A2 (https=)

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Also Published As

Publication number Publication date
DE69933040T2 (de) 2007-03-01
US6692993B2 (en) 2004-02-17
US20040159902A1 (en) 2004-08-19
KR20010080129A (ko) 2001-08-22
DE69933040D1 (de) 2006-10-12
AU1444900A (en) 2000-05-01
EP1121799A4 (en) 2004-08-04
US6072232A (en) 2000-06-06
US6753922B1 (en) 2004-06-22
US20020125552A1 (en) 2002-09-12
US7026707B2 (en) 2006-04-11
JP5201770B2 (ja) 2013-06-05
JP2002527912A (ja) 2002-08-27
WO2000022814A9 (en) 2000-09-21
TW454411B (en) 2001-09-11
EP1121799B1 (en) 2006-08-30
WO2000022814A2 (en) 2000-04-20
WO2000022814A3 (en) 2000-08-03
EP1121799A2 (en) 2001-08-08
US7223631B2 (en) 2007-05-29
MY118657A (en) 2004-12-31
US20060141674A1 (en) 2006-06-29

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