TW558840B - Image sensor of tape carrier package and method for manufacturing the same - Google Patents

Abstract

An image sensor of tape carrier package includes a flexible substrate, a base and an image sensing chip. The flexible substrate has a slit which passing through an upper surface and a lower surface. The flexible substrate forms a plurality of flying grids extending to the slit. The base is mounted on the lower surface of flexible substrate by molding. The base has a chip-passing hole. A photosensitive surface of the image sensing is upwards and passes through the chip-passing hole of base. A plurality of bumps formed on the photosensitive surface is electrically connected with the flying grids of the flexible substrate. Thus, the image sensing chip locates inside the base and no contacts the base.

Description

558840

V. Description of the invention (1) [Field of the invention] 棬 Φ Ϊ: There is an image sensor, especially an image sensor in the 41 # package, which can avoid mismatch due to thermal stress- An image sensor for sensing chip chipping and its manufacturing method. [Previous technology] 1. The application fields of front image sensors are quite extensive, such as digital cameras,: κ f ί, mobile phone systems and video conferences, etc., which are based on an image sensing chip C such as a complementary metal oxide semiconductor CM0S) is packaged in the optical device β to capture the optical image signal, convert the optical image signal into an electronic signal and transfer it to the circuit substrate, so that the optical image signal can be identified, processed or stored.

In the Republic of China Patent Gazette Bulletin No. 484237 "Optical Device for Tape and Reel Packaging", an optical device and its packaging method are disclosed. As shown in Fig. 8, the optical device 200 includes a flexible circuit substrate 21, A plurality of metal circuits 220, a light-sensing chip 230, and a base 240, wherein the soft circuit substrate 210 is taken from a tape with a metal circuit 220 formed therein, and the inner pins 221 of the metal circuits 220 extend to the A window 211 of the flexible circuit substrate 2 10 'A plurality of bumps 231 are formed on the front surface of the light sensing wafer 2 3 0 and are electrically bonded to the inner pins 221 of the flexible circuit substrate 210. Then, a thermosetting material is formed. The mold 240 is filled with glue to form a base 240. The light sensing chip 230 is housed in the base 240 and is covered and carried by the harder base 240. The base 240 is formed so that the flexible circuit board 2 10 And the light sensing chip 230 maintains a certain flatness. When the temperature of the die-forming base 240 is heated above its glass transition temperature (glass transition temperature Tg,

Page 5 558840 V. Description of the invention (2) Depending on the material of the thermosetting material (between about 50 and 200 ° C), at this time

The thermal expansion coefficient of the base 240 is about 50 to 60 ppm / ° C. When the temperature of the base 240 is cooled to below its glass transition temperature: at this time, the thermal expansion coefficient of the base 240 is about 15 to 20 ppm / ° C. The conventional light-sensing chip 230 is made of silicon wafer. The thermal expansion coefficient of the light-sensing chip 230 is about 3 ~ 4ppm / ° C. The thermal expansion coefficient of the base 240 is due to the temperature rise when the stamper is formed. And the temperature drop from 50 ~ 60ppm / ° C to 15 ~ 20ρριη / χ: and because the base 240 is formed of a thermosetting material to cover the light-sensing chip 23, it is very easy to cause the base 240 to be die-molded. The wafer 230 is damaged, and because the thermal expansion coefficients of the light-sensing wafer 230 and the base 240 are not matched, it is easy to generate thermal stress on the contact surface between the light-sensing wafer 230 and the base 2 40, causing the wafer to warp. Warping or cracking. In addition, in the aforementioned optical device manufacturing process, the light sensing wafer 23 is first bonded to the flexible circuit substrate 210, and then the die is formed to form a base 24. During the stamping process, the thermosetting material is heated to make it fluid. Then, the thermosetting material is poured into the mold under high pressure. When the light sensing wafer 230 is improperly joined with the inner pin 221 or the pressure of the high pressure pouring into the mold due to the thermosetting filler is too high, the capacity of the sensing wafer 230 is tilted, which prevents The optical setting is accurately captured and cannot be repaired. ^ Image State [Objective and Summary of the Invention] Sensing Burst: The main purpose is to provide an image of a tape carrier package = = to a flexible substrate, so that the image sensing chip =-does not touch the side base, so it can prevent image sensing Chip and base

558840 V. Description of the invention (3) Thermal stress is generated between °° The second purpose of the present invention is to provide a sensor for short supply. The image sensor is formed by a tape and a base. The base is used to maintain the sense of image. The test chip has a stable optical imaging signal. Yet another object of the present invention is to provide a method for manufacturing a sensor, which is based on the base of the tape reel, and the flexible substrate is placed by the wafer into the inlet. Therefore, the base is offset or tilted when the die is formed to make subsequent bonding images. Take the optical image signal. Another object of the present invention is to provide a method for manufacturing a sensor, which is attached to a base of a tape take-up opening, and then the wafer is placed in the inlet to place a flexible substrate 'so that the base is damaged when the base is formed. It is made of a tape and tape carrying package. The flat substrate has a sensing angle of the flexible substrate. The tape and tape can be sealed with a stamper to form an image sensing chip. It does not cause the image sensing chip to maintain the mounted image and press it. The degree of shape enables the accurately captured image chip to be insertedly bonded to the sensor chip for flattening to capture a tape carrier to seal the stamper to form an image with the image sensor chip that will not cause image sensing. II Chip placement An image sensor according to the present invention, which is reel-bonded to a test wafer, includes a flexible substrate, a base, and an image sensing chip, wherein the flexible substrate has a slot penetrating the upper and lower surfaces. Holes, and the flexible substrate is formed with a circuit pattern 'the circuit pattern is provided with a plurality of floating pins extending to the slot hole' and the base is stamped on the lower surface of the f flexible substrate to form the base, the base is provided with a wafer Entrance, the wafer placement entrance corresponds to the slot of the flexible substrate 'the image sensing wafer is placed through the wafer with the photosensitive side facing up

558840 V. Description of the invention

Sense ===== According to the present invention, the steps of the tape carrier sealing include: firstly providing a board, which has at least one penetrating circuit pattern formed thereon, the circuit board's floating pins; providing at least one shadow of photosensitivity The surface is upward and a base is formed on the lower surface of the tape, a method for manufacturing an image sensor, a tape, the tape is a soft base, a slot on the lower surface, and the roll The belt system has a plurality of image sensor wafers extending to the slot, and the image sensor wafer has a plurality of bumps; and then the mold is formed to form at least one of the base systems having a wafer insertion.

Port 1 The chip placement inlet corresponds to the slot of the tape, and the remaining wafer placement inlet is larger than the image sensing wafer for the image sensing wafer to pass through. Finally, the image sensing wafer is electrically connected. With the reel, the image sensing chip is placed through the wafer inlet of the stage base, and the image sensing chip is

The bumps are electrically connected to the floating pins of the tape, so that the image sensing chip is located in the base and does not contact the base. [Detailed description of the invention] Please refer to the attached drawings. The present invention will enumerate the following embodiments: According to the first embodiment of the present invention, FIGS. 1 to 6 are image sensing of a tape carrier package. A schematic sectional view of the process steps of the device 100. The image sensor 100 includes a flexible substrate 110, a base 120, and an image sensing chip 130. The manufacturing method is as follows. · First, as shown in Figure 1, provide a roll of tape, such as

558840 V. Description of the invention (5) Soft materials such as imine (PI) are used as the flexible substrate 1 10 of the image sensor 100. In this embodiment, the flexible substrate 11 The surface 111, the lower surface 112, and at least one slot hole 113, the slot holes 1 1 3 penetrate the upper surface 11 1 and the lower surface 112, and the flexible substrate 110 is formed with a circuit pattern (not shown) (Illustrated), in this embodiment, the circuit pattern is formed on the lower surface 112, which is provided with a plurality of flying grids 114 (flying grid) extending to the slot 113 to electrically connect an image sense.测 Fairing 130. Next, an image sensing chip 1 30 (as shown in FIG. 3) is provided. The image sensing chip 1 30 is a light sensing chip (〇ptica 1 sensing chip) and a charge coupled device (charge coupled device). CCD), complementary metal oxide semiconductor (CMOS), photodiode or infrared sensor, etc. The image sensing chip 130 has a photosensitive surface 1 31 is used to hold optical image signals. Bumps 132 (such as gold bumps) are formed on the photosensitive surface 131 as signal output ends of the image sensing chip 1 30. Then, as shown in FIG. 2, the stamper forms at least one base 1 2 0 on the lower surface 112 of the flexible substrate 110. In this embodiment, the base 1 20 is die-molded from a thermosetting material by a mold ( mo 1 di ng), which has a wafer insertion opening 1 2 1, and the wafer insertion inlet 1 21 is a slot 11 3 corresponding to the flexible substrate 1 1 0 for the image sensing wafer 1 3 0 When the wafer passes, the wafer inlet 1 2 1 is larger than the image sensor wafer 1 3 0 to prevent abrasion through the image 558840

V. Description of the invention (6) Sensing chip {30. After that, as shown in FIG. 3, the image sensing wafer 13o and the flexible substrate 11 are electrically bonded to the image sensing wafer 1 30, and the photosensitive surface 1 31 of the image sensing wafer 13 passes upward through the wafer of the base 1 2 0. The entrance 1 2 1 is set, and the floating pins 1 1 4 of the flexible substrate 丨 丨 are electrically connected to the projections 1 3 2 of the image sensing chip 1 3 0 to make the image sensing The wafer 130 is located in the base 120 and does not contact the base 120. ~ As shown in FIGS. 4 and 5 again, 'In this embodiment, a protective colloid 1 3 3 is applied around the slot 11 3 of the flexible substrate 丨 j 〇 (preferably a translucent colloid). Mo colloid 1 3 3 is used to spread to the periphery of the photosensitive surface 131 of the image sensing chip 130 and the lower surface 112 of the flexible substrate 110 by using capillary phenomenon. The protective colloid 1 3 3 does not cover the central part of the photosensitive surface 1 31. The protective colloid 1 3 3 not only enables the image sensing chip 130 to be firmly coupled to the flexible substrate 1 1 0, but also to increase the lambda picking 1 3 9 to complete the coffee from the coffee ^ 4 ^

On the 'make the flexible substrate 11 〇 and the image sensing chip j 3 〇 can be 5 light sensitive surface of the image sensing wafer I 3 0 j 3 j can pass through 558840 V. Description of the invention (7) Cover 1 4 G corresponds to optical The lens of the device 丨 50 (that is, the image sensing chip 130, the transparent cover 14o and the lens 丨 50 are in a set angle correspondence relationship, such as being parallel to each other to make the image sensor 100 packaged image sensor chip 1 30 It has a stable image sensing angle, and will not produce displacement or deviation of the image capturing angle.

Because the image sensor chip of the image sensor of the present invention, the image sensor chip, is located in the base 120 and does not contact the base 120, so it will not be caused by the thermal expansion of the base 120 and the image sensor chip 130. The coefficients do not match and thermal stress is generated. The image sensor chip 130 will not warp, deform or crack. In addition, in the process of the image sensor, the first step is to place the flexible substrate on the flexible substrate 110. The thermosetting material forms a base 1 20 with a wafer insertion opening 1 21 by a compression molding method, and then electrically connects the image sensing wafer 12G to a flexible substrate through the wafer insertion opening 21, so when the base 120 is formed, Even if the thermal expansion coefficient of the thermosetting material changes sharply due to the heating and cooling of the stamping process, it will not cause the image sensor wafer to be damaged. On the other hand, when the base 1 2 0 is formed, the thermosetting material is poured into the mold. If the pressure is too large, it will not cause the subsequent jointed image sensing chip 130 to shift or tilt, so that the image sensing chip 130 can maintain flatness and can accurately capture optical image signals. According to the second specific embodiment of the present invention, as shown in FIG. 7, in the second specific embodiment, the same components as the first specific embodiment are represented by the same drawing numbers, wherein the tape carries the packaged image The sensor system includes an image sensing chip 130, a flexible substrate 160 and a base 170. In this embodiment, the flexible substrate 160 has a top surface 161 and a bottom surface that penetrate through

558840 V. Description of the invention (8) 162 slot 163. In this embodiment, the circuit pattern (not shown) of the flexible substrate 16 is formed on the upper surface 1 6 1 and has a plurality of extensions to the The floating pin 164 of the slot 163 is used to electrically connect the image sensing chip 130. When the base 170 is formed by stamping, the base 170 has a wafer receiving port 17 and a stepped bank. 1 72, wherein the wafer insertion opening 171 corresponds to the slot 163 of the flexible substrate 160, and the bank 172 is

stress), the image sensing chip 13 ° will not warp, deform or even be damaged. In this case, the pedestal 170 with a bank 172 can maintain the flatness of the flexible substrate 16 and the flatness of the sensing chip 130, so that The photosensitive surface 13! Of the image sensing chip 13 !: a flat lens corresponding to the optical device ... etc., so that the image sensor has a stable image sensing angle, and can accurately capture the image signal of the first learning.

It is formed on the upper surface 16 of the flexible substrate 16 and passes the image sensor wafer 130 through the wafer inlet 17 1 and is electrically bonded to the flexible substrate 161. Then, a transparent cover 140 is placed. The bank 172 bonded to the base 丨 70 is provided to provide better stability and sealing to the image sensing chip 130, because the image sensing chip 130 is located in the base 170 and does not contact the base 170. Therefore, it is possible to prevent thermal stress between the base 170 and the image sensing chip 130 (thermal. Therefore, the scope of protection of the present invention shall prevail. Any changes and repairs made within the scope of this technology are well known. 0 See attached application Those defined in the scope of the patent, "without departing from the spirit and modification of the invention," all belong to the protection scope of the invention.

558840 Brief description of the drawings [Illustration of the drawings] Figure 1 · Schematic diagram according to the present invention Figure 2 · Section of the seat according to the present invention Figure 3: Test chip according to the present invention Figure 4: No. 5 according to the present invention substrate Figure: Figure 6 of the substrate according to the present invention: Section of the document according to the present invention. Figure 7: Image sensing according to the present invention. Figure 8: Learning Volume [Illustration of Drawing Number] I 〇〇Image Sensor II 0 on the flexible substrate 111 The surface 113 slot 120 base 1 21 wafer placement inlet 130 the first specific embodiment of the image sensing crystal, providing a view of the first specific embodiment seen above the tape; the first specific embodiment of the Ming and the tape Sectional view; Cross-sectional view of the upper surface of the first specific embodiment; First schematic view of the first specific embodiment of the upper surface of the first specific embodiment; Press mold to form at least one bottom electrically connected to an image to form an adhesive layer A second embodiment of forming an adhesive layer on a flexible surface and combining at least one transparent cover on a flexible surface, a cross-sectional view of a roll-loaded packaging tester, and a cross-sectional view of an optical device with a package. Sheet U2 lower surface 11 4 floating pin i

Page 13 558840 Brief description of the diagram 131 Photosensitive surface 132 140 Transparent cover 150 160 Flexible substrate 161 Upper surface 162 163 Slot 164 170 Base 1 71 Wafer inlet 200 Optical device 210 Soft circuit substrate 211 Window 220 Metal wire 221 Inner pin 230 light-sensing chip 231 bump 240 base bump lens bottom surface hanging pin 133 protective colloid 172 bank

Page 14

Claims (1)

558840 VI. Scope of patent application [Patent application patent garden] 1. A method for manufacturing a tape and tape carrying package image sensor, the steps include: providing a tape, the tape is a flexible substrate, which is There is an upper surface, a lower surface, and at least one slot hole, the slot hole runs through the upper surface and the lower surface, and the tape system is formed with a circuit pattern, and the circuit pattern has a plurality of suspensions extending to the slot hole. Pins; providing at least one image sensing chip, the photosensitive surface of the image sensing chip is facing upwards and a plurality of bumps are formed; the stamper forms at least one base on the lower surface of the tape, wherein the base has a A wafer placement inlet corresponding to the slot of the tape, and the wafer placement inlet is larger than the image sensing wafer for the image sensing wafer to pass through, and after the base is formed, it is electrically bonded The image sensing chip and the tape, the image sensing chip is inserted through the wafer of the base, and the floating pins of the tape are electrically connected to the image sensing chip. The bumps make the image sensing chip be located in the base and not contact the base.乂 2. The method for manufacturing an image sensor in a tape carrier package as described in item 1 of the scope of the patent application, wherein after the step of "electrically bonding the image sensing crystal ^ the tape", Apply one dollar to the periphery of the slot. The protective glue system uses capillary phenomenon to spread to the periphery of the photosensitive surface of the image and eyes. ,,,,,,,,,,,,,,,,,,,,,,,,,, 3. The tape carrier package described in item 1 or 2 of the scope of patent application, 558840 6. Scope of patent application The transparent cover of the sensor is above the surface. 4. If the application for the special test device is manufactured on the tape 5. If the application for the special test device is manufactured, the bottom 6. If the application for the special test device is manufactured, the bottom 7. A tape with a soft base The slot is a method for manufacturing a floating pin with a circuit diagram, and the transparent cover is the third method in the right range, in which the surface is. The first method of the electric power range, wherein the base is the first method of the thermal solid power range, wherein the base has a plate bearing a package, which has a top surface, and the circuit further includes a step of combining at least one application. The transparent cover is fixed on the base and combined with the tape bearing package described in the item above the tape. The transparent cover is fixed with the protective colloid to the item described in the "compressive material item described in the" extending to the image. " The tape bearing mold of the sense is formed to the stamper (the tape bearing mold of the mo is formed to the tape upper tester, which is an upper surface and the lower pattern system surface, and has a base with a plurality of packages for image sense. " Step lding). The image of the package is one step less than the base j. Including: a lower surface and a slot, the flexible substrate is extended to the base of the slot, the die is formed into a sheet inlet, an image sensing wafer, and the photosensitive electrical bonding of the wafer is seventh It is provided with a crystal slot for an image sensing. The image sensing the bumps. 8. If applying for the bottom surface of the flexible substrate, the wafer insertion opening of the base corresponds to the wafer of the tape. Pass; and are located in the base without contacting the base, the surface is upward and a plurality of bumps are formed, and the floating pins of the flexible substrate. The image sensor IRI ^ I lUffill 558840 mentioned in the tape carrier package mentioned in Item 6. A patent scope detector, wherein a protective colloid is formed around the slot of the flexible substrate, and the protective adhesive system is bonded to the image sensor chip. The periphery of the photosensitive surface 0 9. The image sensor of the tape carrier package described in item 7 or 8 of the scope of patent application, further comprising a transparent cover, which is coupled above the upper surface of the flexible substrate. 10. The image sensor of the tape carrier package described in item 9 of the scope of the patent application, wherein the transparent cover is adhered to the upper surface of the flexible substrate with the protective colloid. . i j. The image sensor of the tape carrier package described in item 7 of the scope of the patent application, wherein the wafer insertion opening of the base is larger than the image sensing wafer. _ 1 2. The tape-and-reel image sensor described in item 7 of the scope of patent application, wherein the base is a thermosetting material. 1 3. The tape-carrying sealed image sensor described in item 7 of the scope of the patent application, wherein the base is provided with a flexible substrate extending: