MY118657A - Windowed non-ceramic package having embedded frame - Google Patents

Windowed non-ceramic package having embedded frame

Info

Publication number
MY118657A
MY118657A MYPI99005288A MYPI9905288A MY118657A MY 118657 A MY118657 A MY 118657A MY PI99005288 A MYPI99005288 A MY PI99005288A MY PI9905288 A MYPI9905288 A MY PI9905288A MY 118657 A MY118657 A MY 118657A
Authority
MY
Malaysia
Prior art keywords
ceramic package
embedded frame
mold compound
package
frame
Prior art date
Application number
MYPI99005288A
Other languages
English (en)
Inventor
Zong-Fu Li
Kabul Sengupta
Deborah L Thompson
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of MY118657A publication Critical patent/MY118657A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
MYPI99005288A 1998-10-13 1999-12-06 Windowed non-ceramic package having embedded frame MY118657A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/172,734 US6753922B1 (en) 1998-10-13 1998-10-13 Image sensor mounted by mass reflow
US09/219,186 US6072232A (en) 1998-10-13 1998-12-21 Windowed non-ceramic package having embedded frame

Publications (1)

Publication Number Publication Date
MY118657A true MY118657A (en) 2004-12-31

Family

ID=22628985

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI99005288A MY118657A (en) 1998-10-13 1999-12-06 Windowed non-ceramic package having embedded frame

Country Status (9)

Country Link
US (5) US6753922B1 (https=)
EP (1) EP1121799B1 (https=)
JP (1) JP5201770B2 (https=)
KR (1) KR100527897B1 (https=)
AU (1) AU1444900A (https=)
DE (1) DE69933040T2 (https=)
MY (1) MY118657A (https=)
TW (1) TW454411B (https=)
WO (1) WO2000022814A2 (https=)

Families Citing this family (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6795120B2 (en) * 1996-05-17 2004-09-21 Sony Corporation Solid-state imaging apparatus and camera using the same
JPH1123613A (ja) * 1997-07-04 1999-01-29 Tokai Rika Co Ltd ダイアフラム式センサチップを利用したセンサ
US6753922B1 (en) * 1998-10-13 2004-06-22 Intel Corporation Image sensor mounted by mass reflow
US6307258B1 (en) * 1998-12-22 2001-10-23 Silicon Bandwidth, Inc. Open-cavity semiconductor die package
US6297540B1 (en) * 1999-06-03 2001-10-02 Intel Corporation Microlens for surface mount products
GB2355112A (en) * 1999-10-08 2001-04-11 Nokia Mobile Phones Ltd Controlling bondwire inductance by using chip as positional reference
JP2001119006A (ja) * 1999-10-19 2001-04-27 Sony Corp 撮像デバイス及びその製造方法
US6483030B1 (en) * 1999-12-08 2002-11-19 Amkor Technology, Inc. Snap lid image sensor package
US6483101B1 (en) * 1999-12-08 2002-11-19 Amkor Technology, Inc. Molded image sensor package having lens holder
US6512219B1 (en) * 2000-01-25 2003-01-28 Amkor Technology, Inc. Fabrication method for integrally connected image sensor packages having a window support in contact with the window and active area
US6515269B1 (en) * 2000-01-25 2003-02-04 Amkor Technology, Inc. Integrally connected image sensor packages having a window support in contact with a window and the active area
WO2001091193A2 (en) 2000-05-23 2001-11-29 Atmel Corporation Integrated ic chip package for electronic image sensor die
US6503780B1 (en) 2000-07-05 2003-01-07 Amkor Technology, Inc. Wafer scale image sensor package fabrication method
US7059040B1 (en) 2001-01-16 2006-06-13 Amkor Technology, Inc. Optical module with lens integral holder fabrication method
KR100401020B1 (ko) * 2001-03-09 2003-10-08 앰코 테크놀로지 코리아 주식회사 반도체칩의 스택킹 구조 및 이를 이용한 반도체패키지
JP3773177B2 (ja) * 2001-11-30 2006-05-10 松下電器産業株式会社 固体撮像装置およびその製造方法
US6825540B2 (en) * 2001-12-05 2004-11-30 Matsushita Electric Industrial Co., Ltd. Miniaturized, resin-sealed solid state imaging apparatus
JP2003244560A (ja) * 2002-02-21 2003-08-29 Seiko Precision Inc 固体撮像装置
US6967123B2 (en) * 2002-04-11 2005-11-22 Agilent Technologies, Inc. Adhesive die attachment method for a semiconductor die and arrangement for carrying out the method
US6906403B2 (en) * 2002-06-04 2005-06-14 Micron Technology, Inc. Sealed electronic device packages with transparent coverings
US7163838B2 (en) * 2002-07-22 2007-01-16 Texas Instruments Incorporated Method and apparatus for forming a DMD window frame with molded glass
US7146106B2 (en) * 2002-08-23 2006-12-05 Amkor Technology, Inc. Optic semiconductor module and manufacturing method
US7105383B2 (en) * 2002-08-29 2006-09-12 Freescale Semiconductor, Inc. Packaged semiconductor with coated leads and method therefore
ITMI20022467A1 (it) * 2002-11-20 2004-05-21 St Microelectronics Srl Processo per realizzare un transistore di selezione di byte per
CN1617347A (zh) * 2003-04-09 2005-05-18 Hoya株式会社 半导体封装窗用玻璃及所用玻璃窗及其制法和半导体封装
JP3729817B2 (ja) * 2003-04-28 2005-12-21 松下電器産業株式会社 固体撮像装置の製造方法
US6874227B2 (en) * 2003-06-03 2005-04-05 Kingpak Technology Inc. Method for packaging an image sensor
US7180064B2 (en) * 2003-07-24 2007-02-20 Delphi Technologies, Inc. Infrared sensor package
US6953891B2 (en) 2003-09-16 2005-10-11 Micron Technology, Inc. Moisture-resistant electronic device package and methods of assembly
KR100539082B1 (ko) * 2003-10-01 2006-01-10 주식회사 네패스 반도체 촬상소자의 패키지 구조 및 그 제조방법
US20060261458A1 (en) * 2003-11-12 2006-11-23 Amkor Technology, Inc. Semiconductor package and manufacturing method thereof
US7690303B2 (en) 2004-04-22 2010-04-06 Reynolds Systems, Inc. Plastic encapsulated energetic material initiation device
TWI333249B (en) * 2004-08-24 2010-11-11 Himax Tech Inc Sensor package
JP2006093588A (ja) * 2004-09-27 2006-04-06 Nec Electronics Corp 表面に突起部を有する半導体装置および半導体パッケージの識別方法。
US7359579B1 (en) 2004-10-08 2008-04-15 Amkor Technology, Inc. Image sensor package and its manufacturing method
US7364945B2 (en) * 2005-03-31 2008-04-29 Stats Chippac Ltd. Method of mounting an integrated circuit package in an encapsulant cavity
US20070210246A1 (en) * 2005-04-14 2007-09-13 Amkor Technology, Inc. Stacked image sensor optical module and fabrication method
US7227236B1 (en) 2005-04-26 2007-06-05 Amkor Technology, Inc. Image sensor package and its manufacturing method
US20070272827A1 (en) * 2005-04-27 2007-11-29 Amkor Technology, Inc. Image sensor package having mount holder attached to image sensor die
US7354800B2 (en) * 2005-04-29 2008-04-08 Stats Chippac Ltd. Method of fabricating a stacked integrated circuit package system
US7576401B1 (en) 2005-07-07 2009-08-18 Amkor Technology, Inc. Direct glass attached on die optical module
US7671478B2 (en) * 2005-09-02 2010-03-02 Honeywell International Inc. Low height vertical sensor packaging
US7723146B2 (en) * 2006-01-04 2010-05-25 Stats Chippac Ltd. Integrated circuit package system with image sensor system
US7768125B2 (en) 2006-01-04 2010-08-03 Stats Chippac Ltd. Multi-chip package system
US7456088B2 (en) 2006-01-04 2008-11-25 Stats Chippac Ltd. Integrated circuit package system including stacked die
US7750482B2 (en) 2006-02-09 2010-07-06 Stats Chippac Ltd. Integrated circuit package system including zero fillet resin
US8704349B2 (en) 2006-02-14 2014-04-22 Stats Chippac Ltd. Integrated circuit package system with exposed interconnects
US7675180B1 (en) 2006-02-17 2010-03-09 Amkor Technology, Inc. Stacked electronic component package having film-on-wire spacer
US20080237824A1 (en) * 2006-02-17 2008-10-02 Amkor Technology, Inc. Stacked electronic component package having single-sided film spacer
US7633144B1 (en) 2006-05-24 2009-12-15 Amkor Technology, Inc. Semiconductor package
JP5132957B2 (ja) * 2007-03-14 2013-01-30 パナソニック株式会社 半導体デバイス、その製造方法および光ピックアップモジュール
DE102007026634B4 (de) * 2007-06-06 2009-04-16 Atotech Deutschland Gmbh Vertikalanlage zur galvanotechnischen Behandlung eines Werkstückes und Verfahren zum Befördern des Werkstückes
SG152086A1 (en) * 2007-10-23 2009-05-29 Micron Technology Inc Packaged semiconductor assemblies and associated systems and methods
JP2009176894A (ja) * 2008-01-23 2009-08-06 Panasonic Corp 光学半導体装置
US8100043B1 (en) 2008-03-28 2012-01-24 Reynolds Systems, Inc. Detonator cartridge and methods of use
US7915717B2 (en) * 2008-08-18 2011-03-29 Eastman Kodak Company Plastic image sensor packaging for image sensors
US8276516B1 (en) 2008-10-30 2012-10-02 Reynolds Systems, Inc. Apparatus for detonating a triaminotrinitrobenzene charge
US8125042B2 (en) * 2008-11-13 2012-02-28 Samsung Electronics Co., Ltd. Semiconductor package and method of manufacturing the same
US8485097B1 (en) 2010-06-11 2013-07-16 Reynolds Systems, Inc. Energetic material initiation device
CN102136523B (zh) * 2010-12-22 2012-11-28 木林森股份有限公司 眼珠型红外接收器的封装方法、专用模具及制造的产品
US9162872B2 (en) * 2012-09-10 2015-10-20 Invensense, Inc. Pre-molded MEMS device package having conductive column coupled to leadframe and cover
US8872296B2 (en) * 2012-11-01 2014-10-28 Lite-On Technology Corporation Chip module structure for particles protection
US10186539B2 (en) 2014-10-13 2019-01-22 Bio-Rad Laboratories, Inc. Heated image sensor window
US9892935B2 (en) 2015-05-28 2018-02-13 International Business Machines Corporation Limiting electronic package warpage with semiconductor chip lid and lid-ring
US10025033B2 (en) 2016-03-01 2018-07-17 Advanced Semiconductor Engineering, Inc. Optical fiber structure, optical communication apparatus and manufacturing process for manufacturing the same
US10241264B2 (en) 2016-07-01 2019-03-26 Advanced Semiconductor Engineering, Inc. Semiconductor device packages

Family Cites Families (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4285002A (en) * 1978-01-19 1981-08-18 International Computers Limited Integrated circuit package
JPS60115247A (ja) * 1983-11-28 1985-06-21 Fujitsu Ltd 半導体装置
JPS60239043A (ja) 1984-05-14 1985-11-27 Oki Electric Ind Co Ltd 半導体装置用パツケ−ジの製造方法
JPS60257546A (ja) * 1984-06-04 1985-12-19 Mitsubishi Electric Corp 半導体装置及びその製造方法
JPS6220358A (ja) 1985-07-18 1987-01-28 Nec Corp 半導体固体撮像装置
JPS6226847A (ja) * 1985-07-27 1987-02-04 Daiichi Seiko Kk 気密封止形半導体装置
JPS62174956A (ja) 1986-01-28 1987-07-31 Fujitsu Ltd プラスチツク・モ−ルド型半導体装置
US4827118A (en) * 1986-07-10 1989-05-02 Minolta Camera Kabushiki Kaisha Light-sensitive device having color filter and manufacturing method thereof
JPS6333622A (ja) * 1986-07-28 1988-02-13 Minolta Camera Co Ltd 受光素子接続構造及びその製造方法
JPS6342150A (ja) 1986-08-08 1988-02-23 Hitachi Ltd 光消去型樹脂封止型半導体装置
US4771929A (en) * 1987-02-20 1988-09-20 Hollis Automation, Inc. Focused convection reflow soldering method and apparatus
USRE37690E1 (en) * 1987-02-25 2002-05-07 Hitachi, Ltd. Lead frame and semiconductor device
US4893171A (en) * 1988-03-30 1990-01-09 Director General, Agenty Of Industrial Science And Technology Semiconductor device with resin bonding to support structure
KR0158868B1 (ko) * 1988-09-20 1998-12-01 미다 가쓰시게 반도체장치
US5468681A (en) * 1989-08-28 1995-11-21 Lsi Logic Corporation Process for interconnecting conductive substrates using an interposer having conductive plastic filled vias
EP0468379B1 (en) * 1990-07-21 1999-11-17 Mitsui Chemicals, Inc. Semiconductor device having a package
US5168345A (en) * 1990-08-15 1992-12-01 Lsi Logic Corporation Semiconductor device having a universal die size inner lead layout
US5627913A (en) * 1990-08-27 1997-05-06 Sierra Research And Technology, Inc. Placement system using a split imaging system coaxially coupled to a component pickup means
US5235407A (en) * 1990-08-27 1993-08-10 Sierra Research And Technology, Inc. System for placement and mounting of fine pitch integrated circuit devices
US5147821A (en) * 1990-09-28 1992-09-15 Motorola, Inc. Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operation
US5175410A (en) * 1991-06-28 1992-12-29 Digital Equipment Corporation IC package hold-down fixture
US5227604A (en) * 1991-06-28 1993-07-13 Digital Equipment Corporation Atmospheric pressure gaseous-flux-assisted laser reflow soldering
FR2684803A1 (fr) 1991-12-04 1993-06-11 Gemplus Card Int Boitier a structure renforcee pour circuit integre, et carte comprenant un tel boitier.
JP3203736B2 (ja) * 1992-02-13 2001-08-27 株式会社日立製作所 液晶ドライバ用テープキャリアパッケージ及び液晶表示装置
US5721076A (en) * 1992-06-19 1998-02-24 Nippon Steel Corporation Color filters and materials and resins therefor
US5233222A (en) * 1992-07-27 1993-08-03 Motorola, Inc. Semiconductor device having window-frame flag with tapered edge in opening
US5362680A (en) * 1992-08-18 1994-11-08 Texas Instruments Incorporated Technique for enhancing adhesion capability of heat spreaders in molded packages
US5324888A (en) * 1992-10-13 1994-06-28 Olin Corporation Metal electronic package with reduced seal width
US5536908A (en) * 1993-01-05 1996-07-16 Schlumberger Technology Corporation Lead-free printed circuit assembly
US6326678B1 (en) 1993-09-03 2001-12-04 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance
DE9314355U1 (de) 1993-09-22 1994-01-20 ODS R. Oldenbourg Datensysteme GmbH, 81669 München Chipkarten-Modul und Chipkarte
JPH07106351A (ja) * 1993-10-04 1995-04-21 Fujitsu Ltd 半導体装置の製造方法
US5498900A (en) * 1993-12-22 1996-03-12 Honeywell Inc. Semiconductor package with weldable ceramic lid
DE69523815T2 (de) * 1994-05-18 2002-04-18 Xerox Corp., Rochester Akustischbeschichtung von Materialschichten
US5458716A (en) * 1994-05-25 1995-10-17 Texas Instruments Incorporated Methods for manufacturing a thermally enhanced molded cavity package having a parallel lid
US5471011A (en) * 1994-05-26 1995-11-28 Ak Technology, Inc. Homogeneous thermoplastic semi-conductor chip carrier package
US5828406A (en) * 1994-12-30 1998-10-27 Eastman Kodak Company Electronic camera having a processor for mapping image pixel signals into color display pixels
JP3471111B2 (ja) * 1995-03-20 2003-11-25 三菱電機株式会社 半導体装置
JP3054576B2 (ja) * 1995-04-26 2000-06-19 シャープ株式会社 半導体装置
JPH0992748A (ja) 1995-09-21 1997-04-04 Mitsubishi Materials Corp 半導体素子用パッケージ
JP3292798B2 (ja) * 1995-10-04 2002-06-17 三菱電機株式会社 半導体装置
DE19618101A1 (de) 1996-05-06 1997-11-13 Siemens Ag Trägerelement mit wenigstens einem integrierten Schaltkreis sowie Verfahren zur Herstellung eines solchen Trägerelementes
US5821617A (en) 1996-07-29 1998-10-13 Microsemi Corporation Surface mount package with low coefficient of thermal expansion
US6028351A (en) * 1996-10-09 2000-02-22 Texas Instruments Incorporated Gasket sealed integrated circuit package
US5786635A (en) * 1996-12-16 1998-07-28 International Business Machines Corporation Electronic package with compressible heatsink structure
US5907769A (en) * 1996-12-30 1999-05-25 Micron Technology, Inc. Leads under chip in conventional IC package
TW330337B (en) * 1997-05-23 1998-04-21 Siliconware Precision Industries Co Ltd Semiconductor package with detached die pad
US5917709A (en) * 1997-06-16 1999-06-29 Eastman Kodak Company Multiple circuit board assembly having an interconnect mechanism that includes a flex connector
JPH1197656A (ja) * 1997-09-22 1999-04-09 Fuji Electric Co Ltd 半導体光センサデバイス
JP3123482B2 (ja) * 1997-10-08 2001-01-09 日本電気株式会社 低熱抵抗型半導体パッケージ、および低熱抵抗型半導体パッケージの製造方法
US6046075A (en) * 1997-12-23 2000-04-04 Vlsi Technology, Inc. Oxide wire bond insulation in semiconductor assemblies
US6207947B1 (en) * 1998-03-18 2001-03-27 Intel Corporation Using DUV curing to form a protective coating for color filters
JP3173586B2 (ja) * 1998-03-26 2001-06-04 日本電気株式会社 全モールド型固体撮像装置およびその製造方法
US6034423A (en) * 1998-04-02 2000-03-07 National Semiconductor Corporation Lead frame design for increased chip pinout
US6753922B1 (en) 1998-10-13 2004-06-22 Intel Corporation Image sensor mounted by mass reflow
US6191359B1 (en) 1998-10-13 2001-02-20 Intel Corporation Mass reflowable windowed package

Also Published As

Publication number Publication date
DE69933040T2 (de) 2007-03-01
US6692993B2 (en) 2004-02-17
US20040159902A1 (en) 2004-08-19
KR20010080129A (ko) 2001-08-22
DE69933040D1 (de) 2006-10-12
AU1444900A (en) 2000-05-01
EP1121799A4 (en) 2004-08-04
US6072232A (en) 2000-06-06
US6753922B1 (en) 2004-06-22
US20020125552A1 (en) 2002-09-12
US7026707B2 (en) 2006-04-11
JP5201770B2 (ja) 2013-06-05
JP2002527912A (ja) 2002-08-27
WO2000022814A9 (en) 2000-09-21
TW454411B (en) 2001-09-11
EP1121799B1 (en) 2006-08-30
WO2000022814A2 (en) 2000-04-20
WO2000022814A3 (en) 2000-08-03
EP1121799A2 (en) 2001-08-08
KR100527897B1 (ko) 2005-11-15
US7223631B2 (en) 2007-05-29
US20060141674A1 (en) 2006-06-29

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