GB2359927B - Windowed non-ceramic package having embedded frame - Google Patents

Windowed non-ceramic package having embedded frame

Info

Publication number
GB2359927B
GB2359927B GB0113365A GB0113365A GB2359927B GB 2359927 B GB2359927 B GB 2359927B GB 0113365 A GB0113365 A GB 0113365A GB 0113365 A GB0113365 A GB 0113365A GB 2359927 B GB2359927 B GB 2359927B
Authority
GB
United Kingdom
Prior art keywords
ceramic package
embedded frame
frame
mold compound
windowed non
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0113365A
Other versions
GB2359927A (en
GB0113365D0 (en
Inventor
Zong-Fu Li
Kabul Sengupta
Deborah L Thompson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US09/219,186 priority Critical patent/US6072232A/en
Application filed by Intel Corp filed Critical Intel Corp
Priority to PCT/US1999/028012 priority patent/WO2000038230A1/en
Publication of GB0113365D0 publication Critical patent/GB0113365D0/en
Publication of GB2359927A publication Critical patent/GB2359927A/en
Application granted granted Critical
Publication of GB2359927B publication Critical patent/GB2359927B/en
Application status is Expired - Fee Related legal-status Critical
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14618Containers
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L31/00Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0203Containers; Encapsulations, e.g. encapsulation of photodiodes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/102Material of the semiconductor or solid state bodies
    • H01L2924/1025Semiconducting materials
    • H01L2924/10251Elemental semiconductors, i.e. Group IV
    • H01L2924/10253Silicon [Si]

Abstract

An integrated circuit (IC) package includes a mold compound (12), a die (16), and a window (34). The mold compound (12) has a frame (32) embedded within it. The frame (32) has a coefficient of thermal expansion that is less than the mold compound (12). The IC package is capable of being attached to a circuit board via a mass reflow process.
GB0113365A 1998-10-13 1999-11-23 Windowed non-ceramic package having embedded frame Expired - Fee Related GB2359927B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US09/219,186 US6072232A (en) 1998-10-13 1998-12-21 Windowed non-ceramic package having embedded frame
PCT/US1999/028012 WO2000038230A1 (en) 1998-12-21 1999-11-23 Windowed non-ceramic package having embedded frame

Publications (3)

Publication Number Publication Date
GB0113365D0 GB0113365D0 (en) 2001-07-25
GB2359927A GB2359927A (en) 2001-09-05
GB2359927B true GB2359927B (en) 2003-11-26

Family

ID=22818234

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0113365A Expired - Fee Related GB2359927B (en) 1998-10-13 1999-11-23 Windowed non-ceramic package having embedded frame

Country Status (7)

Country Link
JP (1) JP2002533926A (en)
CN (1) CN1225786C (en)
AU (1) AU1744800A (en)
DE (1) DE19983826T1 (en)
GB (1) GB2359927B (en)
TW (1) TWI249234B (en)
WO (1) WO2000038230A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6825540B2 (en) * 2001-12-05 2004-11-30 Matsushita Electric Industrial Co., Ltd. Miniaturized, resin-sealed solid state imaging apparatus
CN104154995B (en) * 2014-08-21 2016-09-28 中国科学院光电研究院 Hyperspectral detection integrated module and the manufacturing method

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4285002A (en) * 1978-01-19 1981-08-18 International Computers Limited Integrated circuit package
US4626960A (en) * 1983-11-28 1986-12-02 Fujitsu Limited Semiconductor device having soldered bond between base and cap thereof
US5343076A (en) * 1990-07-21 1994-08-30 Mitsui Petrochemical Industries, Ltd. Semiconductor device with an airtight space formed internally within a hollow package
US5399805A (en) * 1992-10-13 1995-03-21 Olin Corporation Metal electronic package with reduced seal width
US5471001A (en) * 1994-12-15 1995-11-28 E. I. Du Pont De Nemours And Company Crystallization of adipic acid
US5498900A (en) * 1993-12-22 1996-03-12 Honeywell Inc. Semiconductor package with weldable ceramic lid
JPH0992748A (en) * 1995-09-21 1997-04-04 Mitsubishi Materials Corp Package for semiconductor element
US5701033A (en) * 1995-03-20 1997-12-23 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US5814883A (en) * 1995-10-04 1998-09-29 Mitsubishi Denki Kabushiki Kaisha Packaged semiconductor chip
US5821617A (en) * 1996-07-29 1998-10-13 Microsemi Corporation Surface mount package with low coefficient of thermal expansion
US6326678B1 (en) * 1993-09-03 2001-12-04 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance
JP2002020358A (en) * 2000-07-07 2002-01-23 Kansai Tlo Kk New water-soluble chiral shift reagent comprising complex of rare earth metal with amino acid derivative ligand and optically resolving agent comprising the complex
JP2002174956A (en) * 2000-12-06 2002-06-21 Ricoh Co Ltd Image forming device
JP2003042150A (en) * 2001-07-31 2003-02-13 Koyo Seiko Co Ltd Rolling bearing unit

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0724287B2 (en) * 1987-02-12 1995-03-15 三菱電機株式会社 Semiconductor device and manufacturing method thereof having a light transmitting window
JP2784126B2 (en) * 1993-02-23 1998-08-06 京セラ株式会社 A method of manufacturing a semiconductor device package for housing
US5471011A (en) * 1994-05-26 1995-11-28 Ak Technology, Inc. Homogeneous thermoplastic semi-conductor chip carrier package
JPH09107054A (en) * 1995-10-13 1997-04-22 Sony Corp Semiconductor device
JPH10189792A (en) * 1996-12-27 1998-07-21 Sony Corp Semiconductor package

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4285002A (en) * 1978-01-19 1981-08-18 International Computers Limited Integrated circuit package
US4626960A (en) * 1983-11-28 1986-12-02 Fujitsu Limited Semiconductor device having soldered bond between base and cap thereof
US5343076A (en) * 1990-07-21 1994-08-30 Mitsui Petrochemical Industries, Ltd. Semiconductor device with an airtight space formed internally within a hollow package
US5399805A (en) * 1992-10-13 1995-03-21 Olin Corporation Metal electronic package with reduced seal width
US6326678B1 (en) * 1993-09-03 2001-12-04 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance
US5498900A (en) * 1993-12-22 1996-03-12 Honeywell Inc. Semiconductor package with weldable ceramic lid
US5471001A (en) * 1994-12-15 1995-11-28 E. I. Du Pont De Nemours And Company Crystallization of adipic acid
US5701033A (en) * 1995-03-20 1997-12-23 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
JPH0992748A (en) * 1995-09-21 1997-04-04 Mitsubishi Materials Corp Package for semiconductor element
US5814883A (en) * 1995-10-04 1998-09-29 Mitsubishi Denki Kabushiki Kaisha Packaged semiconductor chip
US5821617A (en) * 1996-07-29 1998-10-13 Microsemi Corporation Surface mount package with low coefficient of thermal expansion
JP2002020358A (en) * 2000-07-07 2002-01-23 Kansai Tlo Kk New water-soluble chiral shift reagent comprising complex of rare earth metal with amino acid derivative ligand and optically resolving agent comprising the complex
JP2002174956A (en) * 2000-12-06 2002-06-21 Ricoh Co Ltd Image forming device
JP2003042150A (en) * 2001-07-31 2003-02-13 Koyo Seiko Co Ltd Rolling bearing unit

Also Published As

Publication number Publication date
TWI249234B (en) 2006-02-11
JP2002533926A (en) 2002-10-08
DE19983826T0 (en)
CN1331841A (en) 2002-01-16
AU1744800A (en) 2000-07-12
GB2359927A (en) 2001-09-05
WO2000038230A1 (en) 2000-06-29
CN1225786C (en) 2005-11-02
DE19983826T1 (en) 2002-03-07
GB0113365D0 (en) 2001-07-25

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20101123