AU1444900A - Image sensor mounted by mass reflow - Google Patents

Image sensor mounted by mass reflow

Info

Publication number
AU1444900A
AU1444900A AU14449/00A AU1444900A AU1444900A AU 1444900 A AU1444900 A AU 1444900A AU 14449/00 A AU14449/00 A AU 14449/00A AU 1444900 A AU1444900 A AU 1444900A AU 1444900 A AU1444900 A AU 1444900A
Authority
AU
Australia
Prior art keywords
image sensor
sensor mounted
mass reflow
reflow
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU14449/00A
Other languages
English (en)
Inventor
Alan B. Alley
Azar Assadi
Kabul S. Sengupta
Robert C. Sundahl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of AU1444900A publication Critical patent/AU1444900A/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/50Encapsulations or containers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011Manufacture or treatment of image sensors covered by group H10F39/12
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/804Containers or encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
AU14449/00A 1998-10-13 1999-10-11 Image sensor mounted by mass reflow Abandoned AU1444900A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/172,734 US6753922B1 (en) 1998-10-13 1998-10-13 Image sensor mounted by mass reflow
US09172734 1998-10-13
PCT/US1999/023771 WO2000022814A2 (en) 1998-10-13 1999-10-11 Image sensor mounted by mass reflow

Publications (1)

Publication Number Publication Date
AU1444900A true AU1444900A (en) 2000-05-01

Family

ID=22628985

Family Applications (1)

Application Number Title Priority Date Filing Date
AU14449/00A Abandoned AU1444900A (en) 1998-10-13 1999-10-11 Image sensor mounted by mass reflow

Country Status (9)

Country Link
US (5) US6753922B1 (https=)
EP (1) EP1121799B1 (https=)
JP (1) JP5201770B2 (https=)
KR (1) KR100527897B1 (https=)
AU (1) AU1444900A (https=)
DE (1) DE69933040T2 (https=)
MY (1) MY118657A (https=)
TW (1) TW454411B (https=)
WO (1) WO2000022814A2 (https=)

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Also Published As

Publication number Publication date
DE69933040T2 (de) 2007-03-01
US6692993B2 (en) 2004-02-17
US20040159902A1 (en) 2004-08-19
KR20010080129A (ko) 2001-08-22
DE69933040D1 (de) 2006-10-12
EP1121799A4 (en) 2004-08-04
US6072232A (en) 2000-06-06
US6753922B1 (en) 2004-06-22
US20020125552A1 (en) 2002-09-12
US7026707B2 (en) 2006-04-11
JP5201770B2 (ja) 2013-06-05
JP2002527912A (ja) 2002-08-27
WO2000022814A9 (en) 2000-09-21
TW454411B (en) 2001-09-11
EP1121799B1 (en) 2006-08-30
WO2000022814A2 (en) 2000-04-20
WO2000022814A3 (en) 2000-08-03
EP1121799A2 (en) 2001-08-08
KR100527897B1 (ko) 2005-11-15
US7223631B2 (en) 2007-05-29
MY118657A (en) 2004-12-31
US20060141674A1 (en) 2006-06-29

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Legal Events

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MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase