KR100514208B1 - 다층금속 적층필름 및 그 제조방법 - Google Patents
다층금속 적층필름 및 그 제조방법 Download PDFInfo
- Publication number
- KR100514208B1 KR100514208B1 KR10-2003-7004797A KR20037004797A KR100514208B1 KR 100514208 B1 KR100514208 B1 KR 100514208B1 KR 20037004797 A KR20037004797 A KR 20037004797A KR 100514208 B1 KR100514208 B1 KR 100514208B1
- Authority
- KR
- South Korea
- Prior art keywords
- film
- metal
- thin film
- metal foil
- metal thin
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/162—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B2037/0092—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding in which absence of adhesives is explicitly presented as an advantage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B2038/0052—Other operations not otherwise provided for
- B32B2038/0092—Metallizing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/60—In a particular environment
- B32B2309/68—Vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2367/00—Polyesters, e.g. PET, i.e. polyethylene terephthalate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
- B32B2379/08—Polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2398/00—Unspecified macromolecular compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Thermal Sciences (AREA)
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (3)
- 삭제
- 고분자 필름 표면에 금속박막을 형성한 금속박막 적층필름을 필름 풀기 릴에 설치하는 공정과;금속박을 금속박 풀기 릴에 설치하는 공정과;상기 금속박막 적층필름을 필름 풀기 릴로부터 풀고, 금속박막 적층필름의 금속박막면을 활성화시키는 공정과;상기 금속박을 금속박 풀기 릴로부터 풀어 금속박 표면을 활성화시키는 공정과;상기 활성화된 금속박막면과 금속박 표면을 압접시키는 공정을 갖는 다층금속 적층필름의 제조방법.
- 고분자 필름을 필름 풀기 릴에 설치하는 공정과, 금속박을 금속박 풀기 릴에 설치하는 공정과,상기 고분자 필름을 필름 풀기 릴로부터 풀어 필름면을 활성화시켜 필름면에 금속박막을 형성하는 공정과,상기 금속박을 금속박 풀기 릴로부터 풀어 금속박 표면을 활성화시키는 공정과,상기 금속박막면과 상기 활성화된 금속박 표면을 압접시키는 공정을 갖는 다층금속 적층필름의 제조방법.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000311038A JP4532713B2 (ja) | 2000-10-11 | 2000-10-11 | 多層金属積層フィルム及びその製造方法 |
JPJP-P-2000-00311038 | 2000-10-11 | ||
PCT/JP2001/008755 WO2002030665A1 (fr) | 2000-10-11 | 2001-10-04 | Film de metal multicouche et son procede de fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030036886A KR20030036886A (ko) | 2003-05-09 |
KR100514208B1 true KR100514208B1 (ko) | 2005-09-13 |
Family
ID=18790876
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2003-7004797A KR100514208B1 (ko) | 2000-10-11 | 2001-10-04 | 다층금속 적층필름 및 그 제조방법 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20040038050A1 (ko) |
EP (1) | EP1332867B1 (ko) |
JP (1) | JP4532713B2 (ko) |
KR (1) | KR100514208B1 (ko) |
CN (2) | CN1727179B (ko) |
AU (1) | AU2001292352A1 (ko) |
DE (1) | DE60120454T2 (ko) |
WO (1) | WO2002030665A1 (ko) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8445130B2 (en) | 2002-08-09 | 2013-05-21 | Infinite Power Solutions, Inc. | Hybrid thin-film battery |
US20070264564A1 (en) * | 2006-03-16 | 2007-11-15 | Infinite Power Solutions, Inc. | Thin film battery on an integrated circuit or circuit board and method thereof |
US8431264B2 (en) | 2002-08-09 | 2013-04-30 | Infinite Power Solutions, Inc. | Hybrid thin-film battery |
US8394522B2 (en) * | 2002-08-09 | 2013-03-12 | Infinite Power Solutions, Inc. | Robust metal film encapsulation |
US7993773B2 (en) | 2002-08-09 | 2011-08-09 | Infinite Power Solutions, Inc. | Electrochemical apparatus with barrier layer protected substrate |
US8021778B2 (en) * | 2002-08-09 | 2011-09-20 | Infinite Power Solutions, Inc. | Electrochemical apparatus with barrier layer protected substrate |
US8236443B2 (en) | 2002-08-09 | 2012-08-07 | Infinite Power Solutions, Inc. | Metal film encapsulation |
US8404376B2 (en) | 2002-08-09 | 2013-03-26 | Infinite Power Solutions, Inc. | Metal film encapsulation |
JP2004106338A (ja) * | 2002-09-18 | 2004-04-08 | Toyo Kohan Co Ltd | 導電層接合材の製造方法および導電層接合材を用いた部品の製造方法 |
US8728285B2 (en) | 2003-05-23 | 2014-05-20 | Demaray, Llc | Transparent conductive oxides |
JP5610662B2 (ja) * | 2003-09-30 | 2014-10-22 | ザ・ボーイング・カンパニーTheBoeing Company | 保護シート |
US7867621B2 (en) | 2003-09-30 | 2011-01-11 | The Boeing Company | Wide area lightning diverter overlay |
KR101127370B1 (ko) | 2004-12-08 | 2012-03-29 | 인피니트 파워 솔루션스, 인크. | LiCoO2의 증착 |
US7959769B2 (en) * | 2004-12-08 | 2011-06-14 | Infinite Power Solutions, Inc. | Deposition of LiCoO2 |
CN101523571A (zh) | 2006-09-29 | 2009-09-02 | 无穷动力解决方案股份有限公司 | 柔性基板上沉积的电池层的掩模和材料限制 |
TWI426830B (zh) * | 2006-10-10 | 2014-02-11 | Shinetsu Polymer Co | 雜訊抑制配線構件及其製造方法 |
US8197781B2 (en) * | 2006-11-07 | 2012-06-12 | Infinite Power Solutions, Inc. | Sputtering target of Li3PO4 and method for producing same |
JP4789267B2 (ja) * | 2007-07-17 | 2011-10-12 | 東洋鋼鈑株式会社 | 導電層接合材の製造方法および導電層接合材を用いた部品の製造方法 |
US8268488B2 (en) | 2007-12-21 | 2012-09-18 | Infinite Power Solutions, Inc. | Thin film electrolyte for thin film batteries |
TWI441937B (zh) | 2007-12-21 | 2014-06-21 | Infinite Power Solutions Inc | 形成用於電解質薄膜之濺鍍靶材的方法 |
CN101911367B (zh) | 2008-01-11 | 2015-02-25 | 无穷动力解决方案股份有限公司 | 用于薄膜电池及其他器件的薄膜包封 |
CN101983469B (zh) | 2008-04-02 | 2014-06-04 | 无穷动力解决方案股份有限公司 | 与能量采集关联的储能装置的无源过电压/欠电压控制和保护 |
WO2010019577A1 (en) | 2008-08-11 | 2010-02-18 | Infinite Power Solutions, Inc. | Energy device with integral collector surface for electromagnetic energy harvesting and method thereof |
EP2332127A4 (en) | 2008-09-12 | 2011-11-09 | Infinite Power Solutions Inc | ENERGY DEVICE HAVING AN INTEGRATED CONDUCTIVE SURFACE FOR DATA COMMUNICATION VIA ELECTROMAGNETIC ENERGY AND ASSOCIATED METHOD |
US8508193B2 (en) | 2008-10-08 | 2013-08-13 | Infinite Power Solutions, Inc. | Environmentally-powered wireless sensor module |
FR2940533B1 (fr) * | 2008-12-19 | 2017-05-19 | Carewave Shielding Tech | Materiau multicouche, en particulier pour la protection contre les rayonnements electromagnetiques, et son procede de fabrication. |
FR2940321B1 (fr) * | 2008-12-19 | 2011-12-23 | Carewave Shielding Technologies | Machine de depot sous vide,sur un substrat,de materiaux en couches minces,par pulverisation cathodique. |
FR2940927B1 (fr) * | 2009-01-09 | 2013-01-04 | Eads Europ Aeronautic Defence | Structure en materiau composite protegee des effets de la foudre |
KR101792287B1 (ko) * | 2009-09-01 | 2017-10-31 | 사푸라스트 리써치 엘엘씨 | 집적된 박막 배터리를 갖는 인쇄 회로 보드 |
CN102947976B (zh) | 2010-06-07 | 2018-03-16 | 萨普拉斯特研究有限责任公司 | 可充电、高密度的电化学设备 |
CN102068916A (zh) * | 2010-11-17 | 2011-05-25 | 无锡中科光远生物材料有限公司 | 一种自抽运仿生膜及其制备方法 |
CN102555348B (zh) * | 2011-12-28 | 2014-08-13 | 广东生益科技股份有限公司 | 无胶双面挠性覆铜板生产用保护膜及其制造方法 |
CN104245280B (zh) * | 2012-04-10 | 2017-03-29 | 须贺唯知 | 接合高分子薄膜与高分子薄膜的方法、接合高分子薄膜与无机材料基板的方法、高分子薄膜层叠体及高分子薄膜与无机材料基板的层叠体 |
CN104209323B (zh) * | 2013-05-31 | 2016-10-05 | 宝山钢铁股份有限公司 | 一种复合轧制法生产厚板用碳钢板坯结合表面预处理方法 |
US9924935B2 (en) | 2015-10-23 | 2018-03-27 | Smith & Nephew, Inc. | Suture anchor assembly with slip fit tip |
EP3339027A1 (de) * | 2016-12-22 | 2018-06-27 | Numan Sener | Verfahren zur herstellung einer komposit-folie als verpackungsmaterial für lebensmittel |
EP3339020A1 (de) * | 2016-12-22 | 2018-06-27 | Numan Sener | Komposit-folie als verpackungsmaterial für lebensmittel |
JP2021171963A (ja) | 2020-04-22 | 2021-11-01 | 東洋鋼鈑株式会社 | 金属積層フィルム及びその製造方法 |
CN117881535A (zh) * | 2021-10-26 | 2024-04-12 | 东洋钢钣株式会社 | 金属层叠材料及其制造方法、印刷线路板 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2101049A1 (de) * | 1971-01-11 | 1972-08-03 | Siemens Ag | Verfahren zur vorzugsweise beidseitigen Beschichtung von Kunststoffolien mit .Metall |
US3954570A (en) * | 1974-11-11 | 1976-05-04 | Amp Incorporated | Sensitized polyimides and circuit elements thereof |
US3982066A (en) * | 1975-07-25 | 1976-09-21 | Rca Corporation | Metal coating for video discs |
DE2754248C2 (de) * | 1977-12-06 | 1982-07-01 | Califoil Inc., San Diego, Calif. | Verbundwerkstoff für die Herstellung von gedruckten Schaltungen |
US4446197A (en) * | 1982-07-23 | 1984-05-01 | The Goodyear Tire & Rubber Company | Ion beam deposition or etching re rubber-metal adhesion |
JPS59168693A (ja) * | 1983-03-15 | 1984-09-22 | 松下電工株式会社 | 電気用積層板の製造方法 |
AU589144B2 (en) * | 1984-11-16 | 1989-10-05 | Toyo Seikan Kaisha Ltd. | Packaging material comprising iron foil, and container and container lid composed thereof |
US4863808A (en) * | 1985-09-13 | 1989-09-05 | Gould Inc. | Copper-chromium-polyimide composite |
DE3620601A1 (de) * | 1986-06-19 | 1987-12-23 | Akzo Gmbh | Verfahren zur herstellung von polyimid-metall-laminaten |
US5322976A (en) * | 1987-02-24 | 1994-06-21 | Polyonics Corporation | Process for forming polyimide-metal laminates |
US4802967A (en) * | 1987-04-08 | 1989-02-07 | Andus Corporation | Surface treatment of polymers |
US4896813A (en) * | 1989-04-03 | 1990-01-30 | Toyo Kohan Co., Ltd. | Method and apparatus for cold rolling clad sheet |
JP2775647B2 (ja) * | 1989-11-17 | 1998-07-16 | 宇部興産株式会社 | メタライズドポリイミドフィルムの製法 |
JPH07102648B2 (ja) * | 1990-05-30 | 1995-11-08 | 宇部興産株式会社 | 金属箔積層フィルム |
EP0459452A3 (en) * | 1990-05-30 | 1992-04-08 | Ube Industries, Ltd. | Aromatic polyimide film laminated with metal foil |
JPH04239637A (ja) * | 1991-01-23 | 1992-08-27 | Chisso Corp | 可撓性両面金属張基板及びその製造方法 |
US5461203A (en) * | 1991-05-06 | 1995-10-24 | International Business Machines Corporation | Electronic package including lower water content polyimide film |
US5156710A (en) * | 1991-05-06 | 1992-10-20 | International Business Machines Corporation | Method of laminating polyimide to thin sheet metal |
US5288541A (en) * | 1991-10-17 | 1994-02-22 | International Business Machines Corporation | Method for metallizing through holes in thin film substrates, and resulting devices |
CN1032796C (zh) * | 1991-12-18 | 1996-09-18 | 青岛塑料八厂 | 塑料层合金属带及其制造方法 |
JP2631441B2 (ja) * | 1993-04-30 | 1997-07-16 | 株式会社巴川製紙所 | ポリイミドフィルム・金属箔複合フィルムの製造方法 |
US5512381A (en) * | 1993-09-24 | 1996-04-30 | Alliedsignal Inc. | Copper foil laminate for protecting multilayer articles |
DE19534480C2 (de) * | 1995-09-18 | 1999-11-11 | David Finn | IC-Kartenmodul zur Herstellung einer IC-Karte sowie IC-Karte mit einem IC-Kartenmodul |
US5863666A (en) * | 1997-08-07 | 1999-01-26 | Gould Electronics Inc. | High performance flexible laminate |
CN1222445A (zh) * | 1997-06-24 | 1999-07-14 | 林和国 | 可冷弯成型的双金属复合板材制造工艺及其制品 |
US6129982A (en) * | 1997-11-28 | 2000-10-10 | Ube Industries, Ltd. | Aromatic polyimide film having improved adhesion |
CN1116164C (zh) * | 1998-04-09 | 2003-07-30 | 可乐丽股份有限公司 | 使用聚合物薄膜的涂层方法和由此得到的涂层体 |
-
2000
- 2000-10-11 JP JP2000311038A patent/JP4532713B2/ja not_active Expired - Fee Related
-
2001
- 2001-10-04 CN CN2005100791460A patent/CN1727179B/zh not_active Expired - Lifetime
- 2001-10-04 KR KR10-2003-7004797A patent/KR100514208B1/ko active IP Right Grant
- 2001-10-04 DE DE60120454T patent/DE60120454T2/de not_active Expired - Lifetime
- 2001-10-04 EP EP01972689A patent/EP1332867B1/en not_active Expired - Lifetime
- 2001-10-04 WO PCT/JP2001/008755 patent/WO2002030665A1/ja active IP Right Grant
- 2001-10-04 US US10/398,917 patent/US20040038050A1/en not_active Abandoned
- 2001-10-04 AU AU2001292352A patent/AU2001292352A1/en not_active Abandoned
- 2001-10-04 CN CNB018172377A patent/CN1239318C/zh not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
AU2001292352A1 (en) | 2002-04-22 |
JP4532713B2 (ja) | 2010-08-25 |
CN1469806A (zh) | 2004-01-21 |
EP1332867A1 (en) | 2003-08-06 |
EP1332867B1 (en) | 2006-06-07 |
KR20030036886A (ko) | 2003-05-09 |
CN1727179A (zh) | 2006-02-01 |
CN1727179B (zh) | 2011-05-04 |
JP2002113811A (ja) | 2002-04-16 |
DE60120454D1 (de) | 2006-07-20 |
US20040038050A1 (en) | 2004-02-26 |
WO2002030665A1 (fr) | 2002-04-18 |
EP1332867A4 (en) | 2004-06-23 |
DE60120454T2 (de) | 2006-12-07 |
CN1239318C (zh) | 2006-02-01 |
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