FR2940321B1 - Machine de depot sous vide,sur un substrat,de materiaux en couches minces,par pulverisation cathodique. - Google Patents

Machine de depot sous vide,sur un substrat,de materiaux en couches minces,par pulverisation cathodique.

Info

Publication number
FR2940321B1
FR2940321B1 FR0807179A FR0807179A FR2940321B1 FR 2940321 B1 FR2940321 B1 FR 2940321B1 FR 0807179 A FR0807179 A FR 0807179A FR 0807179 A FR0807179 A FR 0807179A FR 2940321 B1 FR2940321 B1 FR 2940321B1
Authority
FR
France
Prior art keywords
substrate
thin layer
vacuum deposition
layer materials
deposition machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0807179A
Other languages
English (en)
Other versions
FR2940321A1 (fr
Inventor
Daniel Perrin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tecalemit Aerospace Composites SAS
Original Assignee
CAREWAVE SHIELDING TECHNOLOGIES
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CAREWAVE SHIELDING TECHNOLOGIES filed Critical CAREWAVE SHIELDING TECHNOLOGIES
Priority to FR0807179A priority Critical patent/FR2940321B1/fr
Priority to PCT/FR2009/001437 priority patent/WO2010076421A2/fr
Priority to PCT/FR2009/001435 priority patent/WO2010076419A1/fr
Publication of FR2940321A1 publication Critical patent/FR2940321A1/fr
Application granted granted Critical
Publication of FR2940321B1 publication Critical patent/FR2940321B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3464—Sputtering using more than one target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Nozzles (AREA)
FR0807179A 2008-12-19 2008-12-19 Machine de depot sous vide,sur un substrat,de materiaux en couches minces,par pulverisation cathodique. Expired - Fee Related FR2940321B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR0807179A FR2940321B1 (fr) 2008-12-19 2008-12-19 Machine de depot sous vide,sur un substrat,de materiaux en couches minces,par pulverisation cathodique.
PCT/FR2009/001437 WO2010076421A2 (fr) 2008-12-19 2009-12-17 Module de pulvérisation cathodique
PCT/FR2009/001435 WO2010076419A1 (fr) 2008-12-19 2009-12-17 Machine de dépôt sous vide de matériaux en couches minces par pulvérisation cathodique.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0807179A FR2940321B1 (fr) 2008-12-19 2008-12-19 Machine de depot sous vide,sur un substrat,de materiaux en couches minces,par pulverisation cathodique.

Publications (2)

Publication Number Publication Date
FR2940321A1 FR2940321A1 (fr) 2010-06-25
FR2940321B1 true FR2940321B1 (fr) 2011-12-23

Family

ID=40809853

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0807179A Expired - Fee Related FR2940321B1 (fr) 2008-12-19 2008-12-19 Machine de depot sous vide,sur un substrat,de materiaux en couches minces,par pulverisation cathodique.

Country Status (2)

Country Link
FR (1) FR2940321B1 (fr)
WO (2) WO2010076419A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2741636T3 (es) * 2010-02-08 2020-02-11 Agc Glass Europe Dispositivo de revestimiento modular
BE1022358B1 (nl) * 2014-07-09 2016-03-24 Soleras Advanced Coatings Bvba Sputterinrichting met bewegend doelwit

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX145314A (es) * 1975-12-17 1982-01-27 Coulter Systems Corp Mejoras a un aparato chisporroteador para producir pelicula electrofotografica
US4793908A (en) * 1986-12-29 1988-12-27 Rockwell International Corporation Multiple ion source method and apparatus for fabricating multilayer optical films
WO1989006437A1 (fr) * 1988-01-11 1989-07-13 Tadahiro Ohmi Dispositif de formation d'une fine pellicule
US6005715A (en) * 1996-09-17 1999-12-21 Dielectric Coating Industries Reflectors
AUPO338396A0 (en) * 1996-11-04 1996-11-28 Sola International Holdings Ltd Sputter coating apparatus
JP4532713B2 (ja) * 2000-10-11 2010-08-25 東洋鋼鈑株式会社 多層金属積層フィルム及びその製造方法
CN101397649B (zh) * 2001-02-01 2011-12-28 株式会社半导体能源研究所 能够将有机化合物沉积在衬底上的装置
JP2003133230A (ja) * 2001-10-29 2003-05-09 Mitsubishi Heavy Ind Ltd フレキシブル基板の半導体処理装置
FR2843129B1 (fr) * 2002-08-01 2006-01-06 Tecmachine Installation pour le traitement sous vide notamment de substrats
US20040206306A1 (en) * 2003-04-17 2004-10-21 Frank Lin Deposition station for forming a polysilicon film of low temperature processed polysilicon thin film transistor
US7432184B2 (en) * 2005-08-26 2008-10-07 Applied Materials, Inc. Integrated PVD system using designated PVD chambers
US20080157007A1 (en) * 2006-12-27 2008-07-03 Varian Semiconductor Equipment Associates, Inc. Active particle trapping for process control
EP1988186A1 (fr) * 2007-04-24 2008-11-05 Galileo Vacuum Systems S.p.A. Système de dépôt sous vide à plusieurs chambres

Also Published As

Publication number Publication date
WO2010076421A3 (fr) 2011-01-20
FR2940321A1 (fr) 2010-06-25
WO2010076421A2 (fr) 2010-07-08
WO2010076419A1 (fr) 2010-07-08

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