MX364356B - Capas hipims. - Google Patents

Capas hipims.

Info

Publication number
MX364356B
MX364356B MX2014005722A MX2014005722A MX364356B MX 364356 B MX364356 B MX 364356B MX 2014005722 A MX2014005722 A MX 2014005722A MX 2014005722 A MX2014005722 A MX 2014005722A MX 364356 B MX364356 B MX 364356B
Authority
MX
Mexico
Prior art keywords
hipims
layering
substrate
layer
sputtering
Prior art date
Application number
MX2014005722A
Other languages
English (en)
Other versions
MX2014005722A (es
Inventor
Krassnitzer Siegfried
Lechthaler Markus
Original Assignee
Oerlikon Surface Solutions Ag Pfaeffikon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Surface Solutions Ag Pfaeffikon filed Critical Oerlikon Surface Solutions Ag Pfaeffikon
Publication of MX2014005722A publication Critical patent/MX2014005722A/es
Publication of MX364356B publication Critical patent/MX364356B/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3435—Applying energy to the substrate during sputtering
    • C23C14/345—Applying energy to the substrate during sputtering using substrate bias
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3485—Sputtering using pulsed power to the target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3464—Operating strategies
    • H01J37/3467—Pulsed operation, e.g. HIPIMS
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Physical Vapour Deposition (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

La presente invención se refiere a un método para la deposición con vapor de sistemas de capas de PVD por medio de pulverización en por lo menos un sustrato, en donde el sistema de capas comprende por lo menos una primera capa, caracterizado porque, por lo menos en un paso del método, se usa un método HiPIMS con una densidad de energía de por lo menos 250 W/cm2, en donde se usa una longitud de pulso con una duración de por lo menos 5 ms mientras se aplica una polarización de sustrato al substrato.
MX2014005722A 2011-11-09 2012-10-26 Capas hipims. MX364356B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011117994A DE102011117994A1 (de) 2011-11-09 2011-11-09 HIPIMS-Schichten
PCT/EP2012/004498 WO2013068080A1 (de) 2011-11-09 2012-10-26 Hipims-schichten

Publications (2)

Publication Number Publication Date
MX2014005722A MX2014005722A (es) 2015-03-09
MX364356B true MX364356B (es) 2019-04-08

Family

ID=47263219

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2014005722A MX364356B (es) 2011-11-09 2012-10-26 Capas hipims.

Country Status (16)

Country Link
US (1) US9416441B2 (es)
EP (1) EP2777061B1 (es)
JP (1) JP6236613B2 (es)
KR (1) KR101929085B1 (es)
CN (1) CN103918054B (es)
AR (1) AR088700A1 (es)
BR (1) BR112014011141B1 (es)
CA (1) CA2854976C (es)
DE (1) DE102011117994A1 (es)
MX (1) MX364356B (es)
MY (1) MY168656A (es)
RU (1) RU2633672C2 (es)
SG (1) SG11201402191VA (es)
TR (1) TR201902881T4 (es)
TW (1) TWI582258B (es)
WO (1) WO2013068080A1 (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102274981B1 (ko) * 2013-06-26 2021-07-09 오를리콘 서피스 솔루션스 아크티엔게젤샤프트, 페피콘 장식적 hipims 경질층
PL3212819T3 (pl) * 2014-09-17 2023-10-16 Oerlikon Surface Solutions Ag, Pfäffikon Sposób wytwarzania narzędzia skrawającego powleczonego podwójną warstwą o polepszonej odporności na zużycie
EP3018233A1 (de) 2014-11-05 2016-05-11 Walter Ag Schneidwerkzeug mit mehrlagiger PVD-Beschichtung
EP3056587B1 (de) * 2015-02-13 2020-11-18 Walter AG VHM-Schaftfräser mit TiAlN-ZrN-Beschichtung
JP7292695B2 (ja) * 2016-08-17 2023-06-19 地方独立行政法人東京都立産業技術研究センター 機能性薄膜、その製造方法、積層構造体及びその製造方法
US11473189B2 (en) 2019-02-11 2022-10-18 Applied Materials, Inc. Method for particle removal from wafers through plasma modification in pulsed PVD
DE102022003082A1 (de) 2022-08-23 2024-02-29 Oerlikon Surface Solutions Ag, Pfäffikon Beschichtungsverfahren zur Abscheidung eines Schichtsystems auf einem Substrat, sowie ein Substrat mit einem Schichtsystem

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1580298A1 (fr) * 2004-03-22 2005-09-28 Materia Nova A.S.B.L Dépôt par pulverisation cathodique magnétron en régime impulsionnel avec préionisation
DE102005033769B4 (de) * 2005-07-15 2009-10-22 Systec System- Und Anlagentechnik Gmbh & Co.Kg Verfahren und Vorrichtung zur Mehrkathoden-PVD-Beschichtung und Substrat mit PVD-Beschichtung
US9605338B2 (en) * 2006-10-11 2017-03-28 Oerlikon Surface Solutions Ag, Pfaffikon Method for depositing electrically insulating layers
RU2339735C1 (ru) * 2007-02-12 2008-11-27 Закрытое акционерное общество "Нано-Плазменные Технологии" (ЗАО "НАНПЛАТЕК") Способ нанесения пленочного покрытия
US7966909B2 (en) * 2007-07-25 2011-06-28 The Gillette Company Process of forming a razor blade
SE532505C2 (sv) * 2007-12-12 2010-02-09 Plasmatrix Materials Ab Förfarande för plasmaaktiverad kemisk ångdeponering och plasmasönderdelningsenhet
WO2009132822A2 (de) * 2008-04-28 2009-11-05 Cemecon Ag Vorrichtung und verfahren zum vorbehandeln und beschichten von körpern
DE102008028140B3 (de) * 2008-06-13 2009-12-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung einer transparenten und leitfähigen Metalloxidschicht durch gepulstes, hochionisierendes Magnetronsputtern
US20100055826A1 (en) * 2008-08-26 2010-03-04 General Electric Company Methods of Fabrication of Solar Cells Using High Power Pulsed Magnetron Sputtering
DE202010001497U1 (de) 2010-01-29 2010-04-22 Hauzer Techno-Coating B.V. Beschichtungsvorrichtung mit einer HIPIMS-Leistungsquelle

Also Published As

Publication number Publication date
RU2633672C2 (ru) 2017-10-16
RU2014123354A (ru) 2015-12-20
EP2777061A1 (de) 2014-09-17
MY168656A (en) 2018-11-28
JP2015501876A (ja) 2015-01-19
KR20140099898A (ko) 2014-08-13
CA2854976C (en) 2019-07-30
TWI582258B (zh) 2017-05-11
SG11201402191VA (en) 2014-08-28
MX2014005722A (es) 2015-03-09
DE102011117994A1 (de) 2013-05-16
WO2013068080A1 (de) 2013-05-16
TR201902881T4 (tr) 2019-03-21
EP2777061B1 (de) 2018-12-12
AR088700A1 (es) 2014-06-25
BR112014011141B1 (pt) 2021-08-10
BR112014011141A2 (pt) 2017-05-16
US9416441B2 (en) 2016-08-16
US20140305792A1 (en) 2014-10-16
CN103918054B (zh) 2017-02-15
KR101929085B1 (ko) 2018-12-13
JP6236613B2 (ja) 2017-11-29
TW201329271A (zh) 2013-07-16
CA2854976A1 (en) 2013-05-16
CN103918054A (zh) 2014-07-09

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Owner name: BAYER INTELLECTUAL PROPERTY GMBH