TR201902881T4 - Hıpıms kaplamalar. - Google Patents

Hıpıms kaplamalar. Download PDF

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Publication number
TR201902881T4
TR201902881T4 TR2019/02881T TR201902881T TR201902881T4 TR 201902881 T4 TR201902881 T4 TR 201902881T4 TR 2019/02881 T TR2019/02881 T TR 2019/02881T TR 201902881 T TR201902881 T TR 201902881T TR 201902881 T4 TR201902881 T4 TR 201902881T4
Authority
TR
Turkey
Prior art keywords
coating
substrate
hippy
veneers
sputtering
Prior art date
Application number
TR2019/02881T
Other languages
English (en)
Inventor
Krassnitzer Siegfried
Lechthaler Markus
Original Assignee
Oerlikon Surface Solutions Ag Pfaeffikon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Surface Solutions Ag Pfaeffikon filed Critical Oerlikon Surface Solutions Ag Pfaeffikon
Publication of TR201902881T4 publication Critical patent/TR201902881T4/tr

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/35Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3435Applying energy to the substrate during sputtering
    • C23C14/345Applying energy to the substrate during sputtering using substrate bias
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3485Sputtering using pulsed power to the target
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3464Operating strategies
    • H01J37/3467Pulsed operation, e.g. HIPIMS
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Physical Vapour Deposition (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

Söz konusu buluş PVD kaplama sistemlerinin gaz fazdan en az bir substrata püskürtme aracılığıyla biriktirilmesi için bir yöntem olup, burada kaplama sistemi en az bir birinci kaplama içermektedir, en az 250 W/cm2 güç yoğunluğuna sahip bir HIPIMS yönteminin bir kaplamasında kullanılması ile karakterize edilmektedir, burada substrata bir substrat eğimi uygulanırken darbe uzunluğu en az 5 ms süreklilikte kullanılmaktadır.
TR2019/02881T 2011-11-09 2012-10-26 Hıpıms kaplamalar. TR201902881T4 (tr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102011117994A DE102011117994A1 (de) 2011-11-09 2011-11-09 HIPIMS-Schichten

Publications (1)

Publication Number Publication Date
TR201902881T4 true TR201902881T4 (tr) 2019-03-21

Family

ID=47263219

Family Applications (1)

Application Number Title Priority Date Filing Date
TR2019/02881T TR201902881T4 (tr) 2011-11-09 2012-10-26 Hıpıms kaplamalar.

Country Status (16)

Country Link
US (1) US9416441B2 (tr)
EP (1) EP2777061B1 (tr)
JP (1) JP6236613B2 (tr)
KR (1) KR101929085B1 (tr)
CN (1) CN103918054B (tr)
AR (1) AR088700A1 (tr)
BR (1) BR112014011141B1 (tr)
CA (1) CA2854976C (tr)
DE (1) DE102011117994A1 (tr)
MX (1) MX364356B (tr)
MY (1) MY168656A (tr)
RU (1) RU2633672C2 (tr)
SG (1) SG11201402191VA (tr)
TR (1) TR201902881T4 (tr)
TW (1) TWI582258B (tr)
WO (1) WO2013068080A1 (tr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11060181B2 (en) * 2013-06-26 2021-07-13 Oerlikon Surface Solutions Ag, Pfaffikon Decorative HIPIMS hard material layers
CN107002226B (zh) * 2014-09-17 2021-03-12 欧瑞康表面解决方案股份公司,普费菲孔 制备具有改善的耐磨性的双层涂布的切割工具的方法
EP3018233A1 (de) * 2014-11-05 2016-05-11 Walter Ag Schneidwerkzeug mit mehrlagiger PVD-Beschichtung
EP3056587B1 (de) * 2015-02-13 2020-11-18 Walter AG VHM-Schaftfräser mit TiAlN-ZrN-Beschichtung
JP7292695B2 (ja) * 2016-08-17 2023-06-19 地方独立行政法人東京都立産業技術研究センター 機能性薄膜、その製造方法、積層構造体及びその製造方法
TW202340495A (zh) 2019-02-11 2023-10-16 美商應用材料股份有限公司 物理氣相沉積方法
DE102022003082A1 (de) 2022-08-23 2024-02-29 Oerlikon Surface Solutions Ag, Pfäffikon Beschichtungsverfahren zur Abscheidung eines Schichtsystems auf einem Substrat, sowie ein Substrat mit einem Schichtsystem

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1580298A1 (fr) * 2004-03-22 2005-09-28 Materia Nova A.S.B.L Dépôt par pulverisation cathodique magnétron en régime impulsionnel avec préionisation
DE102005033769B4 (de) * 2005-07-15 2009-10-22 Systec System- Und Anlagentechnik Gmbh & Co.Kg Verfahren und Vorrichtung zur Mehrkathoden-PVD-Beschichtung und Substrat mit PVD-Beschichtung
US9605338B2 (en) * 2006-10-11 2017-03-28 Oerlikon Surface Solutions Ag, Pfaffikon Method for depositing electrically insulating layers
RU2339735C1 (ru) * 2007-02-12 2008-11-27 Закрытое акционерное общество "Нано-Плазменные Технологии" (ЗАО "НАНПЛАТЕК") Способ нанесения пленочного покрытия
US7966909B2 (en) * 2007-07-25 2011-06-28 The Gillette Company Process of forming a razor blade
SE532505C2 (sv) * 2007-12-12 2010-02-09 Plasmatrix Materials Ab Förfarande för plasmaaktiverad kemisk ångdeponering och plasmasönderdelningsenhet
CN102027564B (zh) * 2008-04-28 2013-05-22 塞梅孔公司 对物体进行预处理和涂覆的装置和方法
DE102008028140B3 (de) * 2008-06-13 2009-12-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung einer transparenten und leitfähigen Metalloxidschicht durch gepulstes, hochionisierendes Magnetronsputtern
US20100055826A1 (en) * 2008-08-26 2010-03-04 General Electric Company Methods of Fabrication of Solar Cells Using High Power Pulsed Magnetron Sputtering
DE202010001497U1 (de) * 2010-01-29 2010-04-22 Hauzer Techno-Coating B.V. Beschichtungsvorrichtung mit einer HIPIMS-Leistungsquelle

Also Published As

Publication number Publication date
CA2854976A1 (en) 2013-05-16
SG11201402191VA (en) 2014-08-28
TW201329271A (zh) 2013-07-16
AR088700A1 (es) 2014-06-25
CN103918054B (zh) 2017-02-15
BR112014011141A2 (pt) 2017-05-16
US20140305792A1 (en) 2014-10-16
BR112014011141B1 (pt) 2021-08-10
US9416441B2 (en) 2016-08-16
MY168656A (en) 2018-11-28
WO2013068080A1 (de) 2013-05-16
EP2777061B1 (de) 2018-12-12
JP6236613B2 (ja) 2017-11-29
CA2854976C (en) 2019-07-30
JP2015501876A (ja) 2015-01-19
KR20140099898A (ko) 2014-08-13
TWI582258B (zh) 2017-05-11
RU2014123354A (ru) 2015-12-20
CN103918054A (zh) 2014-07-09
MX364356B (es) 2019-04-08
KR101929085B1 (ko) 2018-12-13
DE102011117994A1 (de) 2013-05-16
RU2633672C2 (ru) 2017-10-16
EP2777061A1 (de) 2014-09-17
MX2014005722A (es) 2015-03-09

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